JP2002261121A5 - - Google Patents
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- Publication number
- JP2002261121A5 JP2002261121A5 JP2001053684A JP2001053684A JP2002261121A5 JP 2002261121 A5 JP2002261121 A5 JP 2002261121A5 JP 2001053684 A JP2001053684 A JP 2001053684A JP 2001053684 A JP2001053684 A JP 2001053684A JP 2002261121 A5 JP2002261121 A5 JP 2002261121A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001053684A JP4598968B2 (ja) | 2001-02-28 | 2001-02-28 | ボンディングツール、ならびにボンディング装置、半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001053684A JP4598968B2 (ja) | 2001-02-28 | 2001-02-28 | ボンディングツール、ならびにボンディング装置、半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002261121A JP2002261121A (ja) | 2002-09-13 |
| JP2002261121A5 true JP2002261121A5 (enExample) | 2008-04-17 |
| JP4598968B2 JP4598968B2 (ja) | 2010-12-15 |
Family
ID=18914119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001053684A Expired - Fee Related JP4598968B2 (ja) | 2001-02-28 | 2001-02-28 | ボンディングツール、ならびにボンディング装置、半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4598968B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4529759B2 (ja) * | 2005-03-29 | 2010-08-25 | パナソニック株式会社 | 電子部品装着装置および電子部品装着方法 |
| KR102568186B1 (ko) * | 2015-08-26 | 2023-08-23 | 아리조나 보드 오브 리젠츠 온 비하프 오브 아리조나 스테이트 유니버시티 | 국소화된 초음파 증진식 재료 유동 및 융합을 이용한 적층 제조를 위한 시스템 및 방법 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09162248A (ja) * | 1995-12-11 | 1997-06-20 | Toshiba Corp | ボンディングツール及びボンディング装置 |
| JP3565063B2 (ja) * | 1998-12-09 | 2004-09-15 | 松下電器産業株式会社 | 電子部品の超音波圧着装置および超音波圧着方法 |
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2001
- 2001-02-28 JP JP2001053684A patent/JP4598968B2/ja not_active Expired - Fee Related