JP2002252237A - Method and apparatus for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve loading accuracy of a ball electrode. SOLUTION: A sealing body is divide into individual sealing bodies in the unit of each semiconductor element, before a solder ball is loaded to an external electrode of the sealing body which is sealed by loading a plurality of semiconductor elements on a wiring board, an amount of warpage of the sealing body which is generated at the time of sealing is divided to each individual sealing body. For this reason, the ball electrode can be loaded in a condition in which flatness of the external electrode on a back surface of the sealing body is kept good, and the high loading accuracy of the ball electrode can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a semiconductor device in which a ball electrode is mounted on an external electrode of a sealing body of a semiconductor element or an electrode of the semiconductor element. The present invention also relates to a method and an apparatus for manufacturing a semiconductor device mounted on external electrodes of a wiring board.

[0002]

2. Description of the Related Art In recent years, there has been a demand for miniaturization of electronic equipment and improvement in mounting reliability, and accordingly, various methods for electrically connecting a semiconductor device to a wiring board have been proposed.

Hereinafter, a conventional method for manufacturing a semiconductor device will be described.

FIG. 7 is a flow chart of a conventional semiconductor device manufacturing process.

As shown in FIG. 7, first, the back surface of a semiconductor element is bonded to the front surface of a wiring board using an adhesive (die bonding step).

Next, an electrode of the semiconductor element and an electrode portion formed on the surface of the wiring board are electrically connected by a thin metal wire (a thin metal wire connecting step).

Next, the plurality of semiconductor elements are sealed with a sealing resin on the surface of the wiring board on which the plurality of semiconductor elements are mounted (sealing step).

Thereafter, a ball electrode is mounted on the external electrode on the back surface of the wiring board electrically connected to the electrode portion on the front surface of the wiring board by a through hole inside the wiring board (ball electrode mounting step).

After the wiring board on which the ball electrodes are mounted is passed through an atmosphere at a certain temperature or higher to melt the ball electrodes, the solder is solidified at room temperature (reflow process).

[0010] Then, a boundary portion of the wiring board for each semiconductor element is cut using a blade and divided into individual sealing bodies (sealing body dividing step).

[0011]

However, in the conventional method of manufacturing a semiconductor device, a plurality of ball electrodes are formed on the external electrodes on the back surface of the wiring board before the sealing body of the semiconductor element is cut into individual sealing bodies. At the same time, it had the following issues.

FIG. 8 is a sectional view showing a conventional ball electrode mounting process.

As shown in FIG. 8, a ball electrode 4 is mounted on an external electrode 3 of a wiring board 2 on which a plurality of semiconductor elements 1 are mounted. The electrodes of the semiconductor element 1 are electrically connected to electrode portions (not shown) formed on the surface of the wiring board 2 by thin metal wires 5. Are electrically connected to the external electrodes 3 by through holes formed inside the wiring board 2.

On the other hand, the ball electrode 4 is sucked in the suction hole 7 of the ball electrode mounting head 6.

In the above positional relationship between the wiring board 2 and the ball electrode mounting head 6, a plurality of ball electrodes 4 are simultaneously mounted on the plurality of external electrodes 3 of the wiring board 2. Since is heated in the sealing step, warpage occurs due to internal stress. However, the positions of the suction holes of the ball electrode mounting head 6 where the plurality of ball electrodes are sucked are designed in accordance with the positions of the external electrodes 3 of the flat wiring board 2 before being affected by heating in the sealing step. I have. Therefore, the positions of the external electrodes 3 on the wiring board 2 and the positions of the ball electrodes 4 sucked in the suction holes 7 of the ball electrode mounting head 6 deviate, and all the ball electrodes 4 are accurately positioned on the external electrodes 3 of the wiring board 2. A ball electrode 4 which cannot be mounted and protrudes from the external electrode 3 is generated.

Next, the accuracy of mounting the ball electrodes on the external electrodes of the wiring board will be described.

FIG. 9 shows a state in which the wiring board is warped.
When mounting two ball electrodes on the external electrodes of the wiring board,
FIG. 4 is a diagram illustrating a deviation amount of a ball electrode from an external electrode.

As shown in FIG. 9, when the wiring substrate 2 warps and the external electrode 3 falls a distance d from its original position, a deviation 8 between the center of the external electrode 3 and the center of the ball electrode 4 is obtained.
Occurs. Depending on the relationship between the deviation 8, the size of the ball electrode 4 and the size of the external electrode 3, the ball electrode 4 protrudes from the external electrode 3 and is mounted.

Further, with the recent increase in the diameter of the semiconductor wafer, the semiconductor wafer may be warped before being sealed with a sealing resin. Similarly, when ball electrodes are simultaneously mounted on the external electrodes connected to the electrodes of the wafer, it is difficult to mount the ball electrodes with high accuracy.

On the other hand, as a method of absorbing the warpage of the wiring board 2, a method of correcting the warpage of the wiring board 2 by applying pressure to the wiring board 2 by the ball electrode mounting head 6 can be considered. In addition, problems such as disconnection and cracking of the wiring formed on the wiring board 2 occur.

Furthermore, even if a defective product is present in the semiconductor element or the wiring board, unnecessary ball electrodes are consumed because the ball electrodes are collectively mounted on the back surface electrode portion of the wiring substrate corresponding to the defective product. Resulting in.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a method and an apparatus for manufacturing a semiconductor device for improving the mounting accuracy of a ball electrode.

[0023]

In order to solve the above-mentioned conventional problems, a method of manufacturing a semiconductor device according to the present invention comprises a wiring electrode on at least an upper surface and an external electrode electrically connected to the wiring electrode on a bottom surface. A plurality of semiconductor elements are mounted on the upper surface of the wiring substrate thus formed, and the wiring substrate is cut into individual semiconductor elements and individually sealed with respect to a sealing body in which substantially the entire surface is sealed with a sealing resin. A step of obtaining a stationary body, and a step of arranging a plurality of pieces with the external electrode side of the back surface of the individual sealing body facing upward,
And a step of simultaneously mounting ball electrodes on the external electrodes on the back surfaces of the plurality of individual sealing bodies arranged.

As described above, after dividing the sealing body of the semiconductor element into individual sealing bodies, a plurality of solder balls are simultaneously mounted on the external electrodes on the back surface of the individual sealing body, respectively, whereby the sealing is performed. Since the ball electrode can be mounted on the external electrode of the wiring board in a state of high flatness without being affected by the warpage of the body, the ball electrode can be mounted on the external electrode with high accuracy.

A plurality of semiconductor elements are mounted on an upper surface of a wiring substrate having at least a wiring electrode on an upper surface and external electrodes electrically connected to the wiring electrode on a lower surface, and a substantially entire surface of the upper surface is formed of a sealing resin. In the step of cutting the wiring substrate for each semiconductor element unit to obtain an individual sealing body with respect to the sealing body sealed with, the sealing body is a sealing body that is warped upward or downward. By cutting into individual sealing bodies, the warpage is reduced.

With this, even if the sealing body is heated and warped in the sealing step, the warpage is reduced by cutting the sealing body into individual sealing bodies, so that the amount of deviation between the ball electrode and the external electrode can be reduced. This makes it possible to mount the ball electrode on the external electrode with high accuracy.

A plurality of semiconductor elements are mounted on an upper surface of a wiring board having a wiring electrode on at least an upper surface and external electrodes electrically connected to the wiring electrode on a lower surface, and a substantially entire surface of the upper surface is formed of a sealing resin. In the step of cutting the wiring substrate for each semiconductor element unit to obtain an individual sealed body with respect to the sealed body sealed by the above, the semiconductor device is divided into each semiconductor element unit by a rotating blade.

As described above, by using the rotating blade, the sealing body can be cut with high accuracy in a short time, and an individual sealing body can be formed.

A plurality of semiconductor elements are mounted on an upper surface of a wiring board having a wiring electrode on at least an upper surface and external electrodes electrically connected to the wiring electrode on a lower surface, and a substantially entire surface is formed of a sealing resin. In the step of cutting the wiring board for each semiconductor element unit to obtain an individual sealed body for the sealed body sealed with, the wiring board can mount a plurality of semiconductor elements on one substrate, This is a wiring board that can be cut for each individual semiconductor element.

As described above, by using a wiring board on which a plurality of semiconductor elements can be mounted, a plurality of semiconductor elements can be collectively sealed at the same time, thereby improving productivity.

Further, the bumps formed on the electrodes of the semiconductor element are electrically connected to the wiring electrodes of the wiring board.

As a result, it is possible to reduce the wiring length as well as the size, and the present invention can be applied to a high-frequency device.

Further, the back surface of the semiconductor element is bonded to the upper surface of the wiring board, and the electrode of the semiconductor element and the wiring electrode of the wiring board are electrically connected by a thin metal wire.

This makes it possible to electrically connect the electrodes of the semiconductor element to the electrode portions on the surface of the wiring board by using the wire bonding apparatus.

In addition, a resin is formed on an upper surface of a semiconductor wafer having a plurality of semiconductor elements formed in the surface thereof, and a sealing body provided with external electrodes respectively connected to the plurality of semiconductor elements on the surface of the resin. A step of cutting the semiconductor wafer for each semiconductor element unit to obtain an individual sealing body, a step of arranging a plurality of the individual sealing bodies with the external electrode side facing up, And mounting the ball electrodes simultaneously on the external electrodes of the individual sealing bodies.

[0036] Thereby, after the semiconductor wafer is cut to obtain the individual sealing bodies, the ball electrodes are simultaneously mounted on the external electrodes of the plurality of individual sealing bodies, respectively, so that the mounting accuracy of the ball electrodes is improved. .

In addition, a resin is formed on an upper surface of a semiconductor wafer having a plurality of semiconductor elements formed in the surface thereof, and an external electrode provided on the surface of the resin is provided with external electrodes respectively connected to the plurality of semiconductor elements. On the other hand, in the step of cutting the semiconductor wafer for each semiconductor element unit to obtain an individual sealing body, the sealing body is a sealing body that is warped upward or downward, and cut into individual sealing bodies. This reduces that warpage.

Thus, even if the amount of warpage of the semiconductor wafer increases with the increase in the diameter of the semiconductor wafer, the ball electrode can be precisely formed with respect to the electrode of the semiconductor wafer or the external electrode connected to the electrode of the semiconductor wafer. Can be mounted.

A ball electrode mounting head for sucking and transferring a plurality of ball electrodes by suction holes, and an upper surface of a wiring board having at least a wiring electrode on an upper surface and an external electrode electrically connected to the wiring electrode on a lower surface. The semiconductor element is mounted on
An apparatus for manufacturing a semiconductor device, comprising: a transport jig for arranging a plurality of individual sealing bodies of each semiconductor element unit whose upper surface is sealed with a sealing resin, wherein the plurality of ball electrodes and The external electrodes of the wiring board are aligned with each other, and the ball electrodes are simultaneously mounted on the external electrodes on the back surfaces of the plurality of individual sealing bodies arranged.

Thus, the ball electrode can be mounted on the external electrode of the wiring board in a state of high flatness without being affected by the warpage of the wiring board. Therefore, the ball electrode can be mounted on the external electrode with high precision. Is possible.

Further, a heat-resistant adhesive tape is provided on the upper surface of the transport jig, and an individual sealing body is mounted on the heat-resistant adhesive tape.

Thus, the individual sealing body can be easily fixed on the heat-resistant adhesive tape, and the mounting accuracy of the ball electrode is improved.

[0043]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a method and an apparatus for manufacturing a semiconductor device according to the present invention will be described below with reference to the drawings.

First, a method for manufacturing the semiconductor device of the present embodiment will be described.

FIG. 1 is a flowchart showing each manufacturing process of the method of manufacturing a semiconductor device according to the present embodiment.

As shown in FIG. 1, first, a bump is formed on an electrode of a semiconductor wafer on which a plurality of semiconductor elements have been formed (bump forming step). In the present embodiment, the Au bump is formed by a wire bonding method, but the bump may be formed by a plating method.

Next, the bumps formed on the electrodes of the semiconductor element are directly electrically connected to the wiring electrodes formed on the upper surface of the wiring substrate having the external electrodes formed on the bottom surfaces thereof (flip chip mounting step). . A bonding adhesive containing conductive particles such as silver palladium is attached to the bumps in advance, and the bonding reliability can be improved by curing the conductive adhesive after mounting.

In this embodiment, the semiconductor element and the wiring substrate are flip-chip connected. However, the back surface of the semiconductor element and the upper surface of the wiring substrate are bonded together, and the electrodes of the semiconductor element and the electrode portions on the upper surface of the wiring substrate are connected. May be electrically connected by a thin metal wire.

Then, substantially the entire upper surface of the wiring board is sealed with a sealing resin. That is, a plurality of semiconductor elements mounted on the upper surface of the wiring board are sealed with a sealing resin made of epoxy resin or the like to form a sealed body in which the plurality of semiconductor elements are sealed (sealing step).

Next, a boundary portion of each semiconductor element of the sealing body is cut by dicing with a blade and divided into individual sealing bodies (sealing body dividing step).

Next, a plurality of individual sealing bodies are arranged on the upper surface of the transport jig. At this time, the individual sealing bodies are arranged such that the external electrode side on the back surface of the individual sealing body faces upward. Before arranging the individual sealing bodies on the surface of the transport jig, it is checked whether the individual sealing bodies are non-defective, and by mounting only the non-defective individual sealing bodies on the transport jig, Since the mounting of the ball electrode on the external electrode on the back surface of the defective individual sealing body can be prevented, the production efficiency is improved.

Then, the plurality of ball electrodes sucked in the suction holes of the ball electrode mounting head are aligned with the plurality of external electrodes of the individual sealing body, and the external electrodes on the back surfaces of the plurality of individual sealing bodies are aligned. On the other hand, a plurality of ball electrodes are simultaneously mounted. In addition, by installing a heat-resistant adhesive tape on the surface of the transport jig and mounting the individual sealing body on the heat-resistant adhesive tape, the individual sealed body can be easily fixed to the transport jig. Yes (ball electrode mounting process).

Next, the ball electrodes are melted by passing the plurality of individual sealing bodies on which the ball electrodes are mounted together with the transport jig in an atmosphere at a certain temperature or higher. Thereafter, by cooling the plurality of individual sealing bodies mounted on the transport jig at room temperature, the solder of the external electrodes on the back surface of the individual sealing bodies is solidified (reflow step).

Then, a plurality of individual sealing bodies are arranged and stored in a predetermined tray (tray storing step).

As described above, in the method of manufacturing a semiconductor device according to the present embodiment, after a plurality of semiconductor elements mounted on a wiring board are divided into individual semiconductor elements, a plurality of ball electrodes are simultaneously respectively sealed with a plurality of individual sealing elements. Since it is mounted on the external electrode of the stop,
The amount of warpage of the sealing body generated by heating in the sealing step is dispersed among the plurality of individual sealing bodies after division, and the ball electrode can be mounted with the external electrode being substantially flat. Therefore, the ball electrode can be mounted on the external electrode with high accuracy, so that the problem that the ball electrode is mounted outside the external electrode is eliminated, and the productivity of the semiconductor device can be improved. .

Next, the method of manufacturing the semiconductor device of the present embodiment described with reference to FIG. 1 will be described in detail with reference to the drawings.

The contents common to the above are omitted.

FIG. 2 is a cross-sectional view showing a part of the steps of the method for manufacturing a semiconductor device according to the present embodiment.

As shown in FIG. 2A, a semiconductor wafer 10 on which a plurality of electrodes 9 are formed is prepared.

Next, as shown in FIG. 2B, bumps 11 are formed on each of the electrodes 9. In the present embodiment, the bump 11 is formed by an Au bump by a wire bonding method, but may be formed by a plating method.

Next, as shown in FIGS. 2 (c) and 2 (d), the semiconductor wafer 10 on which the bumps 11 are formed is inverted and flip-chip mounted on the upper surface of a wiring board 12 made of glass epoxy resin. . Here, the sealing resin 13
Is injected between the semiconductor wafer 10 and the wiring substrate 12, heated and cured, and the bumps 11 are electrically connected to the wiring electrodes 14 formed on the upper surface of the wiring substrate 12, so that a plurality of semiconductor elements 15 are mounted. A sealed body 16 is formed.
Then, the semiconductor wafer 10 is diced and cut using a blade together with the wiring substrate 12 and the sealing resin 13 on a straight line passing through the boundary portion 17 for each semiconductor element 15 to form a plurality of individual sealing bodies 18.

An external electrode 19 for mounting a ball electrode is formed on the bottom surface of the wiring board 12.

In the above-mentioned sealing step, the sealing body is heated when the sealing resin is cured, so that the sealing body warps over the entire surface. Are dispersed, so that warpage can be reduced, and mounting of the ball electrode with high accuracy can be realized.

Usually, after a sealed body on which a plurality of semiconductor elements are mounted and sealed is diced with a blade, the individual sealed bodies are stored in a tray with the wiring substrate side down. You. However, since it is necessary to mount the ball electrode on the external electrode formed on the wiring board,
After turning over the individual sealing bodies stored in the tray,
Seals must be arranged on the transport jig.

Therefore, a transport device for turning the individual sealing body upside down is required.

Hereinafter, a transport carrier mounting machine for reversing the front and back of the individual sealing body will be described with reference to the drawings.

FIG. 3 is a perspective view of a carrier mounting machine for turning over the individual sealing body.

As shown in FIG. 3, first, the external electrodes of the individual sealing body 18 are mounted in a plurality of recesses formed on the upper surface of the tray 20 with the external electrodes facing down. A plurality of individual sealing bodies 18 are sequentially
After being attracted and inverted by the chip inversion head 21,
The suction is performed by the chip transfer head 22. At this stage,
The chip transfer head 2 with the external electrodes facing upward
2 is in a state of being adsorbed. In addition, recognition camera 2
3, the recognition accuracy of the chip transfer head 22 is improved by recognizing the recognition mark on the tray 20.

Next, the individual sealing body 18 is transported and stored on the upper surface of the transport jig 24 by the chip transfer head 22.
When a certain number of the individual sealing bodies 18 are arranged on the transport jig 24, the transport jig 24 is moved to and stored in the comb magazine 25.

Next, a process of mounting ball electrodes on the external electrodes of the plurality of individual sealing bodies arranged on the transport jig and performing reflow will be described. In the present embodiment, a solder ball made of solder is used as the ball electrode.

FIG. 4 is a cross-sectional view showing a part of a step following the method of manufacturing the semiconductor device of the present embodiment shown in FIG.

As shown in FIG. 4A, the individual sealing members 18 are arranged so that the wiring substrate 12 is located above the semiconductor wafer 10.
Is stored in the concave portion 26 of the transport jig 24.

Next, as shown in FIGS. 4B and 4C, a plurality of ball electrodes 27 are simultaneously mounted on the external electrodes 19 of the plurality of individual sealing bodies 18, respectively. In the present embodiment, a solder ball made of solder is used as the ball electrode, but other metal particles and a spherical resin coated with a metal film may be used.

Then, the carrier jig 24 is passed through an atmosphere having a temperature equal to or higher than a predetermined temperature together with the plurality of individual sealing bodies 18 to melt the ball electrodes 27, and thereafter, the solder 28 is cured at room temperature. In addition, the individual sealing body 18 can be easily fixed by installing a heat-resistant adhesive tape on the bottom surface of the concave portion 26 of the transport jig 24 and mounting the individual sealing body 18 on the heat-resistant adhesive tape. , External electrode 1 of ball electrode 27
9 is improved in mounting accuracy.

Next, another embodiment of the method of manufacturing a semiconductor device according to the present invention will be described.

Resin is formed on the upper surface of a semiconductor wafer on which a plurality of semiconductor elements are formed, and each semiconductor element is sealed with respect to a sealing body provided with external electrodes respectively connected to the plurality of semiconductor elements on the surface of the resin. A step of obtaining individual sealed bodies by cutting the semiconductor wafer into units, a step of arranging a plurality of individual sealed bodies with the external electrode side facing up, and a step of arranging a plurality of arranged individual sealed bodies on external electrodes. And a step of mounting ball electrodes at the same time.

As described above, since the external electrode connected to the electrode of the semiconductor element is formed on the surface of the resin, the external electrode has mobility, and a highly reliable electrical connection can be ensured. In addition, a ball electrode can be mounted on the external electrode with high accuracy.

In the above embodiment, the sealing body is housed in the concave portion of the transport jig. However, a flat surface of the transport jig where no concave portion is formed is used, and the sealing member or the semiconductor is placed on the surface of the transport jig. The elements may be arranged and mounted.

As described above, according to the manufacturing method of the semiconductor device of the present embodiment, the warpage of the sealing body caused by heating in the sealing step of sealing the sealing body is divided into individual sealing bodies. As a result, the warpage is reduced, and the rear electrodes of the arranged individual sealing bodies can be made flat, so that the ball electrodes can be mounted on the external electrodes of the individual sealing bodies with high accuracy.

Further, when a resin is provided on the upper surface of the semiconductor wafer, external electrodes connected to electrodes of the semiconductor wafer are formed on the surface of the resin, and a ball electrode is mounted on the external electrode. Is divided into individual semiconductor elements, so that the warpage of the semiconductor wafer can be reduced and the electrodes of the arranged individual semiconductor elements can be made flat, so the ball electrodes can be mounted on the individual semiconductor element electrodes with high precision. can do.

Next, an apparatus for manufacturing a semiconductor device according to this embodiment will be described with reference to the drawings.

FIG. 5 is a diagram showing an apparatus for manufacturing a semiconductor device according to the present embodiment.

The same components as those in the embodiment of the semiconductor device manufacturing method described above are denoted by the same reference numerals, and the same contents are omitted. Further, the structure of the sealing body is shown in a simplified manner.

As shown in FIG. 5, a plurality of ball electrodes 27
Is sucked by the suction hole 30 of the ball electrode mounting head 29, and is aligned with the external electrode 19 of the individual sealing body 18 stored in the concave portion 26 of the transport jig 24. Further, in order to improve the wettability of the ball electrode 27 during the reflow, the flux 31 is applied to the surface of the external electrode 19 in advance.
Then, the plurality of ball electrodes 27 are mounted on the external electrodes 19.

Further, by providing a heat-resistant adhesive tape on the bottom surface of the concave portion 26, the individual sealing body 18 can be easily fixed, and the mounting accuracy of the ball electrode 27 can be improved.

FIG. 6 is a diagram showing a method of installing an adhesive tape on a transport jig.

As shown in FIG.
6 has an opening smaller than the bottom of the recess, and the heat-resistant adhesive tape 32 is adhered from the bottom side of the conveying jig to allow the individual sealing body accommodated in the recess 26 to pass through the opening. It becomes possible to fix with the adhesive tape 32. In the case of a transfer jig having a flat surface on which no concave portion is formed, a heat-resistant adhesive tape is provided on the surface of the transfer jig, and the semiconductor element on which the individual sealing body or the resin is formed is placed on the heat-resistant adhesive tape. It may be mounted on.

As described above, according to the semiconductor device manufacturing apparatus of the present embodiment, a plurality of ball electrodes can be simultaneously mounted on a plurality of individual sealing elements or a plurality of individual semiconductor elements on which resin is formed. Therefore, the warpage of the sealing body or the semiconductor wafer before being individually cut is dispersed to each of the sealing bodies or each of the individual semiconductor elements, so that the ball electrodes can be mounted with high accuracy.

[0089]

According to the method and the apparatus for manufacturing a semiconductor device of the present invention, after dividing a plurality of semiconductor element sealing bodies into individual sealing bodies, a plurality of ball electrodes are formed on external electrodes of the plurality of individual sealing bodies. Are simultaneously mounted, so that warpage caused by heating at the time of sealing of the sealing body can be reduced, and the ball electrode can be mounted on the external electrode of the individual sealing body with high accuracy.

Further, when a resin is provided on the upper surface of the semiconductor wafer, and external electrodes connected to the electrodes of the semiconductor wafer are formed on the surface of the resin, and the ball electrodes are mounted on the external electrodes, the semiconductor wafer is also used. Is divided into individual semiconductor elements, so that the warpage of the semiconductor wafer can be reduced and the electrodes of the arranged individual semiconductor elements can be made flat, so the ball electrodes can be mounted on the individual semiconductor element electrodes with high precision. can do.

[Brief description of the drawings]

FIG. 1 is a flowchart showing a method for manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a sectional view showing the method for manufacturing the semiconductor device according to the embodiment of the present invention;

FIG. 3 is a perspective view showing a method for manufacturing a semiconductor device according to one embodiment of the present invention;

FIG. 4 is a sectional view showing the method of manufacturing the semiconductor device according to one embodiment of the present invention;

FIG. 5 is a sectional view showing a semiconductor device manufacturing apparatus according to one embodiment of the present invention;

FIG. 6 is a diagram showing a method for manufacturing a semiconductor device according to one embodiment of the present invention;

FIG. 7 is a flowchart showing a conventional method for manufacturing a semiconductor device.

FIG. 8 is a sectional view showing a conventional method for manufacturing a semiconductor device.

FIG. 9 is a cross-sectional view illustrating a conventional method for manufacturing a semiconductor device.

[Explanation of symbols]

 Reference Signs List 1 semiconductor element 2 wiring board 3 external electrode 4 ball electrode 5 thin metal wire 6 ball electrode mounting head 7 suction hole 8 gap 9 electrode 10 semiconductor wafer 11 bump 12 wiring board 13 sealing resin 14 wiring electrode 15 semiconductor element 16 sealing body 17 Boundary part 18 Individual sealing body 19 External electrode 20 Tray 21 Chip reversing head 22 Chip transfer head 23 Recognition camera 24 Transport jig 25 Com magazine 26 Depression 27 Ball electrode 28 Solder 29 Ball electrode mounting head 30 Suction hole 31 Flux 32 Heat resistance Adhesive tape

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 23/12 501 H01L 23/12 501C 501P

Claims (10)

[Claims] 1. A plurality of semiconductor elements are mounted on an upper surface of a wiring substrate having a wiring electrode on at least an upper surface and external electrodes electrically connected to the wiring electrode on a lower surface, and a substantially entire surface of the upper surface is formed of a sealing resin. A step of cutting the wiring substrate for each semiconductor element unit to obtain an individual sealing body with respect to the sealing body sealed with A method of manufacturing a semiconductor device, comprising: arranging and simultaneously mounting ball electrodes on external electrodes on the back surfaces of the arranged plurality of individual sealing bodies, respectively. 2. A plurality of semiconductor elements are mounted on an upper surface of a wiring substrate having a wiring electrode on at least an upper surface and external electrodes electrically connected to the wiring electrode on a lower surface, and a substantially entire surface of the upper surface is formed of a sealing resin. In the step of cutting the wiring substrate for each semiconductor element unit to obtain an individual sealing body with respect to the sealing body sealed with, the sealing body is a sealing body that is warped upward or downward. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the warpage is reduced by cutting into individual sealing bodies. 3. A plurality of semiconductor elements are mounted on an upper surface of a wiring substrate having a wiring electrode on at least an upper surface and external electrodes electrically connected to the wiring electrode on a lower surface, and a substantially entire surface of the upper surface is formed of a sealing resin. In the step of cutting the wiring substrate for each semiconductor element unit to obtain an individually sealed body with respect to the sealed body sealed by the above, dividing into each semiconductor element unit by a rotating blade. 2. The method for manufacturing a semiconductor device according to item 1. 4. A plurality of semiconductor elements are mounted on an upper surface of a wiring substrate having a wiring electrode on at least an upper surface and external electrodes electrically connected to the wiring electrode on a lower surface, and a substantially entire surface is formed of a sealing resin. In the step of cutting the wiring board for each semiconductor element unit to obtain an individual sealed body for the sealed body sealed with, the wiring board can mount a plurality of semiconductor elements on one substrate, 2. The method for manufacturing a semiconductor device according to claim 1, wherein the wiring substrate can be cut for each individual semiconductor element. 5. The method according to claim 1, wherein the bumps formed on the electrodes of the semiconductor element are electrically connected to the wiring electrodes of the wiring board. 6. The semiconductor device according to claim 1, wherein a back surface of the semiconductor element and an upper surface of the wiring board are bonded to each other, and an electrode of the semiconductor element and a wiring electrode of the wiring board are electrically connected by a thin metal wire. The manufacturing method of the semiconductor device described in the above. 7. A sealing body in which a resin is formed on an upper surface of a semiconductor wafer in which a plurality of semiconductor elements are formed in its surface, and an external electrode connected to each of the plurality of semiconductor elements is provided on the surface of the resin. A step of cutting the semiconductor wafer for each semiconductor element unit to obtain an individual sealing body, a step of arranging a plurality of the individual sealing bodies with the external electrode side facing up, Mounting a ball electrode on each of the external electrodes of the individual sealing body at the same time. 8. A sealing body in which a resin is formed on an upper surface of a semiconductor wafer in which a plurality of semiconductor elements are formed in the plane, and external electrodes respectively connected to the plurality of semiconductor elements are provided on the surface of the resin. In contrast, in the step of cutting the semiconductor wafer for each semiconductor element unit to obtain an individual sealing body,
The method according to claim 7, wherein the sealing body is a sealing body that is warped upward or downward, and the warpage is reduced by cutting the sealing body into individual sealing bodies. 9. A top surface of a wiring board having a ball electrode mounting head for sucking and transporting a plurality of ball electrodes by suction holes, and a wiring electrode on at least an upper surface and an external electrode electrically connected to the wiring electrode on a bottom surface. A semiconductor device is mounted on a semiconductor device, and the upper surface thereof is a semiconductor device manufacturing apparatus comprising a transport jig for arranging a plurality of individual sealing bodies for each semiconductor element unit sealed with a sealing resin, The semiconductor device according to claim 1, wherein the plurality of ball electrodes and the external electrodes of the wiring board are aligned with each other, and the ball electrodes are simultaneously mounted on the external electrodes on the back surface of the arranged plurality of individual sealing bodies. manufacturing device. 10. The apparatus for manufacturing a semiconductor device according to claim 9, wherein a heat-resistant adhesive tape is provided on an upper surface of the transport jig, and an individual sealing body is mounted on the heat-resistant adhesive tape.