JP2002184805A5 - - Google Patents

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Publication number
JP2002184805A5
JP2002184805A5 JP2000382222A JP2000382222A JP2002184805A5 JP 2002184805 A5 JP2002184805 A5 JP 2002184805A5 JP 2000382222 A JP2000382222 A JP 2000382222A JP 2000382222 A JP2000382222 A JP 2000382222A JP 2002184805 A5 JP2002184805 A5 JP 2002184805A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000382222A
Other languages
Japanese (ja)
Other versions
JP2002184805A (ja
JP4034932B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000382222A priority Critical patent/JP4034932B2/ja
Priority claimed from JP2000382222A external-priority patent/JP4034932B2/ja
Publication of JP2002184805A publication Critical patent/JP2002184805A/ja
Publication of JP2002184805A5 publication Critical patent/JP2002184805A5/ja
Application granted granted Critical
Publication of JP4034932B2 publication Critical patent/JP4034932B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000382222A 2000-12-15 2000-12-15 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法 Expired - Fee Related JP4034932B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000382222A JP4034932B2 (ja) 2000-12-15 2000-12-15 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000382222A JP4034932B2 (ja) 2000-12-15 2000-12-15 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法

Publications (3)

Publication Number Publication Date
JP2002184805A JP2002184805A (ja) 2002-06-28
JP2002184805A5 true JP2002184805A5 (cg-RX-API-DMAC10.html) 2006-10-12
JP4034932B2 JP4034932B2 (ja) 2008-01-16

Family

ID=18850087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000382222A Expired - Fee Related JP4034932B2 (ja) 2000-12-15 2000-12-15 半導体装置、ｌｅｄプリントヘッドおよびワイヤボンディング方法

Country Status (1)

Country Link
JP (1) JP4034932B2 (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4522079B2 (ja) * 2003-11-20 2010-08-11 イビデン株式会社 Ｉｃチップ実装用基板
KR101475314B1 (ko) * 2009-03-30 2014-12-23 엘지디스플레이 주식회사 엘이디 백라이트 유닛 및 이를 이용한 액정표시장치모듈
JP6196092B2 (ja) 2013-07-30 2017-09-13 ルネサスエレクトロニクス株式会社 半導体装置
KR102638304B1 (ko) 2016-08-02 2024-02-20 삼성디스플레이 주식회사 표시장치
JP7249302B2 (ja) * 2020-03-19 2023-03-30 株式会社東芝 半導体装置
WO2021187101A1 (ja) * 2020-03-19 2021-09-23 京セラ株式会社 発光素子アレイおよびこれを備える光プリントヘッドならびに画像形成装置

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