JP2002267758A - X-ray imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small-sized, thin and lightweight X-ray imaging device. SOLUTION: A drive processing circuit board 28 is arranged in the downward inclination part 22b of a support member 22 within a casing 21, whereby the direct radiation of the X-ray incident from above to an electronic part on the drive processing circuit board 28 can be eliminated to prevent the deterioration or malfunction of the electronic part. Since the device can be thinned without reducing the area of the drive processing circuit board 28, and a circuit protective material such as lead plate or the like is dispensed with, the weight of the device can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a thinner, smaller,
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an X-ray imaging apparatus capable of achieving weight reduction and obtaining good images, and particularly to such a cassette type X-ray imaging apparatus.

[0002]

2. Description of the Related Art Conventionally, a film screen system combining an intensifying screen and an X-ray photographic film is often used for X-ray photography. According to this method, the X-ray transmitted through the subject includes internal information of the subject, and the internal information is converted into visible light proportional to the intensity of the X-ray by the intensifying screen, and the visible light is exposed to the X-ray photographic film. Then, an X-ray image is formed on the film.

However, in such a film method, an X-ray image of a patient to obtain a doctor requires a development processing step on the way to the film, and the like takes time and labor problems. Further, the photographed X-ray image film needs to be stored in a hospital or a general clinic for a certain period of time, and the number of such films becomes enormous, which causes a serious problem in management.

[0004] In view of these problems, and with recent technological advances, the medical industry is increasingly demanding X-ray image information using electrical signals. That is, an X-ray imaging apparatus using a semiconductor sensor that converts X-rays into visible light proportional to the intensity of the X-rays using a phosphor and converts the visible light into an electric signal using a photoelectric conversion element is used. Is starting to be.

In recent years, with the development of photoelectric conversion semiconductor materials typified by hydrogenated amorphous silicon (hereinafter abbreviated as a-Si), photoelectric conversion elements and signal processing units have been formed on large-area substrates, and information sources have been developed. The development of contact-type sensors for reading with an optical system of the same magnification is progressing. In particular, a-Si can be used not only as a photoelectric conversion material but also as a semiconductor material of a TFT (thin film field effect transistor), so that the photoelectric conversion semiconductor layer and the semiconductor layer of the TFT can be formed simultaneously. There are advantages.

Further, on a large-area photoelectric conversion substrate on which a photoelectric conversion semiconductor layer and a TFT semiconductor layer are simultaneously formed, a wavelength conversion member comprising a material for converting X-rays into visible light or converting wavelengths is combined. Or, an X-ray imaging apparatus to be arranged is known.

FIG. 4 shows an example of a conventional radiation image capturing system using the above-described semiconductor sensor. An X-ray imaging apparatus 1 has an X-ray having a detection surface on which photoelectric conversion elements are two-dimensionally arranged. image detection panel 2 is built, the X-ray irradiating the subject S from the X-ray generator 3 provided above the X-ray imaging apparatus 1, the X-rays transmitted through the subject S X
It is detected by the line image detection panel 2. The image signal output from the X-ray image detection panel 2 is subjected to digital image processing by an image processor 4 serving as image processing means, and then displayed on a display 5 as an X-ray image of the subject S. Further, such an X-ray image detection panel 2 is built in, and is inserted under a subject lying on a bed or the like or under a sheet, and is a portable X-ray imaging suitable for acquiring an X-ray image of the subject. Devices, ie, cassette type X-ray imaging devices are known.

FIG. 5 is a cross-sectional view of the above-mentioned X-ray imaging apparatus 1. The housing 11 includes a lower housing 11a and an upper housing 11b.
And an upper case 11b that transmits X-rays.
1c is attached. The support member 1 is provided in the housing 11.
2, the support member 12 is fixed to the lower housing 11a by screws or the like at the feet 12a. An X-ray image detection panel 13 in which photoelectric conversion elements are arranged two-dimensionally is adhered and fixed on the support member 12, and a phosphor 14 is provided integrally on the X-ray image detection panel 13. In addition, the X-ray image detection panel 13 is provided via a flexible wiring board 15 having an electronic component 15a such as an IC.
Similarly, it is connected to a peripheral circuit board 16 such as a driving circuit board on which electronic components such as an IC are mounted, and further, on the back surface of the support member 12, another peripheral circuit board 1 such as an interface circuit board is provided.
7 are installed.

In order to prevent deterioration and malfunction due to X-rays, the electronic components 15a and the like are protected by using a protective lead plate 18 or the like, or a metal member made of a heavy metal that is hard to transmit X-rays to the housing 11 is used. Need to be used and protected.

A peripheral circuit board 16 such as a driving circuit board includes
A configuration in which the X-ray image detection panel 13 is fixed on the support member 12 perpendicularly to the X-ray image detection panel 13 or, as shown in FIG. Have been.

[0011]

However, the configuration described above has the following problems. That is,
When the peripheral circuit board 16 is fixed vertically to the X-ray image detection panel 13 as shown in FIG.
The thickness of the X-ray imaging apparatus 1 in the direction perpendicular to the direction requires a thickness equal to or greater than the length of the peripheral circuit board 16 in the same direction, and becomes large.

Also, as shown in FIG.
Are fixed in parallel with the X-ray image detection panel 13, the projection cross-sectional area of the X-ray imaging apparatus 1 in the direction perpendicular to the X-ray image detection panel 13 increases, and the X-ray image detection panel 1
The distance from the X-ray image detection panel 13 to the housing in the direction along 3 also becomes significantly longer.

Further, it is necessary to use an extra protective lead plate 18 or heavy metal member for protecting the electronic component 15a, which causes a problem that the X-ray imaging apparatus 1 becomes heavy. In particular, in the case of the above-described cassette type X-ray imaging apparatus, it is necessary to reduce the size, particularly the thickness and the weight, from the viewpoint of portability and ease of handling.

An object of the present invention is to solve the above problems,
An object of the present invention is to provide an X-ray imaging apparatus that is small, thin, and lightweight, and that can obtain better X-ray images.

[0015]

According to the first aspect of the present invention, there is provided a two-dimensional X-ray image detector, a support member on which the X-ray image detector is mounted, and a support member. An X-ray imaging apparatus, comprising: a circuit board disposed on a side opposite to the X-ray image detector with respect to a member and inclined with respect to a detection surface of the X-ray image detector.

According to a second aspect of the present invention, there is provided the X-ray imaging apparatus according to the first aspect, wherein the X-ray image detector and the circuit board are connected by a flexible wiring board.

According to a third aspect of the present invention, there is provided the X-ray imaging apparatus according to the first aspect, wherein the circuit board is disposed on an inclined surface of the support member.

According to a fourth aspect of the present invention, in the X-ray imaging apparatus according to the first aspect, the inclination angle of the circuit board is set to approximately 45 degrees with respect to a detection surface of the X-ray image detector. Device.

The present invention according to claim 5 is the X-ray imaging apparatus according to claim 1, wherein the circuit board includes one of a drive processing circuit board and a signal processing circuit board.

According to a sixth aspect of the present invention, the X-ray image detector includes a semiconductor sensor having a plurality of photoelectric conversion elements arranged two-dimensionally, and a phosphor arranged on the semiconductor sensor. The X-ray imaging apparatus according to claim 1, wherein:

According to a seventh aspect of the present invention, there is provided a two-dimensional X-ray image detector, a support member on which the X-ray image detector is mounted, and a support member on a side opposite to the X-ray image detector with respect to the support member. A first circuit board disposed at an angle to the detection surface of the X-ray image detector, and a detection surface of the X-ray image detector on a side opposite to the X-ray image detector with respect to the support member. The second is arranged approximately parallel
An X-ray imaging apparatus comprising:

According to an eighth aspect of the present invention, the X-ray image detector and the first circuit board, and the X-ray image detector and the second circuit board are connected by a flexible wiring board. An X-ray imaging apparatus according to claim 7, wherein:

According to a ninth aspect of the present invention, there is provided the X-ray imaging apparatus according to the seventh aspect, wherein the first circuit board is disposed on an inclined surface of the support member.

According to a tenth aspect of the present invention, the tilt angle of the first circuit board is set to approximately 45 degrees with respect to the detection surface of the X-ray image detector. It is an X-ray imaging device.

According to an eleventh aspect of the present invention, in the X-ray imaging apparatus according to the seventh aspect, the first circuit board includes one of a drive processing circuit board and a signal processing circuit board. is there.

According to a twelfth aspect of the present invention, the second circuit board is a drive processing circuit board, a signal processing circuit board, an A / D
The X-ray imaging apparatus according to claim 7, further comprising at least one of a conversion circuit board and an interface circuit board.

According to a thirteenth aspect of the present invention, the X-ray image detector includes a semiconductor sensor having a plurality of photoelectric conversion elements arranged two-dimensionally, and a phosphor arranged on the semiconductor sensor. The X-ray imaging apparatus according to claim 7, wherein:

According to a fourteenth aspect of the present invention, there is provided a photoelectric conversion substrate in which a plurality of sets each including a photoelectric conversion element and a thin film transistor are two-dimensionally arranged at substantially equal intervals, and the photoelectric conversion substrate is driven. A drive processing circuit board, a signal processing circuit board that processes an output from the photoelectric conversion board, and a wavelength conversion member that converts X-rays into visible light, and converts the visible light from the wavelength conversion member into the photoelectric conversion. In an X-ray imaging apparatus configured to perform photoelectric conversion by a substrate, the X-ray imaging apparatus includes a support member on which the photoelectric conversion substrate is mounted, and any one of the drive processing circuit board and the signal processing circuit board is attached to the support member. On the other hand, on the opposite side of the photoelectric conversion substrate, it is disposed at an inclination of approximately 45 degrees with respect to the detection surface of the photoelectric conversion substrate, and the other one of the drive processing circuit substrate and the signal processing circuit substrate is placed on the support member. Is an X-ray imaging apparatus characterized by on the opposite side of the serial photoelectric conversion substrate was substantially arranged in parallel with the detection surface of the photoelectric conversion substrate.

According to a fifteenth aspect of the present invention, there is provided the X-ray apparatus according to the fourteenth aspect, wherein an inclined surface of approximately 45 degrees is formed on a side surface of the support member, and the one processing circuit board is disposed on the inclined surface. An imaging device.

According to a sixteenth aspect of the present invention, the other processing circuit board is disposed on a back surface of the support member.
2. An X-ray imaging apparatus according to (1).

[0031]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the embodiments shown in FIGS. FIG. 1 is a cross-sectional view of an X-ray imaging apparatus according to the present embodiment, FIG. 2 is an exploded perspective view of the X-ray imaging apparatus turned upside down, and FIG. 3 is an X-ray image connecting an X-ray image detection panel and a peripheral circuit board. FIG. 4 shows a developed plan view of the detection module.

The X-ray imaging apparatus according to the present embodiment includes, for example, a photoelectric conversion substrate formed by arranging a plurality of sets each including a photoelectric conversion element and a thin film transistor at substantially equal intervals in a two-dimensional manner; A drive processing circuit board that drives the signal processing circuit board that processes the output from the photoelectric conversion board,
A wavelength conversion member for converting X-rays into visible light. Here, the wavelength conversion member to convert the distribution or X-ray image of the X-rays irradiated through the object into visible light distribution or visible light image, the photoelectric conversion substrate charge by photoelectric conversion of the visible light image distribution or an electrical signal Convert to Further, the X-ray imaging apparatus of the present embodiment has a support member on which, for example, a photoelectric conversion substrate is placed, and one of the drive processing circuit board and the signal processing circuit board is provided on the photoelectric conversion substrate with respect to the support member. On the opposite side, it is disposed at an angle of approximately 45 degrees with respect to the detection surface of the photoelectric conversion substrate,
One of the drive processing circuit board and the signal processing circuit board is arranged on the opposite side of the photoelectric conversion substrate with respect to the support member and substantially parallel to the detection surface of the photoelectric conversion substrate.

The housing 21 includes a lower housing 21a and an upper housing 21.
It is preferable to use a material which has a load resistance and can be reduced in weight. In the present embodiment, a magnesium alloy is used as a lightweight and highly rigid material. A housing lid 21c made of a material having high load resistance and high X-ray transmittance is integrally fixed to the upper housing 21b by bonding or the like. The housing lid 21c is made of carbon fiber reinforced plastic (CFRP). ) Is used.

A support member 22 made of a low-density metal such as a magnesium alloy is disposed on the lower housing 21a, and its foot 22a is screwed to the lower housing 21a. Is the X-ray image detection module 2
3 is adhesively fixed and supported using a silicone resin (Toray Silicone SE9175). In the X-ray image detection module 23, a fluorescent powder (for example, GOS chemical formula: Gd which is a gadolinium-based phosphor) is provided on an X-ray image detection panel 24 including photoelectric conversion elements arranged two-dimensionally on a glass substrate. A phosphor 25 in the form of a film of ₂ O ₂ S) is attached, and an electromagnetic shield plate (not shown), which also serves as a light shield, is adhered thereon.

Flexible wiring boards (TAB) 27 and 32 are connected to the connection electrodes 26 provided on the X-ray image detection panel 24 by an anisotropic conductive adhesive. A drive processing circuit board 28 on which electronic components such as ICs are mounted is connected to the other end of the flexible wiring board 27. In the present embodiment, the drive processing IC 27a is also mounted on the flexible wiring board 27. The drive processing circuit board 28 is fixed by bending the flexible wiring board 27 to the inclined portion 22b inclined obliquely downward and inward at an angle of, for example, 45 degrees on the side surface of the support member 22 with screws or the like.

On the back side of the support member 22, a signal processing circuit board 29, an interface circuit board 30 for exchanging signals with an image processor (not shown), and a digital signal for converting an analog signal from the signal processing circuit. An A / D conversion circuit board 31 is provided. The signal processing circuit board 29 is connected to the X-ray image detection panel 24 via the flexible wiring board 32 as described above, and by bending the flexible wiring board 32, the X-ray image detection panel It is also fixed by screws or the like in parallel with 24. In the present embodiment, the signal processing IC 32 is also provided on the flexible printed circuit board 32.
a has been implemented. Note that a power supply unit 33 for supplying power to each part in the X-ray imaging apparatus is provided in the housing 21.

As the inclination angle of the inclined portion 22b is increased to be closer to the horizontal direction, there is an advantage that the X-ray imaging apparatus can be made thinner and the area for fixing the drive processing circuit board 28 can be increased. However, if the inclination angle is too large, a problem in strength of the support member 22 and a problem in processing occur. Further, the signal processing circuit board 29, the interface circuit board 30, and the A /
Problems such as a reduction in the mounting area of the D conversion circuit board 31 occur.

In the present embodiment, by setting the inclination angle of the inclined portion 22b of the support member 22 to approximately 45 degrees, the projection area of the X-ray imaging device in the normal direction of the imaging surface is not increased. In addition, it is possible to reduce the thickness of the X-ray imaging apparatus and to secure a mounting area for components such as the signal processing circuit board 29, the interface circuit board 30, and the A / D conversion circuit board 31 on the back side of the support member 22. By attaching the drive processing circuit board 28 to the inclined portion 22b as described above, the electronic components 28a mounted on the drive processing circuit board 28 can be arranged so as to be hidden by the X-ray module 23 and the support member 22, and the No lead plate is required, and the weight can be reduced.

In this embodiment, by dividing the peripheral circuit board into a plurality of circuit boards, it is possible to optimize the design of each processing circuit board and to reduce the risk due to the yield.

By arranging the drive processing circuit board 28 and the signal processing circuit board 29 substantially parallel to the detection surface of the X-ray image detection panel 24, the drive processing circuit board 28 and the signal processing circuit board 29 partially overlap. As a result, there is a problem in reducing the thickness of the entire device. Drive processing circuit board 28 and signal processing circuit board 2
9 as well as minimizing the size of at least one of the drive processing circuit board 28 and the signal processing circuit board 29 in the short side direction. By inclining one of the circuit boards 29 at approximately 45 degrees, it is possible to realize a thin and small X-ray imaging apparatus.

In such an X-ray imaging apparatus, the X-ray image detection module 23 is at least two
The processing circuit boards 28 and 29 are connected to the sides by the flexible wiring boards 27 and 32, and are fixedly mounted on the support member 22 and then incorporated in the housing 21. Note that the upper housing 21b and the lower housing 21a to which the housing lid 21c is integrally fixed are fixed by screws or the like, and the X-ray imaging apparatus is completed.

In the X-ray imaging apparatus of the present embodiment,
One signal processing circuit board 29 of the circuit board connected by flexible wiring from at least two adjacent sides of the X-ray image detection panel 24 is arranged on the back side of the support member 22 in parallel with the X-ray image detection panel 24, and Since the drive processing circuit board 28 is disposed below the support member 22 at an angle to the X-ray image detection panel 24, for example, at an angle of about 45 degrees,
It is possible to obtain an X-ray imaging apparatus that is thinner, smaller, or has a smaller frame outside the sensor effective area.

Further, the processing circuit boards 28 and 29 are both X
X-ray image detection module 23, support member 2 for X-ray irradiation
2 and the X-rays are absorbed and attenuated by the phosphor 25, the glass substrate, the support member 22, and the like.
No X-rays are directly irradiated to the electrical components 8 and 29, especially electronic components such as ICs, so that an X-ray imaging apparatus with high reliability and preventing malfunction can be obtained. If a phosphor having a high X-ray absorptivity is used, the effect of protecting the electronic component is further enhanced. Further, there is no need to protect the drive processing IC 27a or the like with a lead plate or the like, and the X-ray imaging apparatus can be reduced in size and weight.

In this embodiment, the case where the drive processing circuit board 28 is disposed on the inclined portion 22b of the support member 22 has been described, but the signal processing circuit board 2 is disposed on the inclined portion 22b.
Needless to say, 9 can be arranged. Further, on the inclined portion 22b, or on each of the inclined portion 22b and the back surface side of the support member 22, how to arrange the peripheral circuit board of what kind of function or processing content is only a design matter, and how to arrange it. Does not depart from the scope of the present invention.

Considering that an X-ray imaging apparatus is used by inserting it between a subject such as a patient and a top plate such as a bed or a table, the thickness of the X-ray imaging apparatus is reduced as in this embodiment. 5 and 6 on the side portion at the front end in the insertion direction and the side portion at the rear end in the insertion direction of the X-ray imaging apparatus, if necessary.
It is preferable to provide an inclined portion as shown in FIG. This makes it easy to insert and discharge the X-ray imaging device between the subject and the top plate, minimize the movement of the subject, or obtain a subject-friendly X-ray imaging device. .

[0046]

According to the present invention as described in the foregoing, it is possible to provide small, the X-ray imaging apparatus thin and lightweight.

[0047] or, according to the present invention, can be provided with mounted electronic components can obtain good X-ray image is protected from X-ray, thin, and X-ray imaging system for a small and light weight.

According to the present invention, since a part or all of a lead plate for protecting a circuit or a part or all of a housing is not required to be heavy metal, a lightweight X-ray imaging apparatus is provided. can do.

According to the present invention, it is possible to provide an X-ray imaging apparatus which is excellent in portability and ease of handling and which is gentle on a subject such as a patient.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of the present embodiment.

FIG. 2 is an exploded perspective view.

FIG. 3 is a plan view of the X-ray image detection module.

FIG. 4 is a configuration diagram of a radiographic image capturing system.

FIG. 5 is a sectional view of a conventional X-ray imaging apparatus.

FIG. 6 is a sectional view of a conventional X-ray imaging apparatus.

[Explanation of symbols]

 Reference Signs List 21 housing 21a lower housing 21b upper housing 21c housing lid 22 support member 22a leg 22b inclined portion 23 X-ray image detection module 24 X-ray image detection panel 25 phosphor 26 connection electrode 27, 32 flexible wiring board 27a Drive processing IC 28 Drive processing circuit board 29 Signal processing circuit board 30 Interface circuit board 31 A / D conversion circuit board 32a Signal processing IC

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 27/14 D (72) Inventor Eiichi Takami 3-2-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. F term (reference) 2G088 EE01 FF02 GG19 GG20 GG21 JJ05 JJ09 JJ29 JJ33 JJ37 LL11 LL12 4M118 AB01 CB11 HA19 HA22 HA23 HA27 5C024 AX12 CX00 EX23 5F088 BA03 BA15 BB07 EA04 JA15 HA03 HA10 HA10

Claims (16)

[Claims] 1. A two-dimensional X-ray image detector, a support member on which the X-ray image detector is mounted, and the X-ray image detector on a side opposite to the X-ray image detector with respect to the support member. An X-ray imaging apparatus, comprising: a circuit board that is arranged to be inclined with respect to the detection surface. 2. The X-ray imaging apparatus according to claim 1, wherein the X-ray image detector and the circuit board are connected by a flexible wiring board. 3. The X-ray imaging apparatus according to claim 1, wherein the circuit board is disposed on an inclined surface of the support member. 4. The X-ray imaging apparatus according to claim 1, wherein an inclination angle of the circuit board is set to approximately 45 degrees with respect to a detection surface of the X-ray image detector. 5. The X-ray imaging apparatus according to claim 1, wherein the circuit board includes one of a drive processing circuit board and a signal processing circuit board. 6. The X-ray image detector includes a semiconductor sensor having a plurality of two-dimensionally arranged photoelectric conversion elements, and a phosphor disposed on the semiconductor sensor. 3. The X-ray imaging apparatus according to claim 1. 7. A two-dimensional X-ray image detector, a support member on which the X-ray image detector is mounted, and the X-ray image detector on the opposite side of the support member from the X-ray image detector. A first circuit board that is arranged obliquely with respect to the detection surface, and a first circuit board that is arranged on the opposite side of the X-ray image detector with respect to the support member and substantially parallel to the detection surface of the X-ray image detector. An X-ray imaging apparatus, comprising: two circuit boards. 8. The X-ray image detector and the first circuit board, and the X-ray image detector and the second circuit board are connected to each other by a flexible wiring board. 8. The X-ray imaging apparatus according to 7. 9. The X-ray imaging apparatus according to claim 7, wherein the first circuit board is disposed on an inclined surface of the support member. 10. The tilt angle of the first circuit board is set to the X angle.
The X-ray imaging apparatus according to claim 7, wherein the angle is set to approximately 45 degrees with respect to a detection surface of the line image detector. 11. The X-ray imaging apparatus according to claim 7, wherein the first circuit board includes one of a drive processing circuit board and a signal processing circuit board. Wherein said second circuit board drive processing circuit board, the signal processing circuit board, X according to claim 7, characterized in that it comprises at least one of the A / D conversion circuit board and an interface circuit board Line imaging device. 13. The X-ray image detector according to claim 7, wherein the X-ray image detector includes a semiconductor sensor having a plurality of photoelectric conversion elements arranged two-dimensionally, and a phosphor arranged on the semiconductor sensor. 3. The X-ray imaging apparatus according to claim 1. 14. A photoelectric conversion substrate in which a plurality of sets each including a photoelectric conversion element and a thin film transistor are two-dimensionally arranged at substantially equal intervals, a drive processing circuit substrate for driving the photoelectric conversion substrate, A signal processing circuit board that processes output from the photoelectric conversion substrate, and a wavelength conversion member that converts X-rays into visible light, and the visible light from the wavelength conversion member is photoelectrically converted by the photoelectric conversion substrate. In the configured X-ray imaging apparatus, there is provided a support member on which the photoelectric conversion board is mounted, and one of the drive processing circuit board and the signal processing circuit board is opposed to the photoelectric conversion board with respect to the support member. And the other side of the drive processing circuit board and the signal processing circuit board is positioned on the opposite side of the photoelectric conversion board with respect to the support member. An X-ray imaging apparatus, wherein the X-ray imaging apparatus is disposed substantially parallel to a detection surface of the photoelectric conversion substrate. 15. The X-ray imaging apparatus according to claim 14, wherein an inclined surface of approximately 45 degrees is formed on a side surface of the support member, and the one processing circuit board is disposed on the inclined surface. 16. The X-ray imaging apparatus according to claim 14, wherein the other processing circuit board is disposed on a back surface of the support member.