JP2002246282A - Shutter, light source and aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deformation and damage due to heating of a reflector for regulating the quantity of exposure or altering the optical path. SOLUTION: A heat ray reflection filter 50 is inserted before illumination light from a light source 1 reaches a shutter blade 4 in a shutter chamber 61 through a window glass 51 in order to reduce the heat rays reaching the shutter blade 4 thus reducing heat shock onto the shutter face. In such a light source, incident angle of illumination light impinging on the filter 50 is made uniform thus stabilizing the optical characteristics of the filter 50.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an illuminator for an exposure apparatus, and more particularly, to a method for manufacturing a semiconductor element such as an IC or LSI, a liquid crystal display element, a thin film magnetic head, or the like by a photolithography process. A so-called exposure shutter device and a light source device using the shutter device for controlling the state of blocking and projecting light from a light source in an illumination system of an exposure device to be used. It is suitable for a light source that emits radiation in a region.

[0002]

2. Description of the Related Art When manufacturing semiconductor elements, liquid crystal display elements, and thin-film magnetic heads, a pattern formed on the surface of an original plate called a mask or a reticle (hereinafter, typically referred to as a mask) using lithography technology. Substrate coated with a photosensitive material called a resist on the surface of a silicon wafer or glass substrate (hereinafter, typically referred to as a wafer)
In order to transfer the light onto the wafer, a projection exposure apparatus that exposes the wafer with illumination light for exposing a resist through the mask is used.

Conventionally, a projection exposure apparatus uses a proximity exposure method in which a mask and a wafer are brought into close contact with or close to each other to perform batch exposure, or scans and exposes an arc-shaped exposure light on an original plate and a wafer via a mirror reflection optical system. A mirror projection exposure method or a step-and-repeat type reduction projection exposure apparatus (so-called stepper) that collectively exposes a reduced exposure image of an original plate while sequentially moving each exposure area on a wafer to an exposure area of a projection optical system. In recent years, a so-called slit scan exposure method in which a mask and a wafer are scanned and moved by using a rectangular, arc-shaped, or slit-shaped exposure area while scanning is performed. Or step and
An exposure apparatus of a scanning system (hereinafter, typically referred to as a slit scanning system) is used.

[0004] These exposure apparatuses generally transfer a pattern by irradiating a mask and a wafer with illumination light from a laser or a light source such as a mercury lamp (hereinafter, referred to as a lamp) that generates a wavelength in an ultraviolet region. Therefore, when the exposure is not performed, the illumination light emitted from the light source is blocked by a shutter device so as to be in a light-blocking state, so that unnecessary exposure is not performed. In particular, in an exposure apparatus that performs batch exposure such as a stepper, a time during which the illumination light is not blocked by the shutter device, that is, a light projection time is a time for exposing the mask and the wafer without any change. Opening and closing time is an important component in controlling the exposure time or exposure amount,
In order to more precisely control the exposure time or the exposure amount, it has been required to increase the opening and closing speed of the shutter and to reduce the cross-sectional area of the illumination light blocked by the shutter.

On the other hand, in recent exposure apparatuses, in order to improve the number of wafers that can be processed per unit time (hereinafter, referred to as throughput), the irradiation energy per unit exposure time tends to increase, and it is a light source. The output of a laser or a mercury lamp is increasing. If the output of the light source is increased in this manner, the shutter device having a structure that blocks light emitted from the light source is exposed to high energy irradiation, and a high energy resistance is required.

[0006] Therefore, in order to drive the shutter blades at high speed, on the one hand, it is required to reduce the weight and thickness of the material and to reduce the external dimensions of the shutter device. The miniaturization inevitably increases the concentration of illumination light applied to the surface of the shutter blades, increasing the energy per unit area and increasing the energy emitted from the light source. Strengthening has been required.

FIG. 10 shows the structure of a shutter device for an exposure apparatus disclosed in Japanese Patent Application Laid-Open No. 9-27446. In FIG. 1, a light source 1 is disposed near a first focal point of an elliptical light collecting mirror 2, and illumination light emitted from the light source 1 is reflected by the elliptical light collecting mirror 2,
The light is once converged near the second focal point of the elliptical converging mirror 2 and then diffused again and transmitted to an illumination optical system (not shown). The shutter device is, for example, as shown in FIG.
The structure is such that the surface of a metal plate having the following thickness is polished so as to have a high reflectance, and the shaped shutter blade 4 is rotated by a motor 5, and the shutter blade 4 is shielded from light in the rotation direction. The part and the light projecting part are arranged in two to four parts. Further, when the shutter blade 4 is inserted near the second focal point of the elliptical condensing mirror 2 and rotated by the power of the motor 5, the illumination light is projected and linked with the rotation angle.
Shading is repeated.

In FIG. 10, reference numerals 51, 52, 53
Is a window glass, and 55 is an input lens. Also, 6
1 is a shutter room, 62 is a ventilation duct, 63 is an air discharge duct, 64 is a blower for blowing cooling air to the shutter blades 4, and 70 and 72 are light rays from the light source 1 reflected by the elliptical converging mirror 2. Illumination light.

[0009]

Here, it is important that the shutter blades 4 are lightweight as described above.
An aluminum plate having a thickness of 1 mm or less is polished to increase the surface reflectance, and a protective film is further provided for the purpose of increasing the reflectance and preventing oxidation.
Since the energy does not reach 00%, a part of the energy on the light source side is stored in the shutter blade 4 as heat, and depends on the degree of increase in the energy on the light source 1 side and the degree of collection of the illumination light on the shutter blade 4. However, there is a disadvantage that the shutter blades 4 are deformed, and furthermore, a part of the shutter blades is melted or damaged, thereby causing an accident that the shutter device cannot function.

According to the present inventors, in the conventional shutter device, the following contents have been confirmed as a typical process (hereinafter referred to as a damage process) that causes the shutter blades 4 to be damaged as described above. FIG. 6 shows the lamp irradiation time on the horizontal axis and the shutter surface temperature on the vertical axis.
The description is given below with reference to FIG. First stage a. Light energy absorption on the shutter surface. b. Thermal energy absorption of the shutter due to heat transfer from the surrounding environment of the shutter (peripheral gas, shutter driving motor, shutter holding parts, etc.). c. Thermal energy absorption of shutter by direct and indirect radiation from light source lamp. Second stage d. The above a. ~ C. Temperature rise on the shutter surface due to Third stage e, a. ~ D. Deterioration of the shutter surface due to (deposition of impurities from inside the shutter, oxidation by reaction with outside air, etc.). Fourth stage f. E. The reflectance of the shutter surface (light irradiation side: mirror surface) decreases due to the Fifth stage g. F. Increases the amount of light energy absorbed by the shutter surface. Sixth stage h. The above g. Local and rapid temperature rise of the shutter surface due to. Seventh stage i. H. Deformation / melting of the shutter temperature rise part due to
Corruption. It is following the process.

[0011] Of course, in the conventional example, there are also those taking measures to prevent the above-mentioned heat generation and damage.
In the shutter device for an exposure apparatus disclosed in JP-A-9-27446 described above, first, the d. Is configured to be blown by a blower 64 with a gas whose temperature has been controlled in order to suppress the rise in temperature described in (1), and to cool the gas. In order to suppress the decrease in reflectivity described in ( ¹ ), the blowing gas is supplied with air filtered by a chemical filter (not shown) to supply ammonium ions (NH ₄ ⁺ ) and sulfate ions ( It is configured to be able to remove substances that cause fogging on the shutter surface, such as SO ₄ ^2- ). However, even in the case of the above-mentioned conventional example, the temperature rise generated on the shutter surface is cooled, and the occurrence of the temperature rise itself is not suppressed.

The present invention has been made in view of the above-mentioned disadvantages associated with the prior art, and it is an object of the present invention to provide an illumination light irradiating the shutter blades 4 with an amount of light which particularly causes a heat generation effect. It is an object of the present invention to provide a shutter device, a light source device, and the like that extend the life of shutter blades and can withstand long-time use by minimizing the length of the shutter blade.

[0013]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a method of blocking and projecting illumination light by inserting and retracting shutter blades in an optical path of illumination light emitted from a light source. A wavelength selecting means is provided between the light source and the shutter blade, and the wavelength selecting means is shaped so that the incident angle of the illumination light is substantially constant. It is characterized by the following. The wavelength selection means is preferably a heat ray cut filter, and the heat ray cut filter may be inserted before the illumination light reaches the shutter blade.

Further, the present invention may be provided with a means for confirming at least one of the deterioration and the change of the shutter blade.

More specifically, in the first aspect of the present invention, as shown in FIG. 2, a window glass 51 is disposed between the light source 1 and the shutter blade 4, and the window glass 51 has a wavelength The window glass 51 has a selection function, and is characterized in that the window glass 51 has a substantially constant incident angle in the entire incident range where the illumination light emitted from the light source 1 is incident. Here, the wavelength selection function will be described in further detail. In the case of the second aspect according to the present invention, the heat ray cutting function is used.
Filter.

In the second aspect according to the present invention, the window glass 51 functioning as a wavelength selecting means such as a heat ray cut filter is provided with an optically functional film coated on its surface or an optical function of the window glass 51 itself. Characteristics, it is possible to exhibit uniform performance in the entire incident range, for example, if the function of the wavelength selection means is a heat ray cut, among the illumination light emitted from the light source 1, The heat ray component, which is not required by the exposure device,
This can be eliminated before reaching the shutter blade 4, so that even if the shutter blade is in a light-shielded state, a rise in temperature due to exposure to illumination light is minimized.

The present invention is also applicable to a light source device having any one of the above-described shutter devices and an exposure apparatus including the light source device.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment of the present invention will be described below with reference to the drawings. Figure 1
1 shows a configuration of a projection exposure apparatus of a so-called slit scan type equipped with an exposure shutter device and a light source device including the shutter device according to the first embodiment of the present invention,
In FIG. 1, illumination light (exposure light) diffused radially from a light source 1 such as a lamp is applied to a condenser mirror 2, but the inner surface of the condenser mirror 2 has a part of a parabolic ellipsoid cut out. The light emitted radially from the first focal point of the condenser mirror 2 has a characteristic of being condensed at the second focal point when reflected on the inner surface of the ellipse. When the bright spot of the light source 1 is arranged so as to coincide with the first focal point of the condenser mirror 2, the illumination light radially diffused from the light source 1 is focused on the second focal point.

At this time, the light source 1 is fixed on a lamp stage (not shown) and can move relative to the condensing mirror 2, but is installed in the lamp stage (not shown). The type of lamp is specified by the lamp identification means, and the exposure control system 44 adjusts the power supplied from the power supply 43 to the light source 1 according to the specified type. In FIG. 1, reference numeral 28 is a diffracted light detection sensor, 38 is a reflected light detection sensor, and 39 and 40 are condenser lenses.

Now, with respect to the illuminating light condensed by the condensing mirror 2 at the second focal position of the mirror, near the converging point, a shutter blade opened and closed by a motor 5 constituting a shutter driving mechanism. When the shutter blades 4 are in an open state, the illumination light passes through the optical path changing mirror 3 and the collimator lens 6.
After being converted into a substantially parallel light beam through the optical path, only the wavelength used for exposure is transmitted by the band-pass filter 48, further passes through the field stop 7, and enters the optical integrator 9 via the first relay lens 8. . Subsequently, the illumination light emitted from the optical integrator 9 further passes through the light amount aperture 10, the second relay lens 12, and the optical integrators 14a and 14b, passes through the illumination system aperture stop 16, and is branched into an optical path by the half mirror 37. .

The half mirror 37 is coated with a semi-transmissive film having a transmittance of 95% or more, so that most of the illumination light is transmitted, but a part of the light is reflected and condensed on the projection light amount detection sensor 41. The output state of the light source 1 is measured, and the detected output of the light source 1 is transmitted to the exposure control system 44 to adjust the output of the power supply 43 that supplies power to the light source 1. By doing so, the adjustment is performed so that the intensity of the illumination light is stabilized at a target value.

On the other hand, the illumination light transmitted through the half mirror 37 passes through the third relay lens 42, and the shape of the illumination area is adjusted by the masking blind 34 arranged on the Fourier transform surface of the optical integrator 14, and subsequently, The illuminance non-uniformity of the illumination light is adjusted by the exposure non-uniformity adjustment blind 32 arranged near the masking blind 34, and is projected on the mask 23 via the fourth relay lens 35, the collimator lens 36 and the reflection mirror 11, The illumination light transmitted through the mask 23 is projected by the projection lens 2.
2 and finally projected onto the wafer 25,
This means that the pattern formed of chromium or the like on 3 is image-transferred onto the wafer 25.

Here, since the wafer is placed on the stage 26, it can be moved within the image forming plane for forming the image of the mask 23 on the stage 24, An image plane illuminometer 27 is provided on the upper side, so that the intensity distribution of the illumination light can be measured within the exposure range of the projection lens 22.

When the shutter blades 4 are in the open state as described above, the shutter blades 4 are not damaged at all. However, in order to block the illumination light from the light source device,
When the shutter blades 4 are in the light-shielded state, the surface temperature starts to rise due to the illumination light, and the damage process of the shutter blades 4 starts.

In the present embodiment, a light source device having the same configuration as that of the conventional example as shown in FIG. 2 will be described first for comparison with the conventional example shown in FIG. 2, the light source device includes a light source 1 such as a lamp and a condenser mirror 2, and includes a shutter blade 4 and a motor 5 in a shutter chamber 61. The shutter chamber 61 is provided with the window glass 5.
1, 52, and 53, and has a ventilation duct 62 and a discharge duct 63. 55 is an input lens. The illumination light emitted from the light source 1 and reflected by the condenser mirror 2 includes a light ray 70 on the outermost periphery and a light ray 72 near the center.

The light source device according to the present embodiment is different from the conventional example in that a shutter chamber 61 sealing the periphery of the shutter device is provided on a surface of a window glass 51 which is an intake of illumination light from the light source 1. The point is that a heat ray cut filter 50 coated with a heat ray reflection film and shaped is provided. The heat rays referred to here mainly refer to electromagnetic waves in the infrared region, but in an exposure apparatus used in a lithography process of a semiconductor element or a liquid crystal display element as shown in the present embodiment,
Since a light beam in the ultraviolet region of about 150 nm to 400 nm is used as the exposure wavelength, the region up to the visible light region may be considered as a heat ray region.

As shown in a reflectance curve 82 in FIG. 7 in which the abscissa represents the wavelength and the ordinate represents the wavelength, for example, the heat ray cut filter 50 made of the heat ray reflection coating has a light ray of a specific wavelength or more. Of the illumination light emitted from the light source 1 and having a wavelength belonging to the heat ray region is reflected before the shutter chamber 61 to reach the surface of the shutter blade 4. This is prevented, and the heat source itself which causes a temperature rise after the first stage of the damage process of the shutter blade 4 is reduced.

Therefore, in the light source device according to the present embodiment, when the change in the surface temperature of the shutter blade 4 is observed,
As shown by the broken line in FIG. 6, the items a. And item c. The temperature rise is suppressed due to a decrease in the amount of energy absorption at the point e. Since the deterioration of the surface of the shutter blade 4 does not occur, no subsequent temperature rise is seen, and the temperature enters an equilibrium state.
Since the shutter device is not used only in the shielded state, when the shutter device is opened, the surface temperature further decreases.

It should be noted that a band-pass filter (narrow-band transmission filter) centering on the exposure wavelength of the exposure apparatus may be used instead of the above-mentioned heat-ray reflection film. Several nm
Although it is designed to increase the transmittance in the transmission region in the wavelength region of several hundred nm from the above, and to reduce the transmittance in both the shorter wavelength region and the longer wavelength region, Often, wavelengths that deviate significantly from the wavelength are not guaranteed. For example, FIG. 9 in which wavelength (nm) is plotted on the horizontal axis and transmittance is plotted on the vertical axis shows an example of the wavelength characteristic of a bandpass filter having a center wavelength of 400 nm. 600n
Although the transmittance at wavelengths of about m to 800 nm is kept low, the transmission of heat rays is sufficiently considered for the wavelengths in the far-infrared region because high transmittance areas are scattered. In order to avoid such inconveniences, in the present embodiment, a heat ray reflection film is used to suppress the rise in the temperature of the surface of the shutter blade 4.

However, in order to further improve the efficiency of eliminating the heat rays by the heat ray reflection film, the reflection surface of the condenser mirror 2 which reflects the illumination light from the light source 1 to the shutter side is made of a heat ray transmission type. It is desirable to use a reflective film.

As described above, in the light source device according to the present invention, the heat load on the surface of the shutter blade 4 is reduced by cutting the heat rays reaching the shutter blade 4, thereby preventing the damage to the shutter blade. However, the present invention proposes a method for further improving the characteristics of the heat ray reflective film.

Generally, a coating such as an anti-reflection film or a heat ray reflection film on the optical element is formed by coating MgF ₂ ,
It is formed by laminating substances such as TiO ₂ and the optical characteristics are adjusted by the combination of the type and thickness of the substance used for the laminated film, but when the incident angle of light to the optical element changes, Since the apparent thickness of the laminated film changes, the wavelength characteristics of the coating also change. For example, even in the case of the above heat ray reflection filter,
When the incident angle of the light beam is as designed, it has the characteristic shown in the wavelength characteristic of the reflectance curve 82 in FIG.
When the angle of the incident light changes, the reflectance at an unintended wavelength increases (or decreases) as in the wavelength characteristic of the reflectance curve 81.

Here, the illumination light in the light source device will be described. In the conventional example shown in FIG. 10, the illumination light reflected by the condenser mirror 2 is collected at the second focal position of the condenser mirror 2. The light ray 7 near the center of the window glass 51
2 is incident at an angle nearly perpendicular, but the outermost ray 70 has an incident angle of several tens of degrees. On the other hand, in the light source device according to the present embodiment, as shown in FIG. 2, the window glass 51 is shaped into a curved surface in accordance with the converging angle of the converging mirror. The light is incident on the window glass 51 at a uniform incident angle.

Therefore, in the light source device according to the present embodiment,
The optical characteristics of the heat ray reflective film formed on the surface of the window glass 51 show stable optical characteristics regardless of the incident position of the illumination light, and the wavelength component of the illumination light applied to the shutter blade 4 is also constant. Has become.

(Second Embodiment) As described above,
According to the present invention, by removing the heat ray portion from the light reaching the shutter blade 4, the thermal shock applied to the shutter blade 4 is reduced as much as possible. For example, as shown in FIG. In addition to the shutter blade 4 that can be opened and closed, a heat-resistant shutter blade 65, which is inferior in drive speed but resistant to thermal shock and covers at least a part of the shutter blade 4, is further added. During the period in which the shutter is kept in the light-shielding state for a long time, for example, when the exposure apparatus is in the operation of changing the illumination conditions or in the operation of replacing the wafer 25, the light is shielded by the heat-resistant shutter blades 65. , Shutter blade 4
It is desirable to add a means for further reducing the load on the shutter blades 4 to reduce the possibility of the shutter blades 4 being damaged.

Further, although an accident such as damage to the shutter blades 4 is prevented by the above-described embodiment, the inspection light from the inspection light source 71 is reflected by the scanning mirror 58 as shown in FIG. By scanning the surface of the shutter blade 4 and detecting the reflected light with the detector 73,
The reflectance of the surface of the shutter blade 4 is periodically observed, and
Whether the surface of the shutter blades 4 has been altered in the third stage of the damage process, changes such as deformation, melting, breakage, etc. have occurred in the seventh stage, or whether the shutter blades 4 are present at the designated position without error It is desirable to provide a means for confirming whether or not this is the case. Note that FIG.
4, 55 is an input lens, 56 is an alignment system mirror, 57 is an illumination system mirror, 61 is a shutter room, 62 is a ventilation duct, and 63 is an air discharge duct.

(Third Embodiment) Up to here, the converging mirror 2 has an elliptic paraboloidal shape, and the illumination light emitted from the light source 1 is converged on the second focal point of the converging mirror 2. Since the case has been described, the shape of the window glass 51 has been described as a curved surface such as a spherical shape. However, what is intended by the present invention is that the incident angles of the light incident on the window glass 51 are substantially equal. For example, as shown in FIG. 5, the shape of the reflecting surface of the condenser mirror 2 is a paraboloid. The illumination light emitted from the light source 1 is arranged to be a substantially parallel light flux, and the light flux is incident on a window glass 51 coated with a heat ray reflective film or the like, and then condensed by a condenser lens. If so, the shape of the window glass 51 for the illumination light to be incident vertically is not a curved surface but a flat surface.

(Embodiment of Device Manufacturing Method) Next, a manufacturing process of a semiconductor device using an exposure apparatus having the above-described shutter device will be described. FIG. 11 shows the flow of the entire semiconductor device manufacturing process. In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and step 4
Is a process of forming a semiconductor chip using the wafer produced by the above-described process, and includes an assembly process such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7). The pre-process and the post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the above-described remote maintenance system. Further, information for production management and apparatus maintenance is also communicated between the pre-process factory and the post-process factory via the Internet or a dedicated line network.

FIG. 12 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented beforehand, and if troubles occur, quick recovery is possible. Can be improved in productivity.

[0040]

As described above, according to the shutter device and the light source device provided with the shutter device according to the present invention, the wavelength selecting means such as a heat ray cut filter among the illumination light emitted from the light source. This makes it possible to eliminate light of components not required by the exposure apparatus at a stage before reaching the shutter blades. Even if the shutter blades are in a fast light state, the temperature rise due to exposure to illumination light Is kept to a minimum.

In particular, the window glass functioning as the heat ray cut filter is characterized in that it is shaped so that the incident angle of the illumination light is substantially constant, and generally has different characteristics depending on the incident angle. The heat ray cut filter acts so as to exhibit uniform optical characteristics over the entire area of the illumination light beam. Therefore, even if the condenser mirror condenses light at a large angle, the performance of the wavelength selecting means can be maintained, and the temperature rise of the shutter blade due to exposure to illumination light can be more effectively suppressed. .
Therefore, according to the present invention, a shutter device that can withstand long-time use and a light source device including the shutter device are realized.

[Brief description of the drawings]

FIG. 1 is a configuration diagram for explaining an exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram for explaining a light source device including a shutter device according to the first embodiment of the present invention.

FIG. 3 is a configuration diagram illustrating a structure of a light source device including a shutter device according to a second embodiment of the present invention.

FIG. 4 is a configuration diagram for explaining a structure of a light source device according to a second embodiment of the present invention.

FIG. 5 is a configuration diagram illustrating a structure of a light source device including a shutter device according to a third embodiment of the present invention.

FIG. 6 is a diagram for explaining a temporal change of a shutter blade.

FIG. 7 is a diagram for explaining characteristics of an optical filter.

FIG. 8 is a perspective view for explaining the shape of a shutter blade.

FIG. 9 is a diagram for explaining characteristics of an optical filter.

FIG. 10 is a configuration diagram illustrating a conventional exposure shutter.

FIG. 11 is a diagram illustrating a flow of a device manufacturing process.

FIG. 12 is a diagram illustrating a wafer process.

[Explanation of symbols]

1: light source, 2: elliptical condensing mirror, 4: shutter blade,
5: motor, 22: projection lens, 23: mask, 25:
Wafer, 50: heat ray cut filter, 51, 52, 5
3: window glass, 55: input lens, 61: shutter chamber, 65: heat-resistant shutter blade, 81: reflectance curve at different incident angles, 82: reflectance curve at an appropriate incident angle.

Claims (7)

[Claims] In the optical path of illumination light emitted from a light source,
In a shutter device that controls the shielding and projection of illumination light by inserting and retracting shutter blades, a wavelength selection unit is provided between the light source and the shutter blades,
The shutter device, wherein the wavelength selection unit is shaped so that an incident angle of the illumination light is substantially constant. 2. The shutter device according to claim 1, wherein said wavelength selecting means is a heat ray cut filter. 3. The shutter device according to claim 2, wherein the heat ray cut filter is inserted before the illumination light reaches the shutter blade. 4. In the optical path of illumination light emitted from a light source,
What is claimed is: 1. A shutter device, comprising: a shutter device for controlling the shielding and projection of illumination light by inserting and retracting a shutter blade, wherein a means for confirming at least one of the deterioration and change of the shutter blade is provided. 5. A light source device comprising the shutter device according to claim 1. 6. An exposure apparatus comprising the light source device according to claim 5. 7. A step of installing a group of manufacturing apparatuses for various processes including the exposure apparatus according to claim 6 in a semiconductor manufacturing plant, and a step of manufacturing a semiconductor device by a plurality of processes using the group of manufacturing apparatuses. A semiconductor device manufacturing method, comprising: