JP2002261121A5 - - Google Patents

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Publication number
JP2002261121A5
JP2002261121A5 JP2001053684A JP2001053684A JP2002261121A5 JP 2002261121 A5 JP2002261121 A5 JP 2002261121A5 JP 2001053684 A JP2001053684 A JP 2001053684A JP 2001053684 A JP2001053684 A JP 2001053684A JP 2002261121 A5 JP2002261121 A5 JP 2002261121A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001053684A
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Japanese (ja)
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JP4598968B2 (ja
JP2002261121A (ja
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Priority to JP2001053684A priority Critical patent/JP4598968B2/ja
Priority claimed from JP2001053684A external-priority patent/JP4598968B2/ja
Publication of JP2002261121A publication Critical patent/JP2002261121A/ja
Publication of JP2002261121A5 publication Critical patent/JP2002261121A5/ja
Application granted granted Critical
Publication of JP4598968B2 publication Critical patent/JP4598968B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001053684A 2001-02-28 2001-02-28 ボンディングツール、ならびにボンディング装置、半導体装置の製造方法 Expired - Fee Related JP4598968B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001053684A JP4598968B2 (ja) 2001-02-28 2001-02-28 ボンディングツール、ならびにボンディング装置、半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001053684A JP4598968B2 (ja) 2001-02-28 2001-02-28 ボンディングツール、ならびにボンディング装置、半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2002261121A JP2002261121A (ja) 2002-09-13
JP2002261121A5 true JP2002261121A5 (cg-RX-API-DMAC10.html) 2008-04-17
JP4598968B2 JP4598968B2 (ja) 2010-12-15

Family

ID=18914119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001053684A Expired - Fee Related JP4598968B2 (ja) 2001-02-28 2001-02-28 ボンディングツール、ならびにボンディング装置、半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4598968B2 (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4529759B2 (ja) * 2005-03-29 2010-08-25 パナソニック株式会社 電子部品装着装置および電子部品装着方法
CN113732313B (zh) * 2015-08-26 2024-08-06 代表亚利桑那州立大学的亚利桑那校董会 利用局部超声波增强的材料流和熔合的增材制造系统和方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09162248A (ja) * 1995-12-11 1997-06-20 Toshiba Corp ボンディングツール及びボンディング装置
JP3565063B2 (ja) * 1998-12-09 2004-09-15 松下電器産業株式会社 電子部品の超音波圧着装置および超音波圧着方法

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