JP2002184752A - Method of manufacturing pattern form - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a pattern form by which a fine pattern form can be manufactured without using a photolithography method even in the case where a micro-contact printing is not appropriate. SOLUTION: The method of manufacturing the pattern form includes a step in which an agent for transforming the surface material of a substrate is attached to the surface material of the substrate in the shape of a pattern by the use of a pattern, so as to chemically transform the surface material of the substrate, thereby forming a pattern of a region chemically transformed on the surface material of the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a pattern formed body used for an electronic device, a bio device, an optical device, a sensor, and an electromagnetic wave shield.

[0002]

2. Description of the Related Art Hitherto, a pattern forming body requiring a fine pattern used for an electronic element or the like has been usually formed by a photolithography method.
However, since the photolithography method needs to perform many steps such as application, exposure, and development of a photoresist, there are cases where problems are involved in labor and cost.

[0003] In particular, a pattern for forming a conductive pattern on a non-conductive material such as glass or plastic.
Metallization is as follows: 1) A photoresist is applied to the entire surface of the substrate where the sputtered film or metal foil is formed, exposed through a photomask, developed, and then unnecessary metal parts are removed. 2) A photoresist is applied to a substrate, exposed through a photomask, developed, and then the substrate surface is modified / roughened with a treating agent, and then a catalyst is attached to the portion. A method of performing electroless plating, using electroplating if necessary, and finally removing the remaining resist has been used. Since these use a photoresist, the process is complicated, and a large amount of waste liquid is generated.

In recent years, a method using a photo-resolution catalyst has been proposed as a pattern metallizing method for a photoresist-less non-conductive substrate (for example, Japanese Patent Application Laid-Open No. 7-336018). ), It is difficult to establish the process compared to the conventional electroless plating, and it has not been put to practical use. In addition, this method also has a problem that an exposure step using a mask is indispensable, and a development step for removing an inactive catalyst in an unexposed portion is often required.

On the other hand, as a method of forming a fine pattern without using a photoresist method, a micro contact printing method has been proposed by George M. of Harvard University.
It is proposed by White Size (Jeorge M. Whitesides) (for example, U.S. Pat. Nos. 5,512,131, 5,900,160, JP-A-9-240125, JP-A-10-12545). This micro-contact printing method has attracted attention as a method capable of mass-producing relatively fine patterns with high productivity. This method is used to manufacture semiconductor products such as vacuum equipment and gas processing equipment, which are not suitable for investment in semiconductor equipment, in small lots, many kinds, and have short delivery times, as well as various functional devices in the bio / chemical field such as sensor chips and micro reactors. Promising as a method.

In the micro contact printing method, an elastomer represented by polydimethylsiloxane is used as a stamp, and an organic thiol represented by alkanethiol is absorbed by the stamp, and the stamp is applied to a metal surface represented by gold. After being in contact with the substrate for a predetermined time and then peeling off (contact printing), a self-assembled monolayer (hereinafter referred to as S) is formed on the substrate.
AM. ).

[0007] It is generally difficult to form a thiol SAM on a surface other than the gold surface. In addition, SAMs of silane compounds such as those known as silane coupling agents
Is required to have a surface having many hydroxyl groups such as glass and silicon oxide. In particular, since a silane compound reacts violently with moisture in the atmosphere, it is generally difficult to obtain a SAM with good reproducibility. Further, the SAM formed in a pattern by micro contact printing is used as a resist that can be formed without photolithography, but it is considered that it is difficult to eliminate point defects and the like to a practical level.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made in consideration of the above-described problems. It is a primary object of the present invention to provide a method for manufacturing a pattern formed body capable of manufacturing a formed body.

[0009]

In order to achieve the above-mentioned object, the present invention provides a method for chemically modifying a surface material of a substrate by using a plate as described in claim 1. Manufacturing a pattern-forming body, comprising a step of forming a pattern of a chemically modified region on the surface material of the base material by adhering a modifying agent for modifying the surface material to the surface material in a pattern. Provide a way.

As described above, according to the present invention, it is possible to form a region in which the surface is chemically modified in a pattern by attaching a modifying agent to the surface material of the substrate in a pattern using the plate. Therefore, it is possible to form a fine pattern in the chemically modified region without using a photolithography method or the like.

In this case, as described in claim 2, the modifying agent may be capable of chemically removing the surface material of the substrate. This is because, when a chemically modified pattern is formed, by using a pattern that is further chemically removed, the use of the obtained pattern formed body is expanded. Further, in the case where another functional material is brought into close contact with the pattern of the chemically modified region, the concave portion is formed in the chemically modified region, so that the function with the substrate is caused by the anchor effect or the like. This is because it becomes possible to adhere the conductive material with higher strength.

According to the first or second aspect of the present invention, as set forth in the third aspect, the surface material of the base material is an insulating material, and the chemical substance formed by the step is formed. The method may include a step of attaching a conductive material to the pattern of the region that has been denatured. By attaching a conductive material to the chemically modified region in this manner, a fine pattern of the conductive layer can be formed without using a photolithography method.

Further, in the invention described in claim 3, as described in claim 4, the step of attaching a conductive material to the pattern of the chemically modified region is performed by chemically modifying the pattern. The method may include a step of attaching a catalyst to the pattern of the formed region, and a step of subjecting the substrate, to which the catalyst has been attached in a pattern, to electroless plating. With such steps, it is possible to easily form a pattern of a conductive layer on a non-conductive substrate.

According to the present invention, in order to chemically remove the surface material of the substrate, the surface material of the substrate is removed using a printing plate. The present invention provides a method for producing a pattern-formed body, comprising a step of forming a pattern of a region chemically removed on a surface of a base material by applying an agent in a pattern.

In this manner, a pattern of a region which has been chemically removed can be formed on the surface of the base material. By attaching a functional material to the concave portions formed in a pattern, a functional material can be formed. The pattern formed body on which the pattern of the conductive material is formed can be easily formed without a photolithography step.

In the invention according to the fifth aspect, as described in the sixth aspect, the substrate is a substrate having a thin layer on its surface having a thickness removable by the removing agent, The removing agent may be a removing agent capable of chemically removing the material of the thin layer. If the substrate has a thin layer on the surface as described above, the thin layer is removed with a removing agent, and if the thin layer is a functional material, a pattern formed body having a thin layer pattern is formed. If the material is a functional material, it is possible to obtain a pattern formed body having a pattern of a base material masked in a pattern by a thin layer.

In the invention described in claim 6, as described in claim 7, the thin layer is a thin layer having conductivity and the base material is an insulating base material. be able to. In this case, the pattern of the conductive layer can be easily formed by removing the thin layer in a pattern.

In the invention according to any one of the first to seventh aspects, as described in the eighth aspect, the printing plate may be any one of a relief printing plate, a planographic printing plate, and a stencil printing plate. it can. In the present invention, it is possible to easily attach the above-mentioned modifier or remover to the surface of the substrate in a pattern by printing using a relief plate, planographic plate, and stencil plate used in general printing.

On the other hand, in the invention according to any one of the first to seventh aspects, as described in the ninth aspect, the modifying agent or the removing agent is provided on the plate surface of the plate. Is preferably formed of a material having a porous structure in which continuous pores are formed. If the above-mentioned modifier or remover adheres only to the plate surface of the plate as in a conventional printing method, the modification or removal of the substrate surface may not proceed sufficiently due to a quantitative problem. In this case, by using such a material having a porous structure in this portion, it becomes possible to sufficiently attach the denaturing agent or the removing agent to the portion of the substrate to be modified or removed. The above denaturation or removal can be sufficiently advanced.

In the ninth aspect of the present invention, as described in the tenth aspect, it is preferable that the attachment surface is a convex surface. The reason for this is that by making the attachment surface having a porous structure convex, the ink can be attached to the substrate with high accuracy.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION The method for producing a pattern-formed body according to the present invention comprises a first embodiment in which a surface-formed material of a substrate is modified into a pattern to produce a pattern-formed body; It can be divided into a second embodiment in which a pattern-formed body is manufactured by removing the pattern-formed body. Hereinafter, each embodiment will be described.

1. First Embodiment A first embodiment of the method for producing a pattern-formed body of the present invention comprises:
In order to chemically modify the surface material of the base material, a modifying agent for modifying the surface material is attached to the surface material of the base material in a pattern using a plate, and the surface material of the base material is chemically modified. And forming a pattern in the region.

As described above, in the present embodiment, the modifying agent is adhered to the surface of the substrate in a pattern using the plate, whereby the pattern of the chemically modified region is formed on the surface of the substrate. Therefore, a pattern of a chemically modified region can be formed on the substrate surface without using a photolithography method. Various useful functional elements can be obtained by attaching a functional material to the chemically modified region or the region that is not chemically modified.

For example, a chemical modification for attaching a catalyst for electroless plating to the surface material of the base material, that is, a modified region which is modified by hydrolysis or oxidative decomposition is formed in a pattern. A catalyst for electroless plating can be attached to the substrate. By performing electroless plating on the substrate on which the catalyst has been attached in a pattern, a substrate having a plating layer attached in a pattern can be obtained.

The pattern-formed body of the present invention is used as a conductive pattern-formed body in which a conductive layer is formed as a functional material by forming a plating layer in a pattern as described above. There is, for example)
Polyethylene glycol, lipid (bimolecular) membrane, poly (2
-Methacryloyloxyethyl phosphorylcholine), poly n-isopropylacrylamide, copolymers containing these monomer units as one component, polypeptides, DN
A biocompatible material such as A, a microfluidic device such as a microcolumn in which a biocompatible material having a cross-linking property is attached thereto in a pattern, a bio-microelectromechanical system (bio MEMS),
Applications such as biochips, biosensors, and cell culture media (hereinafter, may be referred to as use 2) can be given.

Further, other applications include polyacrylic acid, poly4-styrenesulfonic acid, polyallylamine,
Polymer electrolytes such as polydiallyldimethylammonium chloride, ionic polymer copolymers containing these monomer units, polyion complexes using these polymers, and nonionic water-soluble polymers such as poly n-isopropylacrylamide And a use such as a microfluidic device such as a microcolumn in which a copolymer containing the monomer unit as one component is adhered in a pattern (hereinafter, may be referred to as use 3), silica, titania, and alumina. (Hereinafter, may be referred to as use 4) as an optical element having an oxide or the like adhered in a pattern.

The substrate used in the present invention is not particularly limited as long as the material of the surface can be chemically modified by a modifying agent. That is, various materials can be used depending on the type of the functional element.

For example, as described above, the conductive pattern formed body in which the plating layer is formed in a pattern on the surface of the base material by electroless plating, that is, the base material used in the case of use 1 is insulative. Materials which need to be modified by hydrolysis or oxidative degradation by a modifier are used. Specifically, polyimides, polyesters, polyamides, polyurethanes, celluloses, poly (meth) acrylates and the like are suitably used.

Further, the base material used in the above-mentioned applications 2 and 3 requires workability, especially various moldability, and transparency is particularly required in optical detection applications. Specific examples of the substrate used in such applications include polyesters, polycarbonates,
Examples include celluloses, poly (meth) acrylates, and the like.

Further, when the above-mentioned use 4 is used as an optical element, workability, especially various moldability and transparency are required. Specific materials that can be used as the base material include polyesters and polycarbonates. , Alicyclic polyolefins, poly (meth) acrylates, and the like.

The substrate used in the present invention does not need to be a single substance, and may have a surface layer made of another substance formed on the substrate. The surface material of the base material refers to a material on the surface of such a base material. If the base material is formed of a plurality of layers, the material forming the surface layer is the surface of the base material. It is equivalent to a material.

In the present invention, the surface material of such a substrate is chemically modified. The chemical modification is mainly performed by a modification treatment for attaching a functional material to the modified portion in the next step. Or a denaturation treatment for preventing a functional material from adhering. That is, when the functional material is chemically modified so as to adhere, by attaching the functional material to the modified site in the next step,
If the functional material is chemically modified so that it does not adhere, the functional material is attached to the unmodified portion in the next step, so that the functional material adheres to the substrate in a pattern. This is for producing a conductive element.

Specifically, in the above-mentioned application 1, for example, a hydrolysis treatment or an oxidative decomposition treatment for attaching a catalyst for electroless plating is performed. Further, in the above-mentioned application 2, in order to attach a biocompatible material as a functional material, hydrolysis modification and oxidation (decomposition) modification (providing hydrophilicity and adsorptivity) are performed. Further, in the above-mentioned application 3, in order to attach a polymer electrolyte, an ionic polymer, and a polyion complex as functional materials, hydrolysis modification and oxidation (decomposition) modification (providing hydrophilicity and adsorptivity) are performed. . In the above-mentioned use 4, hydrolysis modification and oxidation (decomposition) modification (contribution of hydrophilicity and adsorptivity) are performed in order to attach the various oxides described above as functional materials.

In the present invention, such a chemical modification is carried out by using a plate to attach a modifying agent to the surface material of the substrate in a pattern. Various modifiers can be used here depending on the type of modification. Specifically, examples of the modifier used when the chemical modification is hydrolysis modification include alkaline substances such as sodium hydroxide, potassium hydroxide, ammonia, and amines, and solutions thereof. Further, as the modifier used when the chemical modification is hydrolysis modification and oxidation (decomposition) modification,
Examples thereof include acidic substances such as organic acids such as hydrochloric acid, sulfuric acid, chromium mixed acid, and acetic acid, and solutions thereof.

The present invention employs a method using a plate as a method for attaching the above modifier in a pattern on the surface material of the substrate. Here, the method using a plate refers to a printing method using a plate used for a normal printing method or the like, and the present invention is applicable to any printing method as long as the printing method uses such a plate. Can be used. Specific examples include a relief printing method using a relief printing plate, a lithographic printing method using a lithographic printing plate, and a stencil printing method using a stencil printing plate.
The method of transferring the base material to the surface material may be direct printing or offset, and the pressing method may be any of a flat pressure type, a circular pressure type, and a rotary type. Can be.

In the present invention, it is particularly preferable to use a relief printing plate. Among the printing methods using this relief printing plate, it is particularly preferable to use a direct pressure printing method with a flat pressure type as the pressing method.

The material of the plate used in the present invention is not particularly limited as long as it is chemically stable at least with respect to the modifying agent. The material may be a material to be transferred, or a material in which the plate absorbs the denaturant and adheres it to the substrate.

As a material of a plate for attaching a modifier to the surface of the plate and transferring the modified agent to a substrate, a material of the plate used for general printing, that is, a metal or a polymer substance is appropriately selected according to the application. It is used. In the case of such a plate, when the modifier is water-based, it is effective to make the plate surface hydrophilic by a method such as ozone oxidation.

On the other hand, examples of the material that allows the plate to absorb the modifier and adhere it to the substrate include elastomers and gels. Preferred elastomer materials include:
Examples of the silicone resin-based elastomer generally used in micro contact printing and a preferable gel material include a hydrophilic gel and a lipophilic gel cross-linked by a chemical bond. Examples of plates using such elastomers and gels as materials are Laurent Libioulle et al.
Langmuir, Vol. 15, pp. 300-304 (1999) and Brett D. Marti
n et al., Langmuir, vol. 14, pages 3971-3975 (1998).

As described above, the present invention is characterized in that the surface material of the substrate is directly chemically modified to be modified. However, in the method using a general plate as described above, since the modifier is supplied only in an amount attached to the plate surface, the modification may not proceed sufficiently depending on the type of chemical modification. From this viewpoint, in the present invention, on the plate surface of the plate to be used, the adhesion surface for adhering the modifying agent to the surface material of the substrate is formed of a material having a porous structure in which continuous pores are formed. It is preferable to use a plate. That is, it is preferable to use a porous plate having a porous structure formed on the plate surface according to a pattern in which the modifier is attached to the surface material of the substrate.

The shape of such a porous plate is not particularly limited as long as the adhering surface for adhering the modifier to the surface material of the substrate has a porous structure as described above. It is preferable to use a plate in which the attachment surface is a convex surface.

Such a porous plate will be described with reference to the drawings. FIG. 1 shows an example of the porous plate of the present invention. In this example, the porous structure 3 is arranged on the portion of the attachment surface 2 of the porous plate 1. The porous structure 3 is formed only on the plate surface side without penetrating the porous plate 1. In the case of a porous plate having a structure as shown in this example, it is necessary that the denaturing agent has previously penetrated into the porous structure 3.
That is, the denaturant is brought into contact with the adhesion surface 2 in advance,
The denaturing agent is made to penetrate into the porous structure 3 by a capillary phenomenon or the like, and is attached to the surface material of the base material.

In the example shown in FIG. 2, the porous structure 3 of the porous plate 1 is arranged so as to penetrate the porous plate 1.
In this case, it is possible to infiltrate the denaturing agent in advance as described above. However, as schematically shown in FIG. The supply means 5 may be provided so that the modifier 4 is continuously supplied to the porous structure 3 from the back side. By doing so, it becomes possible to supply a large amount of the modifying agent to the adhesion surface.

FIG. 3 shows a further different example of the porous plate 1. In this example, the attachment surface 2 is formed so as to be convex. Further, in this example, the entire porous plate 1 has a porous structure 3, and the convex side surface 6 and the concave surface 7 except the adhesion surface on the plate side have the porous structure 3 so that the denaturant does not leak to the surface. A sealing layer 8 is formed so as to close the holes. Also in this example, the denaturing agent may be previously infiltrated into the porous structure 3 or a denaturing agent supply means as shown in FIG. 2 may be provided.

FIG. 4 shows an example in which the attachment surface 2 is a convex surface as in FIG. 3 and the entire porous plate 1 has a porous structure 3. In FIG. This is an example in which the sealing layer 8 is not formed. Even when the entire porous plate 1 has a porous structure, FIG.
When a convex surface is provided as shown in (1), the sealing layer is not indispensable. Whether or not to form a sealing layer is determined by the definition required for the pattern, the cost, the type of the porous structure, and the like.

The porous plate of the present invention only needs to have an adhered surface formed of a material having a porous structure.
As shown in FIG. 2, only the portion of the attachment surface of the porous plate may have a porous structure, as shown in FIG. 2, a porous structure may be provided so as to penetrate the porous plate, and FIGS. As shown in FIG. 4, the entire porous plate may have a porous structure. In the case where the entire porous plate has a porous structure, as shown in FIG. 3, a treatment for preventing the denaturant from leaking out of the portion other than the adhered surface is performed to form a higher definition pattern. Becomes possible. Such an arrangement of the porous structure may be any arrangement with or without a convex surface, for example, a structure without a convex surface as shown in FIG. 1 or FIG. However, it is also possible to make the entire porous plate have a porous structure, and even if the structure has a convex surface as shown in FIG. 3 or FIG. 4, it is also possible to make only the attachment surface a porous structure.

Examples of the porous structure in the present invention include a porous body having fine continuous pores therein and fibers.

Among them, the porous body is preferably one in which a large number of pores are continuously formed three-dimensionally, and the pore diameter is larger than the particle diameter when the modifier to be used contains particles. Must be something. When the modifier does not contain a particle component, the pattern can be finer as the pore size of the porous structure is smaller. In general, the movement of the liquid substance in the porous structure, when the pore size is larger than 50 nm,
Viscous flow and molecular diffu
In the case where the pore diameter is 2 nm or more and 50 nm or less, surface diffusion and capillary transport are dominant, and the pore diameter is 2n.
If it is less than m, activated transport is said to be dominant. In consideration of this point, the pore size desirable in the present invention is at least 2 nm or more, preferably in the range of 5 nm to 50 μm, particularly 10 μm.
Preferably, it is in the range of nm to 5 μm.

Specific examples of such a porous body include a sponge-like foam and a porous body using a fine particle assembly as a template. Is applicable.

Further, as shown in a porous structure 3 ′ shown in FIG. 2, for example, this porous body has a large number of through holes with extremely small diameters formed from the back side to the plate side, and fine cracks. May have many gaps extending from the back side to the plate side. Specific examples include an anodized body (porous alumina).

The porous structure used in the present invention may use fibers other than the above-mentioned porous body. In this case, a fiber in which each fiber is densely arranged is preferably used.

Materials used for the porous structure composed of the above-mentioned porous body or fiber include metals such as aluminum, metal oxides such as silica, titania and alumina, vulcanized rubber, and polysilanes. And polymers such as polydimethylsiloxane, polyurethane, polystyrene, and poly (meth) acrylate.

When the porous plate used in the present invention has a convex surface as shown in FIG. 3, the convex surface may be formed by a method using a mold such as a mold, an engraving method, a laser drawing method, or the like. A drawing method, an exposure / development method, a dry or wet etching method, or the like can be preferably used.

As described above, the pattern formed body obtained by the method of manufacturing a pattern formed body of the present invention can be made into various functional elements by attaching various functional materials on the pattern. However, in the present invention, it is preferable to use the method for producing a functional element having a conductive pattern obtained by forming a conductive layer on the formed pattern, particularly because of its wide range of use. It can be said that.

The functional element having such a conductive pattern can be specifically used for a printed wiring board, an electrode plate for a display, an electrode plate for a sensor, and the like.

In order to manufacture such a conductive pattern formed body, first, the above-mentioned insulating material is used as a surface material of the base material. Then, after the step of forming a pattern of the chemically modified region, a step of attaching a conductive layer to the chemically modified region to form a conductive pattern is performed.

The chemical modification method for producing such a conductive pattern-formed body differs depending on the method of attaching the conductive layer. Examples of a method for attaching such a conductive layer include a method using electroless plating as described above, a method using direct plating, and a method for transferring a metal foil. As a chemical modification method used in each of these methods, when a conductive layer is attached by electroless plating, as described above, hydrolysis is performed on the surface material of the substrate to attach a catalyst for electroless plating. Treatment or oxidative decomposition treatment. In the case of direct plating, the surface material of the substrate is subjected to a hydrolysis treatment or an oxidative decomposition treatment in order to attach a metal nucleus such as palladium or palladium / tin. Also,
In the case of the metal foil transfer method, a method in which the surface material is plasticized by hydrolysis treatment or oxidative decomposition treatment to develop tackiness and, if necessary, subjected to a secondary treatment such as heat treatment to transfer the metal foil. Used.

In the present invention, a method using electroless plating is particularly preferable. In the case of the method by electroless plating, for example, only a desired portion of the substrate surface can be chemically modified by using a substrate surface treatment agent used in conventional electroless plating as a modifier. Thereby, when the catalyst is attached, the catalyst is attached only to the modified portion, and in the subsequent electroless plating step, only the portion where the catalyst is attached is metallized. Therefore, as a result, a metal pattern can be formed on a non-conductive substrate without using a photoresist and without an exposure step. As described above, the modifier used is generally one that hydrolyzes or denaturates the substrate. As the surface material of the insulating base material that can be used, in addition to the above-mentioned materials, engineering plastics such as epoxy resin and ABS resin can be used. The surface material of the material can be chemically modified.

It is to be noted that such a method using electroless plating is naturally preferably carried out by the method using a porous plate as described above. In this case, a catalyst solution and a plating solution are used as agents for filling the porous plate. By using this, the entire process can be performed by a printing method using a porous plate.

After the conductive layer is formed in a pattern by electroless plating in this way, electrolytic plating may be used in combination to further increase the thickness of the conductive layer.

[0061] 2. Second Embodiment In a second embodiment of the pattern forming body of the present invention, in order to chemically remove the surface material of the substrate, a removing agent for removing the surface material is added to the surface material of the substrate using a plate. The method is characterized in that the method includes a step of forming a pattern of a region which is chemically removed on the surface material of the base material by being attached in a pattern.

As described above, in the present embodiment, the removing agent is adhered to the surface of the base material in a pattern using the printing plate, thereby forming a pattern of the region where the surface of the base material is chemically removed. Therefore, it is possible to form a pattern in a region where the substrate surface is chemically removed without using a photolithography method. By attaching a functional material to this chemically removed region, various useful functional elements can be obtained.

In the present embodiment, even if the base material is formed of a single material, it can be removed by the above-mentioned removing agent as a surface material of the base material, and the removable film thickness May be a substrate having a thin layer. When the base material is formed of a single material, a functional element can be obtained by attaching a functional material to the chemically removed region as described above. When the surface material of the base material is a thin layer that can be removed by the removing agent, the thin layer itself may be a functional material, or the base material itself under the thin layer may be a functional material. By doing so, the pattern forming body itself in which a thin layer is simply removed in a pattern by a removing agent may become a functional element.

Specifically, when the substrate is formed of a single material, it can be used for a microfluidic device, a bio MEMS, etc., and a functional material which can be used in this case. Examples thereof include glass and quartz.

Further, when a substrate having a thin layer that can be removed by a removing agent is used as a surface material of the substrate, for example, ITO (indium tin oxidized) is applied on a transparent substrate.
e) When the film is formed, the ITO film is removed in a pattern using an acidic etchant, so that the IT
Examples of the application include obtaining a transparent substrate on which an O film pattern is formed, and using copper, silver, and gold as a thin layer to form an electrode.

The substrate used in the present invention is not particularly limited as long as it is formed of a material which can be chemically removed with a removing agent. In addition, as described above, when the base material has a thin layer as a surface material, the thin layer, that is, only the surface material of the base material is formed of a material that is removed by the removing agent, and the base material below the base material itself is removed. It is preferably formed of a material that is not chemically removed by the agent.

The removing agent used in this embodiment and the surface material of the substrate to be removed by the removing agent are not particularly limited as long as they are useful and can be used as a functional element thereafter. More specifically, as described above, a combination of using a surface material of a base material, that is, using ITO as a thin layer and using an acidic etching solution as a remover,
Combinations (for display electrodes) using copper, silver, gold, or the like as the thin layer and using a commercially available remover used in the field of plating can be given.

The difference between the second embodiment and the above-described first embodiment is that a removing agent is used in place of the modifying agent, and that the surface material of the substrate can be removed by the removing agent. Is a point. Therefore, since the first embodiment and the second embodiment are similar except for these points,
With respect to other configurations, the method described in the first embodiment described above, for example, in that a porous plate can be used, and the like, can be used as it is in the second embodiment. Therefore, the description thereof is omitted here.

3. Third Embodiment (Combination of First and Second Embodiments) In the present invention, an agent capable of removing a surface material of a substrate (hereinafter, referred to as a denaturing remover) is used. This also provides a method for producing a pattern-formed body having a pattern in which the surface material of the substrate is chemically modified and chemically removed at the same time.

Since such a pattern-formed body has a pattern that has been chemically modified and removed, it is easy to attach a functional material to the pattern, and high adhesion is achieved by an anchor effect or the like. The functional material can be attached to the pattern while having it.

As a specific example, in the method of forming a pattern of a conductive layer by the above-described electroless plating, by using a denaturing and removing agent capable of chemically modifying and removing the surface material of the base material, By attaching a biomaterial such as a protein or cell to a surface with irregularities and a biocompatible material attached to a substrate, for example, a conductive layer with higher adhesion can be obtained by electroless plating. Examples in which the decrease in the activity of the biomaterial is suppressed can be given.

Examples of the combination of the denaturing remover and the surface material of the substrate used in the present embodiment include a commercially available surface treatment agent for electroless plating and the insulating substrate described in the first embodiment. And a combination with
Such a surface treatment agent for electroless plating is exemplified as a modifying agent in the first embodiment, but may be used as a modifying and removing agent by increasing the treatment time.

The difference between the third embodiment and the first embodiment is that a denaturing agent is used instead of the denaturing agent, and that the surface material of the base material is denatured and removed by the denaturing agent. It is a point to gain. Therefore, since the first embodiment and the second embodiment are the same except for these points, for the other configuration, for example, the porous plate is used, such as the method described in the first embodiment. For example, it can be used in the second embodiment as it is. Therefore, the description thereof is omitted here.

4. Example of Manufacturing Procedure of Pattern Forming Body Hereinafter, an example of the manufacturing procedure of the pattern forming body of the present invention will be briefly described with reference to the drawings. FIG. 5 shows an example of the first embodiment of the method for producing a pattern forming body of the present invention. First, as shown in FIG. 5 (a), a porous plate 1 as described in FIG. 3 is prepared and impregnated with a modifier. The impregnating method may be a method in which a modifier is infiltrated in advance from the attachment surface 2 side of the porous plate 1 or a method in which the modifier is continuously supplied from the back surface side of the porous plate 1.

Next, as shown in FIG. 5B, the porous plate 1 is brought into close contact with the substrate 8. At this time, the modifier is brought into contact with the surface material of the substrate 8 on the adhesion surface 2 to perform chemical modification. Then, as shown in FIG. 5C, a pattern of the chemically modified region 9 is formed on the surface material of the base material 8. The chemical modification may be performed while the porous plate 1 and the substrate 8 are being adhered, or a modifying agent from the porous plate 1 may be adhered to the substrate 8 beforehand. Chemical modification may be performed even after the porous plate 1 and the substrate 8 are separated. However, in consideration of accuracy, it is preferable that the porous plate 1 and the substrate 8 are brought into contact with each other and the chemical modification is completed during the contact.

The substrate 8 on which the chemically modified region 9 is formed is washed as necessary, and a necessary functional material 10 is adhered on the chemically modified region 9. Thereby, a pattern formed body which is a functional element having the functional material 10 in a pattern on the substrate 8 can be obtained.

FIG. 6 shows an example of the second embodiment of the method of manufacturing a pattern-formed body according to the present invention. First, as shown in FIG. 6 (a), a porous plate 1 as described in FIG. 1 is prepared, and a removing agent is infiltrated into the porous structure 3 in advance.

Next, as shown in FIG. 6B, the base material 8 having the thin layer 11 as the surface material is attached to the adhesion surface 2 of the porous plate 1.
Are brought into close contact with the thin layer 11. By such close contact, the thin layer 11 is removed by the removing agent, and a pattern formed body in which the thin layer 11 is formed in a pattern can be obtained (FIG. 6C). As described above, the method of removing the thin layer 11 is not limited only to the time when the porous plate 1 and the substrate 8 are in close contact with each other.

By washing the pattern formed body thus obtained, if the thin layer 11 is a functional material,
A pattern formed body, which is a functional element in which a functional material is formed in a pattern, can be obtained. Alternatively, a functional element may be formed by attaching another functional material to the concave portion from which the thin layer 11 has been removed.

In the example shown in FIG. 6, the thin layer 1 is used as the surface material.
Although the base material 8 having 1 is used, as described above, in the second embodiment, the base material may be formed of a single material, and thus the base material may be formed of a single material. When the functional element is formed, a functional element in which the functional material is formed in a pattern on the base material can be obtained by attaching the functional material to the concave portion obtained by the method described above.

The present invention is not limited to the above embodiment. The above embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and has the same effect. Within the technical scope of

[0082]

EXAMPLES Hereinafter, the method for producing a pattern-formed body of the present invention will be described more specifically with reference to examples.

[Example 1] (Formation of porous plate) A commercially available foam (manufactured by Sekisui Chemical Co., Ltd.)
Using a trade name: Formac # 1005), a porous plate having a convex surface was formed by an engraving method.

(Modification of Substrate Surface Material by Modifier) A commercially available triacetyl cellulose (TAC) film (manufactured by Fuji Photo Film, trade name: TD80U) was used as a substrate. This substrate was placed on a hot plate at 60 ° C., and the porous plate impregnated with a 2N aqueous potassium hydroxide solution as a modifier was placed on the substrate, and a mark of 12 g · cm ⁻² was placed. Treated with pressure for 2 minutes. Thereafter, the printing pressure was removed, and the TAC film as the substrate after the treatment was sufficiently washed with ion-exchanged water. As a result, a substrate was obtained in which only the portion treated with the modifying agent was hydrolyzed.

(Electroless Plating) 5% S-10X (trade name) and 5% A-10X which are catalyzing agents manufactured by Uemura Kogyo Co., Ltd.
(Trade name) was used. First, the TAC film was immersed in 5% S-10X after surface treatment for 3 minutes, and then washed with ion-exchanged water. The film was then placed in 5% A-10X for 3
Then, the substrate was washed with ion-exchanged water to obtain a substrate (catalyzed film) having a catalyst adhered to the pattern of the region modified with the above-mentioned modifier. This catalyzed film was
Electroless nickel plating solution NPR-4 manufactured by Uemura Kogyo Co., Ltd.
When immersed in (trade name), a nickel film having a metallic luster was formed only on the pattern hydrolyzed with a modifier. After plating, there was a blackish stain on a part of the substrate surface, but the stain could be easily and completely wiped off with a wiper. By wiping the dirt in this way, the nickel film formed in a pattern was not peeled off. No peeling of this nickel film by a tape peeling test was observed.

[Example 2] (Preparation of porous plate) A porous plate having a convex surface was formed by laser plate making using porous polyvinyl chloride for penetrating printing manufactured by Bando Kagaku.

(Modification of Surface Material of Substrate by Modifier) The surface of the substrate was modified in the same manner as in Example 1 by using a polyimide film as a substrate and an alkali roughening chemical manufactured by Ebara Ujilite as a modifier. It was chemically modified in a pattern.

(Electroless Plating) The composition of the electroless copper plating bath is described in a paper by Naofune et al. (Surface Technology, Vol. 49, No. 12, 136).
0-1361, 1998). Bath temperature 5
When electroless copper plating was performed at 5 ° C. for 30 minutes, copper was deposited only on the portion of the base material where the surface material was modified. Although some background dirt was observed, the copper could be easily wiped off without damaging the deposited copper. No peeling was observed in the copper tape peeling test.

Example 3 Using a transparent conductive film having an ITO film formed on the entire surface as a base material, and using an acidic etching solution as a remover, the chemical reaction with the remover was performed for 5 minutes in the same manner as in Example 1. Elimination treatment was performed. After the treatment, the plate was thoroughly washed with water to obtain a transparent conductive film in which ITO was etched only in a portion corresponding to the surface to which the plate was attached. There was no change in the surface resistance of ITO before and after the chemical removal treatment.

[0090]

According to the method for producing a pattern-formed body of the present invention, a modifying agent or a removing agent is adhered to a surface material of a substrate in a pattern using a plate, and the surface is chemically formed in a pattern. Since it is possible to form a modified region or a chemically removed region, it is possible to form a fine pattern of a chemically modified region or a chemically removed region without using a photolithography method or the like. It is possible. Then, by attaching a functional material on this fine pattern, a useful functional element can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing one example of a porous plate used in the method for producing a pattern-formed body of the present invention.

FIG. 2 is a schematic sectional view showing another example of a porous plate used in the method for producing a pattern-formed body of the present invention.

FIG. 3 is a schematic cross-sectional view showing another example of a porous plate used in the method for producing a pattern forming body of the present invention.

FIG. 4 is a schematic sectional view showing another example of a porous plate used in the method for producing a pattern-formed body of the present invention.

FIG. 5 is a process chart for explaining an example of a method for manufacturing a pattern forming body of the present invention.

FIG. 6 is a process chart for explaining another example of the method for manufacturing a pattern forming body of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Porous plate 2 ... Adhesion surface 3 ... Porous structure 8 ... Base material 11 ... Thin layer

Claims (10)

[Claims] In order to chemically modify the surface material of a substrate, a modifying agent for modifying the surface material is attached to the surface material of the substrate in a pattern using a plate, and the surface material of the substrate is applied to the surface material of the substrate. A method for producing a pattern-formed body, comprising a step of forming a pattern of a chemically modified region. 2. The method according to claim 1, wherein the modifying agent is capable of chemically removing a surface material of the substrate.
A method for producing the pattern-formed body according to the above. 3. The method according to claim 2, wherein the surface material of the base material is an insulating material, and the method further comprises a step of attaching a conductive material to the pattern of the chemically modified region formed by the step. A method for manufacturing the pattern forming body according to claim 1. 4. The step of adhering a conductive material to the pattern of the chemically modified region includes the step of attaching a catalyst to the pattern of the chemically modified region, and the step of attaching a catalyst to the pattern of the chemically modified region. And subjecting the material to electroless plating. 5. In order to chemically remove the surface material of the substrate, a removing agent for removing the surface material is adhered to the surface material of the substrate in a pattern using a plate, and the surface of the substrate is chemically removed. Forming a pattern of a region that has been removed. 6. The substrate according to claim 1, wherein said substrate has a thin layer on its surface having a thickness capable of being removed by said removing agent, and said removing agent is capable of chemically removing a material of said thin layer. The method for producing a pattern-formed body according to claim 5, which is an agent. 7. The thin layer is a conductive thin layer,
The method according to claim 6, wherein the substrate is an insulating substrate. 8. The method according to claim 1, wherein the printing plate is any one of a relief printing plate, a planographic printing plate, and a stencil printing plate. 9. The method according to claim 9, wherein an adhering surface for adhering the modifying agent or the removing agent to a surface material of the substrate is formed of a material having a porous structure in which continuous pores are formed. A method for manufacturing a pattern-formed body according to any one of claims 1 to 7, wherein: 10. The method according to claim 9, wherein the attachment surface is a convex surface.