JP2002185872A - Photoelectric converter and image pickup unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photoelectric converter and an image pickup unit, that can prevent a capacitive element from being unstable due to the effects of deformation of a printed circuit board caused by vibration/shock or the like so as to continuously supply a stable power. SOLUTION: In the photoelectric converter provided with an optical sensor panel 2-b, where sensor cells 2-f are arranged in a form of a matrix, a signal processing circuit that processes an image signal outputted from the optical sensor panel 2-b, and a printed circuit board 2-a on which a capacitive element 2-k is mounted, the capacitive element 2-k is mounted on the printed circuit board, while the part is pared from the front side of the printed circuit board 2-a via a lead terminal, and part of the capacitive element 2-k is fixed to a support 2-n.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a photoelectric conversion device having a structure in which photoelectric conversion elements are arranged on a matrix,
In addition, the present invention relates to a photographing device that performs photographing using a photoelectric conversion device.

[0002]

2. Description of the Related Art Conventionally, there is an optical sensor panel having a structure in which a large number of minute optical sensor cells are formed one-dimensionally or two-dimensionally on a glass or semiconductor substrate. With this type of optical sensor panel, given image information is read, an output from the optical sensor cell is appropriately processed by a signal processing circuit, and an image information signal is obtained electrically as a set of pixel signals for the optical sensor cell. Is being done.

FIG. 7 shows an example of a conventional optical sensor panel. In FIG. 7, 1-a represents one optical sensor cell, 1
-B indicates a capacitance portion of the photosensor cell 1-a, 1-c indicates a power supply line, and 1-d indicates an output line. Optical sensor cell 1
In -a, the carriers generated by the light given from the outside are accumulated in the capacitance section 1-b, and the output line 1-b.
It is extracted from d through 1-f as image information.

Here, when a certain unstable power is supplied to the power supply line 1-c supplying the reference potential, the carriers stored in the capacitance portion 1-b are directly affected by the fluctuation. Therefore, the extracted image information contains "noise"
The effect appears in the form. The stability of the power supply largely depends on a power supply circuit (comprising a power supply generation unit and a smoothing unit) on the power supply side, and a capacitor, a noise filter, and the like have been conventionally used for smoothing. Was. Further, in recent years, many regulators with high precision have appeared, and a circuit is configured by combining these regulators.

[0005] In recent years, surface mount elements have been used in many of these elements in order to save space. However, when an element (hereinafter referred to as a capacitance element) for reducing noise with an electric capacitance as typified by a capacitor is surface-mounted, a PCB on which the element is mounted is mounted.
In some cases, it reacts sharply to physical deformation of the (printed wiring board), causing a constant change.

FIG. 8 shows an example of a conventional surface mounting. In FIG. 8, 1-g represents the above-described surface-mount type capacitive element,
h is the PCB on which the surface mount type capacitive element is mounted, 1-
i indicates vibration or impact given to PCB1-h.

[0007]

The vibration or shock 1-i applied to the surface mount type capacitive element 1-g shown in FIG.
Is transmitted as a force for expanding and contracting the surface-mounted capacitive element 1-g. As a result, the capacitance of the surface-mounted capacitive element 1-g becomes unstable, and the potential to be stabilized is not relative to the reference potential. Let it be stable.

[0008] Physical deformation of the surface mount type capacitive element is mainly caused by pressurization, vibration, impact or the like applied to the external housing. Therefore, in particular, the optical sensor panel is portable, or the vibrating body / actuator is nearby. In an environment where there is the like, the physical deformation amount may not be negligible compared to the signal output. Therefore, when the optical sensor panel is mounted on a photographing apparatus, noise components appear in image information depending on a photographing target and a photographing purpose, and the quality of the image is greatly impaired.

Since this noise is included in image information as a random component, it is very difficult to remove the noise by noise processing such as a soft or hard filter. Can degrade the quality of

Therefore, it is desirable to stabilize the power supply itself. However, since a change in a constant due to vibration or impact also causes a random component in time and position, a conventionally used standard is used. Even if a compensating circuit using a resistor, a reference power generator, or the like is formed, there is a problem that they often cannot function sufficiently.

An object of the present invention is to prevent the capacitance element from becoming unstable due to the influence of the deformation of the printed wiring board caused by vibration, impact, and the like, and to make it possible to continuously supply a stable power supply. An object is to provide a photoelectric conversion device and an imaging device.

[0012]

A photoelectric conversion device according to the present invention comprises an optical sensor panel in which a plurality of sensor cells are arranged in a matrix, and a printed wiring board on which a power supply circuit for supplying power to the optical sensor cells is mounted. In the photoelectric conversion device, the power supply circuit includes a capacitance element, and is mounted on the printed wiring board in a state where at least a capacitance portion of the capacitance element is separated from the printed wiring board.

[0013] In the photoelectric conversion device according to the present invention, the capacitance element may include a lead wire longer than a normal mounting length, and the lead wire may be connected to the printed wiring board.

[0014] The photoelectric conversion device according to the present invention may include a support placed on the printed wiring board, and the capacitance section may be placed on the support.

In the photoelectric conversion device according to the present invention, the support may have elasticity.

In the photoelectric conversion device according to the present invention, the support may have a viscosity.

In the photoelectric conversion device according to the present invention, the support may include silicon, rubber, a spring, styrene, or paper.

[0018] The photoelectric conversion device according to the present invention may include a flexible substrate having at least one end connected to the printed wiring board, and the capacitance element is mounted on the flexible substrate.

In the photoelectric conversion device according to the present invention, another end of the flexible substrate may be connected to the printed wiring board.

The photoelectric conversion device according to the present invention may include a support placed on the printed wiring board, and another end of the flexible substrate may be fixed to the support.

In the photoelectric conversion device according to the present invention, the support may have elasticity.

In the photoelectric conversion device according to the present invention, the support may have a viscosity.

In the photoelectric conversion device according to the present invention, the support may include silicon, rubber, a spring, styrene, or paper.

In the photoelectric conversion device according to the present invention, the support may be iron, a metal whose surface is rust-proof plated, a non-ferrous metal,
These alloys or hard plastics may be provided.

An imaging device according to the present invention includes the above-mentioned photoelectric conversion device.

In addition, the photoelectric conversion device of the present invention will be described with reference to FIGS. 1 to 3. An optical sensor panel 2-b in which a plurality of sensor cells 2-f are arranged in a matrix; In a photoelectric conversion device including a signal processing circuit that processes an image signal output from 2-b and a printed wiring board 2-a on which an electric circuit component 2-k is mounted,
A part of the electric circuit component 2-k is
-A mounted in a state separated from the surface.

[Operation] The photoelectric conversion device of the present invention is a device in which a portion of a capacitance element disposed in a reference power generation unit / smoothing unit, which controls a capacitance, is mounted separately from a printed wiring board or a flexible printed wiring board. It is. Therefore, the capacitive element can be isolated from the external influence of the physical deformation of the printed wiring board caused by vibration, shock, and the like, and high-quality image information with reduced noise due to power supply fluctuation can be output. A photoelectric conversion device that can be provided can be provided.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment Next, a first embodiment of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 1, an equivalent circuit of the photoelectric conversion device according to the first embodiment of the present invention includes a plurality of photosensor cells 2 arranged in a matrix and having a capacitance portion 2-g.
f, a power supply line 2-h, and an output line 2-i.

As shown in FIGS. 2 and 3, the photoelectric conversion device according to the first embodiment of the present invention includes a PCB (printed wiring board) 2-a on which a power supply circuit for driving is mounted, An optical sensor panel 2-b in which sensor cells 2-f are arranged in a matrix, a gate driving circuit 2-c, and a signal processing circuit (not shown) for processing an image signal output from the optical sensor panel 2-b are provided. ing.

In the optical sensor cell 2-f, carriers generated by the applied light are accumulated in the capacitor 2-g, and extracted as image information through the output line 2-i. A plurality of capacitive elements 2-k, 2
-P is mounted in a state of being separated (floated) from the upper surface of the substrate. Here, means for mounting discrete components connected via the lead terminals 101 is adopted.

The capacitive elements 2-k, 2-
In order to alleviate the vibration transmission to p, the lead terminals need to be mounted after leaving an extra length as compared with the normal mounting. Specifically, in addition to the normal mounting length, for example, 0.5 to
About 50 mm can be proposed as an appropriate range. The normal mounting length is a standard length that allows the capacitors 2-k and 2-p to be mounted on the PCB 2-a without giving stress to the capacitors 2-k and 2-p (for example, depending on the manufacturer of the capacitor. Recommended length), which is the capacitance element 2-k, 2-p
And the distance between a plurality of mounting through holes per element provided in the PCB2-a. An example of these implementations is shown in FIG. 2-n, 2-
q is a capacitive element 2-k, which is additionally mounted as necessary.
2-p support.

It is desirable that the supports 2-n and 2-q be made of a material which is flexible, has elasticity and viscosity and has a vibration damping effect. Specific examples include silicon, rubber, spring bodies,
Styrol, paper or the like, and the like. As a result, the PCB2-a portion is isolated from external influences such as vibrations indicated by 2-m in the drawing, and a stable power supply can be provided to the optical sensor panel.

According to the first embodiment of the present invention, of the capacitive elements arranged in the reference power generation unit / smoothing unit, the part which controls the capacitance is mounted away from the PCB, and is caused by vibration, shock, or the like. It is possible to provide a photoelectric conversion device having a stable power supply circuit isolated from the influence of physical deformation of the PCB and capable of outputting high-quality images.
Further, it is possible to provide a photographing device equipped with the photoelectric conversion device having the above-described excellent effects.

[Second Embodiment] Next, a second embodiment of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 4, an equivalent circuit of the photoelectric conversion device according to the second embodiment of the present invention has a plurality of photosensor cells 3 arranged in a matrix and having a capacitance portion 3-g.
f, a power supply line 3-h, and an output line 3-i.

As shown in FIGS. 5 and 6, the photoelectric conversion device according to the second embodiment of the present invention has a PCB (printed wiring board) 3-a on which a power supply circuit for driving is mounted. A photosensor panel 3-b in which photosensor cells 3-f are arranged in a matrix, a gate driving circuit 3-c, and a signal processing circuit (not shown) for processing an image signal output from the photosensor panel 3-b. Have.

In the photosensor cell 3-f, carriers generated by the applied light are accumulated in the capacitor 3-g, and are extracted as image information through the output line 3-i. The capacitive element 3-k is mounted on the flexible substrate 3p, and the flexible substrate 3p is mounted on the PCB 3-a. The terminal of the capacitive element 3-k is connected to the wiring on the PCB 3-a via the wiring of the flexible substrate 3p. Regarding the mounting form of the flexible board 3-p on the PCB 3-a, one end of the flexible board 3-p is directly connected to the PCB for wiring connection, and the other end of the flexible board 3-p needs to be connected by wiring. There is no flexible board 3
-A, so that the length of the flexible substrate 3-p has a margin so as not to hinder the vibration damping effect of PCB-
a connected to a or mounted on a PCB 3-a
n. FIG. 6 shows the flexible substrate 3-
The other end of p has shown the form fixed to the support body 3-n.

If a material having elasticity and viscosity is used for the support 3-n, a further vibration damping effect can be expected. However, depending on the mounting conditions, other materials, for example, for example, may be used.
Examples include iron, a metal whose surface is rust-proof plated, a non-ferrous metal such as copper or aluminum, an alloy thereof, or a hard plastic. Further, as a specific example of a material having a vibration damping effect having flexibility and elasticity and viscosity, the first embodiment
Similarly to the above, silicon, rubber, a spring body, styrene, paper or the like can be used.

The advantage of this mounting method is that a commonly used surface mount element or an element having a structure that is vulnerable to vibration can be used. There is no need for replacement, and high density can be achieved by using small components. Thereby, the capacitive element 3-k mounted on the flexible substrate is protected from external influences such as vibration indicated by 3-m in the drawing, and a stable power supply can be provided to the optical sensor panel. .

According to the second embodiment of the present invention, a portion of the capacitive element arranged in the reference power supply circuit,
Provide a photoelectric conversion device that has a stable power supply circuit isolated from the effects of physical deformation of the PCB caused by vibration, shock, etc., and is capable of high-quality image output by mounting it away from Can be. Further, it is possible to provide a photographing device equipped with the photoelectric conversion device having the above-described excellent effects.

[0042]

As described above, according to the present invention, a portion of a capacitance element arranged in a reference power supply circuit, which controls a capacitance, is separated from a printed wiring board and mounted, whereby vibration and impact can be prevented. A photoelectric conversion device capable of isolating a capacitive portion of a capacitive element from external influences caused by physical deformation of a printed wiring board and outputting high-quality image information with reduced noise due to power supply fluctuation. And an imaging device including the same.

[Brief description of the drawings]

FIG. 1 is a circuit diagram showing an equivalent circuit of a photoelectric conversion device according to a first embodiment of the present invention.

FIG. 2 is a top view of the photoelectric conversion device according to the first embodiment of the present invention.

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a circuit diagram showing an equivalent circuit of a photoelectric conversion device according to a second embodiment of the present invention.

FIG. 5 is a top view of a photoelectric conversion device according to a second embodiment of the present invention.

6 is a sectional view taken along line BB in FIG. 5;

FIG. 7 is a circuit diagram showing an equivalent circuit of a conventional sensor panel.

FIG. 8 is a view showing a sensor panel of a conventional example, and FIG.
Is a top view, and (b) is a side view.

[Explanation of symbols]

 2-a, 3-a PCB 2-b, 3-b Photosensor panel 2-c, 3-c Gate drive circuit 2-f, 3-f Photosensor cell 2-k, 2-p, 3-k Capacitance element 2-n, 2-q, 3-n support 3-p flexible substrate

Claims (14)

[Claims] 1. A photoelectric conversion device comprising: an optical sensor panel in which a plurality of sensor cells are arranged in a matrix; and a printed wiring board on which a power supply circuit for supplying power to the optical sensor cells is mounted. A photoelectric conversion device, wherein at least a capacitive part of the capacitive element is mounted on the printed wiring board in a state where the capacitive element is separated from the printed wiring board. 2. The photoelectric conversion device according to claim 1, wherein the capacitance element has a lead wire longer than a normal mounting length, and the lead wire is connected to the printed wiring board. Conversion circuit. 3. The photoelectric conversion circuit according to claim 1, further comprising a support mounted on the printed wiring board, wherein the capacitor is mounted on the support. Conversion device. 4. The photoelectric conversion device according to claim 3, wherein the support has elasticity. 5. The photoelectric conversion device according to claim 3, wherein the support has viscosity. 6. The photoelectric conversion device according to claim 3, wherein the support comprises silicon, rubber, a spring, styrene, or paper. 7. The photoelectric conversion device according to claim 1, further comprising a flexible substrate having at least one end connected to the printed wiring board, wherein the capacitance element is mounted on the flexible substrate. Conversion device. 8. The photoelectric conversion device according to claim 7, wherein another end of the flexible substrate is connected to the printed wiring board. 9. The photoelectric conversion device according to claim 7, further comprising a support placed on the printed wiring board, wherein another end of the flexible substrate is fixed to the support. Photoelectric conversion device. 10. The photoelectric conversion device according to claim 9, wherein the support has elasticity. 11. The photoelectric conversion device according to claim 9, wherein the support has viscosity. 12. The photoelectric conversion device according to claim 9, wherein the support comprises silicon, rubber, a spring, styrene, or paper. 13. The photoelectric conversion device according to claim 9, wherein the support comprises iron, a metal whose surface is rust-proof plated, a non-ferrous metal, an alloy thereof, or a hard plastic. . 14. An imaging apparatus comprising the photoelectric conversion device according to claim 1. Description: