JP2002217532A - Apparatus and method for supplying solder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a solder to be supplied efficiently in a prescribed pattern to a recess of a mounting substrate, such as MID substrate or the like. SOLUTION: An apparatus for supplying the solder comprises a base member 1, and a movable member 2 for solder transfer capable of displacing with respect to the surface of the member 1. In this case, the member 2 is constituted so as to be able to be switched between a state, in which the surface is flush with the surface of the member 1 and a state, in which the member 2 is projected from the surface of the member 1. A method for supplying the solder comprises the steps of printing the solder B in the prescribed pattern on the surface of the member 2, in a state in which the surface of the member 1 is flush with the surface of the member 2, thereafter contacting the surface of the member 2 projected from the member 1 with the recess Wa of the substrate W, and transferring to supply the solder B printed on the surface of the movable member to the recess Wa of the substrate W.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mounting a component A in a mounting board having a recess in which a circuit pattern is formed, for example, a recess Wa of a MID (Molded Interconnection Device) board W as shown in FIG. Therefore, the present invention relates to a solder supply device and a solder supply method suitable for, for example, supplying solder to an electrode P of a circuit pattern provided in a recess Wa.

[0002]

2. Description of the Related Art Conventionally, when solder is supplied to a substrate, solder printing for supplying cream solder with a squeegee through a mask has been used. However, in such solder printing, solder is applied only to a flat substrate. It was not possible to supply the solder, and it was difficult to supply the solder to the concave portion of the substrate such as the above-mentioned MID substrate.

For this reason, as a means for supplying the solder to the concave portion of the substrate, a dispenser which presses cream solder in a syringe by air pressure and discharges and supplies the cream solder from the tip of a needle provided in the syringe is used. .

[0004]

However, in solder supply using a dispenser, the number of supply points is limited by the number of needles, so it is difficult to supply solder to many points at once, and the processing efficiency is reduced. Is low.

The present invention has been made in view of such a point, and an object of the present invention is to provide an apparatus and a method capable of efficiently supplying solder to a concave portion of a mounting board in a predetermined pattern. And

[0006]

In order to achieve the above object, the present invention has the following configuration.

That is, the solder supply device of the present invention is a solder supply device for supplying solder to a concave portion, and comprises a base member and a movable member for solder transfer displaceable with respect to the surface of the base member. The movable member is displaceable between a state in which the surface is substantially flush with the surface of the base member and a state in which the movable member protrudes from the surface of the base member and is inserted into the recess.

The term “substantially flush” includes a completely flush state and a flush state in which solder printing can be performed via a mask, and includes a protrusion or a recess formed on the surface of the movable member. This includes a state with partial slight unevenness.

According to the present invention, the movable member is placed in a state where its surface is substantially flush with the surface of the base member, and solder is printed in a predetermined pattern on the surface of the movable member using a pattern mask. By projecting the movable member from the base member, the movable member can be inserted into the concave portion of the substrate, and the solder printed on the movable member can be transferred to the concave portion.

[0010] In one embodiment of the present invention, the movable member is provided facing an opening formed in the base member.

According to the present invention, when the movable member is retracted so that its surface is flush with the surface of the base member,
All the openings of the base member are filled with the surface of the movable member, and the entire surface of the base member becomes a series of flat surfaces, so that the pattern mask can be stably mounted and solder can be printed.

In a preferred embodiment of the present invention,
A plurality of the movable members are provided for a single base member.

According to the present invention, it is possible to simultaneously supply and transfer solder to a plurality of substrates.

In one embodiment of the present invention, a protrusion for regulating the thickness of the solder is provided on the surface of the movable member.

According to the present invention, the distance between the concave portion of the substrate and the surface of the movable member is regulated by the projection, and the thickness of the solder does not change due to the degree of pressing the movable member against the concave portion.

[0016] In another embodiment of the present invention,
The surface of the movable member is provided with a recess for adjusting the amount of solder.

According to the present invention, by performing the solder printing on the portion having the concave portion, it is possible to transfer the solder in a larger amount than the solder printed on the portion having no concave portion.

Further, according to the solder supply method of the present invention, the solder is provided on the surface of the movable member in a state where the surface of the base member is substantially flush with the surface of the movable member which can be displaced relative to the base member. After printing in a pattern, the surface of the movable member protruding from the base member is applied to the concave portion of the substrate, and the solder of the movable member is transferred and supplied to the concave portion of the substrate.

According to the method of the present invention, the movable member is placed in a state where its surface is substantially flush with the surface of the base member, and solder is printed in a predetermined pattern on the surface of the movable member using a pattern mask. By projecting the movable member from the base member, the movable member can be inserted into the concave portion of the substrate, and the solder printed on the movable member can be transferred to the concave portion.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows an outline of a basic procedure in a solder supply method according to the present invention.

In FIG. 1, reference numeral 1 denotes a thick base member;
Reference numeral 2 denotes a movable member for solder transfer.
(B) and FIGS. (C) and (d) are in a state of being turned upside down.

The movable member 2 is attached to a plurality of openings 1a formed in the base member 1 so as to be able to move back and forth, and the surface of the movable member 2 shown in FIGS. (C)
It can be displaced to a state protruding from the surface of the base member 1 shown in (d). In the present invention, solder is supplied to the recess Wa of the substrate W in the following procedure using the base member 1 and the movable member 2.

(1) First, as shown in FIG. 2A, in a retracted state where the surface of the movable member 2 is flush with the surface of the base member 1, the metal mask 3 having a desired thickness is placed on the base member. 1 and the movable member 2 are positioned and mounted. The metal mask 3 has an opening 3 of a printing pattern facing the movable member 2.
a is formed, and by scanning the squeegee 4, creamy solder B is printed in a predetermined pattern on the surface of the movable member 2 as shown in FIG.

(2) Next, as shown in FIG. 3C, the base member 1 carried on the substrate W is turned upside down, and each movable member 2 is projected downward, so that the concave portion of the substrate W is formed. W
a, and the solder B is pressed against an electrode portion (not shown) of the circuit pattern formed in the concave portion Wa.

(3) Next, as shown in FIG. 3D, heat treatment is performed by means such as hot air supply or direct heating, so that the solder B is once melted and then cooled and hardened.

(4) When the base member 1 and the movable member 2 are retracted, as shown in FIG.
The solder B is transferred to the predetermined pattern a in a predetermined pattern, and the component mounting can be performed by loading the component A into each concave portion Wa and heating.

The basic configuration and process of the solder supply apparatus and method according to the present invention are as described above.
MID substrate (see FIG. 8) which is an example of a substrate provided with a
The solder supply device and the process will be described with reference to FIGS.

As shown in FIG. 2, the substrate W is supplied as a hoop material 5 in which a plurality (six in this example) are integrally formed. As shown, six possible members 2 are provided so as to be able to move back and forth corresponding to the concave portions Wa of each substrate W.

Positioning holes 6 and 7 are formed at the four corners of the base member 1 and the hoop material 5, and as shown in FIG. The hoop material 5 is positioned and loaded downward from the member 1 by a set distance. Here, the solder B is printed in a predetermined pattern on the surface of each movable member 2 in advance as described above, and each movable member 2 is kept flush with the base member 1 in a normal state.

Next, as shown in FIG. 4 (b), the pusher 10 disposed below the frame 8 is driven to rise,
Each movable member 2 is pushed up, and each movable member 2 is inserted into the downward recess Wa of each substrate W formed integrally with the hoop material 5, and heated in this state, thereby printing on the surface of each movable member 2. The solder B is transferred by heating to the concave portion Wa. After cooling, the hoop material 5 is removed as shown in FIG. 4C, whereby the solder supply process to the plurality of substrates W is completed.

Here, the movable member 2 is made of a metal such as an aluminum material which does not wet with solder, or a resin material such as I-type LCP (liquid crystal polymer), PA46, PPS which has heat resistance higher than the solder melting point. It is desirable to use. Heating means for heating and transferring the solder B printed on the movable member 2 to the concave portion Wa includes a means for heating the pusher 10 to a high temperature to heat the movable member 2 and a means for heating the surroundings by applying warm air from the surroundings. A means for locally heating the back surface portion of the concave portion Wa in the substrate W by hot air, infrared rays, contact with a high-temperature member, or the like to melt the solder B, or a means for heating the entire substrate W, or A plurality may be appropriately selected according to the shape, material, and the like of the substrate W.

The present invention can be embodied in the following modes.

(1) As shown in FIG.
Projections 2a having a height of, for example, about 0.05 to 0.2 mm
Is formed, the movable member 2 is formed into the concave portion Wa of the substrate W.
Can be regulated by the height of the protrusion 2a.

(2) As shown in FIG.
When the recess 2b having a depth of about 0.05 to 0.2 mm is formed on the surface of the solder B, the solder B is locally thickened at the portion of the recess 2b so that a large amount can be transferred.

(3) Although not shown, if another movable member is removably mounted on the movable member 2, a plurality of recesses Wa can be formed.
Can be supplied to the device.

(4) As shown in FIG.
Flexible and heat-resistant tape 11 made of materials such as ET
Is passed through the solder print processing unit 12 to perform solder printing on the surface thereof in a desired pattern, and the tape 11 is supplied along the surfaces of the base member 1 and the movable member 2 and further downwardly. The tape 11 is attached to the substrate W by supplying and setting the
, The solder B of the pressed tape portion may be heated and transferred to the concave portion Wa. In this case, the tape 11 may be punched out with the protrusion of the movable member 2, or may be simply deformed and pushed into the recess Wa, and may be wound up and collected for reuse.

[0038]

As is apparent from the above description, according to the present invention, the solder can be efficiently supplied to the concave portion of the mounting board in a predetermined pattern.

Further, when the pattern mask is used to print the solder on the surface of the movable member, the holding of the pattern mask is stabilized, and high-accuracy solder printing becomes possible.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a solder supply procedure of the method of the present invention.

FIG. 2 is a perspective view showing an example of a composite material of the MID substrate.

FIG. 3 is a partially cutaway perspective view showing an example of a main structure of the solder supply device.

FIG. 4 is a front view showing a procedure for supplying solder to the composite material of the MID substrate.

FIG. 5 is a front view showing a movable member according to another embodiment.

FIG. 6 is a front view showing a movable member of still another embodiment.

FIG. 7 is a schematic front view showing a modification of the solder supply device.

FIG. 8 is a perspective view showing an example of an MID substrate.

[Explanation of symbols]

 Reference Signs List 1 base member 1a opening 2 movable member 2a protrusion 2b recessed portion W substrate Wa recess B solder

Claims (6)

[Claims] 1. A solder supply device for supplying solder to a recess, comprising: a base member; and a movable member for solder transfer displaceable with respect to the surface of the base member, wherein the movable member has a surface. A solder supply device capable of being displaced between a state in which the surface is substantially flush with the surface of the base member and a state in which the surface protrudes from the surface of the base member and is inserted into the recess. 2. The solder supply device according to claim 1, wherein the movable member is provided at an opening formed in the base member. 3. The solder supply device according to claim 1, wherein a plurality of said movable members are provided for a single base member. 4. The solder supply device according to claim 1, wherein a protrusion for regulating the thickness of the solder is provided on a surface of the movable member. 5. The solder supply device according to claim 1, wherein a surface of said movable member is provided with a concave portion for adjusting a solder amount. 6. After printing solder in a predetermined pattern on the surface of the movable member with the surface of the base member and the surface of the movable member capable of being displaced relative to the base member being substantially flush with each other, the base member A method of supplying the solder of the movable member to the concave portion of the substrate by applying the surface of the movable member protruding from the concave portion to the concave portion of the substrate.