JP2002212308A - Phenolic resin molded material and method for molding the same - Google Patents
Phenolic resin molded material and method for molding the sameInfo
- Publication number
- JP2002212308A JP2002212308A JP2001007253A JP2001007253A JP2002212308A JP 2002212308 A JP2002212308 A JP 2002212308A JP 2001007253 A JP2001007253 A JP 2001007253A JP 2001007253 A JP2001007253 A JP 2001007253A JP 2002212308 A JP2002212308 A JP 2002212308A
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- Japan
- Prior art keywords
- resin
- molding
- modifier
- molded
- condensate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Reinforced Plastic Materials (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はフェノール樹脂系成形材
に関するものであつて、詳しくはレゾール系フェノール
樹脂が使用され寸法安定性に優れたフェノール樹脂成形
物とその成形方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenolic resin-based molding material, and more particularly to a phenolic resin molded product using a resole-based phenolic resin and having excellent dimensional stability, and a method of molding the same.
【0002】[0002]
【従来技術】従来、フェノール樹脂は耐熱性、強靱性、
硬度、電気絶縁性等の性能に優れるため、絶縁板、化粧
板、成形部品、接着剤等の広い分野において使用されて
いる。2. Description of the Related Art Conventionally, phenolic resins have been known for their heat resistance, toughness,
Because of its excellent properties such as hardness and electrical insulation, it is used in a wide range of fields such as insulating boards, decorative boards, molded parts, and adhesives.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、フェノ
ール樹脂を使用した成形品はガラス等の無機質材料や金
属等に比べて寸法安定性が劣るという欠点があり、これ
に起因する成型品のそり、ねじれ、クラック、接着部分
の剥がれ等の欠陥が潜在的に残されていた。殊に他の素
材と複合化されて使用された場合には前記の欠陥が顕著
になるため改良が求められていた。従来、寸法変化を低
減する一方法として無機質充填材を多量に配合するなど
の手段があるが、成型品の強度を低下させる難点があ
り、他の方法による改良が求められていた。However, a molded article using a phenolic resin has a drawback that its dimensional stability is inferior to inorganic materials such as glass, metals, and the like. Defects such as cracks, peeling of the bonded portion, etc. were potentially left. In particular, when used in combination with other materials, the above-mentioned defects become remarkable, so that improvement has been demanded. Conventionally, as a method of reducing the dimensional change, there is a method of blending a large amount of an inorganic filler or the like, but there is a problem that the strength of a molded product is reduced, and improvement by another method has been required.
【0004】[0004]
【課題を解決するための手段】本発明では、前記のよう
な課題を解決すべく鋭意検討してなされた結果、フェノ
ール樹脂にある種の変性剤を配合することにより、寸法
安定性の改良ばかりか、成型材の色調を薄くするととも
に経時的な色調変化を低減できる効果まで得られること
が判明した。According to the present invention, as a result of intensive studies to solve the above-mentioned problems, it has been found that the phenol resin is blended with a certain type of modifier to improve the dimensional stability. Alternatively, it has been found that the effect of reducing the color tone of the molding material over time and reducing the color tone change over time can be obtained.
【0005】この様な特性を実現できる可能性のある変
性剤について幅広く検討を進めた結果、水酸基を持つア
ルキレンオキサイド誘導体をレゾール系フェノール樹脂
に変性剤として配合することにより、配合した樹脂組成
物の状態では溶解していて、硬化が進行するとともに樹
脂から分離し、かつ硬化物中に均一に分散した構造を形
成する変性剤が、この様な効果をもたらすことが確認さ
れ、本発明に至ったものである。該アルキレンオキサイ
ド誘導体として例示すると、ポリエチレングリコール、
ポリプロピレングリコール、ポリブチレングリコール、
ポリエチレングリコールグリセリルエーテル、ポリプロ
ピレングリコールグリセリルエーテル等がある。また、
該アルキレンオキサイド誘導体には分子内に重合性を持
つ化合物をレゾール系フェノール樹脂に添加して硬化過
程において重合せしめ、高分子量化することにより相分
離、均一分散させることも可能である。これらの例とし
て、例えば、ポリエチレングリコールモノ(メタ)アク
リレート、ポリプロピレングリコールモノ(メタ)アク
リレート等のポリアルキレングリコール(メタ)アクリ
レートやポリエチレングリコールアリルエーテル、ポリ
プロピレングリコールアリルエーテル等のアリル化ポリ
エーテルが使用できる。[0005] As a result of extensive studies on modifying agents capable of realizing such characteristics, it has been found that an alkylene oxide derivative having a hydroxyl group is mixed with a resole phenolic resin as a modifying agent to obtain a modified resin composition. It is confirmed that a modifier that is dissolved in the state, separates from the resin as the curing progresses, and forms a structure uniformly dispersed in the cured product has such an effect, and has led to the present invention. Things. Illustrative examples of the alkylene oxide derivative include polyethylene glycol,
Polypropylene glycol, polybutylene glycol,
Examples include polyethylene glycol glyceryl ether and polypropylene glycol glyceryl ether. Also,
The alkylene oxide derivative can be phase-separated and uniformly dispersed by adding a compound having polymerizability in the molecule to a resol-based phenol resin and polymerizing it in a curing process to increase the molecular weight. Examples of these include polyalkylene glycol (meth) acrylates such as polyethylene glycol mono (meth) acrylate and polypropylene glycol mono (meth) acrylate, and allylated polyethers such as polyethylene glycol allyl ether and polypropylene glycol allyl ether. .
【0006】レゾール系フェノール樹脂の硬化過程にお
いて分離、分散する化合物としては疎水性で分子量が高
いほど相分離しやすい。しかしながらある段階以上に疎
水性及び分子量が高くなるとレゾール系フェノール樹脂
溶液に不溶となつたり、硬化過程で分離するものの均一
な分散状態とならず液状で滲み出したりする場合があ
る。これらの現象はフェノールとホルムアルデヒドの反
応比率、反応触媒、例えばアルキルフェノール、アミノ
化合物等の共縮合する化合物、添加される可塑剤等の変
性剤及び成形条件により異なってくるため、レゾール系
フェノール樹脂の性質、特性に応じてアルキレンオキサ
イド誘導体の種類、分子量並びに添加量を調整、選定す
る必要がある。As the compound that separates and disperses during the curing process of the resol-based phenolic resin, the compound is more hydrophobic and the phase separation is easier as the molecular weight is higher. However, if the hydrophobicity and the molecular weight become higher than a certain level, they may become insoluble in the resol-based phenol resin solution, or may exude in a liquid state without separating into a uniform dispersion state even though they are separated during the curing process. These phenomena differ depending on the reaction ratio of phenol and formaldehyde, the reaction catalyst, for example, compounds that co-condensate such as alkylphenols and amino compounds, modifiers such as plasticizers added, and molding conditions. It is necessary to adjust and select the kind, molecular weight and addition amount of the alkylene oxide derivative according to the characteristics.
【0007】本発明の目的を実現するためには樹脂液の
状態においては樹脂と変性剤が溶解した状態であつて、
硬化した樹脂中では変性剤が分離し、均一に分散してい
ることが必要である。硬化した樹脂中に均一に溶け合っ
た状態では目的を達することができない。本発明では硬
化した樹脂中に変性剤が分離し、分散しているかどうか
の判定として、硬化した時点で透明均一状態であるか、
乳白濁状態であるか、変性剤が滲み出しているかどうか
により判断できる。透明均一状態であれば樹脂と変性剤
が均一に溶け合って硬化していると判断され、乳白濁状
であれば分離、分散している状態と判断される。また変
性剤が滲み出している場合は硬化樹脂中に均一に分散せ
ずに分離していると判断される。[0007] In order to realize the object of the present invention, in the state of the resin liquid, the resin and the modifier are dissolved,
It is necessary that the modifier is separated and uniformly dispersed in the cured resin. The purpose cannot be achieved if the resin is uniformly dissolved in the cured resin. In the present invention, the modifier is separated in the cured resin, as a determination of whether or not dispersed, whether or not the transparent uniform state at the time of curing,
The determination can be made based on whether the milky milky state or the denaturant is seeping out. If it is in a transparent and uniform state, it is determined that the resin and the modifying agent are uniformly dissolved and cured, and if it is milky, it is determined that they are separated and dispersed. When the denaturing agent is oozing out, it is judged that the denaturing agent is separated without being uniformly dispersed in the cured resin.
【0008】本発明におけるホルムアルデヒド/フェノ
ールとのモル比は1〜3が望ましく、フェノール樹脂固
形分に対する変性剤の添加率は5〜80%が適合する。
添加率が5%以下では十分に分離、分散状態が得れず目
的を達することができない。80%以上ではフェノール
樹脂の持つ強靱性、耐熱性等が損なわれるため好ましく
ない。変性剤は反応当初に配合してもよいが、フェノー
ルとホルムアルデヒドとの初期縮合物が合成されたの
ち、配合しても構わない。また、フェノール樹脂は単独
でも使用可能であるが、アルキルフェノール類、アミノ
化合物等との共縮合物やパラトルエンスルホンアミド、
カプロラクタム等を添加した変性樹脂にも応用可能であ
る。In the present invention, the molar ratio of formaldehyde to phenol is desirably 1 to 3, and the additive ratio of the modifier to the solid content of the phenol resin is preferably 5 to 80%.
If the addition rate is 5% or less, the separation and dispersion state cannot be sufficiently obtained, and the object cannot be achieved. If it is 80% or more, the toughness and heat resistance of the phenol resin are impaired, which is not preferable. The modifier may be added at the beginning of the reaction, but may be added after the initial condensate of phenol and formaldehyde is synthesized. The phenol resin can be used alone, but alkylphenols, co-condensates with amino compounds and the like, para-toluenesulfonamide,
It is also applicable to modified resins to which caprolactam or the like is added.
【0009】本発明に係わる成形品として積層板の例に
ついて説明すると、この様にして調製した樹脂素材をガ
ラス繊維、セルロース繊維、合成繊維等の繊維類から加
工された紙、不織布、シート、織布等の基材に含浸させ
た含浸シートを複数枚積層し、熱圧成型されて積層板に
仕上げられる。また、積層板表面に化粧層を張り合わせ
たり、塗装等を施して仕上げられても良い。あるいは、
この様に調製された含浸シートの上に、他の樹脂含浸シ
ート、例えば化粧紙にメラミン樹脂、不飽和ポリエステ
ル樹脂等の樹脂を含浸せしめたものを重ねて成型してし
たり、各種の化粧シートを積層するなどして、化粧仕上
げ積層板として仕上げることもできる。[0009] A laminated sheet will be described as an example of a molded article according to the present invention. The resin material prepared in this manner is processed from fibers such as glass fiber, cellulose fiber, and synthetic fiber into paper, nonwoven fabric, sheet, and woven fabric. A plurality of impregnated sheets impregnated into a substrate such as cloth are laminated, and hot-pressed to finish the laminate. Further, it may be finished by attaching a decorative layer to the surface of the laminated board, or by painting. Or,
On the impregnated sheet prepared in this way, another resin-impregnated sheet, for example, a decorative paper impregnated with a resin such as a melamine resin or an unsaturated polyester resin is laminated and molded, or various decorative sheets are formed. Can be finished as a decorative laminate.
【0010】実施例 レゾール系フェノール樹脂の合成 攪拌装置、温度計、冷却コンデンサーを装備したフラス
コにフェノール1モル、47%ホルマリン水溶液1.3
モル(ホルムアルデヒド換算)を仕込み、水酸化ナトリ
ウムによりPH8.0に調整した。反応液を昇温し95
℃に反応液を保持して、反応液の白濁開始温度が40℃
となるまで反応した。そのあと冷却してメタノールを添
加して希釈し、固形分50%のレゾール型フェノール樹
脂(以下樹脂Aという)を得た。EXAMPLES Synthesis of resole phenolic resin A flask equipped with a stirrer, thermometer and cooling condenser was charged with 1 mol of phenol, 47% formalin aqueous solution 1.3.
A mole (in terms of formaldehyde) was charged, and the pH was adjusted to 8.0 with sodium hydroxide. The reaction solution was heated to 95
The reaction solution is maintained at a temperature of 40 ° C.
It reacted until it became. Thereafter, the mixture was cooled and diluted by adding methanol to obtain a resol type phenol resin (hereinafter referred to as resin A) having a solid content of 50%.
【0011】実施例1 実施例により得られた樹脂Aの100重量部(以下単に
部という)に対して平均分子量4000、水酸基価26
(KOHmg/g)のポリプロピレングリコール20
部、メタノール20部を添加した樹脂組成物を得た。
樹脂組成物を140℃の熱板上に滴下し硬化した樹脂
固形物は均一な乳白濁状の褐色であって、ポリプロピレ
ングリコールの滲みだしはなかった。Example 1 An average molecular weight of 4,000 and a hydroxyl value of 26 per 100 parts by weight (hereinafter simply referred to as "parts") of the resin A obtained in the examples.
(KOHmg / g) polypropylene glycol 20
And 20 parts of methanol.
The resin solid which was dropped and cured on a hot plate at 140 ° C. was a uniform milky brown color and did not exude polypropylene glycol.
【0012】実施例2 実施例で得た樹脂A、100部に対して平均分子量15
00、水酸基価39(KOHmg/g)のポリプロピレ
ングリコールモノアリルエーテル20部、ラジカル重合
開始剤としてtーブチルパーオキシ−2−エチルヘキサ
ノエート0.75部、メタノール20部を添加した透明
褐色の樹脂組成物を得た。樹脂組成物を140℃の
熱板上に滴下し、硬化した樹脂固形物は均一な乳白濁状
の褐色であって、ポリプロピレングリコールモノアリル
エーテルの滲みだしはなかった。Example 2 Resin A obtained in Example 2 had an average molecular weight of 15 based on 100 parts.
00, a transparent brown color obtained by adding 20 parts of polypropylene glycol monoallyl ether having a hydroxyl value of 39 (KOH mg / g), 0.75 part of t-butyl peroxy-2-ethylhexanoate as a radical polymerization initiator, and 20 parts of methanol. A resin composition was obtained. The resin composition was dropped on a hot plate at 140 ° C., and the cured resin solid was a uniform milky brown color, with no bleeding of polypropylene glycol monoallyl ether.
【0013】比較例1 実施例により得られた樹脂Aを、そのまま比較例1とし
た。比較例1の樹脂を140℃の熱板上に滴下し、硬化
した樹脂固形物は均一な透明渇色であった。Comparative Example 1 Resin A obtained in the Example was used as Comparative Example 1 as it was. The resin of Comparative Example 1 was dropped on a hot plate at 140 ° C., and the cured resin solid had a uniform, transparent and dry color.
【0014】比較例2 実施例にて得られた樹脂A、100部に対して平均分子
量400、水酸基価279(KOHmg/g)のポリプ
ロピレングリコール20部、メタノール20部添加した
透明褐色の比較例2の樹脂組成物を得た。樹脂組成物
を140℃の熱板上に滴下し硬化した樹脂固形物は均
一な透明渇色であって、滲みだしはなかった。Comparative Example 2 A transparent brown comparative example 2 was obtained by adding 20 parts of polypropylene glycol having an average molecular weight of 400 and a hydroxyl value of 279 (KOH mg / g) to 100 parts of the resin A obtained in Example and 20 parts of methanol. Was obtained. The resin solid obtained by dropping the resin composition on a hot plate at 140 ° C. and hardening had a uniform transparent dry color and did not bleed.
【0015】上記の実施例、比較例の各樹脂組成物を使
用して下記に従って成形物を成形した。 ( 配合 ) 樹脂A及び〜組成物 100重量部 炭酸カルシウム 200重量部 この配合物をメタノールで希釈して含浸塗工用スラリー
を得た。該スラリーを坪量75g/m2、密度0.15
g/m3のガラス繊維不織布に含浸塗工したのち、乾燥
して坪量900g/m2の積層用プリプレグシートを得
た。当プリプレグシートを7枚積層し、150℃、9.
8MPa(100kg/cm2)において30分成形
し、厚さ3mmの積層板を得た。積層板の寸法変化率及
び色調変化の度合いを表1に示す。Using the resin compositions of the above Examples and Comparative Examples, molded articles were molded as follows. (Blending) Resin A and composition 100 parts by weight Calcium carbonate 200 parts by weight This blend was diluted with methanol to obtain a slurry for impregnation coating. The slurry was weighed 75 g / m 2 and had a density of 0.15.
g / m3 glass fiber nonwoven fabric was impregnated and then dried to obtain a prepreg sheet for lamination having a basis weight of 900 g / m2. 7. Laminate 7 prepreg sheets at 150 ° C, 9.
Molding was performed at 8 MPa (100 kg / cm 2) for 30 minutes to obtain a laminated plate having a thickness of 3 mm. Table 1 shows the dimensional change rate and the degree of color tone change of the laminate.
【0016】[0016]
【表1】 ( 測定方法 ) * 寸法変化率 JISK 6902に準じ、伸び+
縮みの合計として表す。 (伸び) 40±2℃ 、相対湿度90〜95%の恒温
恒湿装置中に96時間放置して測定。 (縮み) 70±2℃の恒温乾燥機に24時間放置して
測定。 * 色差 成形した成形品及び40±2℃、相対
湿度90〜95%の恒温恒湿装置中に96時間放置した
成形品のLabを分光測色計にて測定し、ハンター色差
式に基づき色差ΔEを求める。 * 耐煮沸性 JISK6902に準じる。 5
0mm角の試験片を2時間煮沸したのち、試験片の層間
剥離、充填材の脱落がないかどうかを判定する。 * 曲げ強度 JISK 6902に準ずる。 * 曲げ弾性率 JISK 6902に準ずる。[Table 1] (Measurement method) * Dimensional change rate Elongation + according to JISK 6902
Expressed as the total shrinkage. (Elongation) Measured by leaving it in a thermo-hygrostat at 40 ± 2 ° C. and 90-95% relative humidity for 96 hours. (Shrinkage) Measured by leaving it in a constant temperature dryer at 70 ± 2 ° C for 24 hours. * Color difference The Lab of the molded article and the molded article left for 96 hours in a constant temperature and humidity apparatus at 40 ± 2 ° C. and a relative humidity of 90 to 95% was measured with a spectrophotometer, and the color difference ΔE was calculated based on the Hunter color difference equation. Ask for. * Boiling resistance According to JISK6902. 5
After boiling the 0 mm square test piece for 2 hours, it is determined whether or not the test piece has delaminated and the filler has not fallen off. * Bending strength According to JISK 6902. * Flexural modulus According to JISK6902.
【0017】本発明になる成形物は硬化したフェノール
樹脂中に変性剤が分離し、分散した状態を形成している
ため、環境変化により引き起こされるフェノール樹脂層
の収縮、膨張の応力が全体に波及することがない。この
ため寸法安定性が大幅に改善される。従って本発明に係
わる成形物、例えば積層板が他の基材例えばモルタル下
地等に接着剤で一体に接合された場合、環境変化に基づ
く積層板の寸法変化より引き起こされる接着層の剥離、
基材の反り並びにクラックの発生が少なくなるなどの効
果が得られる。このため各種の基材等との複合化した場
合において度々問題となる剥離、そり、クラック等の問
題がなくなり安心して利用できる。また、電気絶縁材等
の成形材料として使用されれば、寸法安定性の改善、狂
い等の問題がなく品質向上を図ることができる。更に、
フェノール樹脂の周囲に変性剤が分離、分散した構造で
あるため色差のブレが少なくなり外観も改善される。In the molded article according to the present invention, since the modifier is separated and dispersed in the cured phenol resin, the shrinkage and expansion stress of the phenol resin layer caused by the environmental change is transmitted throughout. I can't. Therefore, the dimensional stability is greatly improved. Therefore, when the molded product according to the present invention, for example, a laminate is integrally bonded to another base material such as a mortar base with an adhesive, peeling of the adhesive layer caused by a dimensional change of the laminate due to environmental change,
Effects such as a reduction in warpage of the base material and generation of cracks can be obtained. For this reason, problems such as peeling, warping, and cracks, which often occur in the case of compounding with various base materials, can be eliminated, and the device can be used with confidence. Further, if it is used as a molding material such as an electric insulating material, the quality can be improved without problems such as improvement of dimensional stability and deviation. Furthermore,
Due to the structure in which the modifier is separated and dispersed around the phenol resin, the color difference blur is reduced and the appearance is improved.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) // B29K 61:04 B29K 61:04 105:06 105:06 B29L 9:00 B29L 9:00 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) // B29K 61:04 B29K 61:04 105: 06 105: 06 B29L 9:00 B29L 9:00
Claims (6)
を硬化成分として成形されたものであつて、該縮合物中
に変性剤が分離、分散された状態で成形されていること
を特徴とするフェノール樹脂系成形物。1. A phenolic resin molded using a condensate of phenol and formaldehyde as a hardening component, wherein a modifier is separated and dispersed in the condensate. Molded product.
イド誘導体である請求項1記載の成形物。2. The molded article according to claim 1, wherein said modifier is an alkylene oxide derivative having a hydroxyl group.
て成形されている請求項1及び請求項2記載の成形物。3. The molded article according to claim 1, wherein the condensate is impregnated into a substrate and molded as a laminate.
を硬化成分として成形するに際し、変性剤を配合した該
縮合物を硬化させるとともに該変性剤を樹脂硬化物より
分離、分散させた状態で成形することを特徴とする成型
物の成形方法。4. When molding a condensate of phenol and formaldehyde as a curing component, the condensate containing a modifier is cured, and the modifier is separated and dispersed from the cured resin. A method for molding a molded article, characterized by the following.
ド誘導体である請求項4記載の成形物の成形方法。5. The molding method according to claim 4, wherein the modifying agent is an alkylene oxide derivative having a hydroxyl group.
積層板として成形する請求項4及び請求項5記載の成形
物の成形方法。6. A base material impregnated with a condensate containing a modifier,
The molding method according to claim 4 or 5, wherein the molding is performed as a laminate.
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5521415A (en) * | 1978-07-28 | 1980-02-15 | Matsushita Electric Works Ltd | Thermosetting resin molding compound |
JPS55151019A (en) * | 1979-05-12 | 1980-11-25 | Matsushita Electric Works Ltd | Production of plasticization-modified phenolic resin |
JPS55164215A (en) * | 1979-06-08 | 1980-12-20 | Matsushita Electric Works Ltd | Preparation of plasticized phenolic resin |
JPS58113244A (en) * | 1981-12-26 | 1983-07-06 | Sumitomo Bakelite Co Ltd | Thermosetting resin aqueous emulsion |
-
2001
- 2001-01-16 JP JP2001007253A patent/JP4554092B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5521415A (en) * | 1978-07-28 | 1980-02-15 | Matsushita Electric Works Ltd | Thermosetting resin molding compound |
JPS55151019A (en) * | 1979-05-12 | 1980-11-25 | Matsushita Electric Works Ltd | Production of plasticization-modified phenolic resin |
JPS55164215A (en) * | 1979-06-08 | 1980-12-20 | Matsushita Electric Works Ltd | Preparation of plasticized phenolic resin |
JPS58113244A (en) * | 1981-12-26 | 1983-07-06 | Sumitomo Bakelite Co Ltd | Thermosetting resin aqueous emulsion |
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