JP2002233796A - Method and apparatus for forming thin film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming a thin film on a substrate by preparing organic EL material solutions only in amounts to be used without preparing excess amounts of the solutions, and an apparatus for the method. SOLUTION: The apparatus 1 for forming the thin film has mist generators 3a, 3b, and 3c, a mist accumulation tank 7 which is connected to respective mist generators 3a, 3b, and 3c respectively through introduction pipes 5a, 5b, and 5c, and ON-OFF valves 9a, 9b, and 9c which are installed in the introduction pipes 5a, 5b, and 5c, respectively. Different organic material solutions are housed in each mist generator 3a, 3b, and 3c, the solutions are converted into the mists of the solutions, the mists are adjusted in a desired ratio by the valves 9a, 9b, and 9c, only necessary amounts of the mists are supplied to the tank 7 to prepare an aimed organic material in the tank 7, and the material is accumulated on the substrate arranged in the tank 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a thin film forming apparatus and a thin film forming method for forming an organic EL material on a substrate.

[0002]

2. Description of the Related Art Conventionally, as a method of forming an organic EL material on a substrate, a spin coating method, a printing method, a vapor deposition method, or the like has been used. In all of these methods, an organic EL material solution having a desired emission color to be applied to a substrate is previously combined with each organic EL material solution having a primary emission color (for example, red, blue, or green). The prepared organic EL material solution is applied, sprayed, or vapor-deposited on the substrate to form a thin film of the organic EL material having the desired emission color on the substrate.

[0003]

However, in each of the above-mentioned means, it is necessary to previously prepare an organic EL material solution to be applied to a substrate from an organic EL material solution to be a primary color. In this case, there is no problem when all of the prepared organic EL material solution is used up, but when it is not used up and surplus, it cannot be separated back to the original primary color and there is no other use. Discarded and wasted.

An object of the present invention is to provide a thin film forming apparatus and a thin film forming method for preparing an organic EL material solution in an amount to be used without producing a surplus amount and forming a film on a substrate.

[0005]

Means for Solving the Problems In order to solve the above problems,
According to the first aspect of the present invention, a plurality of mist generators each containing a different organic material solution, generating a mist by converting the stored organic material solution into a mist, and the inside thereof are covered with a substrate or a mask. The substrate was accommodated, connected to each of the mist generators via each introduction pipe, and the mist flowing from each of the mist generators through each of the introduction pipes was mixed and covered with the accommodated substrate or the mask. A mist depositing tank for depositing the mist on the substrate; and a plurality of on-off valves provided in each of the introduction pipes to adjust the amount and ratio of each mist flowing into the mist depositing tank.

[0006] According to a second aspect of the present invention, there is provided a process for accommodating a substrate or a substrate covered with a mask in a mist deposition tank.
Each of the plurality of organic material solutions is misted, and each of the misted organic material solutions is fed into the mist deposition tank in a desired amount and in a desired ratio, and is diffused into the mist deposition tank and mixed with each other to form the substrate. Depositing on a substrate coated on or with the mask.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view of a thin film forming apparatus according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1, and FIG. FIG. 4 is a view for explaining the structure of the substrate loading / unloading table, FIG. 4 is a view as viewed from the direction of arrow IV in FIG. 1, and FIG. 5 is a cross-section of a fixing jig disposed on the substrate loading / unloading table. FIG. 6 is a diagram illustrating a state where a substrate and a metal mask are placed on the substrate loading / unloading table.

[0008] The thin film forming apparatus 1 according to this embodiment comprises:
As shown in FIG. 1 and FIG. 2, a plurality (three in FIG. 1) of mist generators 3a, 3b, 3c and respective introduction pipes 5a, 5b,
A mist depositing tank 7 connected to each of the mist generating devices 3a, 3b, 3c via the respective mist generating devices 5c, a plurality of on-off valves 9a, 9b, 9c provided respectively in the introduction pipes 5a, 5b, 5c; And a board loading / unloading table 13 inserted and inserted into the apparatus 7.

Each mist generator 3a (3b, 3c)
As shown in FIG. 2, different organic material solutions 15a
(15b, 15c) is mist (atomized) and mist (atomized particles) of the organic material solution 15a (15b, 15c)
And a solution storage tank 19a (19b, 19c) for storing the organic material solution 15a (15b, 15c) serving as a mist raw material, and a solution storage tank 19a (19).
b, 19c) contained in the organic material solution 15a (15
b, 15c) by ultrasonic vibration of the ultrasonic transducer 21a (21b, 21c).

The solution storage tanks 19a (19b, 19c)
For example, it is formed in a rectangular parallelepiped box shape and the inside is formed in a closed space, and the ultrasonic vibrators 21a (21b, 21b)
c) is arranged, and the organic material solution 15a (15
b, 15c) is poured and the organic material solution 15 is
a (15b, 15c) is accommodated, and the organic material solution 15a (15b, 15c), that is, the mist, which is mist-formed by the ultrasonic vibrator 21a (21b, 21c), is collected in the space above.

Here, the organic material solutions 15a, 15b, 1
5c, for example, when forming an organic light emitting film of an organic EL display panel, a predetermined polymer organic material such as polyfluorene is dissolved in a predetermined solvent such as a xylene solution at 1% by weight, for example. Is used. Further, in this case, as the ultrasonic transducers 21a, 21b, 21c, those whose frequency is set in a range of several kHz to several MHz, for example, are used.

The solution storage tanks 19a (19b, 19b)
An opening to which one end opening of the introduction pipe 5a (5b, 5c) is connected is formed on one side wall of c). Here, for example, the opening is formed in the solution storage tank 19a (19b, 19c).
Of the solution storage tank 19a (19b, 19c)
The entire upper side of the organic material solution 15a (15b, 15c) is opened from near the upper surface thereof.

Each of the introduction pipes 5a, 5b, 5c is connected to a solution storage tank 19a, 19b, 1 of the mist generator 3a, 3b, 3c.
The mist collected in the space above 9c is sent into the mist depositing tank 7 by natural diffusion of the mist.
a, 3b, 3c are connected to the openings formed in the side walls of the solution storage tanks 19a, 19b, 19c, and the other end openings are connected to the upper wall of the mist deposition tank 7.

At this time, the opening at one end of each of the introduction pipes 5a (5b, 5c) is gradually widened to the left and right sides as going toward one end thereof (this portion is referred to as a tapered wall portion 23), and the upper side is opened. The mist generating device 3 is also formed by being gradually inclined and expanded (this portion is referred to as an inclined wall portion 25).
a (3b, 3c) solution storage tank 19a (19b, 19c)
c) is connected to the opening formed in the side wall.

In this connected state, as shown in FIG. 2, the lower side 2 of one end opening of each of the introduction pipes 5a (5b, 5c) is provided.
4 is connected near above the liquid surface of the organic material solution 15a (15b, 15c) stored in the solution storage tank 19a (19b, 19c), and the liquid surface and the introduction pipe 5a (5b, 5c) are connected.
c) The step with the lower side 24 is almost eliminated, and the mist floating near the liquid surface naturally diffuses without being hindered by the step and flows into the introduction pipe 5a (5b, 5c). ing. Further, as shown in FIGS. 1 and 2, the tapered wall portion 23 and the inclined wall portion 25 of each of the introduction pipes 5a, 5b, 5c.
Of each of the openings of the solution storage tanks 19a (1
9b, 19c), the left and right walls 80L, 8 adjacent to the opening
OR and the upper wall 80U are connected to the respective side portions of the opening,
Left and right walls 80 in solution storage tanks 19a (19b, 19c)
The mist floating near the inner surfaces of the L, 80R and the upper wall 80U smoothly and naturally diffuses along the tapered wall portion 23 and the inclined wall portion 25 of the introduction pipe 5a (5b, 5c).
It is designed to flow into (5b, 5c).

Further, the other end openings of the introduction pipes 5a, 5b, 5c are gathered at one place above the center of the upper wall of the mist accumulation tank 7 and connected to the center of the upper wall of the mist accumulation tank 7. .
Thereby, the mist from each of the mist generators 3a, 3b, 3c is mixed with each other, flows into the mist deposition tank 7, and is evenly diffused in the mist deposition tank 7.

For each of the on-off valves 9a, 9b, 9c, for example, a shutter that can be continuously opened and closed from fully open to fully closed is used. Thereby, not only the flow of the mist flowing in each of the introduction pipes 5a, 5b, 5c is opened / closed by the on-off valves 9a, 9b, 9c, but also the flow rate (quantity) and the flow rate ratio (ratio) can be adjusted. Is done.

As shown in FIG. 1, the on-off valves 9a, 9b and 9c are arranged at an equal distance from a portion 90 where the introduction pipes 5a, 5b and 5c are connected to one another. Thereby, when each of the on-off valves 9a, 9b, 9c is opened, the mist flowing through each of the introduction pipes 5a, 5b, 5c flows into the mist deposition tank 7 without a time difference and is uniformly mixed.

The on-off valves 9a, 9b, 9c
Is manually opened and closed, for example.

The mist deposition tank 7 has a rectangular parallelepiped box shape, for example, and has an internal space 27 formed as a closed space large enough to accommodate a substrate 29 covered with the metal mask 11 in a horizontal posture. And in the center of the upper wall, as described above,
The other end side of each of the introduction pipes 5a, 5b, 5c is gathered and connected at one location above the introduction pipes 5a, 5b, 5c.
The mist from each of the mist generators 3a, 3b, 3c taken into the internal space 27 through b, 5c is deposited via the metal mask 11 on the substrate 29 housed in the internal space 27. I have.

As shown in FIG. 2 and FIG. 4, one side wall of the mist deposition tank 7 has, for example, a rectangular shape for inserting and removing the substrate loading / unloading table 13 into / from the mist deposition tank 7. Is formed. The loading / unloading port 33 has a width (width in the x direction) substantially equal to the width of the substrate loading / unloading table 13 and a height (width in the z direction) on the substrate loading / unloading table 13. It is formed to have a size larger than the height from the lower surface 37d of the substrate loading / unloading base 13 to the upper surface of the metal mask 11 in a state where the substrate 29 and the metal mask 11 are placed.

As shown in FIG. 2, the lower edge 33d of the loading / unloading port 33 is formed on the bottom surface 2 of the internal space 27 of the mist deposition tank 7.
7d is formed without a step, and the bottom surface 27d of the mist deposition tank 7 is formed flat. As a result, when the substrate loading / unloading table 13 is inserted and inserted into the mist deposition tank 7 from the loading / unloading port 33, the substrate loading / unloading table 13 is horizontally held by the bottom surface 27d of the mist deposition tank 7 and inserted into and out of the mist deposition tank 7. .

As shown in FIGS. 2, 3 and 6, the substrate loading / unloading table 13 has a substrate 29 and a metal mask 1 on its upper surface.
1 are placed one on top of the other, and in this state, the substrate 29 and the like placed on the upper surface thereof are loaded and unloaded into the mist deposition tank 7 by being inserted and inserted into the mist deposition tank 7 from the loading / unloading port 33. I do. Then, the substrate 29 and the like placed on the upper surface thereof are accommodated and arranged in the internal space 27 of the mist accumulation tank 7 in a state of being inserted and arranged at a predetermined position in the mist accumulation tank 7, as shown in FIG. As described above, the substrate loading / unloading table main body 37 on which the substrate 29 and the like are placed, the frame wall portion 39, the substrate holder 41,
And a mask holder 43.

The substrate 29 used here is formed in a rectangular shape. The metal mask 11 is formed in a rectangular shape slightly larger than the substrate 29, and has a predetermined opening pattern (mask pattern).

The substrate loading / unloading table main body 37 is formed in a rectangular plate shape larger than the dimensions of the substrate 29 and the metal mask 11. At that time, the lateral width (width in the x direction) is substantially the same as the lateral width of the carry-in / out port 33 formed in the mist deposition tank 7 as described above. Further, the length (width in the y direction) is formed slightly longer than the depth of the internal space 27 of the mist deposition tank 7 from the loading / unloading port 33, for example. 13
Is inserted into and removed from the mist deposition tank 7.

As shown in FIG. 3, the frame wall 39 is formed of an elastic member such as a sponge material.
7 over the peripheral area of the upper surface.

More specifically, as shown in FIGS. 2, 3 and 6, the downstream side portion 51 and the left and right side portions 53L of the frame wall portion 39 in the insertion direction (y direction) of the substrate loading / unloading table 13 are provided. , 5
3R (hereinafter, referred to as the frame wall downstream side 51 and the frame wall left and right side 53L, 53R, respectively) have outer side surfaces 51a, 53La, 53Ra, respectively, on the same peripheral side of the substrate loading / unloading table main body 37. It is formed so as to be flat with respect to 37a. As shown in FIGS. 2 and 3, the upstream side 55 in the insertion direction of the substrate loading / unloading table 13 is also provided.
(Hereinafter, referred to as the frame wall upstream side 55) is a margin 47 for the peripheral side surface 37a on the same side of the substrate loading / unloading table main body 37.
And is formed in the lateral width direction (x direction) of the substrate loading / unloading table 13. In this state, the left and right end surfaces 551 and 55r of the frame wall upstream side portion 55 are common to the outer side surfaces 53La and 53Ra of the frame wall left and right side portions 53L and 53R, and are on the same side of the substrate loading / unloading table main body 37. Peripheral side 37a
Is flat. Further, the height (width in the z direction) of the frame wall portion 39 is formed to be slightly higher than, for example, a dimension obtained by subtracting the thickness of the substrate loading / unloading table main body 37 from the height width of the loading / unloading port 33 of the mist deposition tank 7. Have been.

In the frame wall portion 39, as shown in FIGS. 2 and 4, in a state where the substrate loading / unloading table 13 is inserted from the loading / unloading opening 33 to a predetermined position in the mist deposition tank 7, the upstream side of the frame wall portion is provided. The side portion 55 is disposed in the carry-in / out port 33 to close the carry-in / out port 33.

In the closed state, as shown in FIG. 4, the frame wall upstream side 55 is elastically crushed in the height direction by the height slightly increased by the carry-in / out port 33 as described above. The gap between the upper end surface 55u of the frame wall upstream side portion 55 and the upper edge surface 33u of the carry-in / out port 33 is eliminated,
The left and right end surfaces 551 and 55r of the frame wall upstream side portion 55 and the left and right edge surfaces 331 and 33r of the carry-in / out port 33 contact each other without gaps, so that the carry-in / out port 33 is moved to the frame wall upstream side portion. It is closed in a sealed manner by 55.

The substrate holder 41 is provided with a positioning portion 59 and a fixing jig 61 as shown in FIGS.

The positioning portion 59 is provided on the substrate loading / unloading table main body 3.
The substrate 29 placed on the substrate 7 is positioned and arranged. For example, the substrate 29 is arranged in an L-shape along the edge side on the substrate carrying-in / carrying-out table main body 37 and has a height equal to or less than the thickness of the substrate 29. It is made to protrude.

Each of the fixing jigs 61 has a mechanism for compressively deforming so that it can be elastically returned. The fixing jigs 61 are respectively disposed on opposite sides of the L-shaped sides of the positioning portion 59 and are positioned and positioned by the positioning portion 59. The pressed substrate 29 is pressed by the elastic restoring force from the opposing side, so that the substrate 29 is sandwiched and fixed between the positioning portion 59 and the positioning portion 59.

Here, for example, each fixing jig 61 includes a substrate pressing portion 65, a shaft portion 67, a winding spring 69, and a storage case 71.

The substrate pressing portion 65 is formed, for example, in a semicircular shape (a hemispherical shape, a conical shape, or a triangular shape) at its tip end, and its height (width in the z-axis direction) is the thickness of the substrate 29. It is formed in the following dimensions. The shaft portion 67 has a spring pressing portion 67b formed in the base end of the shaft portion main body 67a in a radial direction of the shaft portion main body 67a, and a tip end of the shaft portion main body 67a is connected to a rear portion of the substrate pressing portion 65. Consisting of

The housing case 71 is formed in a box shape whose cross section perpendicular to the longitudinal direction has an arch shape and whose bottom surface is open. An insertion groove 71b is formed at the center of the lower surface of the one end side wall 71a in the longitudinal direction, the shaft main body 67a of the shaft 67 is inserted into the insertion groove 71b, and the substrate pressing portion 65 at the tip of the shaft is exposed to the outside. And the spring pressing portion 67b at the base end of the shaft portion.
Is housed inside the case, and the winding spring 69 is disposed between the other end side wall 71c in the longitudinal direction and the spring pressing portion 67b.
Are fixedly mounted on the substrate loading / unloading table main body 37. In this state, the substrate pressing portion 65 and the shaft portion 67 are slidably disposed on the substrate loading / unloading table main body 37 with the distal end side of the substrate pressing portion 65 facing the side of the positioning portion 59 facing the same. . The movement of the spring pressing portion 67 b is guided by the housing case 71 and is restricted in the longitudinal direction of the housing case 71, that is, in the axial direction of the shaft portion 67.

In the configuration of the fixing jig 61, the shaft 67 is moved by the housing case 71 in response to pressing from the substrate pressing portion 65 side.
When the fixing jig 61 is pressed into the inside, the entire length of the fixing jig 61 is reduced, and when the pressing is released, the shaft 67 is moved by the urging force of the winding spring 69 compressed by the spring pressing portion 67b.
, And the entire length of the fixing jig 61 is restored to the original length, thereby realizing the above-described mechanism of compression-deformation so that it can be elastically restored.

In the substrate holder 41, FIG.
As shown in FIGS. 3 and 6, the substrate 29 is placed on the substrate carrying-in / out table main body 37 with two adjacent sides thereof abutting inside the respective L-shaped sides of the positioning portion 59. ,
The substrate 29 is positioned and arranged on the substrate loading / unloading table 13. Further, each fixing jig 61 is provided with the positioning portion 5.
9 are arranged at intervals slightly shorter than the vertical width and the horizontal width of the substrate 29 from each side of the substrate 29.
9, the respective substrate pressing portions 65 are pressed by the substrate 29 and the respective fixing jigs 61 are compressed, and the substrate 29 is fixed by the elastic return force of the fixing jig 61 with respect to the compression. Pressed from 61, the substrate 29
Are sandwiched and fixed between the positioning portion 59 and the fixing jig 61.

In the state where the substrate 29 is fixed to the substrate holder 41, as shown in FIG. 6, each of the upper surfaces 59 of the positioning portion 59 and the substrate pressing portion 65 of the fixing jig 61.
a and 65 a are located below the upper surface 29 a of the substrate 29. Thus, as described later, when the metal mask 11 is placed on the substrate 29, the metal mask 11 is placed on the substrate 29 in close contact.

The mask holder 43 includes a plurality of locking projections 75 which are located around a region where the substrate 29 is placed on the substrate carrying-in / out table main body 37 and are erected higher than the positioning portion 59, and a metal mask. 11 is provided in the peripheral region,
The metal mask 11 includes a plurality of locking holes 77 inserted by locking protrusions 75 in a state where the metal mask 11 is arranged at a predetermined position on the substrate 29 fixed by the substrate holder 41.

Here, a total of two locking projections 75 are arranged, for example, on the outer side of each L-shaped tip of the positioning portion 59. Further, the locking hole 77 is formed such that a peripheral region thereof extends outside the positioning portion 59 in a state where the metal mask 11 is arranged at a predetermined position on the substrate 29 fixed by the substrate holder 41, A total of 2 on each corner on one diagonal of the overhanging portion of the metal mask 11.
Are provided.

In this mask holder 43, FIGS.
As shown in the figure, the locking holes 77 of the metal mask 11 are provided with the corresponding locking projections 75 erected on the substrate loading / unloading table main body 37.
When the metal mask 11 is disposed on the substrate 29 fixed by the positioning portion 59 so as to engage with the metal mask 11, the metal mask 11 is automatically positioned at a predetermined position and disposed on the substrate 29. Thereby, the substrate 29 is aligned and covered with the metal mask 11.

The substrate loading / unloading table 13 thus configured
As shown in FIGS. 2 and 3, the portion on the opposite side of the grip margin 47 (downstream side 51 of the frame wall) is slightly inserted into the carry-in / out port 33 of the mist deposition tank 7, and The lower surface 37d of the loading / unloading table body 37 is the bottom surface 27 in the mist deposition tank 7.
By being pushed into the mist depositing tank 7 so as to slide on d, the mist is kept in a horizontal position by the bottom surface 27d of the mist depositing tank 7 and inserted into the mist depositing tank 7. Thereby, the substrate 29 and the metal mask 11 fixed on the substrate loading / unloading table 13 by the substrate holder 41 and the mask holder 43 are provided.
Is carried into the mist deposition tank 7.

Then, in a state where the substrate loading / unloading table 13 is inserted to a predetermined position in the mist deposition tank 7, for example, the innermost position, as described above, the upstream side of the frame wall portion of the frame wall section 39 of the substrate loading / unloading table 13 is provided. The substrate loading / unloading port 33 is closed from the side part 55. Further, in this state, the substrate 29 and the metal mask 11 on the substrate carrying-in / out table main body 37 are accommodated and arranged at, for example, a central position in the mist deposition tank 7.

When the grip 47 is pulled in the direction opposite to the insertion direction, the substrate loading / unloading table 13 slides on the bottom surface 27d of the mist deposition tank 7 and is kept in a horizontal position. Is inserted from Thus, the substrate 29 and the metal mask 11 on the substrate loading / unloading table are carried out.

Next, using the thin film forming apparatus 1 described above, a plurality of organic materials (here, for example, high molecular organic EL materials having red, blue, and green luminescent colors) emit light of different colors. A method of preparing an organic material and forming a film on the substrate 29 in a predetermined pattern will be described.

First, in a state where all the on-off valves 9a, 9b, 9c are fully closed, each organic material solution 15a, 15b, 15c having a red, blue, or green emission color is supplied to each mist generator 3a, 3b. , 3c and each organic material solution 1
The mist of 5a, 15b, 15c is generated. that time,
Each of the mist generators 3a, 3b, 3c has, for example, the same frequency of the ultrasonic vibrators 21a, 21b, 21c, and is set to generate the mist of the same concentration. I do.

Then, the substrate 29 and the mask holder 11 are fixed on the substrate loading / unloading table 13 by the substrate holder 41 and the mask holder 43, and the substrate 29 is covered with the metal mask 11 and arranged. Is inserted and arranged at a predetermined position in the mist deposition tank 7, and the substrate 29 and the metal mask 11 are accommodated and arranged in the mist deposition tank 7.

Then, the opening amounts of the respective on-off valves 9a, 9b, 9c are adjusted, and the flow rate and the flow rate ratio of each mist flowing into the mist deposition tank 7 from each of the mist generators 3a, 3b, 3c according to the target emission color. To adjust each mist generator 3a, 3
The mist from b and 3c is sent into the mist deposition tank 7 at a desired flow rate and a desired flow rate ratio, respectively. As a result, the respective mist, each of which has a desired flow rate and a desired flow rate ratio, flows into the mist deposition tank 7 from the center of the upper wall of the mist deposition tank 7 and mixes with each other while diffusing in the mist deposition tank 7. The mist of the desired emission color becomes the metal mask 1
1 and deposited on the substrate 29.

After the mist of the desired emission color is deposited on the substrate 29 having a desired thickness, or after a lapse of a predetermined time from the opening of the on-off valve, all of the on-off valves 9a, 9b, 9c are closed.

Then, the substrate loading / unloading table 13 is inserted from the mist deposition tank 7 to carry out the substrate 29 and the metal mask 11a from the mist deposition tank 7, and the metal mask 11a covered on the substrate 29 is removed. The mist deposited on the surface is air-dried, for example. Thus, a thin film of an organic material having a desired emission color is formed on the substrate 29 in a predetermined pattern.

According to the thin film forming apparatus 1 configured as described above, each of the mist generating devices 3a, 3b, and 3c and each of the mist generating devices 3 through the introduction pipes 5a, 5b, and 5c.
a, 3b, and 3c, and a plurality of open valves 9a, 9b, and 9c respectively provided in the introduction pipes 5a, 5b, and 5c.
b, 3c, respectively, different organic material solutions 15a, 15
b, 15c are stored and mist-formed, and the mist-formed organic material solutions 15a, 15b, 15c are opened and closed by the on-off valves 9a, 9b,
In step 9c, adjust the ratio to a desired value and set the mist deposition tank 7 by the required amount.
And mixed with the target organic material in the mist deposition tank 7, and the metal mask 11 placed in the mist deposition tank 7.
Since the organic material is deposited on the substrate 29 covered with, it is unnecessary to prepare an excess organic material, which is economical.

Further, the mist generated by the mist generators 3a, 3b, 3c is adjusted to a desired ratio by the on-off valves 9a, 9b, 9c and sent to the mist deposition tank, whereby the desired organic material solution is prepared. Therefore, the trouble of mixing the organic material solution itself as in the related art can be omitted, and the organic material solution can be easily prepared.

Further, by adjusting the opening and closing of the on-off valves 15a, 15b and 15c, the ratio of the mist fed into the mist deposition tank 7 can be freely changed, so that the organic material solution having an arbitrary ratio can be easily prepared and convenient. It is. Therefore, in particular, if the organic EL material solutions of the three primary colors are set in the mist generators 3a, 3b, 3c, arbitrary color synthesis can be easily performed.

Further, a substrate loading / unloading table main body 37 is provided. The substrate 29 covered with the metal mask 11 is placed on the substrate loading / unloading table main body 37 and inserted into the mist deposition tank 7 from the loading / unloading port 33. With inserted and inserted,
Since the substrate 29 and the metal mask 11 placed on the upper surface thereof are accommodated in the mist deposition tank 7, the substrate 29 and the metal mask 11 can be easily loaded and unloaded into the mist deposition tank 7.

Further, the width of the substrate loading / unloading table main body 37 is substantially the same as the width of the loading / unloading port 33, and
A frame wall portion 39 is disposed in a peripheral area of the substrate loading / unloading table main body 37, and the substrate loading / unloading table main body 37 is inserted from the loading / unloading port 33 into the mist deposition tank 7 to a predetermined position. Since the loading / unloading port 33 is closed by the frame wall upstream side portion 55 of the portion 39, the loading / unloading port 33 is automatically inserted at the same time when the substrate loading / unloading table 13 is inserted into the mist deposition tank 7. Can be conveniently closed, and the mist in the mist deposition tank 7 can be prevented from leaking outside during use.

Further, when the frame wall portion 39 is formed of an elastic member such as a sponge material, and the carry-in / out port 33 is closed by the frame wall upstream side portion 55, the frame wall upstream side portion 55 is provided. Is formed so as to be slightly elastically crushed by the loading / unloading port 33, so that the gap between the upper end face 55 u of the frame wall upstream side 55 and the upper edge face 33 u of the loading / unloading port 33 is particularly large. The mist can be sealed by an easy mechanism, and leakage of mist from inside the mist deposition tank 7 can be blocked.

Further, the substrate loading / unloading table 13 has a substrate 29
And a mask holder 43 for positioning and fixing the metal mask 11 on the substrate 29 are provided.
The substrate 29 and the metal mask 11 can be easily fixed to the substrate loading / unloading table 13 by aligning the metal mask 11 at a predetermined position on the substrate 29.

Further, the substrate holder 41 has a positioning portion 59 protruding on two adjacent sides of the substrate 29 placed on the substrate carrying-in / out table main body 37, and is configured so as to be elastically resiliently compressively deformed. Then, the substrate 29 is placed on the remaining two adjacent sides of the substrate 29 on the substrate loading / unloading table 13 and compressed by the substrate 29 positioned by the positioning portion 59, and the substrate 29 is elastically returned by the compression and contraction.
Jig 6 that presses and clamps between positioning portion 59
1, the substrate 29 can be appropriately positioned and fixed with respect to the substrates 29 of various dimensions, and the substrate 29 can be easily attached to and detached from the substrate holder 41.

Further, the mask holder 43 is formed on the metal mask 11 and a plurality of locking projections 75 erected on the substrate carry-in / carry-out table main body 37.
Since the plurality of locking projections 75 are provided with the plurality of locking holes 77 respectively inserted in a state where the metal mask 11 is placed at the upper predetermined position, it can be configured with a simple mechanism, and furthermore, the metal mask 11 can be attached to the mask holder 43. Can be easily attached and detached.

In this embodiment, when the substrate loading / unloading table 13 is inserted into the mist deposition tank 7 and the loading / unloading port 33 is closed by the upstream side 55 of the frame wall, a design error or the like may occur. When a gap is formed between the lower surface 37d of the substrate loading / unloading table main body 37 and the lower edge surface 33d of the loading / unloading port 33, the lower surface 37d of the substrate loading / unloading table main body 37 or the lower edge surface 33d of the loading / unloading port 33. Alternatively, a sponge material having an appropriate thickness may be provided to close the gap. Similarly,
Even when a gap is formed between the left and right edge surfaces 33l, 33r of the loading / unloading port 33, the left and right end surfaces 51, 55r of the frame wall upstream side portion 55, and the peripheral side surface 37a of the substrate loading / unloading table main body 37,
A sponge material having an appropriate thickness is provided on the left and right edge surfaces 33l and 33r of the loading / unloading port 33, the left and right end surfaces 51 and 55r of the frame wall upstream side portion 55 and the peripheral side surface 37a of the substrate loading / unloading table main body 37. The gap may be closed.

In this embodiment, the case where the substrate holder 41 and the mask holder 43 are provided on the substrate loading / unloading table 13 has been described. However, the substrate holder 41 and the mask holder 43 may not necessarily be provided. When the substrate holder 41 and the mask holder 43 are not provided, the substrate 29 and the metal mask 11 are moved by the frame
From falling off.

Further, in this embodiment, the case where the organic material is patterned on the substrate using the metal mask 11 has been described.
In the case of forming a film on the entire surface, the same operation may be performed by storing only the substrate 29 in the mist deposition tank 7 without using the metal mask 11.

In this embodiment, each on-off valve 9
a, 9b and 9c are manually operated to open and close each of the on-off valves 9.
Although the case where the opening amounts of the valves 9a and 9c and the opening times of the respective on-off valves are controlled has been described, they may be controlled by computer control instead of manual operation.

[0064]

According to the first aspect of the present invention, a plurality of mist generators, a mist deposition tank connected to each mist generator via each introduction pipe, and each mist generator are provided. A plurality of release valves, each of which contains a different organic material solution in each mist generator to form a mist, and adjusts each of the mist-formed organic material solutions to a desired ratio by an on-off valve to adjust a required amount of the mist deposition tank. To the target organic material in the mist deposition tank, so that the volume is placed on a substrate placed in the mist deposition tank or a substrate covered with a mask, so that excess organic material is removed. It is economical because no adjustment is required.

Further, the target organic material solution is prepared simply by sending the mist generated by the mist generating device to a mist deposition tank by adjusting it to a desired ratio by an on-off valve. The organic material solution can be easily prepared without the need to mix the solution itself.

Further, by adjusting the opening and closing of the on-off valve, the ratio of the mist fed into the mist deposition tank can be freely changed, so that an organic material solution having an arbitrary ratio can be easily prepared, which is convenient. Therefore, in particular, if the organic EL material solutions of the three primary colors are set in the mist generator, arbitrary color synthesis can be easily performed.

According to the second aspect of the present invention, a substrate or a substrate covered with a mask is accommodated in a mist deposition tank, a plurality of organic material solutions are mist-formed, and each mist-converted organic material solution is mist-formed. In a desired amount and in a desired ratio, respectively, into the mist deposition tank, diffused into the mist deposition tank, mixed with each other, and deposited on the substrate or the substrate covered with the mask. As described above, the mixing of the organic material solution itself can be omitted, and the organic material solution can be easily prepared. Further, since the organic material solution itself is not prepared, an excessively prepared organic material solution is not generated unlike the related art, which is economical.

[Brief description of the drawings]

FIG. 1 is a plan view of a thin film forming apparatus according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a diagram illustrating a configuration of a substrate loading / unloading table constituting the thin film forming apparatus according to the first embodiment of the present invention.

FIG. 4 is a view as seen from a direction indicated by an arrow IV in FIG. 1;

FIG. 5 is a cross-sectional view of a jig disposed on a substrate loading / unloading table constituting the thin film forming apparatus according to the first embodiment of the present invention.

FIG. 6 is a diagram illustrating a state in which a substrate and a metal mask are arranged on a substrate loading / unloading table constituting the thin film forming apparatus according to the first embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thin film forming apparatus 3a, 3b, 3c Mist generator 5a, 5b, 5c Introducing pipe 7 Mist deposition tank 9a, 9b, 9c On-off valve 11 Metal mask 15a, 15b, 15c Organic material solution 29 Substrate

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Tatsuo Tamagawa 1-7-10 Kikuzumi, Minami-ku, Nagoya-shi, Aichi F-term in the Auto Network Engineering Laboratory Co., Ltd. (Reference) 3K007 AB18 EB00 FA01 FA03 4D073 AA01 BB03 DB03 DB07 DB13 DB24 4F033 RA14 RE19

Claims (2)

[Claims] 1. A plurality of mist generators each containing a different organic material solution, generating a mist by converting the stored organic material solution into mist, and containing a substrate or a substrate covered with a mask therein. ,
The mist is connected to each of the mist generators through each of the introduction pipes, and the mist flowing from each of the mist generators through each of the introduction pipes is mixed and deposited on the accommodated substrate or the substrate covered with the mask. A thin film forming apparatus, comprising: a mist deposition tank; and a plurality of on-off valves disposed in each of the introduction pipes to adjust the amount and ratio of each mist flowing into the mist deposition tank. 2. A step of accommodating a substrate or a substrate covered with a mask in a mist deposition tank, mist-forming a plurality of organic material solutions, and mist-forming each of the organic material solutions in a desired amount and a desired ratio. Feeding into the mist deposition tank, diffusing into the mist deposition tank, mixing with each other, and depositing on the substrate or the substrate covered with the mask. .