JP2002217503A - Printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed board wherein a space is saved and enables easy determination of where among printed boards of multicavity has been positioned, when the boards are manufactured. SOLUTION: In the printed boards 1a-1p of multicavity, in order to determine that the respective printed boards 1a-1p have been positioned at any locations in the case of manufacturing the boards wherein multicavity process are performed, a combination of thickness which is different from a printed wiring pattern 2b of the other printed boards 1a, 1c-1p which are to be subjected to multicavity process is applied to a prescribed wiring pattern (e.g., the wiring patterns 2b of the board 1b), from an among a plurality of wiring patterns 2a, 2b, etc., arranged in the respective boards 1a-1p, and binary number indication is made.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board from which a number of pieces are taken.

[0002]

2. Description of the Related Art In a printed circuit board taken in a large number of pieces, for example, a bar code for determining a position where each printed circuit board is arranged is formed on the surface of each printed circuit board by printing. For example, JP-A-10-
Japanese Patent No. 240888 discloses a configuration in which barcodes that can be used for various purposes are provided in a printed circuit board.

[0003]

SUMMARY OF THE INVENTION The above-mentioned Japanese Patent Application Laid-Open No.
In the prior art including Japanese Patent No. 240888, there is a problem that a space for arranging the barcode is required, so that the substrate itself becomes large, which is an obstacle to downsizing the device.

The present invention has been made in view of such a problem, and an object of the present invention is to save space and at which position one of a large number of printed circuit boards is to be manufactured when the board is manufactured. It is an object of the present invention to provide a printed circuit board that can easily determine whether or not it is located.

[0005]

According to a first aspect of the present invention, there is provided a printed circuit board in which a plurality of printed circuit boards are formed. In order to determine whether or not it has been performed, a predetermined combination of the plurality of wiring patterns provided in each of the substrates is given a combination of a thickness different from that of the other printed wiring patterns taken in large numbers. 2
Performs radix notation.

According to a second aspect of the present invention, in a printed circuit board in which a large number of pieces are taken, the position of each of the printed boards is determined at the time of manufacturing the board in which a large number of pieces are taken. A predetermined wiring pattern among the provided wiring patterns is provided with a different thickness pattern from the other printed wiring patterns taken in large numbers.

In a third aspect of the present invention, a plurality of printed circuit boards in a plurality of printed circuit boards are provided so that it is possible to determine the position of the printed circuit board in one of the printed circuit boards. Are arranged so as to display barcodes having different contents from other printed circuit boards.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is characterized in that means for determining which position one of a large number of printed circuit boards is located at the time of manufacturing the substrate is applied to the wiring pattern itself of the printed circuit board. And the first
In this embodiment, the thick wiring pattern is regarded as "1", and the thin wiring pattern is regarded as "0", and the arrangement of the printed circuit board is determined by a binary representation in which these are appropriately combined. In the second embodiment, the arrangement of the printed circuit board is determined by regarding the wiring pattern itself as a barcode. Further, in the third embodiment, the arrangement of the printed circuit board is determined based on which of the land patterns arranged in parallel is thicker.

Hereinafter, each embodiment will be described in detail with reference to the drawings.

(First Embodiment) FIG. 1 is a top view showing the structure of a worksheet 1 as a multi-piece substrate to which the present invention is applied. This worksheet 1 is a flexible or hard substrate. As shown in FIG. 1, a plurality of printed boards 1 a to 1 p having substantially the same shape are formed on the work sheet 1. FIG. 2A is an enlarged view showing a printed circuit board 1b according to the first embodiment taken out of the worksheet 1 shown in FIG. As shown in FIG. 2A, a plurality of wiring patterns 2a to 2f are formed in parallel on a part of the printed board 1b. 2 is a connection pattern for each of the wiring patterns 2a to 2f.

FIG. 2B is a sectional view taken along line AA of FIG. 2A. As shown in the drawing, the printed board 1b has a configuration in which wiring patterns 2a to 2f are formed on a base 10 and a coverlay 11 is provided in a portion other than the connection pattern 2. The same applies to other printed circuit boards.

The thickness of each wiring pattern is 2a = 2c = 2
Although d = 2e = 2f, the thickness of 2b is different from other wiring patterns 2a, 2c, 2d, 2e, 2f, and is formed thicker. If a thick wiring pattern such as the wiring pattern 2b is “1”, and the wiring patterns 2a, 2c, 2d, 2e, and 2f that are thinner than the thick wiring pattern 2b are “0”, the printed circuit board 1b is 0, 1, 0,0,0,0
Can be represented by a binary number

Therefore, if each of the six wiring patterns 2a to 2f is formed in a "thick" or "thin" pattern, as shown in FIG. 3, 16 (1a to 1p) wiring patterns can be obtained by combining them. All of the printed circuit boards can be determined. For example, in FIG. 3, when a thick line is represented by “1” and a thin line is represented by “0”, the printed circuit board 1 a is “1”.
00000 "and the printed circuit board 1b is" 0
In this way, it is possible to easily determine which position of one of the plurality of printed circuit boards is located on the worksheet at the time of manufacturing the board, while maintaining a small space. become.

(Second Embodiment) FIG. 4A shows a plurality of wirings formed on a part of a flexible printed circuit board 1b 'according to a second embodiment taken out of the worksheet 1 shown in FIG. It is a figure which expands and shows a pattern.

In FIG. 4A, a white portion is a copper foil portion, and constitutes a plurality of parallel wiring patterns 2a 'to 2f'. 2-1 is each wiring pattern 2a'-2f '
Contact for The black portion is a portion from which the copper foil portion has been removed by etching. The wiring pattern portion shown in FIG. 4A includes a region R1 with a cover lay, a region R2 without a cover lay with an exposed copper foil, a region R3 with a cover lay, and a contact 2-1. Contact group width area R4
And can be divided into FIG. 4B is a cross-sectional view taken along the line BB of FIG. As shown in FIG.
The BB cross section of b ′ has a configuration in which a copper foil pattern 12 corresponding to a plurality of wiring patterns 2 a ′ to 2 f ′ is provided on a base 10. No coverlay is provided.

FIG. 4C is a diagram in which the area R2 without the coverlay is represented by a barcode 3. FIG. That is, the black portion of the barcode 3 is the copper foil removed portion 2g 'of the printed board 1b', and the white portion of the barcode 3 is the copper foil portion 12 on the printed board 1b '. By using such a barcode expression, it is possible to easily determine the position where one of the printed circuit boards taken in large numbers was located at the time of manufacturing the board, while maintaining space saving.

The reason why there is no coverlay at the portion corresponding to the region R2 is that the light reflectance of the copper foil portion, that is, the wiring pattern portion is improved, and the bar code can be read more accurately by absorbing the light at the etched portion. That's why. Further, if the back surface of the printed circuit board 1b 'is coated with black or the substrate base is made of a black material, the function of the copper foil removing portion as a blacker portion is improved.

(Third Embodiment) FIG. 5 is an enlarged view showing printed circuit boards 1a 'and 1b' according to a third embodiment taken out of the worksheet 1 shown in FIG. The CPU 200 is mounted on the printed board 1a ', and a land wiring pattern is provided around the CPU 200. One of the land wiring patterns (the rightmost pattern 1a'a in FIG. 5) is formed thicker than the other patterns.

Similarly, the printed circuit board 1b 'has a CP
U100 (the same as the CPU 200) is mounted, and a land wiring pattern is provided around the U100. One of the land wiring patterns (the second pattern 1b′b from the left in FIG. 5) is formed thicker than the other patterns.

As described above, in the third embodiment, the arrangement of the printed circuit board is determined based on the number of the land pattern arranged in parallel which is thicker. Therefore, it is possible to easily determine the position where one of the printed circuit boards obtained in large numbers was located at the time of manufacturing the board while maintaining space saving.

The above-described embodiment is summarized as follows.

1. Printed circuit boards 1a to be taken in large numbers
In order to determine the position of the one printed circuit board 1b on one printed circuit board (for example, 1b) among the printed circuit boards 1b by using a binary number display, the identification provided in each of the substrates 1a to 1p is performed. Are printed wiring patterns 2b of a plurality of other printed boards 1a, 1c to 1p which are taken in a predetermined wiring pattern (for example, wiring pattern 2b in board 1b) among a plurality of wiring patterns 2b, 2b,. Give different thickness.

2. The above 1. , The wiring patterns having different thicknesses (the wiring patterns 2b in the substrate 1b) are thicker or thinner in the specific plurality of wiring patterns 2b, 2b,.

3. Printed circuit boards 1a to be taken in large numbers
In 1p, in order to determine the position of each of the printed boards 1a to 1p in binary notation, a plurality of specific wiring patterns 2b, 2b,... Provided in each of the boards 1a to 1p. The other printed circuit boards 1a, 1c to 1p which are formed in a large number on a predetermined wiring pattern (for example, the wiring pattern 2b in the substrate 1b) in the substrate 2b
Of the printed wiring pattern 2b.

4. 3 above. , The wiring patterns having different thicknesses (the wiring patterns 2b in the substrate 1b) are thicker or thinner in the specific plurality of wiring patterns 2b, 2b,.

[5] Printed circuit boards 1a to be taken in large numbers
1p, a plurality of wiring patterns 2b, 2b provided on each of the substrates 1a to 1p are determined in order to determine the position of each of the printed substrates 1a to 1p at the time of manufacturing the substrate. The other printed circuit boards 1a, 1c to 1p which are formed in a large number on a predetermined wiring pattern (for example, the wiring pattern 2b in the substrate 1b) in.
Is given by giving a combination of thickness different from that of the printed wiring pattern 2b.

6. In order to determine the position of each of the printed circuit boards 1a 'and 1b' at the time of manufacturing the printed circuit board in which a large number of printed circuit boards are taken (for example, 1a 'and 1b' in FIG. 5), Each of the above substrates 1
A predetermined wiring pattern (for example, the wiring pattern 1a'a or 1b'b) among the wiring patterns provided in a 'and 1b' is different from the printed wiring pattern of another printed circuit board taken in large numbers. Give a thickness pattern.

7. 6 above. In the above, the wiring patterns having different thicknesses (wiring patterns 1a'a or 1b'b)
Is thicker or thinner than the other printed wiring patterns.

8. In the printed circuit board taken in large numbers, each of the above printed circuit boards (for example, printed circuit board 1 in FIG. 4)
In order to make it possible to determine which position b ′) is located, a plurality of wiring patterns 2a ′ to 2f ′ are provided in parallel in each of the substrates 1b ′, and the plurality of wiring patterns 2a ′ to 2f ′ are provided.
a 'to 2f' are arranged in a thick and thin manner so as to display a bar code.

9. One printed circuit board (for example, printed circuit board 1 in FIG.
b '), the printed circuit board 1b' is located at a position where the printed circuit board 1b 'is located.
A plurality of wiring patterns 2a 'to 2f' in b 'are arranged so as to display a barcode having contents different from those of other printed circuit boards.

As described above, according to the present invention, if a productionally inconvenient substrate is generated among a large number of substrates, the substrate can be removed or improved immediately, thereby improving production efficiency. be able to.

Further, according to the present invention, it is possible to manage parts of each electric board.

[0033]

According to the present invention, it is possible to provide a printed circuit board which is space-saving and can easily determine where one of a large number of printed circuit boards was located at the time of manufacturing the board. it can.

[Brief description of the drawings]

FIG. 1 is a top view showing a configuration of a worksheet 1 as a multi-piece substrate to which the present invention is applied.

FIG. 2A is an enlarged view of a printed circuit board 1b according to the first embodiment taken out of the worksheet 1 shown in FIG. 1, and FIG. 2B is an AA of FIG. It is sectional drawing.

FIG. 3 is a diagram showing a table in which a printed circuit board is identified by a combination of a plurality of wiring patterns with thick and thin patterns.

FIG. 4A is an enlarged view showing a plurality of wiring patterns formed on a part of a flexible printed circuit board 1b ′ according to a second embodiment taken out of the worksheet 1 shown in FIG. 1; FIG. 4B is a cross-sectional view taken along line BB of FIG. 4A, and FIG. 4C is a diagram illustrating a region R2 without a coverlay.

FIG. 5 is an enlarged view showing printed circuit boards 1a ′ and 1b ′ according to a third embodiment taken out of the worksheet 1 shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Worksheet (multi-piece board) 1a-1p, 1b 'Printed circuit board 2a-2f, 2a'-2f' Wiring pattern 2 Connection pattern 2-1 Contact R1, R3 Area with coverlay R2 Area without coverlay R4 Contact group width area 10 Base 11 Coverlay 12 Copper foil pattern

Claims (3)

[Claims] A plurality of printed circuit boards provided in each of the plurality of printed circuit boards for determining a position of each of the plurality of printed circuit boards when manufacturing the plurality of printed circuit boards; A printed circuit board, wherein a predetermined wiring pattern in a wiring pattern is given a combination of thicknesses different from the printed wiring patterns of the other printed circuit boards taken in large numbers, and binary display is performed. 2. A printed circuit board provided in each of a plurality of printed circuit boards in order to determine a position of each of the plurality of printed circuit boards when the plurality of printed circuit boards are manufactured. Wherein a predetermined wiring pattern is provided with a different thickness pattern from a printed wiring pattern of another printed circuit board taken in large numbers. 3. A plurality of wiring patterns on the printed circuit board in which one of a plurality of printed circuit boards is mounted on the other of the printed circuit boards to determine which position the printed circuit board is located on. A printed circuit board which is arranged so as to display a barcode having a different content from that of the printed circuit board.