JP2002210623A - Surface plate with suction mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fix a substrate with suction down to the periphery thereof irrespective of the dimensions of the substrate as an object of suction. SOLUTION: A surface plate with a suction mechanism, which is used to position and fix the platelike substrate on a stage S when the substrate is worked, has in the stage S a plurality of suction holes 2 and a plurality of suction grooves 1 for fixing the substrate with suction. A change in the pattern of suction according to the size of the substrate can fix the substrate with suction down to the periphery thereof irrespective of the dimensions of the substrate as an object of suction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface plate provided with a suction mechanism for mounting and fixing a flat substrate when processing the substrate.

[0002]

2. Description of the Related Art In general, when a coating liquid is applied to the surface of a plate-like substrate by, for example, a T-die,
In order to make the coating film thickness uniform, it is necessary to keep the substrate horizontal and to keep the gap between the substrate and the die head constant. For this reason, the work is usually performed by placing the substrate on a surface plate. As such a surface plate, an expensive stone surface plate having a suction groove formed on a stage is often used.

[0003]

In the surface plate described in the prior art, if the size of the substrate to be mounted is always constant, a groove for suction corresponding to the size is formed on the stage, and then the surface is fixed. It is possible to fix the mounted substrate to the stage by connecting the pipe to the pump and sucking the pipe. However, when the size of the target substrate is various, there is a problem that the substrate straddles the groove and cannot be attracted. Therefore, the suction holes divided into appropriate blocks may be processed on the stage. However, if the substrate has a certain amount of warpage, the periphery is lifted upward, and the film thickness at that portion is reduced. Happens. In particular, this tendency becomes stronger as the size of the substrate increases.

The present invention has been made in view of such a problem, and an object of the present invention is to fix a substrate in a state in which the substrate is attracted to the outer periphery of the substrate regardless of the size of the substrate to be attracted. An object of the present invention is to provide a surface plate with a suction mechanism.

[0005]

The platen with the suction mechanism according to the first aspect of the present invention basically mounts and fixes a flat substrate on a stage when processing the substrate. A surface plate with a suction mechanism used in the above, wherein a plurality of suction holes and a plurality of suction grooves for sucking and fixing the substrate are provided on the stage.

According to a second aspect of the present invention, there is provided a surface plate with a suction mechanism according to the first aspect.
The pattern is such that a plurality of suction grooves and a plurality of suction holes are provided on a stage in a pattern in which holes near the corners are straight grooves in other portions.

According to a third aspect of the present invention, there is provided the surface plate with the suction mechanism according to the first or second aspect, wherein the suction plate is operated in accordance with the size of the substrate mounted on the stage. And a mechanism for selecting a suction groove and a suction hole.

According to a fourth aspect of the present invention, there is provided a surface plate with a suction mechanism according to any one of the first to third aspects, wherein the surface plate is a stone surface plate. I have.

[0009]

Embodiments of the present invention will now be described with reference to the drawings by way of specific examples.

FIG. 1 is a plan view showing an example of a surface plate with a suction mechanism according to the present invention. FIG. 1 shows a pattern when the stage of the surface plate is viewed from above. As shown in FIG. 1, a linear suction groove 1 is provided in the center of the stage S at a relatively large interval vertically and horizontally, and a straight line is provided along a side excluding the vicinity of a corner. A plurality of suction grooves 1 are provided in parallel at small intervals, and a plurality of suction holes 2 are provided near the corners. That is, a plurality of suction grooves 1 and a plurality of suction holes 2 are provided in a pattern in which holes near the corners of the stage S and holes other than the corners are linear grooves.

The suction groove 1 has suction holes 1a as shown in the drawing, so that the suction groove 1 itself exhibits a suction force, and each suction hole 1a is connected to a suction pump. On the other hand, each of the suction holes 2 is connected to a suction pump. In the case of a stone surface plate, since it is difficult to provide the suction holes 1a in close proximity, as shown in the drawing, the suction holes 1a may be provided at alternate positions for the suction grooves 1 along the sides. . Although the drawing shows the suction groove 1 thin for easy viewing, the suction groove 1 is actually provided with the width of the suction hole 1a.

The platen shown has a mechanism for selecting a hole and a groove to be selected according to the size of the substrate placed on the stage S. Specifically, all the suction holes 2 and the suction holes 1a are connected to a suction pump, and a combination pattern of the suction holes 2 and the suction holes 1a to be operated by switching a valve attached to a predetermined path is selected. Just fine.

For example, the dotted line in FIG. 1 shows the minimum substrate size. When a substrate of this size is placed,
The vertical and horizontal suction grooves 1 at the center and the innermost suction grooves 1 along the sides are selected, and the innermost suction holes 2 are selected, and the substrate is sucked by this suction pattern. Similarly, when placing a larger substrate,
Select the suction groove 1 and the suction hole 2 covered by the substrate,
The substrate is sucked by making them act.

The platen having the structure shown in FIG. 1 is designed so that a substrate having a size larger than the area occupied by the vertical and horizontal suction grooves 1 at the center is placed. That is, the suction groove 1 at the center acts on any substrate. on the other hand,
The parallel suction grooves 1 along the sides are selected and act when the substrate covering them is placed.

At the time of sucking the substrate, it is sufficient that one suction groove 1 along the side is not interrupted by the substrate.
Therefore, in the case of a substrate such as a glass substrate for a plasma display panel, the size of which increases in both the vertical and horizontal directions as the size increases, the suction grooves 1 along the sides need to have the same length as shown in FIG. Instead, for example, as shown in FIG. 2, a pattern in which the outer suction groove 1 becomes gradually longer can be used. In this case, the number of suction holes 2 can be reduced. When the size of the substrate to be handled is limited to several types, the length of the suction groove 1 along the side may be set accordingly, and the suction holes 2 may be set to an appropriate number. In the case of a stone surface plate, since it is difficult to process the suction holes 2 and the suction holes 1a, reducing these numbers leads to cost reduction.

Although the present invention has been described in detail based on the embodiments, the surface plate with the suction mechanism according to the present invention comprises:
It is needless to say that the present invention is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention.

[0017]

The platen with a suction mechanism according to the present invention is a platen with a suction mechanism used for placing and fixing a flat substrate on a stage when processing the substrate. Since the stage is provided with a plurality of suction holes and a plurality of suction grooves for sucking and fixing the substrate, the suction target is changed by changing the suction pattern according to the substrate size. Irrespective of the dimensions of the substrate, it can be fixed in a state of being sucked to the outer periphery of the substrate.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of a surface plate with a suction mechanism according to the present invention.

FIG. 2 is a plan view showing another example of the surface plate with a suction mechanism according to the present invention.

[Explanation of symbols]

 S stage 1 Suction groove 1a Suction hole 2 Suction hole

Claims (4)

[Claims] 1. A platen with a suction mechanism, which is used for mounting and fixing a flat substrate on a stage when processing the substrate, comprising a plurality of substrates for sucking and fixing the substrate. A platen with a suction mechanism, characterized in that a suction hole and a plurality of suction grooves are provided on the stage. 2. A stage wherein a plurality of suction grooves and a plurality of suction holes are provided on a stage in a pattern in which holes are formed near corners and straight grooves are formed in other portions.
Surface plate with suction mechanism described in 1. 3. A suction mechanism according to claim 1, further comprising a mechanism for selecting a suction groove and a suction hole to be operated in accordance with the size of the substrate mounted on the stage. Surface plate. 4. The platen with an adsorption mechanism according to claim 1, wherein the platen is a stone platen.