JP2002258263A - Data management system in manufacturing of device substrate and method of manufacturing using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a data management system and a method of manufacturing a display device which improve the production efficiency in a display device production process having a cutting process, and reduce the burden of an inspection process. SOLUTION: In the device substrate production process having a cutting process, the data management system has a function of managing data with integrating coordinate axes of a device substrate before and after the cutting into the same coordinate axis.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a data management system for manufacturing a device substrate, and more particularly to a method for manufacturing a device, and more particularly, to a method for manufacturing a display device, and particularly to a method for manufacturing a color filter for liquid crystal.

[0002]

2. Description of the Related Art Conventionally, in a method of manufacturing a device, in particular, in manufacturing a display device, an identification code is attached to an outside of a display device area on a display device substrate to individually manage the substrates individually, Japanese Patent Laid-Open No. 9-105895 proposes a management method for managing an inspection result in an inside inspection process in association with the identification code.

However, when the manufacturing process includes a cutting process, there are inconveniences such as a case where the identification code is lost due to the cutting of the substrate and the management cannot be performed, and a case where the information of the substrate before cutting cannot be specified after the cutting. Occurs.

A management method in a display device manufacturing process having a cutting process has been proposed in Japanese Patent Application Laid-Open No. H11-119204. However, when a substrate is cut, a defect obtained as a result of an automatic inspection performed on a substrate before cutting is obtained. Since the origin is different from the coordinates and the defect coordinates obtained as a result of the automatic inspection performed after cutting, they do not match. For this reason, it has been difficult to provide information obtained by the automatic inspection performed on the pre-cut substrate to the post-cut substrate.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and to improve the production efficiency in a device manufacturing process of a display device or the like having a cutting process and to reduce the load of an inspection process. It is an object of the present invention to provide a data management system and a manufacturing method of a display device which can reduce the number of data management systems.

[0006]

The present invention basically has the following configuration to achieve the above object. That is,
A data management system for manufacturing a device substrate, comprising a function of unifying coordinate axes of a device substrate before and after cutting into the same coordinate axis in a device substrate manufacturing process having a cutting process.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to a color liquid crystal display, a monochrome liquid crystal display,
There are display devices such as an L display, a plasma display, and a micro display. Among them, the manufacture of a color filter for a color liquid crystal display will be described below as an example.

FIG. 1 is a schematic view of a color filter as an example of a display device substrate manufactured according to the present invention.

The color filter substrate 1 has a black matrix provided on a transparent substrate such as glass or plastic, and a plurality of colored layers of three primary colors are arranged on the black matrix.
If necessary, a protective film layer and a transparent conductive film layer are formed thereon. As the black matrix, a resin black matrix composed of a resin and a light-shielding material, or a black matrix using an opaque film composed of a metal such as Cr or Ni or an oxide thereof are preferably used. Or a color filter that does not use a black matrix.

The identification code 2 is preferably used in combination with the formation of the black matrix or the formation of each colored layer. Identification code 2 when forming black matrix
The patterning method is also preferable because the identification code 2 is easy to read. In addition, it is necessary to provide the identification code so that at least one or more identification codes 2 are arranged on one substrate after cutting. Identification code 2 requires a serial number,
Further, it is preferable to include information on a product type, information on a board, information on a production lot, information on cutting, information on an arrangement position on a board before cutting, and the like.

In FIG. 1, the identification code 2 is formed in an area where no device is formed. However, if the identification code 2 does not adversely affect device performance such as display performance, the identification code is It may be attached to the device.

The data management system of the present invention uses the color filter substrate 1 obtained as described above. FIG. 2 shows an example of the configuration. In FIG. 2, a solid line indicates a flow of a product, and a broken line indicates a flow of information.

[0013] A brief description will be given of a series of flows. In a color filter manufacturing process 3, a color filter substrate 1 is manufactured.
An automatic inspection is performed by an automatic substrate inspection apparatus 4 before cutting, a substrate is cut into a predetermined size in a cutting step 5, and the cut substrate is automatically inspected by an automatic substrate inspection apparatus 6 after cutting.
Then, in final inspection process 7, shipping inspection (visual inspection etc.)
Is carried out. In the case of a display device substrate having a single display device region, the cutting step cuts a portion outside the display device region to a predetermined size, and in a display device substrate having a plurality of display device regions, a single or This is a step of dividing a plurality of display device regions so as to be arranged. That is, the present invention relates to the production process 3
A data management system for manufacturing device boards, which is composed of hardware and software, including exchanges of processes and devices of the network server 8 and data for linking them.

The present invention is a data management system having the function of unifying the coordinate axes of the device substrate before and after cutting into the same coordinate axis in the device substrate manufacturing process having the cutting process. The functions are not particularly limited, but preferably have the following functions, for example. That is, the defect coordinates detected by the pre-cut substrate automatic inspection apparatus 4 are converted into the coordinate axes of the post-cut substrate according to the post-cut substrate size, and the defect is detected by the post-cut substrate automatic inspection apparatus 6 close to the converted defect coordinates. If detected, a process is performed that regards this as the same as the defect detected by the automatic substrate inspection apparatus 4 before cutting and ignores it. In other words, when a new defect is detected by the automatic substrate inspection apparatus 6 after cutting within an arbitrarily settable range around the coordinates detected by the automatic substrate inspection apparatus 4 before cutting, the defect is detected.
The processing is regarded as the same as the defect detected by the above, and a process of ignoring from the detection result of the automatic substrate inspection apparatus 6 after cutting is added to integrate the inspection result. Note that the closeness cannot be unconditionally determined depending on the size and type of the device substrate, but if it is roughly indicated, it may be 0.02% to 1% (preferably 0.1% to 0%) of the size of the device substrate. .3%). When the value is below the lower limit of the numerical range, the automatic inspection means has, it is not possible to completely absorb the coordinate variation coming from the machine accuracy, and it is not preferable to determine the same defect as another defect.
If the value exceeds the upper limit, different defects existing in different places are determined to be the same defect, which is not preferable.
When the size of the substrate is different in the vertical and horizontal directions like a rectangle, the square root of the area of the substrate is defined as the size of the substrate.

In this case, there is a possibility that the automatic inspection apparatus before and after cutting may react to the same defect, and if either of them may be arranged before and after cutting, the inspection is performed first with a lower possibility of causing an error. Preferably. That is, in FIG. 2, it is preferable that the automatic substrate inspection apparatus 4 before cutting has a lower error probability than the automatic substrate inspection apparatus 6 after cutting. This is because the inspection is performed by the automatic inspection means having the lower error probability first, and as described above, the detected defect is excluded from the downstream inspection, thereby preventing the occurrence of an error having an extra higher probability. Because.

Further, according to the present invention, the substrate before cutting and the arrangement position on the substrate are specified by the information included in the identification code attached to the device substrate after cutting, and the respective substrates before and after cutting are specified. Managing information is also one of the preferred embodiments. That is, all the defect coordinates obtained as a result of the automatic inspection performed by the automatic substrate inspection apparatus 4 before cutting and the automatic substrate inspection apparatus 6 after cutting are converted into a final inspection step 7.
Inspector reads out with the serial number included in the identification code of the board, and performs inspection based on the readout. In this example, the automatic inspection device is installed after passing through the manufacturing process,
In order to improve the yield and operability, it is preferable to arrange in the manufacturing process so that the regeneration process can be performed when a defective product is detected. More preferably, it is arranged before the final inspection step. The identification code includes an optical type and a magnetic tape, and an optical type using a bar code is suitably used. However, an optical type is used so that more information can be identified in a limited space. More preferably, a dimensional code is used.

With respect to a device substrate for which a non-defective product and / or a defective product has been determined by any of the automatic inspection apparatuses, it is possible to select whether or not to make a determination in a subsequent inspection process. Then, for the device board determined to be defective before the cutting step, the automatic inspection result is determined as the final inspection result, so that other automatic inspection and visual inspection are not judged, and the device substrate is discarded in the cutting step. It is preferable to be able to select any of the following: before the cutting, the process is transferred to the regeneration process, or after the cutting process. In other words, the process load is reduced by returning the defective substrate to the regenerating process, or discarding the unreproducible substrate so as not to flow it to the subsequent process.

The present invention is not limited to a display device, but is useful without any limitation as long as the device is manufactured by cutting a device substrate. For example, electronics devices such as LSI, optical devices such as CCD, radio waves, light,
Examples include an intelligent sensor device such as a sound, an odor, a chemical substance, and DNA, a micromechanical device such as a nanomachine or a component thereof, and a composite device thereof.

[0019]

Hereinafter, the present invention will be described in more detail using preferred embodiments, but the efficacy of the present invention is not limited at all by the embodiments used. (1) Formation of Black Matrix and Identification Code A color filter for a color liquid crystal display was manufactured as a display device substrate. 62cm x 7 as a transparent substrate
Using a 5 cm non-alkali glass, a black paste was applied on the glass substrate, and a photosensitive resist film was formed thereon in a laminated state. After that, exposure through a photomask,
After development, a resin black matrix and an identification code were formed. The identification code is composed of numbers, alphabets, and two-dimensional codes, and includes the type of glass substrate, the type of color filter, the production lot, the arrangement position on the substrate before cutting,
Information about serial number and disconnection method can be identified. In addition, the arrangement position of the identification code is arranged at one place with respect to each of the cut substrates. (2) Preparation of Color Filter Substrate On the substrate with black matrix prepared by the method shown in (1) above, each color of RGB is formed by photolithography in the same manner as in the formation of the black matrix.
The layer C was formed as a protective film. Further, an ITO thin film was formed thereon as a conductive film by a sputtering method. (3) Arrangement of an automatic inspection device An automatic inspection device for detecting a protrusion defect generated in a manufacturing process is arranged before a cutting process, and after the cutting process, an automatic inspection device for detecting a defect caused by the cutting process on the cut substrate. The inspection device was arranged. (4) Automatic inspection information flow The defects detected by the automatic substrate inspection apparatus 4 before cutting are linked to the network server 8 connected to the LAN by linking the defect coordinates and the detected size with the serial number stamped on the identification code 2. saved. Since the defect coordinates when the same defect is detected by the automatic substrate inspection apparatus 6 after cutting after passing through the cutting step 5 do not coincide with the defect coordinates when detected by the automatic substrate inspection apparatus 4 before cutting, the The defect coordinates detected by the automatic substrate inspection apparatus 4 were converted into coordinate axes of the substrate after cutting. Thereafter, the defect information on the network server 8 described above is read from the serial number of the board on which the inspection is started, and the defects detected within a 2-mm square centered on the defect coordinates after the conversion are ignored. The processing was performed, and the coordinates and the detected size information of the remaining defects were stored in the network server 8 described above. In this case, since there is a case where a displacement of coordinates occurs due to a margin for cutting when the substrate is cut and chamfered in the cutting step 5, the ignorable range is widened to 2 mm. In the case of a board for which a defect has already been determined as a result of the automatic board inspection apparatus 4 before cutting, the board was discarded in the cutting step 5.

Example 1 An experiment was conducted by applying the manufacturing method and system described in the above (1) to (4) to the manufacture of a color filter for a color liquid crystal display. By discarding the substrate in which the defect was determined before cutting in the cutting process, the waste of processing the defective substrate after the cutting process was reduced by 5%. In addition, shipping inspection is omitted for a substrate that has been determined to be defective in the automatic substrate inspection apparatus after cutting, and when combined with disposal in the cutting process, the total number of shipping inspections has been reduced by about 10%. By displaying the inspection information of the automatic board inspection system before cutting when inspecting the board after cutting,
It was confirmed that the inspection information of the pre-cut substrate automatic inspection device could be fed back to the process without waiting for the shipping inspection. Since a plurality of pieces of defect information are not displayed in the vicinity of the same coordinates with respect to the inspection result of each automatic inspection apparatus, useless analysis work can be omitted, and process feedback can be performed more quickly.
Further, since the inspection result of the substrate before cutting can be displayed in the shipping inspection process by unifying the coordinate axes, the inspection time in the shipping inspection can be reduced to about 3 minutes per sheet.

Comparative Example 1 In the case where the present invention is not used, 5% useless substrates are processed after the cutting step. In addition, only inspection information on the substrate after cutting can be provided for shipping inspection, and the inspection time required about 15 minutes per sheet because there is no information before cutting.

[0022]

According to the present invention, it is possible to establish a system for accurately and quickly feeding back the automatic inspection information to the process in the manufacturing process management of the display device substrate. In addition, by providing the automatic inspection information of the substrate before cutting and the automatic inspection result of the substrate after cutting collectively to the final inspection process, it is possible to simultaneously obtain the effect of improving the accuracy of shipping inspection and the effect of reducing the number of man-hours.

[Brief description of the drawings]

FIG. 1 is a schematic view of a color filter as an example of a display device substrate according to the present invention.

FIG. 2 is a flowchart of an example of a manufacturing process using the visual inspection support system of the present invention.

[Explanation of symbols]

 1: color filter substrate 2: identification code 3: color filter manufacturing process 4: substrate automatic inspection device before cutting 5: cutting process 6: automatic substrate inspection device after cutting 7: visual inspection process 8: network server

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Claims (7)

[Claims] 1. A data management system for manufacturing a device substrate, comprising a function of unifying the coordinate axes of the device substrates before and after cutting into the same coordinate axis in a device substrate manufacturing process having a cutting process. 2. The defect coordinates obtained as a result of inspection performed on a device substrate before cutting and the defect coordinates obtained as a result of inspection performed after cutting the device substrate are unified into the same coordinate axis. 2. The data management system according to claim 1, wherein when the plurality of defect coordinates are close to each other, the defect coordinates are regarded as the same. 3. A substrate before cutting and an arrangement position on the substrate are specified by information included in an identification code attached to the device substrate after cutting, and information on each substrate before and after cutting is managed. 3. The data management system according to claim 1, wherein the data management system is used for manufacturing a device substrate. 4. A method for manufacturing a device substrate, comprising using the data management system in manufacturing a device substrate according to claim 1. 5. The device according to claim 4, wherein for a device substrate for which a non-defective product and / or a defective product has been determined by any one of the automatic inspection devices, whether or not to make a determination in a subsequent inspection process can be selected. Device substrate manufacturing method. 6. A device substrate that is determined to be defective before the cutting step can be discarded in the cutting step, transferred to a regeneration step before cutting, or proceeded to after the cutting step. The method for manufacturing a device substrate according to claim 4, wherein: 7. A method for manufacturing a color filter using the method for manufacturing a device substrate according to claim 4.