JP2002203931A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a semiconductor device that has stack structure including a semiconductor device where a control substrate is fixed, and prevents cracks from being easily generated on the control substrate and the connection section between the control substrate and semiconductor device from being easily broken even if strong impact and continuous vibration are applied. SOLUTION: A cooling fin 7 and the control substrate 2 of an electrode 8 being connected to an anode 1c or a cathode 1a of the semiconductor device such as a GCT thyristor 1 are connected by fixing members 10-21, thus preventing the control substrate 2 from being easily displaced even if strong impact and continuous vibration are applied for allowing the control substrate 2 to be subjected to stress, and hence preventing cracks from being easily generated on the control substrate 2 and the connection section between the control substrate 2 and the GCT thyristor 1 from being easily broken.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device including a power semiconductor element such as a gate commutated turn-off (GCT) thyristor.

[0002]

2. Description of the Related Art A GTO (Gate Turn-Off) thyristor and a GCT thyristor are power semiconductor elements capable of controlling a current flowing between an anode and a cathode by applying a control signal to a gate. In such a semiconductor element, a control board provided with a control circuit for supplying a control signal to its gate is often fixed and integrated. Then, an electrode with a cooling fin is connected to the anode and the cathode of the semiconductor element to constitute one semiconductor device.

FIGS. 13 to 15 show a conventional example of a semiconductor device including a semiconductor element and a control substrate. FIG. 14 is a cross-sectional view taken along the line YY in FIG. Here, a GCT thyristor 1 is employed as an example of a semiconductor element.

As shown in FIGS. 13 and 14, a control substrate 2 having a control circuit formed on the surface thereof is fixed to a GCT thyristor 1 by screws 3. More specifically, the GCT thyristor 1 is inserted into a hole penetrating the control board 2, and the cathode terminal 1 a 1 and the gate terminal 1 b 1 projecting around the GCT thyristor 1 in a protruding manner are connected to the control board 2.
The control board 2 is fixed to the GCT thyristor 1 by screwing the control board 2.

[0005] On the control board 2, a capacitor 4 and a transistor 5, which constitute a control circuit, printed wiring and the like are arranged. Here, the transistor 5 is provided on the wall surface of the wall-shaped member 6.

As shown in FIG. 15, an electrode 8 around which a plurality of cooling fins 7 serving as heat radiating parts are connected to the cathode 1a and the anode 1c of the GCT thyristor 1 to which the control board 2 is fixed. One semiconductor device is configured. FIG. 15 shows a case where two GCT thyristors 1 are connected in series.

[0007] The electrodes 8 are provided between and outside the GCT thyristors 1, and the GCT thyristors 1 and the electrodes 8 are provided.
A semiconductor device having a stack structure is constituted as a whole. Then, when the electrodes 8 on both sides are subjected to pressure from the pair of pressure contact mechanisms 9, the electrodes 8 are pressed against the cathode 1 a and the anode 1 c of the GCT thyristor 1. In addition, the two press-contact mechanisms 9 are connected by a plurality of shafts 9a having a length substantially equal to the length of both ends of the stack structure.

[0008]

The actual length L of the control board 2 is relatively long, about 300 mm to 400 mm. Therefore, when the stack structure is assembled, as shown in FIG. 15, the portion of the control board 2 where the wall-shaped member 6 and the like are present easily protrudes from the stack structure. for that reason,
When a strong shock or continuous vibration is applied to the stack structure, the control board 2 is particularly susceptible to stress in the direction A in FIG. As a result, cracks occur in the control board 2 and the printed wiring on the surface thereof is cut, or the control board 2
In some cases, the cathode terminal 1a1 and the gate terminal 1b1, which are the connection portions between the gate terminal 1a1 and the GCT thyristor 1, are broken. In such a case, the GCT thyristor 1 does not operate normally, and in the worst case, the GCT thyristor 1 may be broken.

As described above, in the conventional semiconductor device, it is necessary to sufficiently consider impact resistance and vibration resistance in use conditions, and there are restrictions on use.

It is an object of the present invention to provide a semiconductor device having a stacked structure including a semiconductor element to which a control board is fixed, and which is capable of controlling the control board even when a strong shock or continuous vibration is applied. Another object of the present invention is to realize a device that is unlikely to cause cracks or break the connection between the control board and the semiconductor element.

[0011]

According to a first aspect of the present invention, there is provided a control board provided with a semiconductor element having a main electrode provided with a heat radiating portion and a control circuit for providing a control signal to the semiconductor element. And a fixing member for connecting and fixing the heat radiating portion and the control board.

According to a second aspect of the present invention, in the semiconductor device according to the first aspect, the heat radiating portion is a cooling fin, and an attachment portion of the fixing member to the heat radiating portion is the cooling fin. A semiconductor device which is fixed to the cooling fin with at least one of the semiconductor devices interposed therebetween.

According to a third aspect of the present invention, in the semiconductor device according to the first aspect, the heat radiating portion is a cooling fin, and a plurality of the cooling fins are attached to the heat radiating portion of the fixing member. A semiconductor device in which the fixing member is fixed by sandwiching a portion.

According to a fourth aspect of the present invention, in the semiconductor device according to the second or third aspect, the mounting portion of the fixing member is provided by a connecting member penetrating the cooling fin and the fixing member. Is a semiconductor device fixed to the cooling fin.

According to a fifth aspect of the present invention, in the semiconductor device according to the second or third aspect, the fixing member includes a first fixing member fixed to the control board and the first fixing member. A semiconductor device including a second fixing member that is connectable to a member and that is the attachment portion of the fixing member to the heat radiating portion.

According to a sixth aspect of the present invention, there is provided the semiconductor device according to the first aspect, wherein the semiconductor element and the control substrate are plural, and the plurality of semiconductor elements and the control substrate are pressed against each other to form a stack structure. Is a semiconductor device.

The invention according to claim 7 is the semiconductor device according to claim 6, further comprising another fixing member connecting the plurality of control boards.

According to an eighth aspect of the present invention, there is provided a semiconductor device comprising: a plurality of semiconductor elements; a plurality of control boards each provided with a control circuit for supplying a control signal to each of the plurality of semiconductor elements; A plurality of semiconductor elements and a control board are pressed into contact with each other to form a stack structure.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS <First Embodiment> This embodiment relates to a semiconductor device having a stacked structure including a semiconductor element to which a control substrate is fixed, in which an electrode connected to an anode or a cathode of the semiconductor element is provided. By connecting the cooling fins to the control board, it is possible to realize a structure in which a crack is not generated in the control board and a connection portion between the control board and the semiconductor element is not easily broken.

FIGS. 1 to 9 show a semiconductor device according to the present embodiment. FIG. 2 is a sectional view taken along the line XX in FIG. Here, as in the description of the related art, the GCT thyristor 1 is adopted as an example of the semiconductor element.

As shown in FIGS. 1 and 2, a control board 2 having a control circuit formed on the surface thereof is fixed to the GCT thyristor 1 by screws 3. More specifically, GCT thyristor 1 is inserted into a hole penetrating control board 2,
The control substrate 2 is fixed to the GCT thyristor 1 by screwing the cathode terminal 1a1 and the gate terminal 1b1 projecting around the GCT thyristor 1 to the control substrate 2.

On the control board 2, a capacitor 4 and a transistor 5, which constitute a control circuit, printed wiring and the like are arranged. The transistor 5 is provided on the wall surface of the wall member 6.

Further, on the control board 2, an L-shaped fixing member 10 includes a screw 11, a spacer 12, and a nut 1.
3, two GCT thyristors 1 are attached in parallel so as to sandwich them.

As shown in FIG. 3, an electrode 8 around which a plurality of cooling fins 7 are provided is connected to the cathode 1a and the anode 1c of the GCT thyristor 1 to which the control substrate 2 is fixed, and one semiconductor Configure the device. FIG. 3 shows a case where two GCT thyristors 1 are connected in series.

The electrodes 8 are provided between the GCT thyristors 1 and outside thereof, and the GCT thyristors 1 and the electrodes 8 are provided.
A semiconductor device having a stack structure is constituted as a whole. Then, when the electrodes 8 on both sides are subjected to pressure from the pair of pressure contact mechanisms 9, the electrodes 8 are pressed against the cathode 1 a and the anode 1 c of the GCT thyristor 1. In addition, the two press-contact mechanisms 9 are connected by a plurality of shafts 9a having a length substantially equal to the length of both ends of the stack structure.

A fixing member for connecting the control board 2 and the cooling fins 7 is attached to the periphery of the cooling fins 7. Specifically, for the control board 2 on the left side in FIG. 3, the block-shaped fixing member 18 sandwiches the cooling fins 7 so that the block-shaped fixing member 1
8 is fixed to the cooling fin 7. Further, the control board 2 on the right side in FIG.
The L-shaped fixing member 20 is fixed to the cooling fins 7 by sandwiching the “0” between the two cooling fins 7. The plate-like member 15 fixed to the L-shaped fixing member 10 is connected to the block-shaped fixing member 18 and the L-shaped fixing member 20, respectively, so that the cooling fins 7 and the control board 2 are connected and fixed. Is done.

FIG. 4 is a perspective view showing how the block-shaped fixing member 18 and the plate-shaped member 15 are connected. FIG. 5 is a perspective view of the block-shaped fixing member 18, and FIG. 6 is a view showing a fixed state of the cooling fin 7 and the block-shaped fixing member 18 as viewed from the direction B in FIG. 4.

As shown in FIG. 5, the block-shaped fixing member 1
8, a screw hole 18a for fixing to the cooling fin 7, a screw hole 18b for connecting to the plate member 15, and a slit for sandwiching one cooling fin 7 are provided. 18c. As shown in FIG. 6, the width T1 of the slit 18c is set to substantially match the thickness of one cooling fin 7, and the thickness T2 of the side portion of the slit 18c substantially matches the interval between the cooling fins 7. Is set to

As shown in FIGS. 4 and 6, the block-shaped fixing member 18 is fixed to the cooling fin 7 so as to sandwich the cooling fin 7 in the slit 18c. It can also be said that the cooling fins 7 fix the block-shaped fixing member 18 by sandwiching the block-shaped fixing member 18 in portions other than the slit 18c.

This fixing is performed by disposing the block-shaped fixing member 18 so that the screw holes 7a provided in the peripheral portion of the cooling fin 7 and the screw holes 18a coincide with each other, and the screws 19 are inserted into the screw holes 7a and the screw holes 18a. It is performed by being screwed. The length of the screw 19 may be set to such a length as to penetrate the cooling fin 7 and the block-shaped fixing member 18.

The plate member 15 is fixed to the two L-shaped fixing members 10 by screws 17 and nuts 14. Then, a screw hole 15 provided in the plate member 15 is formed.
The cooling fin 7 and the control board 2 are connected by the screw 16 penetrating through a and screwing into the screw hole 18 b of the block-shaped fixing member 18. If the screw hole 15a has an oval shape, the position of the electrode 8 can be finely adjusted at the time of assembling the semiconductor device.

FIG. 7 shows a block-shaped fixing member 181 which is a modification of the block-shaped fixing member 18. This block-shaped fixing member 181 is not provided with a slit, and is a screwed screw hole 181 for fixing to the cooling fin 7.
a and screwed screw holes 181 b for connection with the plate-shaped member 15.

Then, as shown in FIG. 8, the block-shaped fixing member 181 is fixed to the cooling fin 7 with screws 19. However, in this case, since no slit is provided, the block-shaped fixing member 181 does not sandwich the cooling fin 7 and the cooling fin 7 is
It is only necessary to fix the block-shaped fixing member 181 by sandwiching 1.

Further, since the slit is not provided, the cooling fin 71 in the portion of the cooling fin 7 into which the block-shaped fixing member 181 is inserted is larger than the outer edge portion of the other cooling fin 7 in the block-shaped fixing member 181. Has its outer edge at a position recessed by the length L1 into which the is inserted.

FIG. 9 is a perspective view showing how the L-shaped fixing member 20 and the plate member 15 are connected.

As shown in FIG. 9, the L-shaped fixing member 20 has a screwed screw hole 20b for fixing to the cooling fin 7, and a screwed screw hole 20 for connecting to the plate member 15. 20a.

Then, as shown in FIG. 9, the L-shaped fixing member 20 is sandwiched between the cooling fins 7 and is fixed to the cooling fins 7.

This fixing is performed so that the screw holes 7a and the screw holes 20b provided in the peripheral portion of the cooling fin 7 coincide with each other.
This is performed by arranging the letter-shaped fixing member 20 and screwing the screw 21 into the screw hole 7a and the screw hole 20b. In addition,
The length of the screw 21 may be set to a length that penetrates the two cooling fins 7 and the L-shaped fixing member 20.

The plate member 15 is fixed to the two L-shaped fixing members 10 by screws 17 and nuts 14. Then, the screw 16 passes through the oval screw hole 15a provided in the plate member 15, and the L-shaped fixing member 2
The cooling fin 7 and the control board 2 are connected by being screwed into the 0 screw hole 20a.

As described above, since the cooling fins 7 and the control board 2 are connected and fixed by the members 10 to 21, a strong impact or continuous vibration is applied to the control board 2, and the control board 2 receives stress. Even if it does, the control board 2 is not easily displaced.
Therefore, cracks are less likely to occur in the control board 2 and the connection between the control board 2 and the GCT thyristor 1 is unlikely to break. That is, in the stack structure, since the cooling fins 7 and the control board 2 are connected by each member,
The control board 2 can be firmly fixed to the stack structure.

Also, like the block-shaped fixing member 18 and the L-shaped fixing member 20, the cooling fin 7 is
Alternatively, if the cooling fin 7 is fixed to the outer edge of the cooling fin 7 by being sandwiched between the cooling fin 7 and fixed to the cooling fin 7 by welding or the like, for example, Are not easily separated, and the control board 2 is less likely to be displaced.

Further, using a connecting member that penetrates the block-shaped fixing member 18 or the L-shaped fixing member 20 and the cooling fin 7 like the screws 19 and 21, the block-shaped fixing member 18 or the L-shaped fixing member 20 is used. By fixing to the cooling fins 7, for example, an adhesive is applied to the sandwiched portion, and the block-shaped fixing member 18 or the L-shaped fixing member 20 is simply sandwiched between the cooling fins 7 and fixed to the cooling fin 7. In comparison with the case, the cooling fin 7 and the block-shaped fixing member 18 or the L-shaped fixing member 20 are harder to separate, and the control board 2 is harder to be displaced.

Further, a fixing member for connecting and fixing the cooling fins 7 and the control board 2 is provided on the control board 2 side.
-Shaped fixing member 10 and plate-shaped member 15 and cooling fin 7
Is divided into a block-shaped fixing member 18 or an L-shaped fixing member 20 which can be connected to the plate-shaped member 15 so that the shape of each of these members can be easily connected at the time of assembling, thereby facilitating production. be able to.

For example, the cooling fins 7 and the control board 2 can be connected to each other by using a fixing member in which the L-shaped fixing member 10 and the plate-shaped member 15 are integrated with the block-shaped fixing member 18 or the L-shaped fixing member 20. It is possible to connect and fix. However, in this case, problems in the manufacturing process tend to occur, such as difficulty in mounting the screws and difficulty in finely adjusting the position of the fixing member.

As described above, if the member on the control board 2 side and the member on the cooling fin 7 side are separated, such a problem can be avoided.

FIGS. 10 and 11 show other examples of attachment of the L-shaped fixing member fixed to the cooling fin 7. FIG.

First, in FIG. 10, the L-shaped fixing member 22 similar to the L-shaped fixing member 20 is directly attached to the L-shaped fixing member 10 with the plate-like member 15 omitted. Then, the cooling fin 7 closest to the cathode side is sandwiched between the L-shaped fixing member 22 and the plate-like member 23 having screwed screw holes, and the cooling fin 7 and the control board 2 are connected. The L-shaped fixing member 22 and the L-shaped fixing member 10 are fixed by screws 17 and nuts 14,
The character-shaped fixing member 22 and the plate-shaped member 23 are fixed by screws 21.

The length of the screw 21 is equal to the length of the cooling fin 7 and L.
What is necessary is just to make it the length which penetrates the character-shaped fixing member 22 and the plate-shaped member 23.

Also in FIG. 11, the L-shaped fixing member 24 similar to the L-shaped fixing member 20 is directly attached to the L-shaped fixing member 10 without the plate-like member 15 being omitted. Then, the L-shaped fixing member 24 includes two cooling fins 7.
And the cooling fin 7 and the control board 2 are connected. The L-shaped fixing member 24 and the L-shaped fixing member 10 are fixed by screws 17 and nuts 14, and the L-shaped fixing member 24 and the cooling fins 7 are fixed by screws 21.

The length of the screw 21 may be set to such a length as to penetrate the two cooling fins 7 and the L-shaped fixing member 24.

In the case of the semiconductor device shown in FIGS. 10 and 11, the same effect as described above is obtained.

Second Embodiment The second embodiment is a modification of the semiconductor device according to the first embodiment. In the present embodiment, in addition to the configuration of the semiconductor device according to the first embodiment, by connecting a plurality of control boards with a fixing member, a control board that is less likely to be displaced is realized.

FIG. 12 shows a semiconductor device according to the present embodiment. As can be seen from FIG. 12, this semiconductor device has a configuration in which a plate-like member 26 and a screw 25 are added to the semiconductor device shown in FIG. And the control board 2
Screw hole 6a threaded on the side of the end of upper wall member 6
Is provided, and a screw 25 is inserted into the screw hole 6a.
The plate-like member 26 is fixed to the wall-like member 6 by being screwed through the through-hole 6.

As a result, the two control boards 2 adjacent to each other are connected to each other, and even if a strong shock or continuous vibration is applied to the control board 2, the control board 2 is hardly displaced, and the control board 2 is hardly displaced. Cracks occur in the control board 2
And the connection portion between the GCT thyristor 1 and the GCT thyristor 1 can be made hard to break.

The other configuration is the same as that of the semiconductor device according to the first embodiment, and the description is omitted.

[0056]

According to the first aspect of the present invention, since the fixing member connects and fixes the heat radiating portion and the control board, a strong shock or continuous vibration is given to the control board to apply a stress. Even if it is received, the control board is not easily displaced, cracks are generated on the control board, and the connection between the control board and the semiconductor element is hardly broken.

According to the second aspect of the present invention, since the attaching portion of the fixing member to the heat radiating portion sandwiches at least one of the cooling fins and is fixed to the cooling fin, the cooling fin and the fixing member are not easily separated from each other. The control board is less likely to be displaced.

According to the third aspect of the present invention, since the plurality of cooling fins fix the fixing member by sandwiching the attachment portion of the fixing member to the heat radiating portion, the cooling fins and the fixing member are hardly separated from each other, and Is more difficult to displace.

According to the fourth aspect of the present invention, since the attachment portion of the fixing member is fixed to the cooling fin by the connecting member penetrating the cooling fin and the fixing member, the cooling fin and the fixing member are harder to separate. In addition, the control board is less likely to be displaced.

According to the fifth aspect of the present invention, since the fixing member includes the first and second fixing members, the first and second fixing members are provided.
Manufacturing can be facilitated by setting the shape of the fixing member to a shape that can be easily connected at the time of assembly.

According to the sixth aspect of the present invention, in the stack structure in which the plurality of semiconductor elements and the control board are pressed against each other, the heat radiating portion and the control board are connected by the fixing member. It can be firmly fixed to the stack structure.

According to the seventh aspect of the present invention, since the other fixing member connects the plurality of control boards, even if a strong shock or continuous vibration is applied to the control board, the control board receives stress. The control board is less likely to be displaced, and the control board is less likely to be cracked and the connection between the control board and the semiconductor element is less likely to break.

According to the eighth aspect of the present invention, since the fixing member connects the plurality of control boards, even if a strong shock or continuous vibration is applied to the control board, the control board receives stress. Are less likely to be displaced, and cracks are less likely to occur in the control board and the connection between the control board and the semiconductor element is less likely to break.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a semiconductor element to which a control substrate is fixed in a semiconductor device according to a first embodiment;

FIG. 2 is a sectional view showing a semiconductor element to which a control substrate is fixed in the semiconductor device according to the first embodiment;

FIG. 3 is a diagram showing a semiconductor device according to the first embodiment;

FIG. 4 is a diagram showing a state where the control substrate and the cooling fins are fixed by the block-shaped fixing member in the semiconductor device according to the first embodiment;

FIG. 5 is a diagram showing a block-shaped fixing member used in the semiconductor device according to the first embodiment;

FIG. 6 is a view showing a state in which the block-shaped fixing member and the cooling fin are fixed.

FIG. 7 is a diagram illustrating another example of the block-shaped fixing member used in the semiconductor device according to the first embodiment;

FIG. 8 is a view showing a state in which another example of the block-shaped fixing member and the cooling fin are fixed to each other.

FIG. 9 is a diagram showing a state in which the control substrate and the cooling fin are fixed by the L-shaped fixing member in the semiconductor device according to the first embodiment;

FIG. 10 is a diagram showing a state in which the control substrate and the cooling fin are fixed by another example of the L-shaped fixing member in the semiconductor device according to the first embodiment;

FIG. 11 is a diagram showing a state in which the control substrate and the cooling fin are fixed by another example of the L-shaped fixing member in the semiconductor device according to the first embodiment;

FIG. 12 is a diagram illustrating a semiconductor device according to a second embodiment;

FIG. 13 is a diagram illustrating a semiconductor element to which a control board is fixed in a conventional semiconductor device.

FIG. 14 is a cross-sectional view showing a semiconductor element to which a control board is fixed in a conventional semiconductor device.

FIG. 15 is a diagram showing a conventional semiconductor device.

[Explanation of symbols]

1 GCT thyristor, 2 control board, 3, 11, 1
6, 17, 19, 21, 25 screws, 4 capacitors,
5 transistor, 6 wall member, 7 cooling fin, 8
Electrode, 9 Pressure contact mechanism, 10 L-shaped fixing member, 12
Spacer, 13, 14 Nut, 15, 23, 26 Plate member, 18, 181 Block-shaped fixing member, 20, 2
2,24 L-shaped fixing member.

Claims (8)

[Claims] A semiconductor element having a main electrode provided with a heat radiating section; a control board having a control circuit for providing a control signal to the semiconductor element; and connecting the heat radiating section to the control board. And a fixing member for fixing the semiconductor device. 2. The semiconductor device according to claim 1, wherein the heat radiating portion is a cooling fin, and a mounting portion of the fixing member to the heat radiating portion sandwiches at least one of the cooling fins. A semiconductor device fixed to the cooling fin; 3. The semiconductor device according to claim 1, wherein the heat radiating portion is a cooling fin, and a plurality of the cooling fins sandwich the fixing portion of the fixing member to the heat radiating portion, and the fixing member is provided. A semiconductor device for fixing the semiconductor device. 4. The semiconductor device according to claim 2, wherein the attachment portion of the fixing member is fixed to the cooling fin by a connecting member penetrating the cooling fin and the fixing member. Semiconductor device. 5. The semiconductor device according to claim 2, wherein the fixing member is a first fixing member fixed to the control board, and is connectable to the first fixing member. A semiconductor device comprising: a second fixing member that is the attachment portion of the fixing member to the heat radiating portion. 6. The semiconductor device according to claim 1, wherein the semiconductor element and the control board are plural, and the plurality of semiconductor elements and the control board are press-contacted to form a stack structure. 7. The semiconductor device according to claim 6, further comprising another fixing member connecting the plurality of control boards. 8. A semiconductor device, comprising: a plurality of semiconductor elements; a plurality of control boards provided with control circuits for respectively providing control signals to the plurality of semiconductor elements; and a fixing member connecting the plurality of control boards. A semiconductor device, wherein the plurality of semiconductor elements and the control substrate are pressed against each other to form a stack structure.