JP2002273926A - Method for manufacturing glazed substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a glazed substrate by which a resist film can be exactly removed an washing work after the resist film is removed is only finished by convenient washing with water and it is unnecessary to treat a used organic solvent as in the conventional case and to improve operability and to reduce cost. SOLUTION: In the method for manufacturing a glazed substrate in which a glazed layer 2 is formed on a ceramic base 1 and in addition, a resist film 3 with a specified pattern is formed thereon and after an etching treatment, the resist film 3 is removed, by spraying sodium bicarbonate particles with a particle diameter of at most 250 μm with at least a pressurized liquid from a nozzle 5. It is preferable that the mean particle diameter of the sodium bicarbonate is at most 130 μm and amount of use is at least 300 g/min. The pressurized liquid is preferably jetted at least at 3 MPa.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a glaze substrate suitable for a thermal head of a printer. More specifically, the present invention relates to a technique for removing a resist film required in a manufacturing process of a glaze substrate.

[0002]

2. Description of the Related Art As a method of manufacturing a glaze substrate, a glaze layer is formed on a ceramic substrate of alumina or the like, the surface of the glaze layer is masked, and the upper portion of the glaze layer is removed to a predetermined depth by sandblasting. Accordingly, a method of forming a glaze substrate having a predetermined pattern is known (Japanese Patent Application Laid-Open No. 3-251466). After the mask material is removed from the convex portion formed by sandblasting, the convex portion is formed into a radius (R) by heat treatment. The conventional method using the sand blast processing has a limitation in processing accuracy and has a technical difficulty in forming a fine pattern. Therefore, as another method, there is known a method in which a glaze layer is formed on a ceramic substrate, a resist film is formed on the surface of the glaze layer, and a precise predetermined pattern is formed by etching (Japanese Unexamined Patent Application Publication No. Hei 9-1997). 2271
No. 55). In this method, when removing the resist film, an organic solvent was generally used.

[0003]

In the case of the latter conventional method, it is relatively easy to form a fine pattern, but it is not possible to completely remove the resist film even by using an organic solvent. It is quite difficult, and there is a technical difficulty that it remains thin and causes defective products.
Furthermore, it takes time and effort to remove the organic solvent attached to the substrate after the resist film removing step and to treat the used organic solvent. The present invention has been developed in view of such a conventional technical situation, and it is possible to accurately and efficiently remove a resist film.
It is an object of the present invention to provide a method for manufacturing a glaze substrate that does not need to treat a used organic solvent and is environmentally friendly unlike the related art, and aims to improve workability and reduce costs.

[0004]

According to the present invention, a glaze layer is formed on a substrate, a resist film having a predetermined pattern is further formed thereon, and the resist film is removed after etching. In the manufacturing method of
Technical means was employed in which sodium bicarbonate particles having a particle diameter of 250 μm or less were sprayed together with at least a pressurized liquid to remove the resist film. As a result of many experiments, when removing the resist film using sodium bicarbonate particles, the maximum particle size is largely related to whether or not the surface of the glaze layer is scratched. Then, it turned out that there was almost no scratch. In the invention according to claim 2, the average particle diameter of the sodium hydrogencarbonate particles is 130 μm or less. In the invention according to claim 3, the amount of the sodium bicarbonate particles used is 300 g.
/ Min or more. In the invention of claim 4, the pressurized liquid is ejected at 3 MPa or more.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION As a working medium to be sprayed to remove a resist film, a medium in which sodium bicarbonate particles are mixed in advance into a pressurized liquid, or a medium in which these are mixed at a nozzle portion during spraying May be. Further, a gas such as air may be further added to form a droplet. If normal water such as tap water or warm water is used as the pressurized liquid, the sodium hydrogencarbonate particles used for removing the resist film can be easily dissolved in water, so that compared to the case where a conventional organic solvent is used, Workability is improved and cost can be reduced. In addition, processing that is easy on the environment is possible. As the sodium hydrogen carbonate particles, those having a particle size of 250 μm or less are used. Here, the particle size refers to a particle size in a powder state before being mixed with a liquid. Maximum particle size is 2
If it is 50 μm or less, various distribution forms can be used, and the average particle diameter is preferably 130 μm or less. Further, regarding the amount of sodium hydrogencarbonate particles used, 300 g / min or more is desirable from the viewpoint of working efficiency. If the pressurized liquid is jetted at a pressure of 3 MPa or more, the resist film can be effectively removed.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic explanatory view exemplifying a basic operation procedure relating to a method for manufacturing a glaze substrate to which the present invention is applied. In step (1), a glaze layer 2 made of a glass layer or the like is formed on a ceramic substrate 1. In step (2), a resist film 3 having a predetermined pattern removed on the upper surface of the glaze layer 2
To form In the step (3), an etching process is performed to erode a predetermined pattern not covered with the resist film 3 to form the concave portion 4. Thereafter, in step (4), the resist film 3 is removed. The feature of the present invention relates to the removal of the resist film 3 in this step (4), using the jet flow 6 containing sodium hydrogen carbonate particles jetted from the nozzle 5 without scratching the surface of the glaze layer 2. In that the resist film 3 is more accurately and efficiently removed. After the removal of the resist film 3, a cleaning operation by water washing is performed, and thereafter, a rounding (R) is performed by a heat treatment. As described above, the target glaze substrate on which the concave portions 4 having the predetermined pattern are formed is obtained, and the basic operation is completed.

Table 1 shows the results of experiments on the removal of the resist film 3. The glaze layer 2 was obtained when the maximum particle diameter and average particle diameter of the sodium hydrogen carbonate particles and the water pressure as the pressurized liquid were changed. 3 shows the presence or absence of a scratch on the surface of FIG. Generally, the size of the glaze substrate is 285
× 85mm, 285 × 55mm, 300 × 55mm, 3
In many cases, 80 × 60 mm or the like is used. Also,
There is a strong demand to process these sizes within 10 seconds per sheet. Therefore, a peeling speed of about 3000 mm ² / s is required. Therefore, in this experiment, the spraying range of the nozzle 5 and the relative moving speed were set so that the peeling speed was 3000 mm ² / s. For example, with the moving speed of the nozzle 5 set to 200 mm / s and the feed pitch set to 15 mm, the stripping operation is performed in both reciprocating directions while pitch feeding is performed on both sides of the resist film 3. Water was used as a liquid, and a pressurized air containing sodium hydrogen carbonate particles was mixed with a water stream jetted in the nozzle portion to form a jet flow in the form of droplets, which was sprayed on the resist film. In addition,
The pressurized air also acts to transport sodium bicarbonate particles in the supply pipe, and the air supply pressure is 0.3M
Pa. The amount of the sodium bicarbonate particles used was 300 g / min. Each experimental example of this experiment (A)
The distribution state regarding the particle size of the sodium hydrogencarbonate particles used in (C) to (C) is as shown in FIG.
This was measured by shaking 100 g of a sample of sodium hydrogencarbonate particles using a low tap sieve shaker (R-2 type manufactured by Tanaka Kagaku Kikai) and a standard sieve (φ = 200 mm) for 10 minutes.

[0008]

[Table 1]

As shown in the experimental results shown in Table 1, with respect to the removal state of the resist film 3, the water pressure was 1 MPa in Experimental Example A.
Only in the case of (1), there was a variation in the presence or absence of the resist film 3, but in other cases, the resist film 3 was completely removed. This indicates that the spray removal method using sodium hydrogencarbonate particles is extremely effective for removing the resist film 3. The variation in the remaining resist film 3 when the water pressure is 1 MPa in Experimental Example A is presumed to be due to unevenness in the thickness of the resist film 3 depending on each sample. To avoid this variation, the water pressure may be set to 3 MPa or more. Regarding the presence or absence of scratches on the surface of the glaze layer 2, the maximum particle size of the sodium hydrogencarbonate particles was 500 μm.
In the case of Experimental Example C having an average particle diameter of 240 μm, scratches were observed in all cases where the supply pressure of the liquid, that is, the water pressure was changed to 1 to 5 MPa. On the other hand, when the maximum particle size is 250
In the case of Experimental Examples A and B in which the average particle diameter was 130 μm or less and the average particle diameter was 130 μm or less, no scratch was observed in all cases where the water pressure was changed to 1 to 5 MPa. It is empirically estimated that the maximum particle diameter has a large effect on the presence or absence of flaws. To avoid flaws on the glaze layer 2, the maximum particle diameter of the sodium bicarbonate particles is determined from the above experimental results. It has been found that the thickness should be 250 μm. It was also found that the average particle size was desirably 130 μm or less. As described above, the water pressure is desirably 3 MPa or more.

Next, Table 2 shows experimental results on the amount of sodium hydrogen carbonate particles used and the state of removal of the resist film 3. In this experiment, the maximum particle size was 1
Using sodium hydrogen carbonate particles having a particle diameter of 80 μm and an average particle diameter of 73 μm, the presence or absence of the resist film 3 was examined while changing the amount of the particles. The water pressure was 3 MPa, the air supply pressure was 0.3 MPa, and the peeling speed was 3000 mm ² / s
And

[0011]

[Table 2]

From the experimental results shown in Table 2, in order to prevent the resist film 3 from remaining while maintaining the generally required peeling speed of about 3000 mm ² / s, the amount of the sodium hydrogencarbonate particles used should be 300 g. / Min or more was found to be desirable. In addition, when the sample used in each of the above experiments was washed and subjected to R-treatment, it was confirmed that there was no particular problem as a glaze substrate. The supply of the pressurized air can be changed to a suction method. In some cases, a mode in which gas such as air is not supplied is also possible.

[0013]

According to the present invention, only the resist film can be removed accurately and efficiently without damaging the surface of the glaze layer. In addition, since the sodium hydrogencarbonate particles used as a means for removing the resist film are soluble in water, the washing operation for the substrate after the removal of the resist film can be simply performed with water. Therefore, the workability related to the manufacture of the glaze substrate can be improved, and the cost can be reduced. In addition, since there is no need to treat the used organic solvent as in the related art, an environment-friendly operation can be performed.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view illustrating a basic operation procedure relating to a method for manufacturing a glaze substrate to which the present invention is applied.

FIG. 2 is a distribution explanatory diagram showing a distribution state regarding a particle diameter of sodium hydrogencarbonate particles used in an experiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Ceramic substrate, 2 ... Glaze layer, 3 ... Resist film, 4 ... Depression, 5 ... Nozzle, 6 ... Jet flow

Claims (4)

[Claims] 1. A method of manufacturing a glaze substrate, comprising: forming a glaze layer on a substrate, forming a resist film having a predetermined pattern thereon, and removing the resist film after the etching process, wherein the particle diameter is 250 μm or less. A method for manufacturing a glaze substrate, comprising spraying sodium bicarbonate particles together with at least a pressurized liquid to remove a resist film. 2. The method according to claim 1, wherein the average particle diameter of the sodium hydrogencarbonate particles is 130 μm or less. 3. The method for manufacturing a glaze substrate according to claim 1, wherein the amount of the sodium hydrogencarbonate particles used is 300 g / min or more. 4. The method for manufacturing a glaze substrate according to claim 1, wherein the pressurized liquid is jetted at a pressure of 3 MPa or more.