JP2002190362A - Socket for ic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the IC package socket, having higher reliability due to ensured electrical connection with IC package, despite repeated or long period uses, and is also superior in durability. SOLUTION: This socket consists of a lower contact piece 46 for supporting each IC package lead contact in the case of mounting IC package, the contact 40 having the upper contact piece 43 to contact with under the elastically depressed condition with respect to the lead contact supported at the lower contact piece 46 and the IC package socket 10 to provide releasing means 40 to release the elastically depressed condition of the relative contact. It serves by shaping at the sharp projection 43 at the contact portion of the upper contact piece 43 of the relative contact 40 and also by providing at the lower contact piece 46 sort of the dimple or the ditch 46a, to prevent the sharp projection 43a from being brought into contact with the top end, at least in a case IC package when being non-mounted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package socket having contacts that can be electrically connected to a semiconductor integrated circuit package (hereinafter, referred to as an IC package) in an elastically pressed state.

[0002]

2. Description of the Related Art In general, in order to test an IC package (for example, a heat resistance test), the IC package is placed in an IC package socket and put into a heating furnace to determine whether the IC package is good or defective. I have.

In such an IC package socket, plating and the like applied to the lead terminals of the IC package are transferred to and adhere to the contact surfaces of the contacts during repeated tests, and this is oxidized to cause electrical contact with the lead terminals. The reliability of dynamic connection is reduced. In addition, since the surface of the lead terminal itself is covered with the oxide film, the reliability of the electrical connection with the contact pin is reduced.

Conventionally, in order to solve such a problem and improve the electrical connection, US Pat. No. 4,846,707 discloses a method in which a plurality of blades are provided on a contact surface of a contact, and the plurality of blades are connected to a lead terminal. There is disclosed a socket adapted to allow biting into a socket.

[0005]

However, in such a conventional socket, in order to improve the electrical connection between the lead terminal and the contact when mounting the IC package,
The contact is elastically configured to press the lead terminal with a predetermined pressing force. As a result, when the IC package is not mounted, the blade directly contacts the lead terminal support of the socket body. As described above, when the blade directly contacts the lead terminal supporting portion of the socket body, the tip of the blade is damaged (for example, the tip is crushed) while the contact is repeatedly opened and closed for a test or the like. The opportunity to receive it will increase. If the tip of the blade is damaged, the contact area with the lead terminal will increase,
Biting into the lead terminal cannot be expected. As a result, there is a problem that the stability and reliability of the electrical connection are reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a socket for an IC package which has high reliability, high reliability, and excellent durability even when used repeatedly or for a long time. .

[0007]

According to the present invention, there is provided a socket for an IC package according to the present invention, comprising: a support for supporting a lead terminal of the IC package when the IC package is mounted; and an IC package supported by the support. A contact having a contact portion that contacts the lead terminal in an elastically pressed state, and a release means capable of releasing the elastically pressed state of the contact, the IC package socket comprising: The portion is formed by a sharp projection, and the support portion is provided with means for avoiding contact with at least the tip of the sharp projection when the IC package is not mounted.

According to the present invention having the above structure, when the IC package is not mounted, at least the tip of the contact portion formed by the sharp projection does not contact any of the socket components of the IC package socket. The chances of damage to the tip of the IC package are reduced, and even when used repeatedly or for a long time, the electrical connection with the IC package is performed stably and reliably, and an IC package socket with excellent durability can be obtained. .

Here, it is preferable that the means for avoiding contact with at least the tip of the sharp projection is a concave portion or a groove formed in the support portion.

The means for avoiding contact with the sharp projection may be a concave portion or a groove formed in the support portion and a regulating portion formed in the contact and in contact with the support portion.

The support may be formed on a socket body.

Further, the support portion may be formed on another contact which is electrically connected to the contact.

[0013]

Embodiments of the present invention will be described below with reference to the accompanying drawings. In the following description, the same portions are denoted by the same reference numerals, and redundant description is avoided.

1 to 6 show a first embodiment of a socket for an IC package according to the present invention. This embodiment is based on I
The present invention is applied to a so-called two-point contact type socket in which contact with a contact is obtained at two upper and lower positions with respect to a lead terminal of a C package.

FIG. 1 is a perspective view showing an entire IC package socket 10. The socket 10 includes a main body 20 made of glass fiber-containing resin and a cover member 30 which is vertically movably engaged with the main body 20. It has. A large number of contacts 40 are attached to both sides of the main body 20 at the same pitch (in FIG. 1, some of the twenty contacts are removed and shown). The main body 20 has an elongated groove 2 to be accommodated.
1 has notches 32 formed in the side wall 31 of the cover member 30 by the number of contacts 40.

Near the four corners of the socket 10, the main body 20 is provided with a guide groove 22 and a guide bar 23, and
The cover member 30 includes a guide bar 33 and a guide groove 34.
The guide grooves 22 and 34 and the guide bars 33 and 23 guide each other so that the cover member 30 can move up and down with respect to the main body 20. Reference numeral 24 denotes a return spring that urges the cover member 30 upward. The cover member 30 has no canopy, and the socket 10 has a space 12 for mounting an IC package.

2 to 5 show cross sections of the socket 10, in which the side surface of the contact 40 and the lower end inclined surface 31a of the side wall 31 of the cover member 30 are clearly shown. The contact 40 is formed by punching or the like from a blank material of a conductive elastic material such as a beryllium copper alloy, a copper titanium alloy, a nickel beryllium alloy, and phosphor bronze. The elastic bending portion 42 and a linear upper end portion 42a connected to the elastic bending portion 42
Contact piece 43 and trigger 4 diverging from the left to the right
4, a connecting portion 45 that branches off from the lower end of the elastic bending portion 42, and a lower contact piece portion 46 to which the connecting portion 45 connects.
And The upper contact piece 43 has an IC
A sharp projection 43a is formed as a contact portion that contacts the lead terminal 51 of the package 50 in an elastically pressed state. The trigger portion 44 is engaged with the lower end inclined surface 31 a of the side wall 31 of the cover member 30. The mounting portion 41
A lead leg 47 is inserted into a lead insertion hole (not shown) of a printed circuit board connected to a test circuit and soldered.

In this embodiment, the lower contact piece 46 is immovably locked to the step 25 formed on the main body 20, and
As shown in FIG. 5, a supporting portion for supporting the lead terminals 51 of the IC package 50 when the IC package 50 is mounted is constituted. Then, the lower contact piece 4 as the support portion
6, a recess or groove 46a is formed as means for avoiding contact with the tip of the sharp projection 43a when the IC package 50 is not mounted (see FIGS. 2 and 3).

The mounting of the IC package 50 in the socket 10 is as follows.

2, the lower end inclined surface 31a of the side wall 31 of the cover member 30 when the IC package 50 is not mounted.
When the trigger portion 44 of the contact 40 is pushed down as shown in FIG. 4, the elastic bending portion 42 is elastically deformed, and the upper contact piece 43 rotates in the direction of the arrow A shown in FIG. . In this state, the IC package 50 is
And the lead terminal 51 of the IC package 50 is placed on the lower contact piece 46 as a support. Next, when the pressing down of the trigger portion 44 by the cover member 30 is released, the upper contact piece 43 presses the lead terminal 51 of the IC package 50 by the elasticity of the elastic bending portion 42, and the lead terminal 51 of the IC package 50 contacts the upper side. The lead terminal 51 and the contact 40 are electrically connected to each other by being sandwiched between the piece 43 and the lower contact piece 46.

At this time, since the sharp protrusion 43a is formed on the upper contact piece 43 as described above, the sharp protrusion 43a has a single point at its tip and the lead terminal 5 is concentrated.
Touch 1. This contact area is significantly smaller. As a result, it is suppressed that the tin plating or the like of the lead terminal 51 described above moves to and adheres to the upper contact piece 43,
Oxidation of the attached tin does not cause contact failure. Also, since the contact area is intensively contacted at one point,
Even if the surface of the lead terminal 51 such as tin plating is oxidized and covered with an oxide film, the tip of the sharp projection 43a bites into the lead terminal 51, so that the oxide film is broken and the internal metal is directly exposed. The contact with the sharp projection 43a ensures the electrical connection between the lead terminal 51 and the contact 40.
FIG. 5 is a sectional view showing a state in which the IC package 50 is mounted on the socket 10 in this manner.

When the test is completed, the cover member 30 is pushed down again to bring the contacts 40 into the state shown in FIG. 3, and the IC package 50 is removed from the space 12. This I
The non-mounted state of the C package 50 is shown in FIG. 2 as described above. The tip of the sharp projection 43a of the contact 40 is received in the recess or groove 46a of the lower contact piece 46, and the tip is Never touch it. When the test of the next IC package is performed after the test of one IC package, the cover member 30 is pushed down to bring the contacts 40 into the state shown in FIG. It should just be attached to.

Here, as shown in FIG. 3, one side of the recess or groove 46a formed in the lower contact piece 46
The inclined surface 4 where the front inclined surface 43b of the sharp projection 43a is in surface contact with the end of the contact 40 on the movement locus in the direction of arrow A.
6b are formed to ensure the holding of the contact 40 when the IC package 50 is not mounted, and the non-contact state of the tip of the sharp projection 43a.
Further, a contact 4 is provided on the other side of the recess or groove 46a.
When 0 rotates in the direction of arrow A, the inclined flank is used to avoid contact between the rear inclined surface 43c and the distal end of the sharp projection 43a and the lower contact piece 46, and to prevent damage to the distal end due to contact. 46c are formed.

The recess or groove 46a formed in the lower contact piece portion 46 is, as shown in FIG.
May be formed over the entire thickness direction, or may be formed only at the central portion in the thickness direction as long as non-contact of the tip of the sharp projection 43a is guaranteed.

Further, as a second embodiment of the present invention, as shown in FIG. 7, a concave portion formed in the lower contact piece 46 is also provided in the main body 20 to which the lower contact piece 46 is locked. Or a similar recess or groove 2 that is continuous with groove 46a.
6 may be formed. In this case, contact 4
Even when the 0 upper contact piece 43 slightly swings in the pitch direction, it is possible to reliably prevent the tip of the sharp projection 43a from contacting the socket constituent member.

Next, a third embodiment of the present invention will be described with reference to FIG. In this embodiment, the present invention is applied to a so-called one-point contact type socket that does not have the connecting portion 45 and the lower contact piece 46 instead of the above-described two-point contact type socket. Since the single-point contact type socket does not have the lower contact piece, a supporting portion for supporting the lead terminals 51 of the IC package 50 when the IC package 50 is mounted on the upper surface 27 of the socket body 20 is formed. A concave portion or groove 27a is formed on the upper surface 27 as the support portion as a means for avoiding contact with the tip of the sharp projection 43a when the IC package 50 is not mounted.

The recesses or grooves formed on the upper surface 27 of the socket body 20 may be formed as a single continuous recess or groove 27b as shown in FIG. 9 as a fourth embodiment.

Here, in the second to fourth embodiments, the relative relationship between the upper contact piece 43 and the concave portion or the groove is the same as in the first embodiment, and the description is omitted.

Further, various forms of the contact portion of the upper contact piece 43 will be described with reference to FIG.

In the embodiment shown in FIG. 10A, the contact portion is formed by a substantially triangular-shaped sharp projection 43a, and is used in the first embodiment. Approximately triangular sharp projection 4
3a is formed thinner than the entire thickness of the contact 40 in order to reduce the contact area, and the blade portion 43d extends in the thickness direction of the contact.

The embodiment shown in FIG. 10B is similar to that shown in FIG.
Is a modified example of the form shown in FIG.
3e is provided.

In the form shown in FIG. 10 (C), the contact portion is formed by a sharp protrusion 43f having a substantially quadrangular pyramid shape, and the tip is formed at a point 43g.

The form shown in FIG. 10D is the same as that shown in FIG.
The contact portion is formed by a sharp truncated pyramid-shaped sharp projection 43h, and the tip is a small area point 4
3i.

The form shown in FIG. 10E is similar to that shown in FIG.
In this modification, the contact portion is formed by a rounded, substantially quadrangular pyramid-shaped sharp projection 43j, and the tip is formed at a point 43k.

In the form shown in FIG. 10 (F), the contact portion is formed by a substantially ridge-like sharp projection 43m.
3n extends in a direction orthogonal to the thickness direction of the contact.

In the form shown in FIG. 10 (G), the contact portion is formed by a substantially triangular sharp projection 43p, which is formed to be equal in thickness to the contact 40, and the blade portion 43q is formed in the contact thickness. Direction.

As described above, the tip of the sharp projection serving as the contact portion of the upper contact piece 43 may have a small area relative to other portions, such as a point, a blade, or a small area point.

Further, a fifth embodiment of the present invention is shown in FIG.
1 and FIG. In the above-described embodiment, one side of the recess or groove 46a formed in the lower contact piece 46
The inclined surface 4 where the front inclined surface 43b of the sharp projection 43a is in surface contact with the terminal end of the contact 40 on the movement locus in the direction of arrow A.
6b, the contact 40 was securely held when the IC package 50 was not mounted, and the non-contact state of the tip of the sharp projection 43a was maintained. However, in this embodiment, depending on the shape of the lead terminal of the IC package 50, the tip of the upper contact piece 43 abuts a part of the lead terminal, and the contact with the lead terminal by the sharp projection 43a is not ensured. There is fear. Therefore,
In the present embodiment, the shape of the contact 40 is slightly different from that of the above-described embodiment to eliminate such a fear.

That is, a restricting portion 42b is formed inside the intersection of the upper contact piece 43 and the linear upper end portion 42a, and the restricting portion 42b is moved downward at the end of the contact 40 on the movement locus in the direction of arrow A. The contact piece 46 comes into contact with the shoulder 46d. Also, in order to more reliably prevent the tip of the upper contact piece 43 from contacting a part of the lead terminal,
The distal end of the upper contact piece 43 is formed substantially flat as shown in FIG.

Thus, when the IC package 50 is not mounted, as shown in FIG. 12, at the end of the contact 40 on the movement trajectory in the direction of the arrow A, the restricting portion 42b becomes the shoulder of the lower contact piece 46. A sharp projection 4 which abuts on the portion 46d and
3a is a recess or groove 46 formed in the lower contact piece 46.
a, damage to the distal end caused by contact of the sharp projection 43a is prevented in the same manner as in the above-described embodiment.

[0041]

As described above, according to the present invention,
When the IC package is not mounted, at least the tip of the contact portion formed by the sharp projection does not contact any of the socket components of the IC package socket. Alternatively, even if the IC package is used for a long period of time, the electrical connection with the IC package is stably and surely performed, and an IC package socket having excellent durability can be obtained.

[Brief description of the drawings]

FIG. 1 shows a first IC package socket according to the present invention.
It is a perspective view which shows the Example of FIG.

FIG. 2 is a cross-sectional view of the IC package socket of FIG. 1 taken along the line II-II, showing a state where the IC package is not mounted.

FIG. 3 is an enlarged view of a main part of FIG. 2;

FIG. 4 is a cross-sectional view of the IC package socket of FIG. 1 taken along the line II-II, showing a state where contacts are opened.

5 is a cross-sectional view of the IC package socket of FIG. 1 taken along the line II-II, showing a state where the IC package is mounted and contacts are closed.

6 is an enlarged perspective view of a main part of the IC package socket of FIG. 1, with a cover member removed;

FIG. 7 shows a second embodiment of the IC package socket according to the present invention.
FIG. 3 is an enlarged perspective view of a main part showing the example of FIG. 1, with a cover member removed.

FIG. 8 shows a third IC package socket according to the present invention.
FIG. 3 is an enlarged perspective view of a main part showing the example of FIG. 1, with a cover member removed.

FIG. 9 shows a fourth IC package socket according to the present invention;
FIG. 3 is an enlarged perspective view of a main part showing the example of FIG. 1, with a cover member removed.

FIG. 10 is a perspective view showing various forms of a contact used in an IC package socket according to the present invention;
It is a figure including (A) thru / or (G).

FIG. 11 is an enlarged sectional view of a main part of a socket for an IC package according to a fifth embodiment of the present invention, showing a state where an IC package is mounted and a contact is closed.

FIG. 12 is an enlarged sectional view of an essential part showing a fifth embodiment of an IC package socket according to the present invention, showing a state where an IC package is not mounted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 IC package socket 20 Socket main body 27 Upper surface (support part) 27a, 27b Depression or groove 30 Cover member 40 Contact 43 Upper contact piece 43a Sharp projection 46 Lower contact piece 46a, 46b Concave or groove

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Yuji Kato 3-28-7 Nakamagome, Ota-ku, Tokyo Yamaichi Electric Co., Ltd. F-term (reference) 2G003 AG01 AG12 AH05 2G011 AA15 AB01 AB07 AC00 AC14 AD01 AF02 5E024 CA07 CB01 CB02

Claims (5)

[Claims] A contact having a support for supporting a lead terminal of the IC package when the IC package is mounted, and a contact for contacting the lead terminal of the IC package supported by the support in an elastically pressed state. And a release means capable of releasing an elastic pressing state of the contact, wherein the contact portion of the contact is formed by a sharp projection, and the support portion has an IC package. A means for avoiding contact with at least the tip of said sharp projection when not mounted. 2. The IC package socket according to claim 1, wherein said means for avoiding contact with a sharp projection is a concave portion or a groove formed in said support portion. 3. The device according to claim 2, wherein the means for avoiding contact with the sharp protrusion is a concave portion or a groove formed in the support portion and a regulating portion formed in the contact and abutting on the support portion. 2. The IC package socket according to 1. 4. The IC package socket according to claim 1, wherein said support portion is formed on a socket body. 5. The IC package socket according to claim 1, wherein said support portion is formed on another contact electrically connected to said contact.