JP2002190483A - Electronic component bonding method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify device constitution and to improve productivity at bonding of an electronic component to the loading part of a substrate without deviations. SOLUTION: In this electronic component bonding method, the positional deviation from a reference position of the electronic component 2 held by a holding means (holding nozzle 33) is detected, and the position deviation in a rotating direction among the detected positional deviations of the electronic component 2 is corrected by the turning of a turning arm 32.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for bonding electronic components such as pellets to a substrate such as a lead frame.

[0002]

2. Description of the Related Art In a bonding apparatus such as a pellet bonding apparatus or a flip chip bonding apparatus, a holding means such as a suction nozzle is provided on a swivel arm, and an electronic component is sucked and held by a holding means from an electronic component supply unit, taken out, and turned. The electronic component held by the holding means is transferred to the transfer position to the mounting means such as a bonding head by the turning movement of the arm, and the electronic component is sucked from the holding means to the suction tool of the mounting means and received at the transfer position. Then, while the suction tool is moving to the mounting portion of the substrate, an image of the electronic component sucked and held by the suction tool is captured by a camera or the like, and the captured image is processed so that the position of the electronic component from the reference position is obtained. The displacement (X, Y and the amount of displacement in the rotation direction) is detected. Among the detected positional shifts, the positional shifts in the X and Y directions are corrected by adjusting the amount of movement of the X and Y stages of the mounting means, and the positional shifts in the rotational direction are corrected by a rotation driving unit that rotates the suction tool. The electronic component is bonded to the mounting portion of the substrate without any deviation by controlling the amount of rotation of the substrate.

[0003]

In the conventional bonding apparatus, the rotation tool for correcting the rotational displacement of the electronic component is provided in the suction tool of the mounting means, so that the structure of the mounting means is complicated. I do. In addition, since the weight of the suction tool portion of the mounting means is increased by the amount corresponding to the rotation drive unit and the inertia is increased, it is difficult to move the suction tool at high speed, which hinders improvement in productivity.

The reason why high-speed movement becomes difficult when the inertia of the suction tool portion in the mounting means becomes large is as follows. If you suddenly stop the moving suction tool,
Vibration occurs due to the bending or rattling of the mechanism holding the suction head. This vibration increases as the inertia of the suction tool increases. If bonding is performed while vibrating, there is a risk of displacement. Therefore, it is necessary to set a waiting time until the vibration subsides or to stop slowly at such a deceleration that vibration does not occur. Even if the moving speed of the suction tool is increased, the time required to load one pellet is almost the same as or longer than that when moving at a slower moving speed due to waiting time and deceleration time. Will be needed.

[0005] It is conceivable to provide a rotation correction table for electronic components at a transfer position from the holding means to the mounting means without providing a rotation driving section of the suction tool in the mounting means. In this case, however, a new mechanism is required. Is added, the bonding apparatus becomes complicated, and a space for arranging a rotation correction table in the bonding apparatus is required, which leads to an increase in the size of the bonding apparatus, which is not preferable.

SUMMARY OF THE INVENTION An object of the present invention is to simplify the device configuration and improve productivity when bonding electronic components to a mounting portion of a substrate without displacement.

[0007]

According to the first aspect of the present invention, the holding means is provided on the turning arm, the electronic component is held and taken out from the electronic component supply section by the holding means, and the holding means is turned by the turning movement of the turning arm. An electronic component bonding method for transferring a held electronic component to a transfer position to a mounting unit, transferring the electronic component from the holding unit to the mounting unit at the transfer position, and bonding the electronic component transferred to the mounting unit to a mounting portion of a substrate In the present invention, the rotational position of the electronic component held by the holding means is detected, and the detected positional shift in the rotational direction is corrected by the turning movement of the turning arm.

According to a second aspect of the present invention, in addition to the first aspect of the present invention, the moving position of the holding means after correcting the positional deviation in the rotation direction by the turning arm is calculated, and the mounting means is mounted on the calculated moving position of the holding means. It is intended to be positioned.

According to a third aspect of the present invention, the turning arm is provided with holding means, the electronic component is held and taken out from the electronic component supply section by the holding means, and the electronic component held by the holding means is mounted by the turning movement of the turning arm. In the electronic component bonding method of transferring the electronic component from the holding unit to the mounting unit at the transfer position, transferring the electronic component to the mounting unit, and bonding the electronic component transferred to the mounting unit to the mounting portion of the substrate, the holding unit holds the electronic component. The detected displacement of the electronic component is detected, and among the detected displacements of the electronic component, the displacement in the rotation direction is corrected by the turning movement of the turning arm, and the displacement in the X and Y directions is moved by the mounting means. Is to be corrected.

According to a fourth aspect of the present invention, the turning arm is provided with holding means, the electronic component is held and taken out from the electronic component supply section by the holding means, and the electronic component held by the holding means is mounted by the turning movement of the turning arm. In the electronic component bonding apparatus for transferring the electronic component from the holding means to the mounting means at the transfer position, transferring the electronic component from the holding means to the mounting means, and bonding the electronic component transferred to the mounting means to the mounting portion of the substrate, A detecting device for detecting the rotational displacement of the electronic component, and a control device for pivoting the pivot arm so as to correct the rotational displacement detected by the detecting device. Things.

According to a fifth aspect of the present invention, in the fourth aspect of the present invention, the control device further calculates a movement position of the holding means after correcting the positional deviation in the rotation direction by the turning arm, and calculates the calculated movement of the holding means. The mounting means is positioned at the position.

According to a sixth aspect of the present invention, the turning arm is provided with holding means, the electronic component is held and taken out from the electronic component supply section by the holding means, and the electronic component held by the holding means is mounted by the turning movement of the turning arm. In the electronic component bonding apparatus for transferring the electronic component from the holding means to the mounting means at the transfer position, transferring the electronic component from the holding means to the mounting means, and bonding the electronic component transferred to the mounting means to the mounting portion of the substrate, A detecting device for detecting the positional deviation of the electronic component, and a rotating arm for rotating the rotating arm so as to correct the positional deviation in the rotating direction among the positional deviations of the electronic component detected by the detecting device. And a control device for moving the mounting means so as to correct the displacement.

[0013]

According to the present invention, the following functions are provided. The rotational displacement of the electronic component delivered from the holding means to the mounting means is corrected by the turning movement of the turning arm. The swivel arm is originally required for transferring the holding means from the electronic component supply unit to the transfer position to the mounting means, so that no special additional device is required, and the rotation of the electronic component is simplified with a simple device configuration. Direction displacement can be corrected. Further, since the weight of the swing arm does not increase at all and there is no increase in inertia, productivity can be improved without hindering high-speed movement of the swing arm and the holding means.

According to the second and fifth aspects of the present invention, the following effects are further obtained. When the rotational position of the electronic component is corrected by the turning arm in the manner described above, the position of the holding unit changes in accordance with the correction amount of the rotational position. Therefore, by calculating the moving position of the holding means after correcting the positional deviation in the rotation direction by the turning arm, and positioning the mounting means at the calculated moving position of the holding means, the electronic parts held by the holding means are surely mounted by the mounting means. I can receive it.

According to the third and sixth aspects of the present invention, the following effects are further obtained. The positional shift in the rotation direction of the electronic component transferred from the holding means to the mounting means is corrected by the turning movement of the turning arm, and the positional shift in the X and Y directions of the electronic component is corrected by the movement of the mounting means. Thereby, the electronic component can be bonded to the mounting portion of the substrate without displacement.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic view showing a bonding apparatus, FIG. 2 is a block diagram showing a control system of the bonding apparatus, FIG. 3 is a schematic view showing a displacement correction operation by a swing arm, and FIG. FIG. 9 is a schematic diagram showing a change in the position of an electronic component following the correction operation of FIG.

As shown in FIG. 1, a bonding apparatus 10 has an electrode group (not shown) of an electronic component 2 opposed to a connected terminal group (not shown) of a substrate 1 such as a lead frame, and press-contacts both. Bonding.

The bonding apparatus 10 includes an electronic component supply device 11 (electronic component supply unit) and an electronic component removal device 12
, A substrate support device 13, a bonding head 14 (mounting means), and a bonding stage 15.

The electronic component supply device 11 pushes out each of the plurality of electronic components 2 attached to the wafer sheet 21A supported by the electronic component supply table 21 by the ejection device 2.
The protruding electronic component 2 is protruded by the second protruding pin 22 </ b> A, and is supplied to the electronic component extracting device 12.

The electronic component take-out device 12 is provided with a holding nozzle 33 (holding means) at the tip of a swivel arm 32 that can be swiveled and moved up and down by a swivel and up-and-down drive unit 31. The held electronic component 2 is sucked and held by the holding nozzle 33 and taken out. still,
Prior to the protrusion of the electronic component 2 by the protrusion device 22, a detection device (image recognition device) including a camera 34 and an image processing device (not shown) detects the center position of the electronic component 2 in the X direction and the Y direction. The control device 80 controls the drive of the XY table 23 of the electronic component supply table 21 so that the center position of the electronic component 2 is aligned with the center position of the protrusion by the protrusion pin 22A. The electronic component take-out device 12 transfers the electronic component 2 held by the holding nozzle 33 to the electronic component transfer position to the bonding head 14 (the position indicated by the two-dot chain line in FIG.
(Solid line position in FIG. 3).

The substrate support device 13 includes a guide rail 4 for supporting and guiding the substrate 1 transported by a transport device (not shown).
1 at the bonding position.
And a clamper (not shown) for fixing the substrate 1 between the two.

The bonding head 14 includes a suction tool 52
With the XY table 51, the suction tool can be moved between the electronic component delivery position and the bonding position by appropriately moving the suction tool in the X and Y directions. At the electronic component delivery position, the bonding head 14 sucks and receives the electronic component 2 picked up by the holding nozzle 33 of the electronic component pick-up device 12 by a suction tool 52 (which also functions as a pressurizing unit that presses against the substrate 1). Then, the suction tool 52 moves to the bonding position, and presses and bonds the electronic component 2 sucked and held by the suction tool 52 to the mounting portion (bonding point) of the substrate 1.

The bonding stage 15 is disposed below the substrate 1 at the bonding position, and is capable of contacting and supporting the lower surface of the substrate 1 during bonding by the bonding head 14.

However, the bonding apparatus 10 includes first and second detection devices 60 and 70 and a control device 80 in order to bond the electronic component 2 to the mounting portion of the substrate 1 without displacement. The take-out device 12 and the bonding head 14 are controlled as follows.

(1) First detection device 60 (image recognition device)
The electronic component 2 includes a camera 61 and an image processing device 62 and is held by the holding nozzle 33 of the electronic component extracting device 12.
From the reference position (X, Y and rotational direction). That is, the camera 61 is arranged above the electronic component delivery position, and captures an image of the electronic component 2 held by the holding nozzle 33 moved to the delivery position.
The image captured by the camera 61 is sent to the image processing device 62, and the outer shape of the electronic component 2 or a predetermined mark position on the electronic component 2 is recognized by a known pattern matching method. Is detected from the reference position. For example, in the present embodiment, as shown in FIG. 4, the reference position is the center position a of the holding nozzle 33, and the center position A of the electronic component 2 is shifted from the center position a in the X direction. Is Δx, and the displacement in the Y direction is Δ
y, and the displacement of the electronic component 2 in the rotational direction are detected as Δθ. The image processing device 62 is connected to the control device 80 and sends the detected position shift of the electronic component 2 to the control device 80.

(2) Second detection device 70 (image recognition device)
Comprises a camera 71 and an image processing device 72, and detects a displacement (a displacement in the X and Y directions) of a mounting portion of the substrate 1 fixed to a clamper of the substrate support device 13 from a reference position. That is, the camera 71 is disposed above the bonding position and captures an image of the substrate 1. The image captured by the camera 71 is sent to the image processing device 72, and the outer shape of the substrate 1 or a predetermined mark position on the substrate 1 is recognized by a known pattern matching method, and the mounting of the substrate 1 is performed based on the recognition result. And detecting a positional deviation of the section from the reference position. The image processing device 72 is connected to the control device 80, and sends the detected displacement of the substrate 1 to the control device 80.

(3) The control unit 80 controls the drive unit of the turning arm 32 of the electronic component take-out device 12 to correct the rotational position shift among the position shifts of the electronic component 2 detected by the first detection device 60. 31 is controlled. That is, the turning arm 32 is turned in the direction opposite to the direction of the rotational shift of the electronic component 2 by the angle of the rotational shift (Δθ) so as to eliminate the rotational shift of the electronic component 2 (FIGS. 3 and 4).

(4) The control device 80 determines the movement position of the holding nozzle 33 after correcting the rotational deviation of the electronic component 2 in the above (3), and in the present embodiment, the center position b of the holding nozzle 33
Is calculated based on the center position a of the holding nozzle 33 before the rotation deviation correction, the turning center position o of the turning arm 32, the turning angle Δθ of the turning arm 32, and the distance l from the turning center o to the center a of the holding nozzle 33. I do. Further, the control device 80
Using the positional deviations Δx, Δy, Δθ before the rotation deviation correction,
The position deviation in the X direction of the center position B of the electronic component 2 with respect to the center position b of the holding nozzle 33 after the correction of the rotational deviation is represented by Δ
The displacement in the x ′ and Y directions is calculated as Δy ′, and the center position B of the electronic component 2 is finally obtained (see FIG. 4).

(5) The controller 80 corrects the X of the bonding head 14 after correcting the rotational deviation of the electronic component 2 according to the above (3).
The Y table 51 is controlled, and the suction tool 52 is moved to the position of the holding nozzle 33 after the rotational deviation is corrected, taking into account the positional deviation in the X and Y directions of the electronic component 2 detected by the first detection device 60 in (1) above. To transfer the electronic component 2 from the holding nozzle 33 to the suction tool 52. That is, in FIG. 4, the control device 80 controls the movement of the XY table 51,
The suction tool 52 is positioned at the center position B of the electronic component 2 obtained in the above (4), and the suction tool 52 delivers the electronic component 2 while sucking the center position B. As a result, the electronic component 2 is held by the suction tool 25 in a predetermined positional relationship in which the positional deviation in the X, Y and rotational directions has been corrected. Thereafter, the electronic component 2 held by the suction tool 52 is moved to the mounting portion of the substrate 1 and bonded by the XY table 51. Incidentally, when the electronic component 2 is delivered to the suction tool 52 and moves to the mounting portion of the substrate 1, the movement amount is X, X of the substrate 1 detected by the second detection device 70 in the above (2).
The displacement in the Y direction is taken into account and corrected, whereby the electronic component 2 is bonded to the mounting portion without displacement.

According to the present embodiment, the following operations are provided. The rotational displacement of the electronic component 2 transferred from the holding nozzle 33 to the bonding head 14 in the rotation direction
Correct by turning motion 2. The swivel arm 32 moves the holding nozzle 33 from the electronic component supply device 11 to the bonding head 1.
Since the configuration is originally necessary for transferring the electronic component 2 to the delivery position, the position shift of the electronic component 2 can be corrected with a simple device configuration without requiring any special additional device. Also,
Since the weight of the swing arm 32 does not increase at all and the inertia does not increase, productivity can be improved without hindering the high-speed movement of the swing arm 32 and the holding nozzle 33.

As described above, when the rotational arm 32 corrects the displacement of the electronic component 2 in the rotation direction, the position of the holding nozzle 33 changes according to the amount of correction of the displacement in the rotation direction. Therefore, the moving position of the holding nozzle 33 after correcting the positional deviation in the rotation direction by the turning arm 32 is calculated, and further, the positional deviation of the center position B of the electronic component 2 with respect to the moving position is calculated. The electronic component 2 held by the holding nozzle 33 can be reliably received by the bonding head 14 by determining the center position B of the electronic component 2 and positioning the bonding head 14 at that position. In addition, since the electronic component 2 is received in a state where the positional deviation in the X, Y and θ directions has been corrected, the bonding head 14 can bond the electronic component 2 to the mounting portion of the substrate 1 without deviation.

The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific structure of the present invention is not limited to this embodiment, and the design can be changed without departing from the scope of the present invention. The present invention is also included in the present invention.

For example, in the above embodiment, the electronic component 2
Is transferred from the holding nozzle 33 to the suction tool 52, the suction tool 5 is positioned at the center position B of the electronic component 2 after the rotation deviation has been corrected.
The position of the suction nozzle 52 after the transfer is determined by positioning the holding nozzle 33 at the moving position (position b in FIG. 4). The movement amount may be corrected by taking those deviations into account.

Further, in the above embodiment, the center position B of the electronic component 2 after the correction of the rotational deviation is obtained by calculating using the positional deviation detection values Δx, Δy, Δθ and the like before the correction of the rotational deviation. However, the positional deviations Δx ′ and Δy ′ may be detected using a camera or the like after the rotation deviation is corrected.

Further, the above-described embodiment is an example in which the wafer sheet 21A of the electronic component supply table 21 arranges the electronic component 2 downward, and the holding nozzle 33 sucks and holds the electronic component 2 upward. In the above example, the electronic component 2 is bonded to the upper surface. For example, if all the arrangements in FIG. 1 are reversed, the electronic component supply table arranges the electronic component upward and the holding nozzle is The electronic component supply device 1 is configured to hold components downward by suction and bond electronic components to the lower surface of the substrate, or to add a transfer device or a reversing device as appropriate.
1 and the electronic component take-out device 12 can be arranged in a reverse orientation, or only the arrangement of the substrate support device 13 and the bonding head 14 can be reversed in the upside-down orientation. The present invention is applicable to any device configuration. Applicable.

[0036]

As described above, according to the present invention, when bonding an electronic component to a mounting portion of a substrate without shifting,
The apparatus configuration can be simplified and the productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a bonding apparatus.

FIG. 2 is a block diagram showing a control system of the bonding apparatus.

FIG. 3 is a schematic diagram showing a displacement correction operation by a turning arm.

FIG. 4 is a schematic diagram showing a change in the position of an electronic component following the correction operation of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Electronic component 10 Bonding device 11 Electronic component supply device (electronic component supply part) 14 Bonding head (mounting means) 31 Revolving and elevating drive part 32 Revolving arm 33 Holding nozzle (Retaining means) 60 Detector 80 Control device

Continued on the front page F term (reference) 5F044 PP16 PP17 5F047 FA08 FA12 FA73

Claims (6)

[Claims] 1. A holding means is provided on a turning arm, an electronic component is held and taken out from the electronic component supply unit by the holding means, and the electronic component held by the holding means is transferred to a mounting means by turning movement of the turning arm. And transferring the electronic component from the holding means to the mounting means at this transfer position, and bonding the electronic component transferred to the mounting means to the mounting portion of the substrate. An electronic component bonding method comprising: detecting a position shift in a rotation direction; and correcting the detected position shift in a rotation direction by a turning movement of a turning arm. 2. The electronic component bonding method according to claim 1, wherein a moving position of the holding unit after the positional displacement in the rotating direction is corrected by the turning arm is calculated, and the mounting unit is positioned at the calculated moving position of the holding unit. 3. A rotating arm is provided with holding means, the electronic component is held and taken out from the electronic component supply unit by the holding means, and the electronic component held by the holding means is transferred to the mounting means by the turning movement of the turning arm. And transferring the electronic component from the holding means to the mounting means at this transfer position, and bonding the electronic component transferred to the mounting means to the mounting portion of the substrate. Detecting a position shift, correcting the position shift in the rotational direction among the detected position shifts of the electronic component by turning the turning arm, and correcting the position shift in the X and Y directions by moving the mounting means; An electronic component bonding method comprising: 4. A rotating arm is provided with holding means, and the electronic component is held and taken out from the electronic component supply unit by the holding means, and the electronic component held by the holding means is transferred to the mounting means by the turning movement of the turning arm. The electronic component bonding apparatus transfers the electronic component from the holding means to the mounting means at this transfer position, and bonds the electronic component transferred to the mounting means to the mounting portion of the substrate. An electronic component bonding apparatus comprising: a detection device for detecting a rotational position shift; and a control device for rotating a turning arm so as to correct the rotational position detected by the detector. apparatus. 5. The electronic component according to claim 4, wherein the control device calculates a moving position of the holding device after correcting the positional deviation in the rotating direction by the turning arm, and positions the mounting device at the calculated moving position of the holding device. Bonding equipment. 6. A holding means is provided on the turning arm, the electronic component is held and taken out from the electronic component supply unit by the holding means, and the electronic component held by the holding means is transferred to the mounting means by the turning movement of the turning arm. The electronic component bonding apparatus transfers the electronic component from the holding means to the mounting means at this transfer position and bonds the electronic component transferred to the mounting means to the mounting portion of the substrate. A detection device for detecting the displacement, and a displacement of the electronic component detected by the detection device.
An electronic component bonding apparatus comprising: a control device for rotating a revolving arm so as to correct a positional deviation in a rotation direction and moving a mounting means so as to correct a positional deviation in the X and Y directions. apparatus.