JP2002261213A - Clip for fixing heat sink - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a clip, for fixing a heat sink, which can obtain a superior shock resistance, without spoiling its mounting property. SOLUTION: One or a plurality of upward protrusion parts 122, for removal prevention, whose tips are sharp so as to be capable of biting into protrusions 31 on the front side face and the rear side face of a socket 3 are formed in the lower edges of through-holes 121 in a front-mounting leg part 12A and a rear mounting leg part 12B.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a clip for fixing a heat sink for dissipating heat generated from an integrated circuit to a socket on which an integrated circuit such as a CPU is mounted in electronic equipment such as a personal computer. .

[0002]

2. Description of the Related Art For example, in a desktop personal computer, a socket is mounted on a motherboard disposed in a housing of the personal computer, and a CPU is mounted on the socket. While the computer is running, the CPU
Generates a large amount of heat, and it is necessary to cool the CPU by dissipating this heat to the outside. Therefore, a heat sink is arranged on the CPU to efficiently radiate heat from the CPU. The heat sink usually includes a substrate and a plurality of fins provided on the upper surface of the substrate.
It is mounted on a socket so that heat generated from U can be received on the lower surface of the substrate. When mounting the heat sink on the socket, clips are usually used.

As shown in FIG. 5, this type of clip is a strip-shaped flat portion or groove (6) extending in the front-rear direction provided on the upper surface of a substrate (61) of a heat sink (6) so as to avoid a fin (62).
11), and two front and rear mounting legs (72A) each having a through hole (721) at the lower end where a hole edge is fitted into a projection (31) on the front and rear side surface of the socket (3). ) (72B) and holding part
The front and rear ends of the holding part (71) and the front and rear mounting legs (72A) (72B) so that a spring force can be applied downward to the front and rear mounting legs (72A) and (72B) with respect to (71). And two connecting portions (73A) and (73B) for connecting the upper end to the upper end. The clip (7) is usually formed by press-forming a metal plate such as a spring steel plate or a stainless steel plate.

[0004]

FIG. 5A shows a normal state in which the heat sink (6) is attached to the socket by the clip (7). However, when, for example, a forward external force acts on the heat sink (6) by applying some impact to the housing of the personal computer, as shown in FIG. 5B, the heat sink (6) is connected to the socket (3). ) Is shifted to the front. When the heat sink (6) is largely displaced forward, as shown in FIG. 5C, the front edge of the substrate (61) of the heat sink (6) is connected to the front mounting leg (72A) of the clip (7). Push outward to fit the edge of the through hole (721) in the front mounting leg (72A) into the socket.
Remove from the protrusion (31) of (3), and the heat sink (6)
It will deviate from (3).

In order to prevent the heat sink (6) from coming off the socket (3) in the above case,
It is conceivable to increase the spring force of the clip (7), but this would make the task of attaching the clip (7) difficult.

SUMMARY OF THE INVENTION An object of the present invention is to provide a heat sink fixing clip that can obtain more excellent impact resistance without impairing the mounting property.

[0007]

SUMMARY OF THE INVENTION The present invention relates to a clip for fixing a heat sink for dissipating heat generated from an integrated circuit to a socket on which the integrated circuit is mounted, the clip comprising: A holding portion disposed on the upper surface of the substrate or astride an upper end of a plurality of fins provided on the upper surface of the substrate, and a lower end portion having a through hole whose hole edge is fitted to a projection provided on the front and rear side surfaces of the socket. The front and rear ends of the holding portion and the upper ends of the front and rear outer legs are connected to each other so that a spring force can be applied downward to the holding portion and upward to the front and rear mounting legs. In the one having two front and rear connecting parts, one upper projection for preventing the coming off is provided at the lower edge of the through hole of the front and rear mounting legs so as to be able to bite into the projections on the front and rear side surfaces of the socket. Other is characterized in that provided in plural.

[0008] The socket is usually formed of a synthetic resin, while the clip is usually formed of a metal plate as described above. Therefore, if one or more of the above-mentioned upper protrusions for retaining is provided on the lower edge of the through hole of the front and rear mounting legs of the heat sink fixing clip, and the heat sink is fixed to the socket using the same clip, Since the spring force of the clip itself acts downwardly on the holding portion and upwardly on the front and rear mounting legs, the tip of the upper protrusion for retaining the lower edge of the through hole of the mounting leg portion is formed on the front and rear side surfaces of the socket. Bite into the protrusions. Therefore, even if the heat sink fixed to the socket by the clip acts on the heat sink in the front-rear direction, the heat sink is displaced in the front-rear direction and the substrate of the heat sink presses the mounting leg, the tip of the socket protrudes. The cut-off upper convex portion prevents the edge of the through hole of the clip from coming off the projection. Therefore, according to the present invention, even if the spring force of the clip is not increased until the mountability is impaired, even if an external force acts on the heat sink, the heat sink can be fixed so as not to be easily detached from the socket. A heat sink fixing clip having excellent properties can be obtained.

[0009]

1 to 4 show an embodiment of the present invention. In this embodiment, the present invention is applied to a clip for fixing a heat sink to a socket to which a CPU is attached in a desktop personal computer.

As shown in FIGS. 2 to 4, a synthetic resin socket (3) is mounted on a motherboard (2) provided in a housing (not shown) of a desktop personal computer. The CPU (4) with the package (5) is attached to the socket (3). socket
Projections (31) are provided on the front and rear sides of (3).

As shown in FIGS. 2 to 4, the heat sink (6) includes a substrate (61) and a plurality of fins (62) provided on the upper surface of the substrate (61). In the center of the left and right width of the upper surface of the substrate (61),
A shallow groove (611) extending in the front-rear direction is provided. The fins (62) are provided side by side at predetermined intervals in the front-rear direction on the left and right sides of the groove (611) on the upper surface of the substrate (61). Each of the fins (62) is a thin plate-like member that curves slightly backward when viewed from the side. Each fin (62) has
A vertical slit (621) extending from the upper end to the height center is formed. The heat sink (6) is manufactured, for example, as follows. That is, a heat sink material (not shown) made of an extruded aluminum material having a substrate portion and a cut portion for forming ridge-shaped fins in two rows provided on the upper surface side of the substrate portion is prepared. The heat sink by shaving
(6) is obtained. Note that the heat sink is not limited to the above, and for example, a heat sink made of extruded aluminum having a plurality of plate-shaped fins integrally provided on the upper surface of the substrate, or a plurality of pin-shaped heat sinks formed on the upper surface of the substrate may be used. It may be a heat sink to which fins are joined.

The heat sink fixing clip (1) is shown in FIG.
As shown in FIGS. 4 to 4, the holding portion (11) arranged in the groove (611) on the upper surface of the substrate (61) of the heat sink (6) and the hole edge of the socket (3)
Front and rear two mounting legs (12A) and (12B) each having a through hole (121) at the lower end thereof to be fitted into the protrusions (31) on the front and rear side surfaces of the front and rear mounting legs that face downward with respect to the holding portion (11). (12A) Holding part (11) so that spring force can be applied upward to (12B)
And two connecting portions (13A) and (13B) for connecting the front and rear ends of the front and rear ends and the upper ends of the front and rear mounting legs (12A) and (12B).

The holding portion (11) has a rectangular plate shape, and is arranged at a position slightly forward of the center of the length of the groove (611) on the upper surface of the substrate (61) as shown in FIG. . In addition, a band-shaped flat portion is provided on the upper surface of the substrate (61) instead of the groove (611),
The holding portion (11) may be arranged on the flat portion. When the heat sink has a plurality of pin-shaped fins arranged at a fine pitch on the upper surface of the substrate, the holding portions are arranged on the upper surface of the substrate so as to extend between the pin-shaped fins in the front-rear direction. And a pair of left and right thin band plates for connecting each connecting portion to the front and rear ends of the left and right band plate members of the holding portion and the front and rear mounting legs. May be configured. Further, if the heat sink is provided with a plurality of relatively strong fins such as plate-like fins at an interval in the front-rear direction on the upper surface of the substrate, the holding portion may be provided at the upper end of the plurality of fins. It may be constituted by a band-shaped body arranged over the web.

As shown in FIG. 4, the front and rear mounting legs (12A) (12A)
B) has a substantially vertical strip shape, and the front mounting leg (12A) is slightly shorter than the rear mounting leg (12B). The through-hole (121) of each mounting leg (12A) (12B) is a horizontal rectangular shape, and the lower edge of the hole (121) is a projection (31) of the socket (3).
Is to be caught in. As shown in FIG. 1, the lower edge of the through-hole (121) is provided with an upper projection (1) having a sharp tip so that it can bite into the projections (31) on the front and rear sides of the socket (3).
22) are provided four by four. As shown in detail in FIG. 1 (a), each of the upper convex portions (122) is of a mountain shape with a sharp pointed end, and is arranged so as to form a tooth shape at the lower edge of the through hole (121). .

The front and rear connecting portions (13A) and (13B) are band-shaped members extending upward and outward from the front and rear ends of the holding portion (11) toward the upper ends of the front and rear mounting legs (12A) and (12B). Thus, as shown in FIG. 4, the front connecting portion (13A) is slightly shorter than the rear connecting portion (13B). The rear connecting portion (13B) is bent slightly downward in the middle of its length. Connection part (13A) (13B)
Is formed in an arc shape so as to smoothly connect to the upper ends of the mounting legs (12A) and (12B).

The clip (1) is formed by press-forming a metal plate such as a spring steel plate or a stainless steel plate similarly to the conventional clip (7) shown in FIG.

The fixing of the heat sink (6) to the socket (3) by the clip (1) is performed, for example, as follows.
First, the board (6) is attached to the CPU (4) attached to the socket (3).
1) The heat sink (6) is arranged on the socket (3) so that the center of the lower surface overlaps. Incidentally, a heat conductive resin film (not shown) is usually adhered to the center of the lower surface of the substrate (61). Then, the clip (1) is arranged so that the holding portion (11) and the front and rear connecting portions (13A) (13B) are above the groove (611) on the upper surface of the substrate (61), and the entire clip (1) is arranged. The socket is tilted slightly forward to fit the edge of the through hole (121) of the front mounting leg (12A) into the projection (31) on the front side surface of the socket (3). Next, the clip (1) is returned to its original position, and the holding portion (11) is grooved.
(611), and then push the outer end of the rear connecting portion (13B) downward to fit the edge of the through hole (121) of the rear mounting leg (12B) to the rear surface of the socket (3). Fit the projections (31). Thus, as shown in FIG. 4, the heat sink (6) is
By (1), it is fixed on the socket (3) so as to be pressed against the CPU (4). In this fixed state, the spring force of the clip (1) itself acts downward on the holding portion (11) and upward on the mounting legs (12A) (12B). (12A) (12B) through hole (1
21) The tip of the upper projection (122) for retaining the lower edge is a socket
It digs into the underside of the projection (31) on the front and rear sides of (3).

In the state shown in FIG. 4, when a front or rearward external force acts on the heat sink (6) by applying some impact to the housing, the heat sink (6) shifts forward or rearward, and its substrate ( 61) At the edge of the mounting leg (12A)
(12B) outward, but as described above, the mounting feet (12A) (12
B) through hole (121) upper projection for retaining provided on the lower edge
Since the tip of (122) bites into the projection (31) of the socket (3), the edge of the through hole (121) is prevented from coming off from the projection (31). Thus, according to the clip (1), the through holes (121) of the front and rear mounting legs (12A) (12B) thereof
By the upper convex part (122) for the detent provided on the lower edge,
Prevents the heat sink (6) from moving in the front-rear direction due to the action of external force as in the prior art, and the edges of the through holes (121) of the mounting legs (12A) (12B) from coming off the projections (31) of the socket (3) As a result, excellent impact resistance can be obtained while maintaining the mountability.

The above embodiment is merely an example, and it is a matter of course that the present invention can be implemented with appropriate modifications without departing from the scope of the present invention described in the appended claims.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention, in which (a)
FIG. 2 is a perspective view of a heat sink fixing clip, and FIG. 2B is an enlarged front view of a main part of the clip.

FIG. 2 is an exploded perspective view showing the clip of FIG. 1 together with a socket and a heat sink attached to a motherboard.

FIG. 3 is a perspective view showing a state where a heat sink is fixed on a socket by the clip of FIG. 1;

FIG. 4 is a vertical sectional view showing the same state as FIG. 3;

FIG. 5 is a side view sequentially showing a process in which a heat sink fixed on a socket by a conventional clip shifts and the clip comes off.

[Explanation of symbols]

 (1): Clip (11): Hold-down part (12A) (12B): Mounting leg (121): Through hole (122): Upper convex part for preventing coming off (2): Motherboard (3): Socket (31) : Projection (4): CPU (6): Heat sink (61): Substrate (611): Groove (62): Fin

Claims (1)

[Claims] 1. A clip for fixing a heat sink for dissipating heat generated from an integrated circuit to a socket on which the integrated circuit is mounted, the clip being disposed on or provided on the upper surface of the heat sink. A retaining portion disposed over the upper ends of the plurality of fins, two mounting leg portions having front and rear mounting holes each having a through hole at a lower end portion of which a hole edge is fitted to a projection provided on the front and rear side surfaces of the socket; And two front and rear connecting portions for connecting the front and rear ends of the holding portion and the upper ends of the front and rear outer legs so that a spring force can be applied downward and upward to the front and rear mounting legs. The lower edge of the through hole of the front and rear mounting legs is provided with one or a plurality of upper protrusions for preventing the coming off so as to be able to bite into the projections on the front and rear side surfaces of the socket.
Heat sink fixing clip.