JP2002203658A - Mounting structure of temperature measuring element for ceramic heater used for semiconductor industry - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure of a temperature measuring element for fixing and maintaining the temperature measuring element embedded in a base board for long time. SOLUTION: For the mounting structure of the temperature measuring element, one or more of slit-shaped housing grooves are formed at the opposite side of a heating surface of a ceramic base board, and a L-shaped temperature measuring element is fitted into the housing groove, and the temperature measuring element, fitted into the housing groove, is fixed by screwing a clamping screw inside a screw hole which is opened so as to overlap with the housing groove.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a ceramic heater used mainly for drying semiconductor products or for sputtering used in the semiconductor industry.
The present invention relates to a structure for mounting a temperature measuring element. The present invention is also applicable to a ceramic substrate of a semiconductor manufacturing / inspection apparatus in which the ceramic heater has a function as an electrostatic chuck or a wafer prober.

[0002]

2. Description of the Related Art An electronic circuit of a semiconductor product is formed by applying a photosensitive resin as an etching resist on a silicon wafer and then etching. In this case, since the photosensitive resin applied to the surface of the silicon wafer is applied by a spin coater or the like,
It must be dried after application. The drying process is performed by heating the silicon wafer coated with the photosensitive resin while holding it on a heater. Conventionally, a metal substrate (aluminum plate) is mainly used as such a heater, but in recent years, a heater in which a heating element is wired inside or on the back surface of a ceramic substrate is also used.

For example, Japanese Patent Publication No. 8-8247 discloses a nitride ceramic substrate on which a heating element is formed.
A ceramic heater that controls the temperature of a ceramic plate while measuring the temperature in the vicinity of the heating element has been proposed. However, when using such a ceramic heater to heat and dry a silicon wafer for a long time,
It is important how to provide a uniform temperature distribution on the heater surface.

[0004] Therefore, conventionally, a temperature measuring element such as a thermocouple is buried at a required position in a substrate, the temperature of the substrate is measured, and control is performed based on the measured value. That is, by controlling the voltage and the amount of current applied when energizing the heating element attached to the substrate using the temperature measuring element,
The heater heating temperature is controlled. However, when the thickness of the substrate is large, there is a problem that the temperature of the substrate does not quickly follow the fluctuation of the voltage or the amount of current, and the temperature control characteristics of the substrate deteriorate. In this sense, the use of ceramic as the substrate is advantageous when the above temperature control characteristics are considered, since the thickness can be reduced.

[0005]

When the temperature of the heater substrate is controlled via a temperature measuring element such as a thermocouple buried in the substrate under the above-mentioned prior art, the temperature measuring element is loosened or improperly mounted. There is a problem that a temperature measurement error due to the above occurs. The cause of this problem is that when the temperature measuring element is embedded and fixed in the substrate, the synthetic resin-based material filled together with the temperature measuring element into a hole for accommodating the element perforated on the surface opposite to the heating surface of the substrate. The adhesive was found to be the cause. That is, for example, in the case where a thermocouple is inserted as a temperature measuring element into the element housing hole, and further filled with a synthetic resin adhesive and embedded and fixed, when the heater is used continuously for a long time, If the temperature temporarily rises due to some kind of trouble, the embedded thermocouple becomes loose due to deterioration, softening, and melting of the resin, and sometimes causes peeling or detachment, resulting in poor temperature measurement. For example, if the element housing hole is filled with, for example, a polyimide resin-based, epoxy resin-based, phenolic resin-based, or silicone resin-based adhesive for embedding and fixing a thermocouple, these synthetic resin-based adhesives are thermally In the case of a plastic resin, the mechanical strength decreases with an increase in temperature, and eventually softens (melts) to become a liquid, and in the case of a thermosetting resin, the mechanical strength decreases with an increase in temperature, and eventually Thermal decomposition begins.

That is, the dislocation point (Tm) of a typical polyimide resin used as an adhesive is less than 500 ° C.
On the other hand, the continuous working temperature of these resins is mostly 120 to 2
60 ° C. Therefore, if these resins are used as a thermocouple fixing means for a ceramic heater (heater heating temperature 200 to 400 ° C), the resin deteriorates quickly even if heat removal from the substrate is taken into account, and the adhesive quickly deteriorates and softens. Occurs, and the thermocouple and the resin are separated or separated from each other, which causes a problem that the life of the thermocouple is shortened. Further, even when the temperature of the heating surface of the ceramic heater suddenly drops, it is necessary to quickly recover the surface temperature of the heating surface, and for that purpose, it is necessary to improve the sensitivity of the thermocouple.

Accordingly, an object of the present invention is to propose a structure for attaching a temperature measuring element to a substrate, which is suitable for performing stable temperature control of a ceramic heater. Another object of the present invention is to propose a mounting structure for a temperature measuring element buried in a substrate to be reliably fixed and maintained for a long time. Another object of the present invention is to improve the sensitivity of the temperature measuring element and improve the temperature controllability of the heating surface.

[0008]

Means for Solving the Problems As a result of diligent research to achieve the above object, the inventors found that the temperature measurement element embedded in the substrate was loosened or detached, resulting in unstable temperature measurement. The cause is that the synthetic resin adhesive fixing the temperature measuring element is deteriorated, softened, and melted, and the temperature sensor can be fixed without using such an adhesive. The present invention relating to the configuration has been developed.

That is, the present invention provides a ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein at least one slit-shaped storage groove is provided on a surface opposite to a heating surface of the ceramic substrate. A temperature measuring element is fitted into this storage groove, and the bent tip of the temperature measuring element is stored along the groove bottom of the storage groove, and the bent tip is pressed or used with a vitreous sealing material. This is a structure for mounting a temperature measuring element of a fixed ceramic heater.

[0010] The present invention also provides a ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein at least one slit-shaped storage groove is provided on a surface of the ceramic substrate opposite to a heating surface, An L-shaped temperature measuring element is fitted into the storage groove, and a fastening screw is screwed into a screw hole that is opened by overlapping the storage groove, and the temperature measurement element that is fitted into the storage groove is fixed. This is a structure for mounting a temperature measuring element of a ceramic heater.

According to the present invention, there is further provided a ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein at least one slit-shaped storage groove is provided on a surface of the ceramic substrate opposite to a heating surface. An L-shaped temperature measuring element is fitted into the storage groove, and a fastening screw is screwed into a screw hole opened so as to overlap with the storage groove to fix the temperature measurement element fitted into the storage groove. In addition, there is provided a temperature measuring element mounting structure for a ceramic heater in which the storage groove is further filled with a vitreous sealing material.

According to the present invention, there is further provided a ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein at least one slit-shaped storage groove is provided on a surface opposite to a heating surface of the ceramic substrate. An L-shaped temperature measuring element is fitted into the storage groove, a vitreous sealing material is filled in the storage groove, and the temperature measuring element is embedded and fixed. .

Further, the present invention provides a ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein one side of the heating surface of the ceramic substrate is opposite to the heating surface.
The above-mentioned slit-shaped storage groove is provided, and an L-shaped temperature measuring element is fitted into the storage groove, and an elastic jig is inserted toward the temperature measuring element in the storage groove and fixed by elastic pressure. This is a structure for mounting a temperature measuring element of a ceramic heater.

In the present invention, an L-shaped temperature measuring element having a bent tip is used as the temperature measuring element, and the bent tip is stored along the bottom of the storage groove.
In addition, it is preferable that the bent end portion is to be fixed,
Further, the fixing of the temperature measuring element by the elastic jig is preferably performed by using a spring material interposed between an intermediate bottom plate or a bottom plate immediately below the substrate.
It is a preferred embodiment to attach a temperature control means.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The feature of the structure for mounting a temperature measuring element of a ceramic heater according to the present invention is that it is formed on the surface of a ceramic substrate, particularly on the surface opposite to the surface on which an object to be heated such as a semiconductor wafer is located. In the storage groove of the temperature measuring element
Basically, an L-shaped temperature measuring element whose tip is bent is embedded and fixed along the groove bottom of the storage groove. At that time, as in the conventional case, chemically, that is, via a synthetic resin-based adhesive, Instead of being fixed in a buried state, it is characterized in that it is fixed by crimping by a physical method such as a screw or a spring, or embedded and fixed by using an inorganic vitreous sealing material.

As described above, when the temperature measuring element is mounted in the storage groove provided on the substrate, the conventional use of the synthetic resin-based adhesive is stopped because of the continuous use of the heater and the trouble in case of trouble. Due to temporary overheating caused by overcurrent, etc., the synthetic resin adhesive deteriorates early, softens,
This is to prevent the temperature measuring element from being loosened or detached easily due to the melting, thereby avoiding the adverse effect that the temperature measuring element function is early lost. For example, the continuous working temperature of epoxy resin or polyimide is about 120 to 260 ° C., about 120 ° C. for polyethylene, and about 180 to 200 ° C. for fluorine resin (CTFE). On the other hand, the heating temperature of the heater
The temperature is about 100 to 800 ° C., and even when the heat removal of the substrate is taken into consideration, the resin adhesive around the temperature measuring element is exposed to a considerably high temperature and deteriorates and softens violently.

Therefore, in the present invention, a physical method that is less affected by the temperature rise of the heater, such as screwing via a screw, or a spring (plate spring, coil spring, disc spring, etc.) ) Is interposed between them to resiliently fix them, or a heat-resistant vitreous sealing material is filled to attach the temperature measuring element to the storage groove. In particular, the tip of the temperature measuring element is bent into an L-shape, and the bent end portion is extended along the groove bottom of the storage groove to make the contact surface long and wide.
A characteristic feature is that the temperature measurement performance is further improved by setting this portion to a position to be fixed with a screw or the like.

FIGS. 2 to 6 show an L-shaped measuring element in a receiving groove 3 for a temperature measuring element, which is formed by piercing and forming a heating element 2 on a side opposite to a heating surface of the substrate 1. This is an example of a configuration in which the temperature element 4 is housed and the bent end portion (parallel portion) is fixed by physical means such as a screw or a spring, or by an inorganic material (glass).

In the example shown in FIG. 2, a temperature measuring element 4, for example, a sheath-type thermocouple inserted into the groove bottom of the slit-shaped storage groove 3 formed in the vicinity of the heating element 2 of the substrate 1 is tightened with a screw. It is fixed. That is, FIG. 3A shows that a screw hole 20 formed in one end of the storage groove 3 as shown in FIG. 3A so as to overlap with a part of the groove is helicert (headless screw).
And the temperature measuring element 4 housed in the groove bottom is pressed and fixed with a screw head. FIG. 2 (b) shows that, instead of the solid heli-sert, a cylindrical heli-sert 22 having a screw groove also provided on the inner peripheral surface is screwed, and at the same time, a small screw 23 is further screwed into the heli-sert 22. The temperature measuring element 4 is double-pressed and fixed by these screw heads. FIG. 3 shows the details of the positional relationship between the storage groove 3 and the screw hole 20.

FIG. 4 shows a spring, for example, a spring 24 in which a support pin is inserted in place of the screws 21, 22, and 23 described above.
This is an example in which the temperature measuring element 4 is elastically pressed and fixed via a through hole so that the temperature measuring element 4 is mounted in the storage groove 3. In this case, it is a preferred embodiment that the spring 24 is fixed to the middle bottom plate 25 of the substrate support as shown.

It is preferable that a metal plate (thickness: 0.1 to 1 mm) such as aluminum, iron, copper, nickel, stainless steel, or Kovar is interposed between the screw or the spring and the temperature measuring element. This is because the temperature controllability of the heating surface can be improved. FIG. 5 shows that the temperature measuring element 4 housed in the housing groove 3 is sealed by filling the housing groove 3 with an inorganic vitreous sealing material 26 instead of a synthetic resin adhesive. This is an example in which the temperature measuring element is attached by the following method.

FIG. 6 shows that a mounting bolt 28 having a through hole 27 through which the temperature measuring element 4 is inserted into the shaft center portion is screwed into the threaded storage groove 3, and the bent end of the temperature measuring element 4 is bent at the bolt head. This is a structural example in which a portion 4a is pressed and fixed.

In the present invention, the temperature measuring element 4 housed in the housing groove 3 is an L-shaped thermocouple formed by joining the free ends of two different types of metal wires, and in particular, the thermocouple is a cylindrical body. It is preferable to use a sheath type housed in the thermocouple, and the size of the junction of the thermocouple, i.e., the diameter of the junction, is the same as or larger than the strand diameter of each metal wire.
Those having a diameter of 5 mm or less are desirable. By using such a temperature measuring element 4, the heat capacity concentrated on the junction is reduced, the temperature can be accurately and quickly converted to a current value, and the temperature controllability is improved, and this is applied to a heater. In this case, the bias of the temperature distribution on the wafer heating surface can be reduced. In addition, a thermistor other than a thermocouple can be used.

Next, the structure for mounting the temperature measuring element of the ceramic heater according to the present invention will be described in more detail with reference to FIG. In a ceramic heater as a preferred example, a heating element 2 is disposed on a heating surface of the ceramic substrate 1 (a surface opposite to the illustrated bottom surface) with respect to a bottom surface of the disk-shaped ceramic substrate 1. It is desirable to form a concentric circle or a spiral pattern in order to heat so as to be uniform. These heating elements 2 have a configuration in which adjacent double concentric circles are connected as one set so as to form a single line, and terminal pins serving as input / output terminals are connected to both ends thereof. The ceramic substrate 1 is provided with a through hole 13 for inserting a support pin 12 for supporting the object to be heated 11, and also for inserting a temperature measuring element, that is, a thermocouple 4. Slit-shaped storage groove 3
Is also formed.

In the ceramic heater having such a configuration, the thickness of the ceramic substrate 1 is preferably set to 0.5 to 5 mm. If it is thinner than 0.5 mm, it is easily broken, while if it is thicker than 5 mm, heat is difficult to propagate, and the heating efficiency is deteriorated.

As the material of the ceramic substrate 1, it is desirable to use a nitride ceramic or a carbide ceramic. As the nitride ceramic, for example,
Examples include aluminum nitride, silicon nitride, boron nitride, and titanium nitride. These may be used alone or 2
More than one species may be used in combination. In addition, examples of the carbide ceramic include silicon carbide, zirconium carbide, titanium carbide, tantalum carbide, and tungsten carbide. These may be used alone or in combination of two or more. Of these, aluminum nitride is most preferred. This is because the thermal conductivity is the highest at 180 W / m · K, and is excellent in temperature followability.

In the above ceramic heater, the distance L between the groove bottom of the storage groove 3 and the heating surface 1a (see FIG. 1B) is
It is desirable that the thickness be 0.1 mm to approximately の of the thickness of the ceramic substrate 1. When the distance L is less than 0.1 mm, a non-uniform temperature distribution occurs on the heating surface due to heat radiation.
And the temperature control by the temperature measuring element 4 becomes impossible. That is, in the present invention, as shown in FIG. 6, the temperature measured by the plurality of temperature measuring elements 4 embedded in the ceramic substrate 1 is used to form a uniform temperature distribution on the heating surface of the ceramic substrate 1. The control circuit controls the current / voltage applied to the heating element 2.

The storage groove formed in the substrate 1 for housing the temperature measuring element 4 has a groove width of 0.3 mm to 5 m.
It is desirable that the size be about m. If the width of the groove is too large, the heat radiation property is increased. If the groove width is too small, the workability is reduced and the distance from the heating surface cannot be made uniform. It is desirable that a plurality of such storage grooves 3 be arranged symmetrically and uniformly with respect to the ceramic substrate 1. This is to enable accurate temperature measurement of the entire heating surface.

After the temperature measuring element 4, that is, a thermocouple is inserted into the storage groove 3, and is fixed firmly using the screws 21, 22, 23 and the spring 24 such as a heli-sert as described above. If possible, it is preferable to seal the inside of the storage groove 3 with a vitreous sealing material, or to bury and fix the inside of the storage groove 3 only with the vitreous sealing material. As a material similar to the vitreous sealing material, ceramic can be used, and as an example, alumina sol, silica sol, or the like can be used. This is because these ceramic sols can be dried and gelled to fix the temperature measuring element 4.

Further, a temperature control method using the temperature measuring element of the ceramic heater will be described with reference to FIG. First, when power is supplied to the ceramic heater by operating the control unit 5, the temperature of the ceramic substrate 1 itself starts to rise, but the surface temperature of the outer peripheral portion generally becomes slightly low. Therefore, data measured by the thermocouple 4 is first stored in the storage unit 6. Next, the temperature measurement data is sent to the calculation unit 7, and the calculation unit 7 calculates the temperature difference ΔT at each measurement point, and further calculates the data ΔW necessary for equalizing the temperature of the heating surface 1a. I do. For example, there is a temperature difference ΔT between the heating element 2a and the heating element 2b, and the heating element 2a
If the value is lower, the power .DELTA.W for setting .DELTA.T to 0 is calculated, transmitted to the control unit 5, and the power based on this is supplied to the heating element 2a to raise the temperature.

Regarding the power calculation algorithm, the simplest method is to calculate the power required to raise the temperature from the specific heat of the ceramic substrate 1 and the weight of the heating area. In addition, a correction coefficient due to the heating element pattern is taken into account. You may. Alternatively, a temperature rise test may be performed on a specific heating element pattern in advance, and a function of the temperature measurement position, the input power, and the temperature may be obtained in advance, and the input power may be calculated from the function. And the calculation unit 7
Is transmitted to the control unit 5, and the control unit 5 supplies power to each heating element 2 based on the values.

[0032]

EXAMPLES (Example 1) (1) Aluminum nitride powder (manufactured by Tokuyama Corporation, average particle size)
Spray-drying of a composition consisting of 100 parts by weight of 1.1 μm), 4 parts by weight of yttrium oxide (Y ₂ O ₃ : yttria, average particle size 0.4 μm), 12 parts by weight of an acrylic binder and alcohol to prepare a granular powder did.

(2) The granular powder was placed in a mold and formed into a flat plate to obtain a green body. (3) The green compact after the processing was hot-pressed at a temperature of 1800 ° C. and a pressure of 20 MPa to obtain an aluminum nitride sintered body having a thickness of 3 mm. Next, from this sintered body,
A 210 mm or 310 mm disk was cut out to obtain a ceramic plate (ceramic substrate 1).

Next, a drilling process is performed on the plate-like body, and a through-hole 13 for inserting the lifter pin 12 of the silicon wafer 11 and a slit-like storage groove 3 for embedding the thermocouple 4 for temperature measurement are provided. Width: 1.1mm, length: 5mm, depth: 2
mm) and a screw hole 20 opened so as to overlap substantially at the center of the groove.

(4) The ceramic substrate 1 obtained in the above (3)
Then, a conductive paste was printed by screen printing. The printing pattern was a concentric pattern. As the conductive paste, Solvest PS6 manufactured by Tokuri Chemical Laboratory, which is used for forming through holes in printed wiring boards, is used.
03D was used. This conductive paste is a silver-lead paste, and based on 100 parts by weight of silver, lead oxide (5% by weight), zinc oxide (55% by weight), silica (10% by weight), and boron oxide (25% by weight). %) And 7.5 parts by weight of a metal oxide composed of alumina (5% by weight). The silver particles had a mean particle size of 4.5 μm and were scaly. (5) The substrate 1 (aluminum nitride sintered body) is heated to 780 ° C.
The thickness is 5 μm and the width is 2.
The heating element 2 made of a silver-lead alloy foil plate having a thickness of 4 mm and a sheet resistivity of 7.7 mΩ / □ was fixed.

(6) Next, the sintered body having the heating element 2 made of a silver-lead alloy foil fixed to the back surface of the substrate was treated with 80 g of nickel sulfate, 24 g of sodium hypophosphite, and 12 g of sodium acetate. / 1, boric acid 8 g / 1, ammonium chloride 6 g / 1 in an electroless nickel plating bath composed of an aqueous solution, and the surface of the silver-lead alloy foil heating element 2 was
A 1 μm thick metallic nickel was deposited and coated.

(7) Then, a silver-lead solder paste (manufactured by Tanaka Kikinzoku Co., Ltd.) was printed by screen printing on the portion where the external terminals were to be attached to form a solder paste layer. Next, an external terminal made of Kovar was placed on the solder paste layer, and heated and reflowed at 420 ° C., and the external terminal was attached to the end of the heating element 2 via the solder layer.

(8) The tip part (parallel part) of the L-shaped thermocouple 4 for temperature control is pushed into the storage groove 3, and then the helisert 21 is screwed into the screw hole 20 to tighten the thermocouple 4. Fixed.

(9) The support 100 is prepared, and the ceramic substrate 1 having the heating element 2 is fitted into the top of the casing 14 via the heat insulating ring 8, and then the middle bottom plate 25 is attached to the support 100. And an external terminal via a socket 14. After that, the bottom plate 15 to which other necessary jigs were attached was attached to the support 100 by welding with a yuxima laser to complete a hot plate.

Example 2 A hot plate was manufactured in the same manner as in Example 1 except that the thermocouple was fixed by a spring 24 shown in FIG. In the fixing, an aluminum plate having a thickness of 0.5 mm was interposed between the spring and the thermocouple.

Example 3 Example 1 was repeated except that the thermocouple was filled and fixed with a vitreous sealing material as shown in FIG.
The same hot plate was manufactured.

Example 4 A hot plate was manufactured in the same manner as in Example 1 except that the thermocouple was fixed with mounting bolts shown in FIG.

Example 5 The same as Example 3, but glass-sealed vertically (to the heating surface) as shown in FIG. 1 (b) without bending as shown in FIG.

(Comparative Example 1) As a mounting structure of the temperature measuring element 4 in the housing groove 3 of the substrate 1, as shown in FIG. 1A, a thermocouple 4 is inserted into a bottomed hole, and then filled with a polyimide resin. Except that this was buried and killed,
A hot plate was manufactured.

The hot plate units according to the examples and the comparative examples thus obtained were evaluated according to the following criteria.

Evaluation method (mounting life, heating surface temperature recovery time) (1) Whether the thermocouple 4 is at least loosened or detached (detection of poor temperature measurement) when the heater is heated to a temperature of 200 ° C. for 1000 hours. No was observed.

(2) The heater is heated to 200 ° C. in a steady state, and the wafer at 25 ° C.
μm and mounted. Heating surface temperature is 200 ℃ and ± 0.5 ℃
The time to recovery was measured.

[0048]

[Table 1]

As shown in Table 1 above, in the hot plate units according to Examples 1 to 5, there was no possibility that the thermocouple would be loosened or detached even if the thermocouple was used continuously for a long time. On the other hand, in the hot plate unit according to Comparative Example 1, the life was poor, and the result was that the slack was particularly fast as compared with the Example. The recovery time can be shortened by bending the thermocouple and increasing the contact area, rather than fixing the thermocouple perpendicularly to the heating surface. Further, it is better to interpose a metal plate.

[0050]

As described above, according to the temperature measuring element mounting structure of the ceramic heater for a semiconductor manufacturing / inspection apparatus of the present invention, the temperature of the substrate can be stably controlled over a long period of time. This is effective for stably manufacturing semiconductor-related products such as silicon wafers having good characteristics. Further, according to the present invention, the life of the device can be significantly improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of a structure for mounting a temperature measuring element of a hot plate unit as an example of a semiconductor manufacturing / inspection apparatus.

FIG. 2 is a partial cross-sectional view illustrating an example of a temperature measuring element mounting structure according to the present invention.

FIG. 3 is a plan view showing a form of a storage groove for applying the present invention.

FIG. 4 is a sectional view showing another example of the temperature measuring element mounting structure according to the present invention.

FIG. 5 is a sectional view showing still another example of the temperature measuring element mounting structure according to the present invention.

FIG. 6 is a sectional view showing still another example of the temperature measuring element mounting structure according to the present invention.

FIG. 7 is a partial sectional view showing an example of an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Ceramic board 2 ... Heating element 3 ... Storage groove 4 ... Temperature measuring element 20 ... Screw hole 21, 22, 23 ... Screw 24 ... Spring 26 ... Vitreous sealing material 28 ... Mounting bolt

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[Procedure amendment]

[Submission date] June 4, 2001 (2001.6.4)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Name of invention

[Correction method] Change

[Correction contents]

Patent application title: Temperature measuring element mounting structure of ceramic heater for semiconductor industry

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction contents]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for attaching a temperature measuring element to a ceramic substrate heater for use in the semiconductor industry, which is mainly used in the semiconductor industry for drying or sputtering semiconductor products. . The present invention is also applicable to a ceramic substrate of a semiconductor manufacturing / inspection apparatus in which the ceramic heater has a function as an electrostatic chuck or a wafer prober.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction contents]

That is, according to the present invention, in a ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, one or more slit-shaped storage grooves are provided on a surface opposite to a heating surface of the ceramic substrate. A temperature measuring element is fitted into the storage groove, and the bent end of the temperature measurement element is stored along the groove bottom of the storage groove, and is fixed using a tightening screw or a vitreous sealing material. Semiconductor industry
Temperature measuring element mounting structure of a ceramic heater for use .

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

The present invention also provides a ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein at least one slit-shaped storage groove is provided on a surface of the ceramic substrate opposite to a heating surface, An L-shaped temperature measuring element is fitted into the storage groove, and a fastening screw is screwed into a screw hole that is opened by overlapping the storage groove, and the temperature measurement element that is fitted into the storage groove is fixed. The temperature measuring element mounting structure of the ceramic heater for semiconductor industry .

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction contents]

The present invention also provides a ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein at least one slit-shaped storage groove is provided on a surface of the ceramic substrate opposite to a heating surface, An L-shaped temperature measuring element is fitted into the storage groove, and a fastening screw is screwed into a screw hole opened so as to overlap with the storage groove to fix the temperature measurement element fitted into the storage groove. semiconductor production with, formed by further filling the vitreous sealing material in the accommodating groove
This is a structure for mounting a temperature measuring element of an industrial ceramic heater.

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

The present invention also provides a ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein at least one slit-shaped storage groove is provided on a surface of the ceramic substrate opposite to a heating surface, fitted with L-type temperature measuring element into the housing groove, it is filled with a vitreous sealing material according accommodating groove, formed by burying fixing the surveying temperature element half
This is a structure for mounting a temperature measuring element of a ceramic heater for the conductor industry .

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction contents]

Further, the present invention provides a ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein one or more slit-shaped storage grooves are provided on a surface of the ceramic substrate opposite to a heating surface. , fitted with L-type temperature measuring element into the accommodation groove, such housing toward the temperature measuring element grooves, measuring the temperature of the semiconductor industry for the ceramic heater, characterized in that the repression fixed by inserting the resilient jig Element mounting structure.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05B 3/20 393 H05B 3/20 393 F term (Reference) 3K034 AA02 AA08 AA10 AA15 AA21 AA22 AA34 BB06 BB14 BC04 BC12 BC17 CA02 CA15 CA26 CA35 DA04 DA08 EA07 FA38 HA01 HA10 JA02 3K058 AA45 AA71 BA00 CA05 CA12 CA16 CA22 CA69 CA91 CB09 CB10 CB26 CE02 CE13 CE19 3K092 PP20 QA05 QB02 QB18 QB31 QB44 QB45 QB69 RFB QC QC QC RF QC UA17 UA18 VV22 VV31 VV40 4M106 AA01 BA01 CA01 DD30 5F103 AA08 NN01 RR10

Claims (9)

[Claims] 1. A ceramic heater having a heating element provided on a surface or inside of a ceramic substrate, wherein at least one slit-like storage groove is provided on a surface of the ceramic substrate opposite to a heating surface, and the inside of the storage groove is provided. A temperature measuring element mounting structure for a ceramic heater, wherein a temperature measuring element is fitted into the device and the bent end of the temperature measuring element is stored and fixed along the bottom of the storage groove. 2. A ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein at least one slit-like storage groove is provided on a surface of the ceramic substrate opposite to a heating surface, and the inside of the storage groove is provided. A ceramic heater in which a temperature measuring element is fitted into the receiving groove, a fastening screw is screwed into a screw hole opened so as to overlap with the storage groove, and the temperature measuring element fitted in the storage groove is fixed. Temperature measuring element mounting structure. 3. A ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein at least one slit-shaped storage groove is provided on a surface of the ceramic substrate opposite to a heating surface, and the storage groove is provided. A temperature-measuring element is fitted into the inside of the storage groove, and a fastening screw is screwed into a screw hole opened so that the storage groove overlaps, and the temperature-measuring element fitted into the storage groove is fixed, and A temperature measuring element mounting structure for a ceramic heater in which a vitreous sealing material is further filled in the groove. 4. A ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein at least one slit-shaped storage groove is provided on a surface of the ceramic substrate opposite to a heating surface, and the storage groove is provided. A temperature measuring element mounting structure of a ceramic heater in which a temperature measuring element is fitted into the inside, a vitreous sealing material is filled in the storage groove, and the temperature measuring element is embedded and fixed. 5. A ceramic heater having a heating element provided on the surface or inside of a ceramic substrate, wherein at least one slit-shaped storage groove is provided on a surface of the ceramic substrate opposite to a heating surface, and the storage groove is provided. A temperature-measuring element mounting structure for a ceramic heater, wherein a temperature-measuring element is fitted into the inside, and an elastic jig is inserted and elastically pressed toward the temperature-measuring element in the storage groove. 6. An L-shaped temperature measuring element, the tip of which is bent.
6. A mold according to claim 2, wherein the bent end portion is accommodated along the groove bottom in the storage groove, and the bent end portion is used as a fixing target portion. Item 2. The temperature measuring element mounting structure according to item 1. 7. The temperature measuring element according to claim 5, wherein the temperature measuring element is fixed by the elastic jig using a spring material interposed between an intermediate bottom plate and a bottom plate immediately below the substrate. Mounting structure. 8. The temperature measuring element mounting structure according to claim 5, wherein a glassy sealing material is further filled in the storage groove. 9. The temperature measuring element mounting structure according to claim 1, wherein a temperature control means is mounted on said ceramic substrate.