JP2002184963A5 - - Google Patents
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- JP2002184963A5 JP2002184963A5 JP2000376236A JP2000376236A JP2002184963A5 JP 2002184963 A5 JP2002184963 A5 JP 2002184963A5 JP 2000376236 A JP2000376236 A JP 2000376236A JP 2000376236 A JP2000376236 A JP 2000376236A JP 2002184963 A5 JP2002184963 A5 JP 2002184963A5
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- JP
- Japan
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000376236A JP4668408B2 (en) | 2000-12-11 | 2000-12-11 | Method and apparatus for attaching a solid-state imaging device to a package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000376236A JP4668408B2 (en) | 2000-12-11 | 2000-12-11 | Method and apparatus for attaching a solid-state imaging device to a package |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002184963A JP2002184963A (en) | 2002-06-28 |
JP2002184963A5 true JP2002184963A5 (en) | 2007-08-09 |
JP4668408B2 JP4668408B2 (en) | 2011-04-13 |
Family
ID=18845128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000376236A Expired - Fee Related JP4668408B2 (en) | 2000-12-11 | 2000-12-11 | Method and apparatus for attaching a solid-state imaging device to a package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4668408B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005020464A (en) * | 2003-06-26 | 2005-01-20 | Kyocera Corp | Optical semiconductor device and its manufacturing method |
WO2007046175A1 (en) * | 2005-10-20 | 2007-04-26 | Nabtesco Corporation | Case, case assembly method, and optical fiber fixation device |
JP2010087833A (en) * | 2008-09-30 | 2010-04-15 | Fujinon Corp | Camera module |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3930087B2 (en) * | 1996-01-12 | 2007-06-13 | 株式会社東芝 | Lid mounting apparatus and solid-state imaging device manufacturing method |
JP3721714B2 (en) * | 1997-05-15 | 2005-11-30 | ソニー株式会社 | Package sealing method for solid-state imaging device |
JP3648721B2 (en) * | 1998-01-30 | 2005-05-18 | 松下電器産業株式会社 | Method for manufacturing solid-state imaging device |
JP4351750B2 (en) * | 1998-08-24 | 2009-10-28 | Okiセミコンダクタ株式会社 | Laser marking method and apparatus |
JP2000266938A (en) * | 1999-03-18 | 2000-09-29 | Alps Electric Co Ltd | Light irradiation device |
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2000
- 2000-12-11 JP JP2000376236A patent/JP4668408B2/en not_active Expired - Fee Related