JP2002264522A - Phase change type information recording medium - Google Patents

Phase change type information recording medium

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Publication number
JP2002264522A
JP2002264522A JP2001072702A JP2001072702A JP2002264522A JP 2002264522 A JP2002264522 A JP 2002264522A JP 2001072702 A JP2001072702 A JP 2001072702A JP 2001072702 A JP2001072702 A JP 2001072702A JP 2002264522 A JP2002264522 A JP 2002264522A
Authority
JP
Japan
Prior art keywords
recording
layer
phase change
type information
recording medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001072702A
Other languages
Japanese (ja)
Inventor
Michiaki Shinozuka
道明 篠塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP2001072702A priority Critical patent/JP2002264522A/en
Publication of JP2002264522A publication Critical patent/JP2002264522A/en
Pending legal-status Critical Current

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  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Optical Record Carriers And Manufacture Thereof (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a phase change type information recording medium of which the recording power is little and which is excellent in repetitive recording characteristics. SOLUTION: In the phase change type information recording medium enabling recording, erasure and reproduction of information, a layer of a material having a melting point of 970 deg.K or above and thermal conductivity of 50 mW/cmK or below and becoming amorphous is provided adjacently to a recording layer.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は記録層がアモルファ
ス相と結晶相との間で可逆的な相変化することにより情
報の記録、消去、再生を行う相変化型記録媒体に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phase change type recording medium for recording, erasing and reproducing information by reversibly changing a recording layer between an amorphous phase and a crystalline phase.

【0002】[0002]

【従来の技術】融合研(ISOM/ODS99)の発表
においては、基板上に誘電体層(SiN)、再生層(S
b)、誘電体層(SiN)、記録層(GeSbTe)、
誘電体層(SiN)、Airなる構成で、再生層がSb
の場合、Sbがレーザー光により結晶からアモルファス
になりその時発生した近接場により誘電体を通じて近接
場が記録層に達して記録層に高密度記録することができ
ることが発表されている。
2. Description of the Related Art In the presentation of Fusion Research (ISOM / ODS99), a dielectric layer (SiN) and a reproducing layer (S
b), a dielectric layer (SiN), a recording layer (GeSbTe),
The structure is made of a dielectric layer (SiN) and Air, and the reproducing layer is made of Sb.
In this case, it is disclosed that Sb changes from a crystal to an amorphous state by a laser beam, and the near field generated at that time reaches the recording layer through a dielectric to allow high-density recording on the recording layer.

【0003】しかし、実際戻り光が少ないことからC/
Nが20dB以下と小さく、記録再生という意味では現
実的ではなかった。またSbは不安定材料であり、結晶
化しやすく、繰返記録特性的にも問題があった。
However, since the amount of return light is small, C /
N was as small as 20 dB or less, which was not realistic in terms of recording and reproduction. Sb is an unstable material, is easily crystallized, and has a problem in repetitive recording characteristics.

【0004】また高密度記録する場合は現在実用化でき
る、短波長LD(レーザーダイオード)としては青色L
D(約400nm)があるが、このLDを使う場合、最
適記録パワーを小さくする工夫をメディア層構成で行う
と、融点が低く熱伝導率の低い材料を記録層に隣接もし
くは添加すると、記録時に融けて記録が正常にできない
という問題があった。
[0004] In addition, when high-density recording is performed, it can be practically used at present.
D (about 400 nm). When this LD is used, if the device for reducing the optimum recording power is devised in the media layer configuration, if a material having a low melting point and a low thermal conductivity is adjacent to or added to the recording layer, a recording There is a problem that recording cannot be performed normally due to melting.

【0005】また特開平11−348428号公報には
SbTe系相変化材料にAl−Cuを添加しているが熱
伝導率が高く記録感度が悪くなり、高密度記録には適さ
ない。
In Japanese Patent Application Laid-Open No. 11-348428, Al-Cu is added to a SbTe-based phase change material, but the thermal conductivity is high and the recording sensitivity is poor, which is not suitable for high density recording.

【0006】[0006]

【発明が解決しようとする課題】本発明は記録パワーが
少なく、かつ繰返記録特性が良好な相変化型情報記録媒
体を提供することを課題とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a phase change type information recording medium having a low recording power and good repetitive recording characteristics.

【0007】[0007]

【課題を解決するための手段】請求項1の発明において
は、情報の記録、消去、再生を行うことができる相変化
型情報記録媒体において、記録層に隣接して融点が97
0°K以上で、かつ熱伝導率が50mW/cmK以下の
アモルファス化する材料層を設ける。
According to the first aspect of the present invention, in a phase change type information recording medium capable of recording, erasing and reproducing information, a melting point of 97% is provided adjacent to a recording layer.
An amorphous material layer having a temperature of 0 ° K or more and a thermal conductivity of 50 mW / cmK or less is provided.

【0008】請求項2の発明においては、前記材料層に
代えて、前記記録層に融点が970°K以上で、かつ熱
伝導率が50mW/cmK以下のアモルファス化する材
料を添加する。
According to the second aspect of the present invention, instead of the material layer, an amorphous material having a melting point of 970 ° K or more and a thermal conductivity of 50 mW / cmK or less is added to the recording layer.

【0009】請求項3の発明においては、前記材料をG
a2Te3とする。請求項4の発明においては、前記材
料をAgGeTe2とする。請求項5の発明において
は、前記材料をCuGeS3とする。請求項6の発明に
おいては、前記材料をHgSeとする。
In the invention of claim 3, the material is G
a2Te3. In the invention according to claim 4, the material is AgGeTe2. In the invention of claim 5, the material is CuGeS3. In the invention according to claim 6, the material is HgSe.

【0010】請求項7の発明においては、前記材料をC
uGaTe2とする。請求項8の発明においては、前記
材料をCuGaSe2とする。請求項9の発明において
は、前記記録層にSbTeを含ませる。
In the invention of claim 7, the material is C
uGaTe2. In the invention according to claim 8, the material is CuGaSe2. In a ninth aspect of the present invention, the recording layer contains SbTe.

【0011】[0011]

【発明の実施の形態】本発明の実施の形態を図1を参照
して説明する。1はポリカーボネート製の透明な基板で
基板1上に例えばZnS.SiO2,SiNx,TaO
xなどの誘電体材料からなる下部保護層2を形成し、さ
らに例えばAgInSbTe,GeSbTeなどの相変
化材料を用いた記録層3を形成し、次にこの記録層3の
上に融点が970°K以上かつ熱伝導率が50mW/c
mK以下のアモルファス化する材料層4を設ける。材料
層4の材料としてはGa2Te3,AgGaTe2,C
uGeS3,HgSe,CuGaTe2,CuGaSe
2等を用いる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIG. 1 is a transparent substrate made of polycarbonate, for example, ZnS. SiO2, SiNx, TaO
a lower protective layer 2 made of a dielectric material such as x, a recording layer 3 made of a phase change material such as AgInSbTe, GeSbTe, and the like. And the thermal conductivity is 50 mW / c
A material layer 4 that is amorphized below mK is provided. The material of the material layer 4 is Ga2Te3, AgGaTe2, C
uGeS3, HgSe, CuGaTe2, CuGaSe
Use 2 or the like.

【0012】次に例えばZnS.SiO2,SiNxな
どの誘電体材料からなる上部保護層5を形成し、さらに
例えばAl,Al合金Au,Ag,Ag合金などの熱伝
導率の高い材料からなる放熱層6を形成し、その上にU
V効果樹脂層7を形成し、保護膜8で保護する。
Next, for example, ZnS. An upper protective layer 5 made of a dielectric material such as SiO2 or SiNx is formed, and a heat radiation layer 6 made of a material having a high thermal conductivity such as Al, an Al alloy Au, Ag, or an Ag alloy is formed thereon. U
A V effect resin layer 7 is formed and protected with a protective film 8.

【0013】記録層3に隣接して融点が970°K以上
かつ熱伝導率が50mW/cmK以下のアモルファス化
する材料層4を設けることで、熱伝導率が低いので記録
感度も下げかつ融点が高いので記録時にも劣化しなく、
また結晶化とアモルファス化するので記録層3の一部と
して材料設計ができる。
By providing an amorphous material layer 4 having a melting point of 970 ° K or more and a thermal conductivity of 50 mW / cmK or less adjacent to the recording layer 3, the thermal conductivity is low, so that the recording sensitivity is lowered and the melting point is lowered. As it is high, it does not deteriorate during recording,
Further, since the crystallization and the amorphization are performed, the material can be designed as a part of the recording layer 3.

【0014】また、記録パワーが12mWでも記録層3
での記録パワーによる昇温後で970°Kに達しないで
950°K程度である。通常青色LDで記録パワーとし
ては10mW以下であるので融点が970°K以上の材
料を隣接および添加する効果が大きい。
Further, even when the recording power is 12 mW, the recording layer 3
Is about 950 ° K without reaching 970 ° K after the temperature rise due to the recording power. Since the recording power of a blue LD is usually 10 mW or less, the effect of adjoining and adding a material having a melting point of 970 ° K or more is great.

【0015】また通常相変化メディアで記録層に隣接し
ている保護層としてはZnSSiO2を使用しており、
その熱伝導率が500mW/cmK程度であるので約1
0分の1であるので記録感度も良くなる。
In general, ZnSSiO 2 is used as a protective layer adjacent to a recording layer in a phase change medium,
Since its thermal conductivity is about 500 mW / cmK, about 1
Since it is 1/0, the recording sensitivity is improved.

【0016】なお材料層4を形成する前述のアモルファ
ス化する材料を記録層3の組成に添加してもよい。しか
し添加する場合は記録層3全体の10at%以内であれ
ば記録ジッタが悪くならない。
The material for forming the material layer 4 to be amorphized may be added to the composition of the recording layer 3. However, when added, the recording jitter does not deteriorate if it is within 10 at% of the entire recording layer 3.

【0017】材料層4の材料がGa2Te3の場合は融
点が1063°Kであり、熱伝導率が4.7mW/cm
K(300°K)と低いので記録感度も下げかつ記録層
3の記録時にも劣化しない。
When the material of the material layer 4 is Ga 2 Te 3, the melting point is 1063 ° K and the thermal conductivity is 4.7 mW / cm.
Since the temperature is as low as K (300 ° K), the recording sensitivity is lowered and the recording layer 3 is not deteriorated during recording.

【0018】また材料層4の材料がAgGaTe2の場
合は融点が990°Kであり、熱伝導率が10mW/c
mK(300°K)と低いので記録感度も下げかつ融点
が高いので記録層3の記録時にも劣化しない。
When the material of the material layer 4 is AgGaTe2, the melting point is 990 ° K and the thermal conductivity is 10 mW / c.
Since it is as low as mK (300 ° K), the recording sensitivity is lowered and the melting point is high, so that it does not deteriorate even when recording on the recording layer 3.

【0019】また材料層4の材料がCuGeS3の場合
は融点が1030°Kであり、熱伝導率が24mW/c
mK(300°K)と低いので記録感度も下げかつ融点
が高いので記録層3の記録時にも劣化しない。
When the material of the material layer 4 is CuGeS3, the melting point is 1030 ° K and the thermal conductivity is 24 mW / c.
Since it is as low as mK (300 ° K), the recording sensitivity is lowered and the melting point is high, so that it does not deteriorate even when recording on the recording layer 3.

【0020】また材料層4の材料がHgSeの場合は融
点が1070°Kであり、熱伝導率が10mW/cmK
(300°K)と低いので記録感度も下げかつ融点が高
いので記録層3の記録時にも劣化しない。
When the material of the material layer 4 is HgSe, the melting point is 1070 ° K and the thermal conductivity is 10 mW / cmK.
(300 ° K), the recording sensitivity is lowered, and the melting point is high, so that the recording layer 3 does not deteriorate even during recording.

【0021】また材料層4の材料がCuGaTe2の場
合は融点が2400°Kであり、熱伝導率が27mW/
cmK(300°K)と低いので記録感度も下げかつ融
点が高いので記録層3の記録時にも劣化しない。
When the material of the material layer 4 is CuGaTe2, the melting point is 2400 ° K and the thermal conductivity is 27 mW /
Since it is as low as cmK (300 ° K), the recording sensitivity is lowered and the melting point is high, so that it does not deteriorate even when recording on the recording layer 3.

【0022】また材料層4の材料がCuGaSe2の場
合は融点が1970°Kであり、熱伝導率が4240m
W/cmK(300°K)と低いので記録感度も下げか
つ融点が高いので記録層3の記録時にも劣化しない。
When the material of the material layer 4 is CuGaSe 2, the melting point is 1970 ° K. and the thermal conductivity is 4240 m.
Since it is as low as W / cmK (300 ° K), the recording sensitivity is lowered and the melting point is high, so that it does not deteriorate even when recording on the recording layer 3.

【0023】また記録層3にSbTeを少なくとも含ま
せることで、記録マーク(アモルファス)が小さくでき
る材料系であるので、青色LDに対応した高密度記録が
可能となる。
Since the recording layer 3 contains at least SbTe, the recording layer (amorphous material) can be made small, so that high-density recording corresponding to a blue LD can be performed.

【0024】つぎに実験結果を説明する。実験は以下に
示す実施例1〜6および従来例で示す構成で相変化型情
報記録媒体を試作し、実験を行った。
Next, the experimental results will be described. In the experiment, a phase change type information recording medium was prototyped with the configurations shown in the following Examples 1 to 6 and the conventional example, and the experiment was performed.

【0025】 〔実施例1〕 保護膜8 ポリカーボネート 0.6mm UV効果樹脂層7 10μm 放熱層6 Ag95Pd2Cu3 110nm 上部保護層5 TaOx 20nm 材料層4 Ga2Te3 5nm 記録層3 Ag6In6Sb66Te22 10nm 下部保護層2 ZnSSiO2 40nm 基板1 ポリカーボネート 0.6mmExample 1 Protective film 8 Polycarbonate 0.6 mm UV effect resin layer 7 10 μm Heat dissipation layer 6 Ag95Pd2Cu3 110 nm Upper protective layer 5 TaOx 20 nm Material layer 4 Ga2Te3 5 nm Recording layer 3 Ag6In6Sb66Te22 10 nm Lower protective layer 2 ZnS2 ZnSiO2 Polycarbonate 0.6mm

【0026】 〔実施例2〕 保護膜8 ポリカーボネート 0.6mm UV効果樹脂層7 10μm 放熱層6 Ag 100nm 上部保護層5 SiNx 20nm 記録層3 (Ag6In6Sb66Te22)95(AgGaTe2)5 10nm 下部保護層2 ZnSSiO2 40nm 基板1 ポリカーボネート 0.6mmExample 2 Protective film 8 Polycarbonate 0.6 mm UV effect resin layer 7 10 μm Heat dissipation layer 6 Ag 100 nm Upper protective layer 5 SiNx 20 nm Recording layer 3 (Ag6In6Sb66Te22) 95 (AgGaTe2) 5 10 nm Lower protective layer 2 ZnSSiO2 40 nm Substrate 1 polycarbonate 0.6mm

【0027】 〔実施例3〕 保護膜8 ポリカーボネート 0.6mm UV効果樹脂層7 10μm 放熱層6 Ag 150nm 上部保護層5 SiNx 20nm 材料層4 CuGeS3 5nm 記録層3 Ag6In6Sb66Te22 15nm 下部保護層2 ZnSSiO2 40nm 基板1 ポリカーボネート 0.6mmExample 3 Protective film 8 Polycarbonate 0.6 mm UV effect resin layer 7 10 μm Heat dissipation layer 6 Ag 150 nm Upper protective layer 5 SiNx 20 nm Material layer 4 CuGeS3 5 nm Recording layer 3 Ag6In6Sb66Te22 15 nm Lower protective layer 2 ZnSSiO2 40 nm substrate 1 Polycarbonate 0.6mm

【0028】 〔実施例4〕 保護膜8 ポリカーボネート 0.6mm UV効果樹脂層7 10μm 放熱層6 Ag 100nm 上部保護層5 TaOx 15nm 記録層3 (Ag6In6Sb66Te22)97(HgSe)3 12nm 下部保護層2 ZnSSiO2 40nm 基板1 ポリカーボネート 0.6mmExample 4 Protective film 8 Polycarbonate 0.6 mm UV effect resin layer 7 10 μm Heat dissipation layer 6 Ag 100 nm Upper protective layer 5 TaOx 15 nm Recording layer 3 (Ag6In6Sb66Te22) 97 (HgSe) 3 12 nm Lower protective layer 2 ZnSSiO2 40 nm Substrate 1 polycarbonate 0.6mm

【0029】 〔実施例5〕 保護膜8 ポリカーボネート 0.6mm UV効果樹脂層7 10μm 放熱層6 Ag 100nm 上部保護層5 ZnSSiO2 10nm 材料層4 CuGaTe2 5nm 記録層3 Ag6In6Sb66Te22 15nm 下部保護層2 ZnSSiO2 38nm 基板1 ポリカーボネート 0.6mmExample 5 Protective film 8 Polycarbonate 0.6 mm UV effect resin layer 7 10 μm Heat dissipation layer 6 Ag 100 nm Upper protective layer 5 ZnSSiO 2 10 nm Material layer 4 CuGaTe2 5 nm Recording layer 3 Ag6In6Sb66Te22 15 nm Lower protective layer 2 ZnSSiO2 38 nm substrate Polycarbonate 0.6mm

【0030】 〔実施例6〕 保護膜8 ポリカーボネート 0.6mm UV効果樹脂層7 10μm 放熱層6 Ag 100nm 上部保護層5 SiNx 15nm 記録層3 (Ag6In6Sb66Te22)96(CuGaSe2)4 15nm 下部保護層2 ZnSSiO2 40nm 基板1 ポリカーボネート 0.6mmExample 6 Protective film 8 Polycarbonate 0.6 mm UV effect resin layer 7 10 μm Heat dissipation layer 6 Ag 100 nm Upper protective layer 5 SiNx 15 nm Recording layer 3 (Ag6In6Sb66Te22) 96 (CuGaSe2) 4 15 nm Lower protective layer 2 ZnSSiO2 40 nm Substrate 1 polycarbonate 0.6mm

【0031】 〔従来例〕 保護膜8 ポリカーボネート 0.6mm UV効果樹脂層7 10μm 放熱層6 Ag 100nm 上部保護層5 ZnSSiO2 15nm 記録層3 Ag6In6Sb66Te22 15nm 下部保護層2 ZnSSiO2 40nm 基板1 ポリカーボネート 0.6mm[Conventional example] Protective film 8 Polycarbonate 0.6 mm UV effect resin layer 7 10 μm Heat dissipation layer 6 Ag 100 nm Upper protective layer 5 ZnSSiO2 15 nm Recording layer 3 Ag6In6Sb66Te22 15 nm Lower protective layer 2 ZnSSiO2 40 nm Substrate 1 Polycarbonate 0.6 mm

【0032】 〔実験条件〕 LD波長 405nm NA=0.65 EFMパターン(C/N測定時のパターンは3Tの繰り返し ) 記録ストラテジー :図2参照 線速 7m/s 線密度 0.15μm/bit(NA=0.65) トラックピッチ 0.40μm(NA=0.65)[Experimental Conditions] LD wavelength 405 nm NA = 0.65 EFM pattern (pattern during C / N measurement is a repetition of 3T) Recording strategy: See FIG. 2 Linear velocity 7 m / s Linear density 0.15 μm / bit (NA = 0.65) Track pitch 0.40 μm (NA = 0.65)

【0033】〔実験結果〕実施例1〜6および従来例の
ジッタはすべて8%台(クロック・データジッタ)が得
られた。このジッタであれば記録再生条件としては十分
な特性と考えられる。またC/Nも全て40dB以上が
得られた。ジッタ最小となる記録パワーは以下のようで
あった。 実施例1:7.4mW 実施例2:7.0mW 実施例3:7.6mW 実施例4:7.2mW 実施例5:7.0mW 実施例6:7.4mW 従来例 :9.0mW 実施例1〜実施例6は従来例に比べて記録感度として1
−2mW低いパワーで記録することができる。
[Experimental Results] The jitters of Examples 1 to 6 and the conventional example were all on the order of 8% (clock / data jitter). This jitter is considered to be a sufficient characteristic for recording and reproduction conditions. Also, the C / N was all 40 dB or more. The recording power at which the jitter was minimized was as follows. Example 1: 7.4 mW Example 2: 7.0 mW Example 3: 7.6 mW Example 4: 7.2 mW Example 5: 7.0 mW Example 6: 7.4 mW Conventional Example: 9.0 mW Example The recording sensitivity of Examples 1 to 6 is 1 as compared with the conventional example.
Recording can be performed with a power of -2 mW lower.

【0034】[0034]

【発明の効果】請求項1の発明によれば、記録層に隣接
して融点が970°K以上かつ熱伝導率が50mW/c
mK以下のアモルファス化する材料層を設けることで、
熱伝導率が低いので記録感度も下げかつ融点が高いので
記録時にも劣化しない。
According to the first aspect of the present invention, the melting point is 970 ° K or more and the thermal conductivity is 50 mW / c adjacent to the recording layer.
By providing an amorphous material layer of mK or less,
Since the thermal conductivity is low, the recording sensitivity is lowered, and the melting point is high, so that it does not deteriorate during recording.

【0035】請求項2の発明によれば、記録層に融点が
融点が970°K以上かつ熱伝導率が50mW/cmK
以下のアモルファス化する材料を記録層である相変化材
料に添加したことで、熱伝導率が低いので記録感度も下
げかつ融点が高いので記録時にも劣化しない。
According to the second aspect of the present invention, the recording layer has a melting point of 970 ° K or more and a thermal conductivity of 50 mW / cmK.
By adding the following amorphous material to the phase change material as the recording layer, the thermal conductivity is low, the recording sensitivity is lowered, and the melting point is high, so that it does not deteriorate during recording.

【0036】請求項3の発明によれば、記録層に隣接す
る層あるいは添加する材料がGa2Te3で、融点が1
063°Kであり、熱伝導率が4.7mW/cmK(3
00°K)と低いので記録感度も下げかつ融点が高いの
で記録時にも劣化しない。
According to the third aspect of the present invention, the layer adjacent to the recording layer or the material to be added is Ga 2 Te 3 and the melting point is 1
063 ° K and a thermal conductivity of 4.7 mW / cmK (3
00K), the recording sensitivity is lowered, and the melting point is high, so that it does not deteriorate during recording.

【0037】請求項4の発明によれば、記録層に隣接す
る材料あるいは添加する材料がAgGaTe2で、融点
が990°Kであり、熱伝導率が10mW/cmK(3
00°K)と低いので記録感度も下げかつ融点が高いの
で記録時にも劣化しない。
According to the invention of claim 4, the material adjacent to the recording layer or the material to be added is AgGaTe2, the melting point is 990 ° K, and the thermal conductivity is 10 mW / cmK (3
00K), the recording sensitivity is lowered, and the melting point is high, so that it does not deteriorate during recording.

【0038】請求項5の発明によれば、記録層に隣接す
る材料あるいは添加する材料がCuGeS3で、融点が
1030°Kであり、熱伝導率が24mW/cmK(3
00°K)と低いので記録感度も下げかつ融点が高いの
で記録時にも劣化しない。
According to the fifth aspect of the present invention, the material adjacent to the recording layer or the material to be added is CuGeS3, the melting point is 1030 ° K, and the thermal conductivity is 24 mW / cmK (3
00K), the recording sensitivity is lowered, and the melting point is high, so that it does not deteriorate during recording.

【0039】請求項6の発明によれば、記録層に隣接す
る材料あるいは添加する材料がHgSeで、融点が10
70°Kであり、熱伝導率が10mW/cmK(300
°K)と低いので記録感度も下げかつ融点が高いので記
録時にも劣化しない。
According to the sixth aspect of the present invention, the material adjacent to the recording layer or the material to be added is HgSe and the melting point is 10%.
70 ° K and a thermal conductivity of 10 mW / cmK (300
° K), the recording sensitivity is lowered, and the melting point is high, so that it does not deteriorate during recording.

【0040】請求項7の発明によれば、記録層に隣接す
る材料あるいは添加する材料がCuGaTe2で、融点
が2400°Kであり、熱伝導率が27mW/cmK
(300°K)と低いので記録感度も下げかつ融点が高
いので記録時にも劣化しない。
According to the present invention, the material adjacent to the recording layer or the material to be added is CuGaTe2, the melting point is 2400 ° K, and the thermal conductivity is 27 mW / cmK.
(300 ° K), the recording sensitivity is lowered, and the melting point is high, so that it does not deteriorate during recording.

【0041】請求項8の発明によれば、記録層に隣接す
る材料あるいは添加する材料がCuGaSe2で、融点
が1970°Kであり、熱伝導率が4240mW/cm
K(300°K)と低いので記録感度も下げかつ融点が
高いので記録時にも劣化しない。
According to the eighth aspect of the present invention, the material adjacent to the recording layer or the material to be added is CuGaSe2, the melting point is 1970 ° K, and the thermal conductivity is 4240 mW / cm.
Since the temperature is as low as K (300 ° K), the recording sensitivity is lowered, and the melting point is high, so that it does not deteriorate during recording.

【0042】請求項9の発明によれば、記録層がSbT
eを少なくとも含むことで、記録マーク(アモルファ
ス)が小さくできる材料系であるので、青色LDに対応
した高密度記録が可能となる。
According to the ninth aspect of the present invention, the recording layer is made of SbT
Since the material system includes at least e and can reduce the size of a recording mark (amorphous), high-density recording corresponding to a blue LD is possible.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.

【図2】実験条件を示す図である。FIG. 2 is a diagram showing experimental conditions.

【符号の説明】[Explanation of symbols]

1 基板 2 下部保護層 3 記録層 4 材料層 5 上部保護層 6 放熱層 7 UV効果樹脂層 8 保護膜 DESCRIPTION OF SYMBOLS 1 Substrate 2 Lower protective layer 3 Recording layer 4 Material layer 5 Upper protective layer 6 Heat dissipation layer 7 UV effect resin layer 8 Protective film

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 情報の記録、消去、再生を行うことがで
きる相変化型情報記録媒体において、 記録層に隣接して融点が970°K以上で、かつ熱伝導
率が50mW/cmK以下のアモルファス化する材料層
を設けることを特徴とする相変化型情報記録媒体。
1. A phase change type information recording medium capable of recording, erasing and reproducing information, comprising an amorphous material having a melting point of 970 ° K or more and a thermal conductivity of 50 mW / cmK or less adjacent to a recording layer. A phase change type information recording medium, comprising a material layer to be converted.
【請求項2】 前記材料層に代えて、前記記録層に融点
が970°K以上で、かつ熱伝導率が50mW/cmK
以下のアモルファス化する材料を添加したことを特徴と
する請求項1記載の相変化型情報記録媒体。
2. In place of the material layer, the recording layer has a melting point of 970 ° K. or more and a thermal conductivity of 50 mW / cmK.
2. A phase change type information recording medium according to claim 1, wherein the following material for amorphization is added.
【請求項3】 前記材料がGa2Te3であることを特
徴とする請求項1または2記載の相変化型情報記録媒
体。
3. The phase change type information recording medium according to claim 1, wherein said material is Ga2Te3.
【請求項4】 前記材料がAgGeTe2であることを
特徴とする請求項1または2記載の相変化型情報記録媒
体。
4. The phase change type information recording medium according to claim 1, wherein said material is AgGeTe2.
【請求項5】 前記材料がCuGeS3であることを特
徴とする請求項1または2記載の相変化型情報記録媒
体。
5. The phase change type information recording medium according to claim 1, wherein the material is CuGeS3.
【請求項6】 前記材料がHgSeであることを特徴と
する請求項1または2記載の相変化型情報記録媒体。
6. The phase change type information recording medium according to claim 1, wherein the material is HgSe.
【請求項7】 前記材料がCuGaTe2であることを
特徴とする請求項1または2記載の相変化型情報記録媒
体。
7. The phase change type information recording medium according to claim 1, wherein said material is CuGaTe2.
【請求項8】 前記材料がCuGaSe2であることを
特徴とする請求項1または2記載の相変化型情報記録媒
体。
8. The phase change type information recording medium according to claim 1, wherein said material is CuGaSe2.
【請求項9】 前記記録層にSbTeが含まれることを
特徴とする請求項1乃至8のいずれかに記載の相変化型
情報記録媒体。
9. The phase change type information recording medium according to claim 1, wherein the recording layer contains SbTe.
JP2001072702A 2001-03-14 2001-03-14 Phase change type information recording medium Pending JP2002264522A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001072702A JP2002264522A (en) 2001-03-14 2001-03-14 Phase change type information recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001072702A JP2002264522A (en) 2001-03-14 2001-03-14 Phase change type information recording medium

Publications (1)

Publication Number Publication Date
JP2002264522A true JP2002264522A (en) 2002-09-18

Family

ID=18930248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001072702A Pending JP2002264522A (en) 2001-03-14 2001-03-14 Phase change type information recording medium

Country Status (1)

Country Link
JP (1) JP2002264522A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110061103A (en) * 2019-02-28 2019-07-26 华灿光电(苏州)有限公司 GaN base light emitting epitaxial wafer and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110061103A (en) * 2019-02-28 2019-07-26 华灿光电(苏州)有限公司 GaN base light emitting epitaxial wafer and preparation method thereof
CN110061103B (en) * 2019-02-28 2022-05-20 华灿光电(苏州)有限公司 GaN-based light emitting diode epitaxial wafer and preparation method thereof

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