JP2002212426A - Conductive silicone rubber composition and conductive part - Google Patents

Conductive silicone rubber composition and conductive part

Info

Publication number
JP2002212426A
JP2002212426A JP2001008730A JP2001008730A JP2002212426A JP 2002212426 A JP2002212426 A JP 2002212426A JP 2001008730 A JP2001008730 A JP 2001008730A JP 2001008730 A JP2001008730 A JP 2001008730A JP 2002212426 A JP2002212426 A JP 2002212426A
Authority
JP
Japan
Prior art keywords
silicone rubber
rubber composition
conductive
silver powder
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001008730A
Other languages
Japanese (ja)
Other versions
JP3922342B2 (en
Inventor
Tsutomu Nakamura
中村  勉
Mikio Iino
幹夫 飯野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2001008730A priority Critical patent/JP3922342B2/en
Publication of JP2002212426A publication Critical patent/JP2002212426A/en
Application granted granted Critical
Publication of JP3922342B2 publication Critical patent/JP3922342B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a conductive silicone rubber composition less vulnerable time-dependent coagulation because it uses spherical silver particles and achieving stable volume resistivity when added to a silicone rubber composition because it is excellent in dispersability and to provide conductive parts particularly excellent in resistance stability when subjected to repeated deformation because the silver particles are high in dispersability and therefore less prone to fall away. SOLUTION: The conductive silicone rubber composition is characterized in that it contains 100 pts.wt. of (A) organopolysiloxane described by average composition formula (1), R1nSiO(4-n)/2, (wherein R1 denotes identical or different optionally substituted monohydric hydrocarbon groups, with n is a positive number of 1.98-2.02) and provided with at least two unsaturated aliphatic groups, (B) 500-2,000 pts.wt. of spherical silver particles, and (C) a hardener enough in quantity to harden component (A).

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、導電性シリコーン
ゴム組成物及びこれを用いた導電性部品に関する。
TECHNICAL FIELD The present invention relates to a conductive silicone rubber composition and a conductive component using the same.

【0002】[0002]

【従来の技術及び発明が解決しようとする課題】銀粉末
は電気伝導度が大きいため、付加反応硬化型シリコーン
ゴム組成物、縮合反応硬化型シリコーンゴム組成物、パ
ーオキサイド加硫シリコーンゴム組成物等のシリコーン
ゴム組成物の導電性充填剤として利用されている。銀粉
末を配合したシリコーンゴム組成物は、硬化して低抵抗
のシリコーンゴムを形成するため、耐熱性、導電性が要
求される分野で応用されている。通常、シリコーンゴム
組成物に配合される銀粉末は、少量の添加で低い電気抵
抗値を得るために、フレーク状、ぶどう状など高次構造
があるものが使用されている。
2. Description of the Related Art Since silver powder has a high electric conductivity, an addition-curable silicone rubber composition, a condensation-curable silicone rubber composition, a peroxide-cured silicone rubber composition and the like are used. As a conductive filler of the silicone rubber composition. A silicone rubber composition containing silver powder is cured to form a low-resistance silicone rubber, and is therefore used in fields requiring heat resistance and conductivity. In general, silver powder used in a silicone rubber composition has a higher-order structure such as a flake shape or a grape shape in order to obtain a low electric resistance value with a small amount of addition.

【0003】しかし、これらの銀粉末は凝集が強く、長
時間貯蔵しておくと、シリコーンゴム組成物への添加が
不可能になる問題、あるいは得られた導電性部品に繰り
返し変形を加えると、銀粉末の高次構造が壊れ、抵抗値
の上昇が見られる不具合があった。
[0003] However, these silver powders have a strong agglomeration and cannot be added to the silicone rubber composition when stored for a long time, or when the obtained conductive parts are repeatedly deformed, There was a problem that the higher-order structure of the silver powder was broken and the resistance value was increased.

【0004】本発明は上記事情に鑑みなされたもので、
繰り返し変形後でも電気抵抗値が安定して得られる硬化
物を与える導電性シリコーンゴム組成物及びこれを用い
た導電性部品を提供することを目的とする。
[0004] The present invention has been made in view of the above circumstances,
It is an object of the present invention to provide a conductive silicone rubber composition that provides a cured product having a stable electric resistance even after repeated deformation, and a conductive component using the same.

【0005】[0005]

【課題を解決するための手段及び発明の実施の形態】本
発明者らは、上記目的を達成するため鋭意研究を行った
結果、銀粉末として球状銀粉末をシリコーンゴム組成物
に配合することが有効で、球状銀粉末は経時での凝集が
少なく、シリコーンゴム組成物に配合した場合、分散性
に優れる為、安定した体積抵抗率を得ることができ、特
に従来のフレーク状銀粉末、ぶどう状銀粉末を添加した
場合に比べ繰り返し変形後でも安定した低い電気抵抗値
を得ることができることを知見し、本発明をなすに至っ
た。即ち、従来、銀粉末を添加し低抵抗を得る技術とし
ては、銀粉末の形状が樹枝状、フレーク状、不定形状、
ぶどう状が良いとされ、またこれらの形状を有する銀粉
末の混合物であってもよいが、低抵抗のシリコーンゴム
を形成するためには完全に独立した分散ではなく、銀の
粉末が部分的に連結していることが望ましいとされたも
のである。しかしながら、これらの高次構造を有する銀
粉末を用いた場合、導電部品に変形を加えると、内部の
銀粉末の構造が壊れ、従って抵抗値の上昇が発生する不
具合があるが、球状の銀粉末を用いることにより、かか
る問題が解消され、安定した導電性を有するシリコーン
導電性部品を得ることができたものである。
Means for Solving the Problems and Embodiments of the Invention The present inventors have conducted intensive studies in order to achieve the above object, and as a result, it has been found that spherical silver powder can be blended into a silicone rubber composition as silver powder. Effective, spherical silver powder is less agglomerated with time, and when blended into a silicone rubber composition, has excellent dispersibility, so that a stable volume resistivity can be obtained, especially conventional flake silver powder, grape-like The present inventors have found that a stable and low electric resistance value can be obtained even after repeated deformation as compared with the case where silver powder is added, and have accomplished the present invention. That is, conventionally, as a technique for obtaining a low resistance by adding silver powder, the shape of the silver powder is dendritic, flake, irregular,
Grapes are considered to be good, and a mixture of silver powders having these shapes may be used.However, in order to form a low-resistance silicone rubber, dispersion is not completely independent, and silver powder is partially dispersed. It is desirable to be connected. However, when using silver powders having these higher-order structures, deformation of the conductive parts breaks the structure of the silver powder inside, and thus increases the resistance value. By using this, such a problem was solved, and a silicone conductive component having stable conductivity could be obtained.

【0006】従って、本発明は、(A)下記平均組成式
(1) R1 nSiO(4-n)/2 (1) (式中、R1は同一又は異種の非置換又は置換の1価炭
化水素基であり、nは1.98〜2.02の正数であ
る。)で示され、脂肪族不飽和基を少なくとも2個有す
るオルガノポリシロキサン:100重量部、(B)球状
銀粉末:500〜2,000重量部、(C)硬化剤:
(A)成分を硬化させ得る量を含有してなることを特徴
とする導電性シリコーンゴム組成物を提供する。
Accordingly, the present invention relates to (A) the following average composition formula (1): R 1 n SiO (4-n) / 2 (1) (wherein, R 1 is the same or different unsubstituted or substituted 1 And n is a positive number from 1.98 to 2.02), and an organopolysiloxane having at least two aliphatic unsaturated groups: 100 parts by weight, (B) spherical silver Powder: 500 to 2,000 parts by weight, (C) curing agent:
(A) Provided is a conductive silicone rubber composition containing an amount capable of curing the component.

【0007】また、本発明は、この導電性シリコーンゴ
ム組成物の硬化物からなる導電性部品を提供する。
The present invention also provides a conductive part made of a cured product of the conductive silicone rubber composition.

【0008】以下、本発明につき更に詳しく説明する。Hereinafter, the present invention will be described in more detail.

【0009】本発明に係るシリコーンゴム組成物の
(A)成分のオルガノポリシロキサンは、下記平均組成
式(1)で示されるものである。 R1 nSiO(4-n)/2 (1) (式中、R1は同一又は異種の非置換又は置換の1価炭
化水素基であり、nは1.98〜2.02の正数であ
る。)
The organopolysiloxane as the component (A) of the silicone rubber composition according to the present invention is represented by the following average composition formula (1). R 1 n SiO (4-n) / 2 (1) (wherein, R 1 is the same or different unsubstituted or substituted monovalent hydrocarbon group, and n is a positive number of 1.98 to 2.02) Is.)

【0010】ここで、上記式中、R1はメチル基、エチ
ル基、プロピル基、ブチル基、ヘキシル基、オクチル基
等のアルキル基、シクロヘキシル基等のシクロアルキル
基、ビニル基、アリル基、プロペニル基、ブテニル基、
ヘキセニル基等のアルケニル基、フェニル基、トリル基
等のアリール基、ベンジル基、フェニルエチル基等のア
ラルキル基などや、これらの基の炭素原子に結合した水
素原子の一部又は全部をハロゲン原子、シアノ基などで
置換したクロロメチル基、トリフルオロプロピル基、シ
アノエチル基などから選択される同一又は異種の好まし
くは炭素数1〜10、より好ましくは炭素数1〜8の非
置換又は置換1価炭化水素基である。特に好ましくはメ
チル基、ビニル基、フェニル基、トリフルオロプロピル
基である。この場合、R1は脂肪族不飽和基(アルケニ
ル基)を少なくとも2個有していることが必要である
が、R1中の脂肪族不飽和基の含有量は0.001〜2
0モル%、特に0.025〜5モル%であることが好ま
しい。また、nは1.98〜2.02の正数である。上
記式(1)のオルガノポリシロキサンは、基本的には直
鎖状であることが好ましいが、分子構造の異なる1種又
は2種以上の混合物であってもよい。更に、上記オルガ
ノポリシロキサンは、平均重合度が100〜20,00
0であることが好ましい。特に液状の組成物とする場合
は、平均重合度は100〜3,000、好ましくは50
0〜2,000、ミラブルの組成物とする場合は平均重
合度は3,000〜20,000、好ましくは4,00
0〜10,000である。
In the above formula, R 1 is an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, an octyl group, a cycloalkyl group such as a cyclohexyl group, a vinyl group, an allyl group, a propenyl group. Group, butenyl group,
Alkenyl groups such as hexenyl groups, phenyl groups, aryl groups such as tolyl groups, benzyl groups, aralkyl groups such as phenylethyl groups, and the like, and some or all of the hydrogen atoms bonded to carbon atoms of these groups are halogen atoms, The same or different, preferably unsubstituted or substituted monovalent carbon having 1 to 10 carbon atoms, more preferably 1 to 8 carbon atoms selected from a chloromethyl group, a trifluoropropyl group, a cyanoethyl group and the like substituted with a cyano group and the like. It is a hydrogen group. Particularly preferred are a methyl group, a vinyl group, a phenyl group and a trifluoropropyl group. In this case, R 1 needs to have at least two aliphatic unsaturated groups (alkenyl groups), and the content of the aliphatic unsaturated group in R 1 is 0.001 to 2
It is preferably 0 mol%, particularly preferably 0.025 to 5 mol%. N is a positive number between 1.98 and 2.02. The organopolysiloxane of the above formula (1) is preferably basically linear, but may be one or a mixture of two or more compounds having different molecular structures. Further, the organopolysiloxane has an average degree of polymerization of 100 to 20,000.
It is preferably 0. In particular, when a liquid composition is used, the average degree of polymerization is 100 to 3,000, preferably 50 to 3,000.
When the composition is a millable composition, the average degree of polymerization is 3,000 to 20,000, preferably 4,000.
0 to 10,000.

【0011】次に、(B)成分の球状銀粉末は、球状で
あればよく、これは1次粒子が球状であっても、1次粒
子を凝集させた高次構造(凝集)が球状であってもよ
い。なお、球状銀粉末が数個かたまり、だるま状になっ
たものが多少含まれていても問題ない。この場合、球状
銀粉末は、アスペクト比が2以下、より好ましくは1.
5以下、更に好ましくは1.3以下であるものが好まし
い。更に、特に繰り返し変形時の抵抗安定性を得る為
に、銀粉末の比表面積は好ましくは1.0m2/g以
下、特に好ましくは0.8m2/g以下である。また、
平均粒径は特に限定されず、0.05〜100μmの範
囲とすることができるが、実用上からは0.1〜10μ
m、特に0.2〜5μmのものが好ましい。
Next, the spherical silver powder of the component (B) may be spherical as long as the primary particles are spherical, but the higher order structure (aggregation) obtained by aggregating the primary particles is spherical. There may be. It is to be noted that there is no problem even if several spherical silver powders are collected and some of them are in a ball shape. In this case, the spherical silver powder has an aspect ratio of 2 or less, more preferably 1.
It is preferably 5 or less, more preferably 1.3 or less. Furthermore, the specific surface area of the silver powder is preferably 1.0 m 2 / g or less, particularly preferably 0.8 m 2 / g or less, in order to obtain resistance stability particularly during repeated deformation. Also,
The average particle size is not particularly limited, and may be in the range of 0.05 to 100 μm.
m, particularly preferably 0.2 to 5 μm.

【0012】上記球状銀粉末の配合量は、(A)成分の
オルガノポリシロキサン100部(重量部、以下同じ)
に対し500〜2,000部、好ましくは700〜1,
500部、特に800〜1,000部である。球状銀粉
末が少なすぎると、十分な導電性が得られないことがあ
り、多すぎると、配合が困難となったり力学的強度が低
下することがある。
The amount of the spherical silver powder is 100 parts by weight of the organopolysiloxane (A) (parts by weight, the same applies hereinafter).
500 to 2,000 parts, preferably 700 to 1,
500 parts, especially 800 to 1,000 parts. If the amount of the spherical silver powder is too small, sufficient conductivity may not be obtained. If the amount is too large, the compounding may be difficult or the mechanical strength may be reduced.

【0013】なお、本発明の球状銀粉末の製造方法は、
特に限定されるものではなく、たとえば電解法、粉砕
法、熱処理法、アトマイズ法、化学的製法などで製造さ
れた、球状粉末であればよい。
The method for producing a spherical silver powder of the present invention comprises:
There is no particular limitation, and any spherical powder produced by, for example, an electrolytic method, a pulverizing method, a heat treatment method, an atomizing method, or a chemical manufacturing method may be used.

【0014】また、銀粉末が凝集している場合は、凝集
を粉砕することが好ましく、凝集した銀粉末を粉砕する
装置は特に限定されず、例えば、スタンプミル、ボール
ミル、振動ミル、ハンマーミル、圧延ローラ、乳鉢等の
公知の装置が挙げられる。また、還元銀、アトマイズ
銀、電解銀またはこれら2種以上の混合物からなる銀粉
末を粉砕してもかまわない。
When the silver powder is agglomerated, it is preferable to pulverize the agglomerated silver powder. The apparatus for pulverizing the agglomerated silver powder is not particularly limited. For example, a stamp mill, a ball mill, a vibration mill, a hammer mill, Known devices such as a rolling roller and a mortar can be used. Alternatively, silver powder composed of reduced silver, atomized silver, electrolytic silver or a mixture of two or more of these may be ground.

【0015】(C)成分の硬化剤としては、通常導電性
シリコーンゴム組成物の加硫に使用される有機過酸化物
によるラジカル反応、付加反応、縮合反応等を利用して
加硫、硬化させるものであれば、その硬化機構に制限は
なく、従来公知の種々の硬化剤を用いることができる
が、有機過酸化物及び付加反応による架橋が好ましい。
The curing agent of the component (C) is vulcanized and cured by utilizing a radical reaction, an addition reaction, a condensation reaction or the like with an organic peroxide usually used for vulcanizing a conductive silicone rubber composition. The curing mechanism is not limited as long as it is one, and various conventionally known curing agents can be used, but crosslinking by an organic peroxide and an addition reaction is preferable.

【0016】例えば、有機過酸化物架橋の場合、有機過
酸化物触媒としては、例えばベンゾイルパーオキサイ
ド、2,4−ジクロロベンゾイルパーオキサイド、p−
メチルベンゾイルパーオキサイド、o−メチルベンゾイ
ルパーオキサイド、2,4−ジクミルパーオキサイド、
2,5−ジメチル−ビス(2,5−t−ブチルパーオキ
シ)ヘキサン、ジ−t−ブチルパーオキサイド、t−ブ
チルパーベンゾエートなどが挙げられる。有機過酸化物
触媒の添加量は、(A)成分のオルガノポリシロキサン
100部に対して0.1〜5部とすればよい。
For example, in the case of organic peroxide crosslinking, examples of the organic peroxide catalyst include benzoyl peroxide, 2,4-dichlorobenzoyl peroxide, p-
Methylbenzoyl peroxide, o-methylbenzoyl peroxide, 2,4-dicumyl peroxide,
Examples thereof include 2,5-dimethyl-bis (2,5-t-butylperoxy) hexane, di-t-butyl peroxide, and t-butyl perbenzoate. The amount of the organic peroxide catalyst to be added may be 0.1 to 5 parts based on 100 parts of the organopolysiloxane (A).

【0017】また、付加反応架橋の場合には、既知のオ
ルガノハイドロジェンポリシロキサン/白金系触媒を使
用し得る。この場合、白金系触媒としては公知のものが
使用でき、具体的には白金元素単体、白金化合物、白金
複合体、塩化白金酸、塩化白金酸のアルコール化合物、
アルデヒド化合物、エーテル化合物、各種オレフィン類
とのコンプレックスなどが例示される。白金系触媒の添
加量は、第1成分のオルガノポリシロキサンに対し白金
原子として1〜2,000ppmの範囲とすることが望
ましい。
In addition, in the case of addition reaction crosslinking, a known organohydrogenpolysiloxane / platinum-based catalyst can be used. In this case, a known catalyst can be used as the platinum-based catalyst. Specifically, a platinum element simple substance, a platinum compound, a platinum complex, chloroplatinic acid, an alcohol compound of chloroplatinic acid,
Examples thereof include aldehyde compounds, ether compounds, and complexes with various olefins. The amount of the platinum-based catalyst to be added is desirably in the range of 1 to 2,000 ppm as platinum atoms with respect to the organopolysiloxane of the first component.

【0018】一方、オルガノハイドロジェンポリシロキ
サンは、ケイ素原子に直結した水素原子を少なくとも2
個以上有するものであれば特に制限されず、直鎖状、分
岐鎖状、環状のいずれであってもよいが、R2 abSi
(4-a-b)/2(R2はR1と同様の非置換又は置換1価炭
化水素基で、好ましくは脂肪族不飽和結合を有さないも
のである。a、bは、0≦a<3、0<b<3、0<a
+b<3の数である。)で表されるものが好ましく、特
に重合度が300以下のものが好ましい。具体的には、
ジメチルハイドロジェンシリル基で末端が封鎖されたジ
オルガノポリシロキサン、ジメチルシロキサン単位とメ
チルハイドロジェンシロキサン単位及び末端トリメチル
シロキシ単位との共重合体、ジメチルハイドロジェンシ
ロキサン単位(H(CH32SiO0.5単位)とSiO2
単位とからなる低粘度流体、1,3,5,7−テトラハ
イドロジェン−1,3,5,7−テトラメチルシクロテ
トラシロキサン、1−プロピル−3,5,7−トリハイ
ドロジェン−1,3,5,7−テトラメチルシクロテト
ラシロキサン、1,5−ジハイドロジェン−3,7−ジ
ヘキシル−1,3,5,7−テトラメチルシクロテトラ
シロキサンなどが例示される。
On the other hand, the organohydrogenpolysiloxane has at least two hydrogen atoms directly bonded to silicon atoms.
It not particularly limited as long as it has more than five, linear, branched, may or cyclic, R 2 a H b Si
O (4-ab) / 2 (R 2 is the same unsubstituted or substituted monovalent hydrocarbon group as R 1 and preferably does not have an aliphatic unsaturated bond. A and b are 0 ≦ a <3, 0 <b <3, 0 <a
+ B <3. ) Are preferable, and those having a polymerization degree of 300 or less are particularly preferable. In particular,
Diorganopolysiloxane having a terminal blocked by a dimethylhydrogensilyl group, a copolymer of a dimethylsiloxane unit, a methylhydrogensiloxane unit and a terminal trimethylsiloxy unit, a dimethylhydrogensiloxane unit (H (CH 3 ) 2 SiO 0.5 Unit) and SiO 2
Low-viscosity fluid consisting of units, 1,3,5,7-tetrahydrogen-1,3,5,7-tetramethylcyclotetrasiloxane, 1-propyl-3,5,7-trihydrogen-1, Examples thereof include 3,5,7-tetramethylcyclotetrasiloxane and 1,5-dihydrogen-3,7-dihexyl-1,3,5,7-tetramethylcyclotetrasiloxane.

【0019】この硬化剤としてのオルガノハイドロジェ
ンポリシロキサンの添加量は、第1成分のオルガノポリ
シロキサンの脂肪族不飽和基(アルケニル基)に対し
て、ケイ素原子に直結した水素原子が50〜500モル
%となる割合で用いることが望ましい。
The amount of the organohydrogenpolysiloxane as the curing agent is such that the hydrogen atoms directly bonded to silicon atoms are 50 to 500 with respect to the aliphatic unsaturated groups (alkenyl groups) of the organopolysiloxane of the first component. It is desirable to use the compound in a ratio of mol%.

【0020】また、オルガノポリシロキサンが水酸基を
含む場合、縮合硬化剤として、多官能のアルコキシシラ
ン又はシロキサンとスズ系やチタン系の有機金属酸塩等
が使用できる。なお、硬化剤の添加量は、通常の導電性
シリコーンゴム組成物と同様でよい。
When the organopolysiloxane contains a hydroxyl group, a polyfunctional alkoxysilane or siloxane and a tin or titanium organic metal salt can be used as the condensation curing agent. Note that the amount of the curing agent added may be the same as that of a normal conductive silicone rubber composition.

【0021】上記シリコーンゴム組成物には、必要に応
じてシリカ、クレイ、炭酸カルシウム、ケイソウ土、二
酸化チタン等の充填剤、低分子シロキサンエステル、ジ
フェニルシランジオール、重合度100未満のα,ω−
ジメチルシロキサンジオール等のシラノール基含有低分
子量有機ケイ素化合物等、分散剤、酸化鉄、酸化セリウ
ム、オクチル酸鉄等の耐熱性向上剤、接着性や成形加工
性を向上させるための各種カーボンファンクショナルシ
ラン、難燃性を付与させる白金化合物等を添加混合して
もよい。
The silicone rubber composition may contain, if necessary, a filler such as silica, clay, calcium carbonate, diatomaceous earth, or titanium dioxide, a low-molecular siloxane ester, diphenylsilanediol, α, ω-
Silanol group-containing low molecular weight organosilicon compounds such as dimethylsiloxane diol, etc., dispersants, heat resistance improvers such as iron oxide, cerium oxide, iron octylate, etc., and various carbon functional silanes for improving adhesion and moldability. Alternatively, a platinum compound or the like for imparting flame retardancy may be added and mixed.

【0022】更には、スポンジを成形するための無機、
有機の発泡剤を添加してもよい。この発泡剤としては、
アゾビスイソブチロニトリル、ジニトロペンタメチレン
テトラミン、ベンゼンスルフォンヒドラジド、アゾジカ
ルボンアミドなどが例示され、その添加量は(A)成分
のオルガノポリシロキサン100部に対し1〜10部の
範囲が好適である。このように、本発明の組成物に発泡
剤を添加すると、スポンジ状の導電性シリコーンゴムを
得ることができる。
Further, an inorganic material for forming a sponge;
An organic foaming agent may be added. As this blowing agent,
Examples thereof include azobisisobutyronitrile, dinitropentamethylenetetramine, benzenesulfone hydrazide, and azodicarbonamide, and the amount of addition is preferably in the range of 1 to 10 parts with respect to 100 parts of the organopolysiloxane (A). . Thus, when a foaming agent is added to the composition of the present invention, a sponge-like conductive silicone rubber can be obtained.

【0023】本発明の導電性シリコーンゴム組成物は、
その硬化物の体積抵抗率が1×10 -5Ω・cm以下で、
初期と50%伸長させてから復元したものの体積抵抗率
の比が100以下、特に10以下、中でも5以下である
ことが好ましい。
The conductive silicone rubber composition of the present invention comprises:
The volume resistivity of the cured product is 1 × 10 -FiveΩcm or less,
Volume resistivity of initial and restored after 50% elongation
Is 100 or less, especially 10 or less, especially 5 or less.
Is preferred.

【0024】この硬化物は、電気スイッチ、コネクター
等の電気接点材料、電磁波シールド材等の導電性部品と
して好適に使用することができる。
The cured product can be suitably used as an electric contact material such as an electric switch and a connector, and a conductive component such as an electromagnetic wave shielding material.

【0025】[0025]

【発明の効果】本発明の導電性シリコーンゴム組成物
は、球状銀粉末を使用したことにより、経時での凝集が
少なく、シリコーンゴム組成物に配合した場合、分散性
に優れる為、安定した体積抵抗率を得ることができる。
また、銀粉末の分散が良いため、銀粉末の脱落が少ない
導電性部品を得ることができ、これは特に繰り返し変形
時の抵抗安定性に優れたものである。
EFFECT OF THE INVENTION The conductive silicone rubber composition of the present invention uses a spherical silver powder, so that there is little agglomeration over time, and when it is blended into a silicone rubber composition, it has excellent dispersibility, so that it has a stable volume. The resistivity can be obtained.
In addition, since the silver powder is well dispersed, it is possible to obtain a conductive component in which the silver powder is less likely to fall off, which has particularly excellent resistance stability during repeated deformation.

【0026】[0026]

【実施例】以下、実施例と比較例を示して本発明を具体
的に説明するが、本発明は下記実施例に限定されるもの
ではない。なお、以下の例において部はいずれも重量部
を示す。
EXAMPLES The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited to the following examples. In the following examples, all parts are parts by weight.

【0027】[実施例1,2、比較例1〜3]ジメチルシ
ロキサン単位99.85モル%とメチルビニルシロキサ
ン単位0.15モル%とからなる平均重合度が約8,0
00のメチルビニルポリシロキサン100部に、平均粒
径2μm、アスペクト比1.1、比表面積0.3m2
gの球状銀粉末(図1)を表1に示す通りに配合後、ジ
クミルパーオキサイドを0.5部添加し、170℃で1
0分間加熱加圧処理し、1mmのシートを得た。
Examples 1 and 2, Comparative Examples 1 to 3 The average degree of polymerization of 99.85 mol% of dimethylsiloxane units and 0.15 mol% of methylvinylsiloxane units is about 8.0.
00, 100 parts of methylvinylpolysiloxane, average particle size 2 μm, aspect ratio 1.1, specific surface area 0.3 m 2 /
g of spherical silver powder (FIG. 1) was added as shown in Table 1, and 0.5 part of dicumyl peroxide was added.
Heating and pressurizing treatment was performed for 0 minutes to obtain a 1 mm sheet.

【0028】このシートの電気特性をSRIS−230
1に準じて測定し、次いで50%伸張させた後、復元し
たシートの抵抗値を確認した。
The electrical characteristics of this sheet were measured using SRIS-230.
After measuring according to No. 1 and then elongating by 50%, the resistance value of the restored sheet was confirmed.

【0029】また、比較例2、3として、高次構造(ぶ
どう状)を持つ、AgC−BO(福田金属製品名、比表
面積1.8m2/g)銀粉末を用いたものを実施例1と
同様なポリマーに400部、800部添加した場合の特
性を調べた。以上の結果を表1に示す。
Further, as Comparative Examples 2 and 3, those using AgC-BO (Fukuda metal product name, specific surface area 1.8 m 2 / g) silver powder having a higher-order structure (grape shape) were used in Example 1. The characteristics when 400 and 800 parts were added to the same polymer as in Example 1 were examined. Table 1 shows the above results.

【0030】[0030]

【表1】 [Table 1]

【0031】[0031]

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施例で用いた球状銀粉末の電子顕微鏡写真で
ある。
FIG. 1 is an electron micrograph of a spherical silver powder used in Examples.

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4F071 AA67 AB07 AD02 AE15 AF37 AF39 AF40 AH12 BA01 BB03 BC01 BC03 4J002 CP131 CP141 DA076 EK037 EK047 FA086 FD010 FD116 FD147 GQ02 5G301 DA03 DA42 DD06 DD10  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F071 AA67 AB07 AD02 AE15 AF37 AF39 AF40 AH12 BA01 BB03 BC01 BC03 4J002 CP131 CP141 DA076 EK037 EK047 FA086 FD010 FD116 FD147 GQ02 5G301 DA03 DA42 DD06 DD10

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 (A)下記平均組成式(1) R1 nSiO(4-n)/2 (1) (式中、R1は同一又は異種の非置換又は置換の1価炭
化水素基であり、nは1.98〜2.02の正数であ
る。)で示され、脂肪族不飽和基を少なくとも2個有す
るオルガノポリシロキサン:100重量部、(B)球状
銀粉末:500〜2,000重量部、(C)硬化剤:
(A)成分を硬化させ得る量を含有してなることを特徴
とする導電性シリコーンゴム組成物。
(A) The following average composition formula (1): R 1 n SiO (4-n) / 2 (1) (wherein, R 1 is the same or different, unsubstituted or substituted monovalent hydrocarbon group) Wherein n is a positive number from 1.98 to 2.02), an organopolysiloxane having at least two aliphatic unsaturated groups: 100 parts by weight, (B) a spherical silver powder: 500 to 2,000 parts by weight, (C) curing agent:
(A) A conductive silicone rubber composition comprising an amount capable of curing the component.
【請求項2】 球状銀粉末の比表面積が1.0m2/g
以下である請求項1記載の組成物。
2. The spherical silver powder has a specific surface area of 1.0 m 2 / g.
The composition of claim 1 wherein:
【請求項3】 硬化物の体積抵抗率が1×10-5Ω・c
m以下であり、初期と50%伸長させてから復元したも
のの体積抵抗率の比が100以下である請求項1又は2
記載の組成物。
3. The cured product has a volume resistivity of 1 × 10 −5 Ω · c.
m or less, and the ratio of the volume resistivity of the initial one and the one restored after elongation by 50% is 100 or less.
A composition as described.
【請求項4】 電気接点材料用又は電磁波シールド材料
用である請求項1〜3のいずれか1項に記載の組成物。
4. The composition according to claim 1, which is used for an electric contact material or an electromagnetic wave shielding material.
【請求項5】 請求項1〜4のいずれか1項に記載の組
成物の硬化物からなる導電性部品。
5. A conductive component comprising a cured product of the composition according to claim 1.
JP2001008730A 2001-01-17 2001-01-17 Conductive silicone rubber composition for electrical contact material or electromagnetic shielding material and conductive part for electrical contact material or electromagnetic shielding material Expired - Fee Related JP3922342B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001008730A JP3922342B2 (en) 2001-01-17 2001-01-17 Conductive silicone rubber composition for electrical contact material or electromagnetic shielding material and conductive part for electrical contact material or electromagnetic shielding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001008730A JP3922342B2 (en) 2001-01-17 2001-01-17 Conductive silicone rubber composition for electrical contact material or electromagnetic shielding material and conductive part for electrical contact material or electromagnetic shielding material

Publications (2)

Publication Number Publication Date
JP2002212426A true JP2002212426A (en) 2002-07-31
JP3922342B2 JP3922342B2 (en) 2007-05-30

Family

ID=18876308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001008730A Expired - Fee Related JP3922342B2 (en) 2001-01-17 2001-01-17 Conductive silicone rubber composition for electrical contact material or electromagnetic shielding material and conductive part for electrical contact material or electromagnetic shielding material

Country Status (1)

Country Link
JP (1) JP3922342B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004027087A (en) * 2002-06-27 2004-01-29 Shin Etsu Chem Co Ltd Conductive silicone rubber composition and conductive member
WO2012108502A1 (en) * 2011-02-10 2012-08-16 東海ゴム工業株式会社 Flexible conductive material, method for manufacturing same, and electrode, wiring, electromagnetic wave shielding, and transducer using flexible conductive material
JP5321723B1 (en) * 2012-10-29 2013-10-23 横浜ゴム株式会社 Conductive composition and solar battery cell

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104690287B (en) * 2014-09-22 2017-09-12 中国热带农业科学院农产品加工研究所 A kind of green, the in situ, preparation method of gold, silver nano-particle/natural rubber nano composite material of size tunable

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004027087A (en) * 2002-06-27 2004-01-29 Shin Etsu Chem Co Ltd Conductive silicone rubber composition and conductive member
WO2012108502A1 (en) * 2011-02-10 2012-08-16 東海ゴム工業株式会社 Flexible conductive material, method for manufacturing same, and electrode, wiring, electromagnetic wave shielding, and transducer using flexible conductive material
CN103120035A (en) * 2011-02-10 2013-05-22 东海橡塑工业株式会社 Flexible conductive material, method for manufacturing same, and electrode, wiring, electromagnetic wave shielding, and transducer using flexible conductive material
EP2568778A4 (en) * 2011-02-10 2015-07-08 Sumitomo Riko Co Ltd Flexible conductive material, method for manufacturing same, and electrode, wiring, electromagnetic wave shielding, and transducer using flexible conductive material
JP5321723B1 (en) * 2012-10-29 2013-10-23 横浜ゴム株式会社 Conductive composition and solar battery cell
JP2014088466A (en) * 2012-10-29 2014-05-15 Yokohama Rubber Co Ltd:The Conductive composition and solar cell

Also Published As

Publication number Publication date
JP3922342B2 (en) 2007-05-30

Similar Documents

Publication Publication Date Title
JP3999994B2 (en) Conductive silicone rubber composition
JP3647389B2 (en) Polyorganosiloxane foam, foam and method for producing the same
EP1039480B1 (en) Conductive silicone rubber composition and low-resistance connector
JP4762781B2 (en) Conductive silicone rubber composition and conductive silicone rubber sponge
JP2003225217A (en) Silicone rubber composition for living body electrode and electrode for living body
JP2004031203A (en) Electrically conductive contact element and electric connector
TW200813137A (en) High-open cell-content silicone rubber sponge
JPH06329909A (en) Silicone rubber roll
JP5160403B2 (en) Conductive silicone rubber composition
JP3501055B2 (en) Semiconductive silicone rubber composition and silicone rubber roll
JP2003176412A (en) Electrically conductive silicone rubber sponge-forming composition, electrically conductive silicone rubber sponge and method for producing them
JP2002212426A (en) Conductive silicone rubber composition and conductive part
JP2003059341A (en) Conductive silicone rubber composition
JP3383536B2 (en) Semiconductive silicone rubber composition and silicone rubber roll
JP3103010B2 (en) Conductive silicone rubber composition and conductive silicone rubber roll using the same
JP2000044804A (en) Electrically insulating silicone rubber composition and silicone rubber insulator
JP4196146B2 (en) Conductive silicone rubber composition and method for producing the same
JP4392106B2 (en) Low resistance connector
JP3503454B2 (en) Semiconductive silicone rubber composition and semiconductive silicone rubber roll
JP3756301B2 (en) Conductive silicone rubber composition for sponge and conductive silicone sponge using the same
US6156236A (en) Conductive organopolysiloxane composition
JP4766244B2 (en) Conductive silicone rubber composition and conductive silicone rubber sponge
JP3846575B2 (en) Conductive silicone rubber composition
JPH08134250A (en) Silicone rubber sponge composition and silicone rubber sponge produced therefrom
JPH04300965A (en) Electrically conductive liquid silicone composition

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20050516

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050518

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050712

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050907

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050928

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070131

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070213

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 3922342

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100302

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130302

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160302

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees