JP2002270660A - Wafer transfer system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer transfer system, capable of being easily laid and of high-speed automatic transfer, to automatically transfer wafers housed in a wafer-housing container in a factory. SOLUTION: A track rail 38 is laid, so as to run near semiconductor manufacturing apparatuses 46. A vehicle 40, moving along the track rail 38, is provided, and it is provided with an arm 44 for delivering a wafer-housing container 42 (FOUP) between a load port 48 and the vehicle 40. The rack rail 38 is provided at a position which is lower than the highest among the machines 46 installed along the track rail 38 but higher than the top face of the load port 48.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer apparatus, and more particularly, to a method for transferring a wafer stored in a wafer storage container.
The present invention relates to a wafer transfer device suitable as an automatic transfer device inside a semiconductor manufacturing plant.

[0002]

2. Description of the Related Art FIG. 6 is a perspective view for explaining a general wafer transfer device conventionally used in a semiconductor manufacturing factory. More specifically, FIG. 6 is a perspective view of one bay installed inside a semiconductor manufacturing factory. Generally, a plurality of bays as shown in FIG. 6 are provided inside a semiconductor manufacturing plant.

In a semiconductor manufacturing plant, a wafer is usually transferred in a state of being stored in a wafer storage container called a FOUP (Front Opening Unified Pod). In FIG. 6, an OHS (Over Head) denoted by reference numeral 10 is shown.
Shuttle) is an apparatus for transporting a FOUP between a plurality of bays. The OHS 10 includes a track rail 12 laid near a ceiling of a factory, and a transfer device 14 moving on the track rail 12.

In each bay in the factory, a stocker 16 for transferring a FOUP to and from the OHS 10 is arranged. Each bay has an OHT (Overhead Hoist Transport) 18 for carrying the FOUP in the process.
Is arranged. The OHT 18 includes a track rail 20 laid near the ceiling of the factory, and a hoist-type transfer device 22 that moves along the track rail 20. The hoist type transfer device 22 can suspend and transport the FOUP while being suspended by the track rail 20.

Inside the bay, RGV (Rail Guided Vehicle) 24, AG
V (Automated Guided Vehicle) 26 and PGV
(Personal Guided Vehicle) 28 or the like is used.
The RGV 24 automatically transports the FOUP along a predetermined route while following the rail 30 laid on the floor of the factory. The AGV 26 automatically conveys the FOUP along a predetermined route by following a magnetic tape (not shown) stuck on the floor of the factory. In addition, PGV28
Is used when the operator manually transports the FOUP.

[0006]

The above-described conventional wafer transfer apparatuses have the following disadvantages. That is, the OHS 10 and the OHT 18 require the track rails 12 and 20 laid near the ceiling of the factory.
Therefore, their installation requires a large-scale construction. Also, for these transport devices, the track rail 1
Since the positions 2 and 20 are located at a high position, there are problems that the transfer speed and the transfer speed of the FOUP cannot be increased, and that the maintenance work is not easy.

[0007] The RGV 24 has a problem that the rail 30 laid on the floor of a factory obstructs various operations. There is a problem that the operation of the AGV 26 that follows the magnetic tape cannot be accelerated. And about PGV28,
There is a problem that factory automation cannot be dealt with.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can be laid easily as compared with OHT or OHS, and can carry out wafer transfer at high speed automatically. It is intended to provide a device.

[0009]

According to the first aspect of the present invention,
A wafer transfer device for transferring a wafer storage container,
A track rail arranged to pass through a predetermined path; and a vehicle movable along the track rail, wherein the vehicle receives the wafer storage container between a load port and the vehicle. An arm for transferring, wherein the track rail is located at a position lower than the tallest semiconductor manufacturing apparatus among the semiconductor manufacturing apparatuses arranged along the track rail and at a distance higher than 50 cm from the floor. It is characterized by being arranged.

According to a second aspect of the present invention, there is provided a wafer transfer apparatus for transferring a wafer storage container, wherein the track rail is disposed so as to pass through a predetermined path, and can move by following the track rail. A vehicle, the vehicle having an arm for transferring the wafer storage container between the load port and the vehicle, wherein the track rail has a height from the floor above the load port. Is 1
It is characterized by being arranged at a position of 30 cm or more and 3.5 m or less.

According to a third aspect of the present invention, there is provided a wafer transfer apparatus for transferring a wafer storage container, wherein the track rail is disposed so as to pass through a predetermined path, and can move by following the track rail. A vehicle, and the vehicle has an arm for transferring the wafer storage container between the load port and the vehicle, and the track rail is located at a position offset from above the load port, and Characterized in that the wafer transfer device is arranged at a position where the height from the top is 50 cm or more and 3.5 m or less.

According to a fourth aspect of the present invention, there is provided the wafer transfer device according to any one of the first to third aspects, wherein the track rail is capable of rotating with two vehicles mounted thereon. And a vehicle exchange mechanism for exchanging the relative positions of the two vehicles while rotating the rotating unit.

According to a fifth aspect of the present invention, there is provided the wafer transfer apparatus according to the fourth aspect, wherein the arm reversing mechanism for reversing the direction of the arm of the vehicle on the track rail, and the trajectory by the vehicle switching mechanism. A reversing control function of reversing the direction of the arm by the arm rotating mechanism when the direction of the vehicle on the rail is reversed.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. Elements common to the drawings are denoted by the same reference numerals, and redundant description will be omitted.

Embodiment 1 FIG. 1 is a diagram for explaining a main part of the wafer transfer device according to the first embodiment of the present invention. FIG. 2 is a plan view showing the entire structure of a semiconductor manufacturing plant including the wafer transfer device of the present embodiment.
The wafer transfer device of the present embodiment transfers FOUPs in individual bays installed in a semiconductor manufacturing factory (in-process transfer).
That is, the FOUP is transported between stockers and manufacturing apparatuses that constitute individual bays.

The semiconductor factory shown in FIG. 2 has a plurality of bays 32. The bays 32 are arranged along a track rail 34 for transporting between processes. The track rail 34 is a rail for configuring an OHS type wafer transfer device, and is laid near the ceiling of a factory by being suspended from the ceiling. The transfer of the FOUP between the individual bays provided in the semiconductor manufacturing factory is performed by a transfer device (not shown) which moves along the track rail 34.

Each of the bays 32 is provided with an OHS track rail 3.
4 is provided with a stocker 36 arranged in the vicinity. The stocker 36 is a device that transfers a FOUP to and from a transfer device that moves along the track rail 34. That is, the stocker 36 is a device that receives the FOUP containing the wafers to be processed in each bay from the OHS transfer device, and transfers the wafer processed in each bay to the OHS transfer device. is there.

Each bay 32 is provided with a track rail 38 separated from the OHS track rail 34.
The track rail 38 is a rail for configuring the wafer transfer device of the present embodiment. The track rail 38 is
The support may be provided by hanging from the ceiling of the factory, a column may be supported on the floor of the factory, or a column may be extended from a manufacturing apparatus arranged in the bay 32 and supported.

As shown in FIG. 1, a vehicle 40 that can move following the track rail 38 is disposed on the track rail 38. The vehicle 40 has an arm 44 below which the FOUP 42 is suspended. The individual manufacturing apparatuses 46 included in the bay 32 and the load ports 48 provided corresponding to them are arranged along the track rail 38.

In this embodiment, the track rail 38 is
It is provided so as to pass through the space just above the load port 48. Accordingly, the vehicle 40 can move just above the load port 48 by moving along the track rail 38. Further, the vehicle 40 is equipped with a sensor for detecting a position just above the load port 48.
Thus, the vehicle 40 can be stopped immediately above any load port 48 as necessary.

The vehicle 40 and the load port 48 are equipped with a parallel I / O device for communicating information necessary for transferring the FOUP. Vehicle 4
0, a FOUP to be processed in a desired step is dropped on an appropriate load port 48 based on information obtained by the parallel I / O device, and a FOUP containing a processed wafer is stored in the load port 48. Can be lifted from above.

In the wafer transfer device of the present embodiment, the track rail 38 is connected to the manufacturing device 4 disposed in the bay 32.
6 are lower than the tallest of the FOUPs 6 and higher than the upper surfaces of the FOUPs placed on the upper surfaces of the other load ports 48. More specifically, the track rail 38 is higher than the sum (130 cm) of the height (90 cm) of the load port 48 and the height (40 cm) of the FOUP, and the maximum height of the manufacturing device defined by the SEMI standard. (3.5 m) or less, and more preferably, the vertical distance from the upper surface of the load port 48 is 50 cm or more.
It is arranged at a position of 5 m or less.

When the track rail 38 is arranged at the above-mentioned height, the loading and unloading of the FOUP 42 by the arm 44 can be performed quickly and safely. For this reason, according to the wafer transfer device of the present embodiment, the FOUP 42 can be transferred at a higher speed and more safely than OHS or OHT.

In the wafer transfer device of the present embodiment, the track rail 38 is located at a position lower than that of the OHS or OHT, that is, at a position where the hand can easily reach. For this reason, the wafer transfer device of the present embodiment
Construction is easier and maintenance is easier than HS and OHT.

Further, the wafer transfer device of the present embodiment
Unlike the case of the GV, there is no need to lay rails on the floor of the bay 32. Further, unlike the AGV and the PGV, there is no need to secure a space on the floor of the bay 32 for running the vehicle. Therefore, according to the wafer transfer device of the present embodiment, the width of the bay 32 can be reduced as compared with the case where RGV or AGV is used.

In the first embodiment, the track rail 38 passes right above the load port 48, and the vehicle 40 suspends the FOUP 42. However, the present invention is not limited to this. . That is, as shown in FIG. 3 (perspective view) and FIG. 4 (plan view), the track rail 38 may be arranged at a position offset from directly above the load port 48. In this case, the FOUP 42 to be conveyed may be placed on the vehicle 40. In this case, the track rail 38 may be arranged at a position where the vertical distance from the floor is higher than 50 cm and is equal to or less than the maximum height (3.5 m) of the manufacturing apparatus defined by the SEMI standard.

Embodiment 2 FIG. Next, FIGS.
Embodiment 2 of the present invention will be described with reference to FIG. FIGS. 5A to 5C are perspective views of the track rail 38 and the vehicle 40 provided in the wafer transfer device of the present embodiment. In these figures, the arrows drawn in the vehicle 40 indicate the traveling direction of each vehicle.

As shown in FIG. 5A, in this embodiment, the track rail 38 includes a fixed portion 50 and a rotating portion 52. The fixing portion 50 is a portion fixedly installed via a support or the like. On the other hand, the rotating portion 52 is a portion provided so as to be rotatable in a horizontal direction about a rotating shaft 54 by a rotating mechanism (not shown).

In the wafer transfer apparatus of the present embodiment, when a plurality of vehicles 40 travel on the track rail 38, as shown in FIG.
The vehicles 38 may line up on the track rails 38 and require replacement of the vehicles.

In such a case, the wafer transfer device of the present embodiment uses the rotating unit 5 to move two vehicles that need to be replaced.
5 and, as shown in FIG. 5B, the rotating unit 54 is rotated by 180 degrees in that state. When the rotating unit 52 is rotated by 180 degrees in this manner, the positions of the two vehicles 40 on the track rail 38 are switched, and a situation can be created in which each vehicle 40 advances in the traveling direction.

The FOUP 42 transported by the vehicle 40 has an opening / closing door on the front surface, and it is necessary to transport the FOUP 42 such that the surface of the opening / closing door faces the manufacturing apparatus. As shown in FIG. 5B, when the rotating portion 52 on which the vehicle 40 is mounted rotates by 180 degrees, the front and rear surfaces of the vehicle 40 are reversed, and the back surface of the FOUP 42 (the surface opposite to the door surface).
Is formed facing the manufacturing apparatus.

Therefore, in the wafer transfer apparatus of the present embodiment, the function of reversing the direction of the FOUP 42 on the track rail 38, that is, rotating the FOUP 42 by 180 degrees about the rotation shaft 56 as shown in FIG. It has a function to make it work. When the front and rear surfaces of the vehicle 40 are reversed due to the replacement of the two vehicles 40, the direction of the FOUP 42 is also reversed, and the state in which the door surface of the FOUP 42 faces the manufacturing apparatus is maintained.

The function of rotating the FOUP 42 on the track rail 38 is, for example, the function of the rotating section 52 of the track rail 38.
Can be further divided into two parts, and the divided parts are individually rotated. Further, the above function can be realized by, for example, providing the vehicle 40 with a reversing function of reversing the direction on the track rail 38. Further, the above functions are provided by the vehicle 40.
Alternatively, the function of reversing the direction of the arm 44 may be provided.

As described above, in the wafer transfer apparatus according to the present embodiment, when two vehicles 38 having different traveling directions face each other on a single track rail 38, their positions are exchanged to each other. A state is created in which the vehicle 40 can proceed in a desired direction. For this reason, according to the wafer transfer device of the present embodiment, a plurality of vehicles 40 travel on a single track rail 38, and the FOUP is transferred more efficiently than in the first embodiment. be able to.

[0035]

Since the present invention is configured as described above, it has the following effects. Claim 1
According to the invention described in any one of (3) to (3), the track rail is installed at a position that is sufficiently low as compared with the ceiling of the semiconductor manufacturing plant and easily accessible, so that it is sufficiently compared with OHS and OHT. In addition, it is possible to realize a wafer transfer device which is low in cost and easy to maintain. Further, according to the wafer transfer device according to the present invention, there is no need for a space for running the vehicle on the floor. Can be used effectively.
Furthermore, according to the wafer transfer device of the present invention, since the track rail is installed at a low position, the loading / unloading of the wafer storage container can be performed at a higher speed than in the case of OHS or OHT.

According to the fourth aspect of the present invention, the positional relationship between the two vehicles on the track rail can be switched by rotating the rotating portion provided on the track rail. Therefore, according to the present invention, a plurality of vehicles can run on a single track rail, and the transfer efficiency of the wafer storage container can be improved.

According to the fifth aspect of the present invention, the direction of the arm of the vehicle is reversed on the track rail, so that when the direction of the vehicle is reversed, the reversal is canceled. The orientation of the container can be modified.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a main part of a wafer transfer device according to a first embodiment of the present invention.

FIG. 2 is a plan view of a semiconductor manufacturing plant including the wafer transfer device according to the first embodiment in each bay.

FIG. 3 is a perspective view showing a modification of the wafer transfer device according to the first embodiment;

FIG. 4 is a plan view showing a structure of the wafer transfer apparatus shown in FIG. 3;

FIG. 5 is a perspective view illustrating a main part of a wafer transfer device according to a second embodiment of the present invention.

FIG. 6 is a diagram illustrating an example of a conventional wafer transfer device used in a semiconductor manufacturing plant.

[Explanation of symbols]

 10 OHS (Overhead Shuttle) 18 OHT (Overhead Hoist Transport) 24 RGV (Rail Guided Vehicle) 26 AGV (Automated Guided Vehicle) 28 PGV (Personal Guided Vehicle) 32 Bay 36 Stocker 38 Track rail 40 Vehicle 42 FOUP (Front Opening Unified Pod) ) 44 arm 46 semiconductor manufacturing equipment 48 load port 50 fixing part 52 rotating part 54, 56 rotating shaft

Claims (5)

[Claims] 1. A wafer transfer device for transferring a wafer storage container, comprising: a track rail arranged so as to pass through a predetermined path; and a vehicle movable along the track rail. The vehicle has an arm for delivering the wafer storage container between the load port and the vehicle, and the track rail is the tallest of the semiconductor manufacturing apparatuses arranged along the track rail. Lower than those,
And a wafer transfer device disposed at a position higher than 50 cm from the floor. 2. A wafer transfer device for transferring a wafer storage container, comprising: a track rail arranged so as to pass through a predetermined path; and a vehicle movable along the track rail. The vehicle has an arm for transferring the wafer storage container between the load port and the vehicle, and the track rail has a height from the floor of 130 cm or more and 3.5 m above the load port. A wafer transfer device characterized by being arranged at the following positions. 3. A wafer transfer device for transferring a wafer storage container, comprising: a track rail arranged so as to pass through a predetermined path; and a vehicle movable along the track rail. The vehicle has an arm for transferring the wafer storage container between the load port and the vehicle, and the track rail has a height from the floor of 50 cm at a position offset from above the load port. More than 3.5m
A wafer transfer device characterized by being arranged at the following positions. 4. The vehicle track switching mechanism according to claim 1, wherein the track rail includes a rotating unit that can rotate with the two vehicles mounted thereon, and switches the relative positions of the two vehicles while rotating the rotating unit. 4. The wafer transfer device according to claim 1, further comprising: 5. An arm reversing mechanism for reversing the direction of an arm of the vehicle on the track rail, and the arm rotating when the direction of the vehicle on the track rail is reversed by the vehicle replacement mechanism. The wafer transfer device according to claim 4, further comprising: a reversal control function of reversing the direction of the arm by a mechanism.