JP2002172550A - Polishing device, polishing method and workpiece obtained with use of the device or method - Google Patents

Polishing device, polishing method and workpiece obtained with use of the device or method

Info

Publication number
JP2002172550A
JP2002172550A JP2000371588A JP2000371588A JP2002172550A JP 2002172550 A JP2002172550 A JP 2002172550A JP 2000371588 A JP2000371588 A JP 2000371588A JP 2000371588 A JP2000371588 A JP 2000371588A JP 2002172550 A JP2002172550 A JP 2002172550A
Authority
JP
Japan
Prior art keywords
polishing
workpiece
contact area
cloth
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000371588A
Other languages
Japanese (ja)
Inventor
Kengo Yasui
健吾 安井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2000371588A priority Critical patent/JP2002172550A/en
Publication of JP2002172550A publication Critical patent/JP2002172550A/en
Pending legal-status Critical Current

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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent deformation such as waviness of a workpiece surface when, for example, polishing such a workpiece with a complicated surface form as an aspheric lens. SOLUTION: A polishing tool 50 has, in the internal space of an elastic body 52, contact detectors 61 for detecting whether a workpiece surface is in contact with fine sectional portions of the surface of abrasive cloth 53, to which the detectors are fixed, or not, and actuators 63 capable of moving pistons 63a axially to bring the fine sectional portions in or out of contact with the workpiece surface. A contact area calculator calculates a contact area between the workpiece surface and the abrasive cloth 53 from information from the contact detectors 61. A controller moves the polishing tool 50 while the abrasive cloth 53 is in contact with the workpiece surface with substantially constant force, and at the same time, operates the actuators 63 to keep the contact area between the workpiece surface and the abrasive cloth 53 substantially equal to a preset reference area from information from the contact area calculator and the like.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、レンズ、特に非球
面レンズを研磨対象とする研磨装置、研磨方法等に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus and a polishing method for polishing a lens, particularly an aspherical lens.

【0002】[0002]

【従来の技術】レンズ等を研磨対象とする研磨装置は、
従来、研磨対象たる工作物を保持する工作物保持部と、
支持部材に取り付けられた弾性体に研磨布紙を覆設して
なる研磨工具とを有して構成され、工作物の表面と研磨
布紙とをほぼ一定の力で接触させた状態で、工作物保持
部と研磨工具とを相対回転させつつ、これらを予め定め
た行路で相対移動させて、精研削で得られた形状精度を
崩す(損なう)ことなく工作物表面を一様に鏡面化(研
磨)するようになっている。
2. Description of the Related Art A polishing apparatus for polishing a lens or the like is a type of polishing apparatus.
Conventionally, a workpiece holding unit that holds a workpiece to be polished,
A polishing tool comprising an elastic body attached to the support member and a polishing cloth covered with the polishing cloth, wherein the surface of the workpiece and the polishing cloth are brought into contact with substantially constant force, and While relatively rotating the workpiece holder and the polishing tool, they are relatively moved along a predetermined path to uniformly mirror-finish the workpiece surface without destroying (damaging) the shape accuracy obtained by precision grinding ( It is adapted to polish).

【0003】[0003]

【発明が解決しようとする課題】しかしながら、このよ
うな研磨装置においては、工作物の表面と研磨布紙とを
ほぼ一定の力で接触させているため、両者の接触面積が
変化する場合には接触圧力が変化することとなり、工作
物の表面にはうねり(リップル)等の形状崩れが生じる
場合があった。そして、このような形状崩れの問題は、
研磨対象たる工作物が非球面レンズである場合のよう
に、工作物保持部と研磨工具を相対移動させる行路が複
雑である場合には特に顕著であった。
However, in such a polishing apparatus, the surface of the workpiece and the polishing cloth are brought into contact with a substantially constant force. As a result, the contact pressure changes, and the surface of the workpiece may lose its shape, such as undulation (ripple). And the problem of such shape collapse,
This is particularly remarkable when the path for relatively moving the workpiece holder and the polishing tool is complicated, such as when the workpiece to be polished is an aspherical lens.

【0004】本発明はこのような問題に鑑みてなされた
ものであり、非球面レンズのように表面形状が複雑な工
作物を研磨する場合等において、工作物の表面にうねり
等の形状崩れが生じることを防止して一様研磨性を高く
し、精研削形状精度を高精度に維持した工作物を得るこ
とが可能な構成の研磨装置、研磨方法等を提供すること
を目的としている。
The present invention has been made in view of such a problem, and when a workpiece having a complicated surface shape such as an aspherical lens is polished, the surface of the workpiece is not deformed due to undulation or the like. It is an object of the present invention to provide a polishing apparatus, a polishing method, and the like having a configuration capable of preventing the occurrence of such a problem, improving uniform polishing properties, and obtaining a workpiece in which precision grinding shape precision is maintained with high precision.

【0005】[0005]

【課題を解決するための手段】このような目的を達成す
るため、第1の本発明に係る研磨装置は、研磨対象たる
工作物を保持する工作物保持部(例えば、実施形態にお
ける回転テーブル40)と、支持部材に取り付けられた
弾性体に研磨布紙(例えば、実施形態における研磨布5
3)を覆設してなる研磨工具とを有し、工作物の表面と
研磨布紙とをほぼ一定の力で接触させた状態で、工作物
保持部と研磨工具とを相対移動させて工作物表面の研磨
を行う研磨装置において、工作物表面と研磨布紙との接
触面積を検出する接触面積検出手段(例えば、実施形態
における接触検出器61,61,…及び接触面積算出器
62)と、工作物表面と研磨布紙との接触面積を変化さ
せる接触面積可変手段(例えば、実施形態におけるアク
チュエータ63,63,…)と、工作物表面の研磨の
際、接触面積検出手段からの検出情報に基づいて、工作
物表面と研磨布紙との接触面積が常時ほぼ一定になるよ
うに接触面積可変手段を作動させる制御を行う制御手段
(例えば、実施形態における制御装置70)とを備え
る。
In order to achieve the above object, a polishing apparatus according to a first aspect of the present invention comprises a workpiece holding unit (for example, a rotary table 40 in the embodiment) for holding a workpiece to be polished. ) And polishing cloth (for example, polishing cloth 5 in the embodiment) on the elastic body attached to the support member.
A polishing tool overlying 3), wherein the workpiece holding portion and the polishing tool are relatively moved while the surface of the workpiece and the polishing cloth are in contact with substantially constant force. in the polishing apparatus which performs polishing of the object surface, the contact area detecting means for detecting a contact area between the coated abrasive and the workpiece surface (e.g., the contact detector 61 in the embodiment, ... and the contact area calculator 62) , the contact area changing means for changing the contact area between the coated abrasive and the workpiece surface (e.g., an actuator 63 in the embodiment, ...) and, during polishing of a workpiece surface, the detection information from the contact area detector And control means (for example, the control device 70 in the embodiment) for controlling the operation of the contact area varying means so that the contact area between the workpiece surface and the polishing cloth is always substantially constant based on the above.

【0006】また、第1の本発明に係る研磨方法は、研
磨対象たる工作物を保持する工作物保持部と、支持部材
に取り付けられた弾性体に研磨布紙を覆設してなる研磨
工具とを、工作物の表面と研磨布紙とをほぼ一定の力で
接触させた状態で相対移動させて工作物表面の研磨を行
う研磨方法において、工作物表面と研磨布紙との接触面
積が常時ほぼ一定になるように制御しながら工作物表面
の研磨を行う。
A polishing method according to a first aspect of the present invention is a polishing tool comprising a workpiece holding portion for holding a workpiece to be polished, and a polishing cloth covered by an elastic body attached to a support member. In the polishing method of polishing the surface of the workpiece by relatively moving the surface of the workpiece and the polishing cloth with a substantially constant force in contact with the surface of the workpiece, the contact area between the surface of the workpiece and the polishing cloth is reduced. The surface of the workpiece is polished while being controlled to be almost always constant.

【0007】これら第1の本発明に係る研磨装置及び研
磨方法においては、工作物表面の研磨の際、工作物表面
と研磨布紙との接触面積が常時ほぼ一定になるように、
工作物表面と研磨布紙との接触面積を制御するようにな
っている。このため、工作物表面の研磨の際には、常に
工作物表面と研磨布紙との接触圧力がほぼ一定となり、
うねり等の形状崩れが生じることが防止されて工作物の
一様研磨精度が向上する。
[0007] In the polishing apparatus and the polishing method according to the first aspect of the present invention, when the surface of the workpiece is polished, the contact area between the workpiece surface and the polishing cloth is always substantially constant.
The contact area between the work surface and the abrasive cloth is controlled. For this reason, when polishing the surface of the workpiece, the contact pressure between the surface of the workpiece and the polishing cloth is almost always constant,
The occurrence of shape deformation such as undulation is prevented, and the uniform polishing accuracy of the workpiece is improved.

【0008】また、第2の本発明に係る研磨装置は、研
磨対象たる工作物を保持する工作物保持部(例えば、実
施形態における回転テーブル40)と、支持部材に取り
付けられた弾性体に研磨布紙(例えば、実施形態におけ
る研磨布53)を覆設してなる研磨工具とを有し、工作
物の表面と研磨布紙とをほぼ一定の力で接触させた状態
で、工作物保持部と研磨工具とを予め定めた行路で相対
移動させて工作物表面の研磨を行う研磨装置において、
工作物表面と研磨布紙との接触面積を検出する接触面積
検出手段(例えば、実施形態における接触検出器61,
61,…及び接触面積算出器62)と、工作物表面と研
磨布紙との接触面積を変化させる接触面積可変手段(例
えば、実施形態におけるアクチュエータ63,63,
…)と、工作物表面と研磨布紙とをほぼ一定の力で接触
させた状態で工作物保持部と研磨工具とを上記行路で相
対移動させる走査を行ったときに得られる接触面積検出
手段からの検出情報に基づいて、上記行路に対応する工
作物表面と研磨布紙との接触面積のデータを記憶する接
触面積データ記憶手段(例えば、実施形態における接触
面積データ記憶装置180)と、工作物表面の研磨の
際、接触面積データ記憶手段により記憶された上記デー
タに基づいて、工作物表面と研磨布紙との接触面積が常
時ほぼ一定になるように接触面積可変手段を作動させる
制御を行う制御手段(例えば、実施形態における制御装
置170)とを備える。
The polishing apparatus according to the second aspect of the present invention includes a workpiece holding portion (for example, the rotary table 40 in the embodiment) for holding a workpiece to be polished, and an elastic body attached to a support member. A polishing tool that covers a cloth (for example, the polishing cloth 53 in the embodiment); and a work holding unit in which the surface of the work is brought into contact with the polishing cloth with a substantially constant force. In a polishing apparatus for polishing a workpiece surface by relatively moving a polishing tool and a predetermined path,
Contact area detecting means for detecting the contact area between the workpiece surface and the polishing cloth (for example, the contact detector 61 in the embodiment,
61,... And a contact area calculator 62), and a contact area variable means (for example, actuators 63, 63, 63, in the embodiment) for changing the contact area between the workpiece surface and the polishing cloth.
...) And a contact area detecting means which is obtained when a scan is performed in which the workpiece holding portion and the polishing tool are relatively moved along the above-mentioned path in a state where the workpiece surface and the polishing cloth are brought into contact with substantially constant force. Contact area data storage means (for example, a contact area data storage device 180 in the embodiment) for storing data of a contact area between the workpiece surface corresponding to the path and the polishing cloth based on the detection information from during polishing of the object surface, based on stored the data by the contact area data storage means, the contact area between the coated abrasive and the workpiece surface a control for actuating the contact area varying means to be substantially constant at all times Control means (for example, the control device 170 in the embodiment).

【0009】また、第2の本発明に係る研磨方法は、研
磨対象たる工作物を保持する工作物保持部と、支持部材
に取り付けられた弾性体に研磨布紙を覆設してなる研磨
工具とを、工作物の表面と研磨布紙とをほぼ一定の力で
接触させた状態で予め定めた行路で相対移動させて工作
物表面の研磨を行う研磨方法において、工作物表面と研
磨布紙とをほぼ一定の力で接触させた状態で工作物保持
部と研磨工具とを上記行路で相対移動させる走査を行
い、上記行路に対応する工作物表面と研磨布紙との接触
面積のデータを取得する第1の工程と、第1の工程にお
いて取得された上記データに基づいて、工作物表面と研
磨布紙との接触面積が常時ほぼ一定になるように制御し
ながら工作物表面の研磨を行う第2の工程とを有する。
A polishing method according to a second aspect of the present invention is a polishing tool comprising a workpiece holder for holding a workpiece to be polished, and a polishing cloth covered by an elastic body attached to a support member. in preparative polishing method of polishing the surface with the coated abrasive and a predetermined path by a relative movement is allowed by the workpiece surface in a state of substantially contacting with a constant force of the workpiece, the workpiece surface and the coated abrasive The workpiece holding unit and the polishing tool are scanned relative to each other in the above-described path in a state in which the workpiece is brought into contact with a substantially constant force, and data of the contact area between the workpiece surface and the polishing cloth paper corresponding to the above-described path is obtained. a first step of acquiring, based on the data acquired in the first step, the contact area between the coated abrasive and the workpiece surface to polish the workpiece surface while controlling so as to substantially always constant And a second step to be performed.

【0010】これら第2の本発明に係る研磨装置及び研
磨方法においては、工作物表面と研磨布紙とをほぼ一定
の力で接触させた状態で走査を行ったときに得られる工
作物表面と研磨布紙との接触面積のデータに基づいて、
工作物表面の研磨の際、工作物表面と研磨布紙との接触
面積が常時ほぼ一定になるように上記接触面積を制御す
るようになっている。このため、上記第1の本発明の場
合と同様、工作物表面の研磨の際には、常に工作物表面
と研磨布紙との接触圧力がほぼ一定となり、うねり等の
形状崩れが生じることが防止されて工作物の一様研磨精
度が向上する。なお、この第2の本発明に係る研磨装置
及び研磨方法は、工作物保持部と研磨工具とを予め定め
た行路で相対移動させて行う研磨において、同一形状の
工作物の研磨を次々に行うような場合に、特に適してい
る。
[0010] In the polishing apparatus and a polishing method according to these second invention, the work surface obtained when performing the scanning and coated abrasive and the workpiece surface substantially being in contact with a constant force Based on the data of the contact area with the abrasive paper,
When polishing the work surface, the contact area is controlled so that the contact area between the work surface and the polishing cloth is almost always constant. For this reason, as in the case of the first aspect of the present invention, when polishing the surface of the workpiece, the contact pressure between the surface of the workpiece and the polishing cloth is always substantially constant, and a shape collapse such as undulation may occur. This improves the uniform polishing accuracy of the workpiece. In the polishing apparatus and the polishing method according to the second aspect of the present invention, the workpieces having the same shape are successively polished in the polishing performed by relatively moving the workpiece holder and the polishing tool in a predetermined path. In such a case, it is particularly suitable.

【0011】ここで、上記第1及び第2の本発明に係る
研磨装置においては、上記接触面積検出手段が、前記研
磨布紙の表面を構成する微小区画部分の各々が工作物表
面と接触しているか否かを検出して工作物表面と研磨布
紙との接触面積を検出する構成になっていることが好ま
しい。また、工作物が透明の材料からなっている場合に
は、接触面積検出手段が、工作物の非研磨面側から工作
物を透して測定される工作物表面と研磨布紙との接触部
の形状に基づいてこの接触部の面積を求める構成になっ
ていることが好ましい。
Here, in the polishing apparatus according to the first and second aspects of the present invention, the contact area detecting means may be arranged such that each of the minute sections constituting the surface of the polishing cloth comes into contact with the surface of the workpiece. It is preferable to detect whether the surface of the workpiece is in contact with the abrasive cloth by detecting whether or not the contact is made. Further, when the workpiece is made of a transparent material, the contact area detecting means detects the contact area between the workpiece surface and the polishing cloth measured through the workpiece from the non-polished surface side of the workpiece. It is preferable that the area of the contact portion is determined based on the shape of the contact portion.

【0012】また、上記第1及び第2の本発明に係る研
磨装置においては、上記接触面積可変手段が、研磨工具
内に設けられ、研磨布紙の表面を構成する微小区画部分
の各々を工作物表面と接触させ、或いは離間させること
が可能な複数のアクチュエータから構成されていること
が好ましい。或いは、上記接触面積可変手段が、研磨工
具を前記工作物と接近させ、或いは離間させる方向に移
動可能なアクチュエータから構成されていることが好ま
しい。
Further, in the polishing apparatus according to the first and second aspects of the present invention, the contact area variable means is provided in a polishing tool, and each of the minute sections constituting the surface of the polishing cloth is machined. it is contacted with the object surface, or it is preferably composed of a plurality of actuators that can be separated. Alternatively, the contact area changing means is, the polishing tool was close to the workpiece, or it is preferably composed of a movable actuator in a direction to separate.

【0013】更に、上記研磨装置及び研磨方法により工
作物表面を研磨して得られた工作物にはうねり等の形状
崩れが生じないので、精研削形状精度を高精度に維持し
た工作物となる。特に、この工作物が非球面レンズであ
れば、従来形状崩れを起こすことなく研磨することが困
難であった点を克服し、精研削形状精度を高精度に維持
した非球面レンズが得られる。
Further, since the workpiece obtained by polishing the surface of the workpiece by the above-described polishing apparatus and method does not lose its shape such as undulation, the workpiece can be maintained with high precision grinding precision. . In particular, if the workpiece is an aspherical lens, it is possible to obtain an aspherical lens that can maintain the precision of the finely ground shape with high accuracy, overcoming the conventional difficulty of polishing without causing shape collapse.

【0014】[0014]

【発明の実施の形態】以下、図面を参照して本発明の好
ましい実施形態について説明する。図1は第1の本発明
に係る研磨装置の一実施形態が適用されるレンズ研磨装
置の構成を示したものである。このレンズ研磨装置は、
研磨対象たる工作物(レンズ)10を真空チャック等に
よりその上面側に固定保持する回転テーブル40と、こ
の回転テーブル40と対向する上方位置に設けられ、下
面側に研磨布53が取り付けられてなる研磨工具50と
を備えて構成されている。なお、ここでは工作物10
は、その表面が球面形状である球面レンズであるとして
説明するが、これは一例に過ぎず、工作物10は他の表
面形状を有するもの(例えば非球面レンズ)であっても
よい。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a configuration of a lens polishing apparatus to which an embodiment of the polishing apparatus according to the first invention is applied. This lens polishing device
A worktable (lens) 10 to be polished is fixedly held on its upper surface by a vacuum chuck or the like, and a turntable 40 is provided at an upper position facing the turntable 40, and a polishing cloth 53 is attached to the lower surface. The polishing tool 50 is provided. Here, the workpiece 10
Is described as a spherical lens whose surface is a spherical shape, but this is merely an example, and the workpiece 10 may have another surface shape (for example, an aspherical lens).

【0015】これら回転テーブル40と研磨工具50と
を保持する支持フレーム20は、水平な基台21と、こ
の基台21上をY方向(紙面に垂直な方向)に移動可能
な第1ステージ22と、この第1ステージ22に垂直に
延びて設けられた垂直フレーム23と、この垂直フレー
ム23上を移動可能な(すなわちZ方向に移動可能な)
第2ステージ24と、この第2ステージ24に水平に延
びて設けられた水平フレーム25と、この水平フレーム
25上を移動可能な(すなわちX方向に移動可能な)第
3ステージ26とを有して構成されている。
The supporting frame 20 for holding the polishing tool 50 and these rotating table 40 includes a horizontal base 21, a first stage movable on the base 21 in the Y direction (direction perpendicular to the sheet) 22 And a vertical frame 23 provided to extend vertically to the first stage 22, and movable on the vertical frame 23 (that is, movable in the Z direction).
A second stage 24, a horizontal frame 25 which is provided to extend horizontally in the second stage 24, and the horizontal frame 25 above (movable i.e. in the X-direction) movable third stage 26 It is configured.

【0016】第1ステージ22は自身に内蔵された電動
モータM1の作動により基台21上をY方向に移動する
ことができ、第2ステージ24は自身に内蔵された電動
モータM2の作動により垂直フレーム23上を移動する
ことができる。また、第3ステージ26は自身に内蔵さ
れた電動モータM3の作動により水平フレーム25上を
移動することができる。このため第3ステージ26は、
これら電動モータM1〜M3の作動により、三次元的な
平行移動を自在に行うことが可能である。
The first stage 22 can move on the base 21 in the Y direction by the operation of an electric motor M1 built therein, and the second stage 24 can move vertically by the operation of an electric motor M2 built therein. It can move on the frame 23. Further, the third stage 26 can move on the horizontal frame 25 by the operation of the electric motor M3 built therein. For this reason the third stage 26,
The operation of these electric motors M1 to M3, it is possible to perform freely moving three-dimensional parallel.

【0017】回転テーブル40は、支持フレーム20の
基台21上に設けられたテーブル支持部27から上方に
延びて設けられた回転軸28の上端部に水平に取り付け
られており、テーブル支持部27に内蔵された電動モー
タM4を作動させて回転軸28を駆動することにより、
工作物10を保持した状態で水平回転することができ
る。
The rotary table 40 is horizontally mounted on the upper end of a rotary shaft 28 provided to extend upward from a table support 27 provided on the base 21 of the support frame 20. by driving the rotary shaft 28 actuates the electric motor M4 that is built in,
The workpiece 10 can be horizontally rotated while being held.

【0018】研磨工具50は、図1及び図2に示すよう
に、支持フレーム20の第3ステージ26から下方に延
びて設けられたスピンドル29の下端部に、エアシリン
ダ30及び薄い円盤状のばね31を介して取り付けられ
ており、第3ステージ26に内蔵された電動モータM5
を作動させてスピンドル29を駆動することにより、研
磨工具50全体を回転テーブル40の回転中心軸とほぼ
平行な軸回りに回転させることができる。また、スピン
ドル29は第3ステージ26に内蔵された電動モータM
6の作動により、紙面に平行な面内での揺動が可能であ
るとともに、同じく第3ステージ26に内蔵されて回転
軸が電動モータM6と直交する電動モータM7の作動に
より、紙面に垂直な面内での揺動が可能である。
As shown in FIGS. 1 and 2, the polishing tool 50 is provided with an air cylinder 30 and a thin disk-shaped spring at the lower end of a spindle 29 extending downward from the third stage 26 of the support frame 20. An electric motor M5 mounted via the third stage 26 and incorporated in the third stage 26
Is operated to drive the spindle 29, whereby the entire polishing tool 50 can be rotated about an axis substantially parallel to the rotation center axis of the turntable 40. Further, the spindle 29 electric motor M mounted in the third stage 26
6 enables a swing in a plane parallel to the plane of the paper, and also operates the electric motor M7, which is also built in the third stage 26 and has a rotating shaft orthogonal to the electric motor M6, to operate the motor perpendicular to the paper. Swing in the plane is possible.

【0019】研磨工具50は、図2に示すように、エア
シリンダ30及び円盤状のばね31を介してスピンドル
29の回転動力が伝達される円盤状の支持部材51の下
面に、ほぼ半球状の弾性体(例えばゴム)52が設けら
れており、この弾性体52の外面に研磨布53が覆設さ
れている。このように研磨布53は弾性体52を介して
支持部材51に取り付けられているため、研磨工具50
が工作物10に押し付けられたときには弾性体52が弾
性変形し、これにより研磨布53は或る接触面積をもっ
て工作物10の表面(以下、工作物表面11と称する)
と接触する。なお、スピンドル29はエアシリンダ30
のシリンダ室30a内に図示しないエア供給路よりエア
を供給することにより、研磨布53が工作物表面11と
接触している状態において、研磨工具50をほぼ一定の
力で工作物10に押し付け、工作物表面11と研磨布5
3との間に適当な接触圧力を作用させることができるよ
うになっている。
As shown in FIG. 2, the polishing tool 50 has a substantially hemispherical shape on the lower surface of a disk-shaped support member 51 to which the rotational power of the spindle 29 is transmitted via an air cylinder 30 and a disk-shaped spring 31. An elastic body (for example, rubber) 52 is provided, and a polishing cloth 53 is covered on an outer surface of the elastic body 52. Since the polishing cloth 53 is attached to the support member 51 via the elastic body 52 in this manner, the polishing tool 50
When the elastic body 52 is pressed against the workpiece 10, the elastic body 52 is elastically deformed, whereby the polishing pad 53 has a certain contact area on the surface of the workpiece 10 (hereinafter referred to as the workpiece surface 11).
Contact with. The spindle 29 is an air cylinder 30
By supplying air from an air supply path (not shown) into the cylinder chamber 30a, the polishing tool 50 is pressed against the workpiece 10 with a substantially constant force while the polishing cloth 53 is in contact with the workpiece surface 11, Work surface 11 and polishing cloth 5
3 so that an appropriate contact pressure can be applied.

【0020】弾性体52の内部には空間が形成されてお
り、この空間内には、工作物表面11と研磨布53との
接触面積を検出する接触面積検出手段たる多数の接触検
出器61,61,…と(接触面積検出手段は、これら接
触検出器61,61,…と後述の接触面積算出器62と
から構成される)、工作物表面11と研磨布53との接
触面積を変化させる接触面積可変手段たる多数のアクチ
ュエータ63,63,…とが設けられている。
[0020] The inside of the elastic body 52 is formed space, Within this space, work surface 11 and the contact for detecting a contact area between the polishing pad 53 area detecting means serving multiple contact detector 61, (The contact area detecting means comprises these contact detectors 61, 61,... And a contact area calculator 62 described later), and changes the contact area between the workpiece surface 11 and the polishing pad 53. There are provided a large number of actuators 63, 63, ... as contact area varying means.

【0021】各アクチュエータ63は、図3に示すよう
に、制御装置70からの電磁駆動制御(又はエア駆動制
御)によりピストン63aを軸方向にスライド移動させ
ることができる構成になっており、そのピストン63a
の先端部は、研磨布53の表面を多数の微小部分に分割
したと想定して得られる多数の微小区画部分の各々に、
弾性体52を挟んで取り付けられている。このため各ア
クチュエータ63は、自身のピストン63aの軸方向移
動動作により、そのピストン63aが取り付けられてい
る研磨布53表面の各微小区画部分を工作物表面11と
接触させ、或いは離間させることが可能である。
As shown in FIG. 3, each of the actuators 63 is configured to be able to slide the piston 63a in the axial direction by electromagnetic drive control (or air drive control) from the control device 70. 63a
The tip of each of a number of micro-partitions obtained assuming that the surface of the polishing pad 53 is divided into a number of micro-parts,
It is attached across the elastic body 52. Therefore, each actuator 63 can contact or separate each minute section of the surface of the polishing pad 53 to which the piston 63a is attached from the workpiece surface 11 by the axial movement of the piston 63a. It is.

【0022】各接触検出器61は圧電型の素子であり、
アクチュエータ63,63,…各々の先端部、すなわち
弾性体52との結合部分に位置している。各接触検出器
61は、自身が弾性体52を介して取り付けられている
研磨布53表面の微小区画部分に工作物表面11が接触
したか否かを検知し、その検知情報を図3に示すよう
に、接触面積算出器62へ出力する。この接触面積算出
器62は、接触検出器61,61,…より出力された、
研磨布53表面を構成する各微小区画部分のそれぞれが
工作物表面11と接触しているか否かの情報に基づい
て、工作物表面11と研磨布53との接触面積を算出
し、これにより得られた接触面積のデータを図3に示す
ように、制御装置70に出力する。
Each contact detector 61 is a piezoelectric element.
The actuators 63, 63,... Are located at the respective distal end portions, that is, at the coupling portions with the elastic body 52. Each contact detector 61 detects whether or not the workpiece surface 11 has come into contact with a micro-partition on the surface of the polishing cloth 53 to which the contact detector 61 is attached via the elastic body 52, and the detection information is shown in FIG. Output to the contact area calculator 62 as described above. This contact area calculator 62 outputs from the contact detectors 61, 61,.
The contact area between the workpiece surface 11 and the polishing cloth 53 is calculated based on the information on whether or not each of the micro-compartments constituting the surface of the polishing cloth 53 is in contact with the workpiece surface 11. The data of the contact area thus obtained is output to the control device 70 as shown in FIG.

【0023】ここで、図4(A)に示すように、工作物
表面11と研磨布53とが接触しており、その接触部が
図4(B)における領域Dで示される領域である場合、
この領域D内に位置する接触検出器61,61,…(こ
れら接触検出器61,61,…を図4(B)中において
は「○」で示す)からは、自身に取り付けられた研磨布
53の微小区画部分(これら微小区画部分の各々を図4
(B)中においては「□」で示す)が工作物表面11と
接触している旨の情報が出力され、この領域内Dには位
置しない接触検出器61,61,…からは、自身に取り
付けられた研磨布53の微小区画部分は工作物表面11
と離間している旨の情報が出力される。このため接触面
積算出器62は、これらの情報に基づいて、自身に取り
付けられた研磨布53の微小区画部分が工作物表面11
と接触している旨の情報を出力している接触検出器6
1,61,…についての微小区画部分の面積の総和を算
出することにより、その領域Dの面積、すなわち工作物
表面11と研磨布53の接触面積を求めることができ
る。
Here, as shown in FIG. 4A, the workpiece surface 11 is in contact with the polishing pad 53, and the contact portion is a region indicated by a region D in FIG. 4B. ,
.. (These contact detectors 61, 61,... Are indicated by “○” in FIG. 4B) from the contact detectors 61, 61,. 53 micro-sections (each of these micro-sections are shown in FIG.
(Indicated by “□” in (B)) is output to the effect that it is in contact with the workpiece surface 11, and the contact detectors 61, 61,. microcompartments portion of installed polishing cloth 53 work surface 11
Is output. For this reason, the contact area calculator 62 determines, based on these pieces of information, that the minute section of the polishing pad 53 attached to itself has the workpiece surface 11.
Contact detector 6 that outputs information that it is in contact with
By calculating the total sum of the areas of the minute sections for 1, 61,..., The area of the region D, that is, the contact area between the workpiece surface 11 and the polishing pad 53 can be obtained.

【0024】接触面積算出器62はまた、接触検出器6
1,61,…から受け取った検知情報をそのまま制御装
置70に出力する。このため制御装置70は、接触検出
器61,61,…からの情報に基づいて、各アクチュエ
ータ63を、そのアクチュエータ63に取り付けられた
研磨布53の微小区画部分が工作物表面11と接触する
ように動作させ、或いはそのアクチュエータ63に取り
付けられた研磨布53の微小区画部分が工作物表面11
と接触しないように動作させて工作物表面11と研磨布
53との接触面積を変化させる制御を行うことが可能で
ある。
The contact area calculator 62 also contact detector 6
The detection information received from 1, 61,... Therefore, the control device 70, the contact detector 61, based on information from ..., the actuators 63, so that the micro-compartment of the polishing cloth 53 mounted on the actuator 63 is in contact with the work surface 11 Or the micro-compartment of the polishing pad 53 attached to the actuator 63 of the workpiece surface 11
It is possible to perform control to change the contact area between the workpiece surface 11 and the polishing pad 53 by operating so as not to contact the surface.

【0025】制御装置70はまた、図3に示すように、
回転テーブル40の回転動作及び第3ステージ26の三
次元平行移動、研磨工具50の任意の方向への揺動動作
及び回転動作の制御(すなわち上記電動モータM1〜M
7の制御)も行うようになっており、制御装置70に隣
接する制御パネル(図示せず)上に設けられた研磨開始
スイッチ71を操作すると、制御装置70は研磨しよう
とする工作物10の表面形状に応じて予め設定された研
磨行程プロクラムに従って電動モータM1〜M7を動作
させ、工作物表面11に研磨工具50の研磨布53をほ
ぼ一定の力で接触させた状態で、回転テーブル40及び
研磨工具50を相対回転させつつ、予め定めた行路(研
磨行程プログラムにより設定されている行路)で研磨工
具50を移動させる。
The control device 70 also includes, as shown in FIG.
Control of the rotation operation of the turntable 40, the three-dimensional parallel movement of the third stage 26, the swing operation and the rotation operation of the polishing tool 50 in an arbitrary direction (that is, the electric motors M1 to M
7). When a polishing start switch 71 provided on a control panel (not shown) adjacent to the control device 70 is operated, the control device 70 The electric motors M1 to M7 are operated according to a polishing stroke program preset according to the surface shape, and the rotary table 40 and the polishing table 53 of the polishing tool 50 are brought into contact with the workpiece surface 11 with a substantially constant force. While relatively rotating the polishing tool 50, the polishing tool 50 is moved on a predetermined path (path set by a polishing stroke program).

【0026】図5及び図6はこのような研磨工具50の
行路の例を示すものであり、工作物10を上方から見た
ものである。両図中に矢印付きで示す行路は、研磨布5
3と工作物表面11との接触部分の中心の行路であり、
図5の例では、回転する工作物10に対してX方向に往
復運動しつつ、Y方向に向かって移動することにより、
工作物表面11の全域を研磨できるようになっている。
また、図6の例では、回転する工作物に対して外縁側か
ら中心部に向かって螺旋状に移動することにより、工作
物表面11の全域を研磨できるようになっている。研磨
工具50は、このような行路で移動しつつ、研磨工具5
0の回転中心(すなわちスピンドル29の回転中心)
が、工作物表面11に対して常時垂直になるように、図
7に示すような揺動動作を行うように制御される。な
お、工作物10の実際の研磨においては、図5又は図6
に示すような行路に従った研磨工具50の移動を複数回
行うようにしてもよい。
FIGS. 5 and 6 show an example of the path of such a polishing tool 50 when the workpiece 10 is viewed from above. The paths indicated by arrows in both figures are the polishing cloth 5
3 is a path at the center of the contact portion between the work surface 3 and the workpiece surface 11;
In the example of FIG. 5, by reciprocating in the X direction with respect to the rotating workpiece 10 and moving in the Y direction,
The entire surface of the workpiece surface 11 can be polished.
In the example of FIG. 6, by moving spirally toward the center from the outer edge side with respect to a rotating workpiece, so that can be polished the entire area of the workpiece surface 11. The polishing tool 50 is moved along such a path while the polishing tool 5 is moving.
Zero rotation center (that is, rotation center of spindle 29)
However, it is controlled to perform a swinging operation as shown in FIG. 7 so that it is always perpendicular to the workpiece surface 11. In actual polishing of the workpiece 10, FIG.
The movement of the polishing tool 50 along the path shown in FIG.

【0027】なお、この工作物10の研磨中には、研磨
加工面の発熱を防ぎ、研磨屑を洗い流して研磨精度と工
作能率とを向上させるため、工作物表面11と研磨布5
3との接触面には研磨剤が、図示しない研磨剤噴射ノズ
ルより噴射供給される。
During the polishing of the workpiece 10, the surface 11 of the workpiece and the polishing pad 5 are removed in order to prevent heat generation on the polished surface and to wash away the polishing debris to improve the polishing precision and the working efficiency.
Abrasive is sprayed and supplied to a contact surface with the nozzle 3 from an abrasive spray nozzle (not shown).

【0028】このようにして工作物表面11は研磨工具
50によりその全域が研磨されるが、制御装置70はこ
の研磨の際、接触面積算出器62より出力される、工作
物表面11と研磨布53との接触面積の情報、及び接触
面積算出器62を介して与えられる接触検出器61,6
1,…からの情報(どの微小区画部分が工作物表面11
と接触し、或いは離間しているかの情報)に基づいて、
工作物表面11と研磨布53との接触面積が予め設定し
た基準面積とほぼ一致するように上記アクチュエータ6
3,63,…を作動させる制御を行う。
In this manner, the entire surface of the workpiece surface 11 is polished by the polishing tool 50. At this time, the controller 70 controls the workpiece surface 11 and the polishing cloth output from the contact area calculator 62 during this polishing. Information on the contact area with the sensor 53 and contact detectors 61 and 6 given via the contact area calculator 62
1, ... information (which microcompartments portion from the workpiece surface 11
Contact, or based on by one of the information are) spaced from the,
The actuator 6 is set so that the contact area between the workpiece surface 11 and the polishing pad 53 substantially matches a predetermined reference area.
3, 63, performs control to operate the ....

【0029】この制御を具体的に説明すると、検出され
た工作物表面11と研磨布53との接触面積が予め設定
した基準面積よりも小さいときには、工作物表面11と
離間した研磨布53表面の微小区画部分に対応するアク
チュエータ63,63,…を伸長させ、そのアクチュエ
ータ63,63,…に対応する研磨布53表面の微小区
画部分を工作物表面11に接触させて接触面積を大きく
し、一方、検出された工作物表面11と研磨布53との
接触面積が基準面積よりも大きいときには、工作物表面
11と接触した研磨布53表面の微小区画部分に対応す
るアクチュエータ63,63,…を収縮作動させ、その
アクチュエータ63,63,…に対応する研磨布53表
面の微小区画部分を工作物表面11から離間させて接触
面積を小さくする。
More specifically, this control will be described. When the detected contact area between the workpiece surface 11 and the polishing pad 53 is smaller than a predetermined reference area, the surface of the polishing pad 53 separated from the workpiece surface 11 is determined. The actuators 63, 63,... Corresponding to the minute sections are extended, and the minute sections on the surface of the polishing pad 53 corresponding to the actuators 63, 63,. When the detected contact area between the workpiece surface 11 and the polishing cloth 53 is larger than the reference area, the actuators 63, 63,... , And the micro-partitions on the surface of the polishing pad 53 corresponding to the actuators 63 are separated from the workpiece surface 11 to reduce the contact area.

【0030】ここで、このような動作を行うアクチュエ
ータ63には、検出された工作物表面11と研磨布53
との接触面積が基準面積よりも小さい場合には、工作物
表面11と接触している研磨布53表面の微小区画部分
の最外縁部に位置するアクチュエータ63に隣接するア
クチュエータ63が選択され、また検出された工作物表
面11と研磨布53との接触面積が基準面積よりも大き
い場合には、工作物表面11と接触している研磨布53
表面の微小区画部分の最外縁部に位置するアクチュエー
タ63が選択される。
[0030] Here, the actuator 63 for performing such operations, the polishing and the workpiece surface 11 detected the cloth 53
If the contact area with the workpiece 63 is smaller than the reference area, the actuator 63 adjacent to the actuator 63 located at the outermost edge of the minute section on the surface of the polishing pad 53 in contact with the workpiece surface 11 is selected, and If the detected contact area between the work surface 11 and the polishing cloth 53 is larger than the reference area, the polishing cloth 53 in contact with the work surface 11 is detected.
The actuator 63 located at the outermost edge of the micro section on the surface is selected.

【0031】なお、このように工作物表面11と研磨布
53との接触面積が常時ほぼ一定になるようにするの
は、前述のように、工作物表面11の研磨の際には、工
作物表面11に研磨工具50の研磨布53をほぼ一定の
力で接触させているためであり、研磨中に工作物表面1
1と研磨布53との接触面積が変化すると(接触面積が
常時ほぼ一定でないと)、接触圧力が変化して工作物表
面11にうねり等の形状崩れができてしまうためであ
る。
The reason why the contact area between the workpiece surface 11 and the polishing pad 53 is always substantially constant as described above is that the workpiece surface 11 is polished when the workpiece surface 11 is polished as described above. This is because the polishing cloth 53 of the polishing tool 50 is brought into contact with the surface 11 with a substantially constant force.
If the contact area between the polishing pad 1 and the polishing pad 53 changes (the contact area is not almost constant at all times), the contact pressure changes and the work surface 11 may be deformed, such as undulation.

【0032】このように第1の本発明に係る研磨装置
(及びこの研磨装置を用いて行う研磨方法)において
は、工作物表面11の研磨の際、工作物表面11と研磨
布紙53との接触面積が常時ほぼ一定になるように上記
接触面積を制御するようになっている。このため、工作
物表面11の研磨の際には、常に工作物表面11と研磨
布紙53との接触圧力がほぼ一定となり、うねり等の形
状崩れが生じることが防止されて工作物10の一様研磨
精度が向上する。また、このような研磨装置(及び研磨
方法)により工作物表面11を研磨して得られた工作物
(ここではレンズ)10には、うねり等の形状崩れがな
いので、精研削形状精度を高精度に維持した工作物とな
る。
As described above, in the polishing apparatus according to the first aspect of the present invention (and the polishing method performed by using the polishing apparatus), when the workpiece surface 11 is polished, The contact area is controlled so that the contact area is almost always constant. For this reason, when polishing the workpiece surface 11, the contact pressure between the workpiece surface 11 and the polishing cloth 53 is almost constant at all times, and the deformation of the workpiece 10, such as undulation, is prevented. Polishing accuracy is improved. Further, the workpiece (here, a lens) 10 obtained by polishing the workpiece surface 11 by such a polishing apparatus (and the polishing method) does not have shape deformation such as undulation, so that the precision grinding shape precision is improved. It is a workpiece that maintains accuracy.

【0033】ここで、図8に示すように、工作物10が
非球面レンズ(これを工作物10’とする)である場合
には、研磨工具50は図8(A)のようにスピンドル2
9を揺動させながら工作物10’を研磨するが、上記の
ように工作物10が球面レンズである場合よりも、レン
ズ表面(これを工作物表面11’とする)と研磨布53
との接触面積の変化は大きくなる。このため非球面レン
ズは、従来、形状くずれを起こすことなく研磨すること
が困難であったが、本発明によればこの点を克服するこ
とができ、精研削形状精度を高精度に維持した非球面レ
ンズを得ることができる。
Here, as shown in FIG. 8, when the workpiece 10 is an aspherical lens (this is referred to as a workpiece 10 '), the polishing tool 50 is mounted on the spindle 2 as shown in FIG.
The workpiece 10 'is polished while the workpiece 9 is oscillated. However, as compared with the case where the workpiece 10 is a spherical lens as described above, the lens surface (this is referred to as the workpiece surface 11') and the polishing pad 53 are polished.
The change in the contact area with the contact becomes large. For this reason, it has conventionally been difficult to polish an aspherical lens without deforming the shape. However, according to the present invention, this point can be overcome, and a non-aspherical lens with a high precision grinding shape precision maintained. A spherical lens can be obtained.

【0034】また、研磨対象たる工作物10がレンズの
ように透明の材料からなっている場合には、工作物表面
11と研磨布53との接触面積を検出する接触面積検出
手段は、上記のようなアクチュエータ63,63,…の
先端部に設けられる接触検出器61,61,…を用いた
ものに代えて、工作物10の非研磨面側、すなわち回転
テーブル40の上面側から工作物10たるレンズを透し
て見ることのできる工作物表面11と研磨布53との接
触部の形状(回転テーブル40の上面に投影される形
状)に基づいて、その面積を求める構成のものとしても
よい。
When the workpiece 10 to be polished is made of a transparent material such as a lens, the contact area detecting means for detecting the contact area between the workpiece surface 11 and the polishing pad 53 is as described above. Instead of using the contact detectors 61, 61,... Provided at the distal end portions of the actuators 63, 63,. upcoming lens based on the contact portion of the shape of the workpiece surface 11 and the polishing pad 53 that can be seen it through (shape projected on the upper surface of the rotary table 40) and may be a configuration for obtaining the area .

【0035】例えば、図8(A)のように研磨工具50
により工作物10’を研磨しているとすると、回転テー
ブル40の上面に設けた形状検出器64は、上方すなわ
ち工作物側に向けて光を照射し、工作物表面11と研磨
布53との接触部の形状(工作物表面11と研磨布53
との接触部分を回転テーブル40の上面に投影して得ら
れる形状)を検出する(読み取る)。この接触部の形状
は、例えば、研磨工具50が図8(A)の実線で示す位
置にあるときには図8(B)の実線で示す形状S1とな
り、研磨工具50が図8(A)の一点鎖線で示す位置に
あるときには図8(B)の一点鎖線で示す形状S2とな
る。そして、形状検出器64は、検出したこれら形状の
情報を、図9に示すように接触面積算出器65へ出力
し、接触面積算出器65はこの形状検出器64からの情
報に基づいて、レンズの特質(屈折率等)や研磨工具5
0の位置・姿勢等を考慮した上で、工作物表面11と研
磨布53との接触面積を算出する。そして、この接触面
積算出器65において算出された情報が、図9に示すよ
うに制御装置70へ出力される。
For example, as shown in FIG.
Assuming that the workpiece 10 ′ is polished by the above, the shape detector 64 provided on the upper surface of the turntable 40 irradiates light upward, that is, toward the workpiece, so that the workpiece surface 11 and the polishing cloth 53 Shape of contact part (workpiece surface 11 and polishing cloth 53
(A shape obtained by projecting the contact portion with the upper surface of the turntable 40). The shape of the contact portion, for example, the polishing tool 50 is shaped S 1 becomes that shown by the solid line of FIG. 8 (B) when in the position indicated by the solid line in FIG. 8 (A), the polishing tool 50 is shown in FIG. 8 (A) when in the position indicated by a chain line has a shape S 2 shown by the chain line in FIG. 8 (B). Then, the shape detector 64 outputs information of the detected shapes to the contact area calculator 65 as shown in FIG. 9, and the contact area calculator 65 outputs a lens based on the information from the shape detector 64. Characteristics (refractive index, etc.) and polishing tools 5
The contact area between the workpiece surface 11 and the polishing pad 53 is calculated in consideration of the position / posture of 0. Then, the information calculated by the contact area calculator 65 is output to the control device 70 as shown in FIG.

【0036】また、工作物表面11と研磨布53との接
触面積を変化させる接触面積可変手段も、上記アクチュ
エータ63,63,…を用いるものに代えて、研磨工具
50を工作物10と接近させ、或いは離間させる方向に
移動可能なアクチュエータ、すなわちスピンドル29を
軸方向に移動させることができるアクチュエータを用
い、検出された工作物表面11と研磨布53との接触面
積が予め設定した基準面積よりも小さいときには、研磨
工具50が工作物表面11に接近する側にスピンドル2
9を移動させて接触面積を大きくし、検出された工作物
表面11と研磨布53との接触面積が基準面積よりも大
きいときには、研磨工具50が工作物表面11から離間
する側にスピンドル29を移動させて接触面積を小さく
する構成にしてもよい。
The contact area changing means for changing the contact area between the work surface 11 and the polishing cloth 53 is also similar to that using the actuators 63, 63,. Alternatively, using an actuator that can move in the direction of separating, that is, an actuator that can move the spindle 29 in the axial direction, the detected contact area between the workpiece surface 11 and the polishing pad 53 is larger than a predetermined reference area. When the polishing tool 50 is small, the spindle 2
9 is moved to increase the contact area, and when the detected contact area between the workpiece surface 11 and the polishing cloth 53 is larger than the reference area, the spindle 29 is moved to the side where the polishing tool 50 is separated from the workpiece surface 11. It may be configured to be moved to reduce the contact area.

【0037】なお、ここに示した研磨装置(及び研磨方
法)では、回転テーブル40に対して研磨工具50を予
め定めた行路で相対移動させて工作物表面11の研磨を
行うようになっていたが、この第1の本発明において
は、必ずしも研磨工具50を予め定めた行路で移動させ
なければならない訳ではなく、研磨工具50をマニュア
ル的に操作して移動させる研磨装置(及び研磨方法)に
も適用することが可能である。
In the above-described polishing apparatus (and polishing method), the polishing of the workpiece surface 11 is performed by moving the polishing tool 50 relative to the rotary table 40 along a predetermined path. However, in the first aspect of the present invention, the polishing tool 50 does not necessarily have to be moved along a predetermined path, and a polishing apparatus (and a polishing method) for manually operating and moving the polishing tool 50 is required. It is also possible to apply.

【0038】続いて、第2の本発明に係る研磨装置の一
実施形態が適用されるレンズ研磨装置について説明す
る。この第2の本発明に係るレンズ研磨装置の構成は、
上記第1の本発明に係るレンズ研磨装置の構成とほぼ同
じであり、接触面積検出手段(例えば上記接触検出器6
1,61,…)により得られる工作物表面11と研磨布
53との接触面積のデータの取り扱い、及び研磨の際に
おける、工作物表面11と研磨布53との接触面積が常
時ほぼ一定となるように接触面積可変手段(例えば上記
アクチュエータ63,63,…)を作動させる制御方法
が異なるのみである。
Next, a description will be given of a lens polishing apparatus to which one embodiment of the polishing apparatus according to the second invention is applied. The configuration of the lens polishing apparatus according to the second aspect of the present invention is as follows.
The configuration of the lens polishing apparatus according to the first aspect of the present invention is substantially the same as that of the first embodiment.
1, 61,...), The contact area between the workpiece surface 11 and the polishing pad 53 during the handling of the data of the contact area between the workpiece surface 11 and the polishing pad 53 and the polishing are always substantially constant. Only the control method for operating the contact area variable means (for example, the actuators 63, 63,...) Is different.

【0039】すなわち、この第2の本発明に係るレンズ
研磨装置においては、図10に示すように、制御パネル
(図示せず)上に設けられた走査開始スイッチ172を
操作すると、制御装置170は研磨しようとする工作物
10の表面形状に応じて予め設定された研磨行程プロク
ラムに従って電動モータM1〜M7を動作させ、工作物
表面11に研磨工具50の研磨布53をほぼ一定の力で
接触させた状態で回転テーブル40及び研磨工具50を
相対回転させつつ、予め定めた行路(研磨行程プログラ
ムにより設定されている行路)で研磨工具50を移動さ
せて走査を行う。
That is, in the lens polishing apparatus according to the second embodiment of the present invention, when the scanning start switch 172 provided on the control panel (not shown) is operated as shown in FIG. The electric motors M1 to M7 are operated according to a polishing stroke program preset according to the surface shape of the workpiece 10 to be polished, and the polishing cloth 53 of the polishing tool 50 is brought into contact with the workpiece surface 11 with a substantially constant force. While the rotary table 40 and the polishing tool 50 are relatively rotated in this state, the scanning is performed by moving the polishing tool 50 on a predetermined path (path set by the polishing stroke program).

【0040】この第2の本発明に係るレンズ研磨装置に
おいては、図10に示すように、制御装置170と繋が
る接触面積データ記憶装置180が設けられており、こ
の接触面積データ記憶装置180は、上記走査の際、接
触面積検出手段(例えば接触検出器61,61,…)か
らの検出情報に基づいて、上記行路に対応する工作物表
面11と研磨布53との接触面積のデータを記憶する。
そして、この走査の後、制御パネル上に設けられた研磨
開始スイッチ171を操作すると、制御装置170は走
査時に用いられた研磨行程プロクラムに従って電動モー
タM1〜M7を動作させ、工作物表面11に研磨工具5
0の研磨布53をほぼ一定の力で接触させた状態で、回
転テーブル40及び研磨工具50を相対回転させつつ、
予め定めた行路(研磨行程プログラムにより設定されて
いる行路)で研磨工具50を移動させて研磨を行う。
In the lens polishing apparatus according to the second aspect of the present invention, as shown in FIG. 10, a contact area data storage device 180 connected to a control device 170 is provided. At the time of the scanning, data of a contact area between the workpiece surface 11 and the polishing pad 53 corresponding to the path is stored based on detection information from contact area detecting means (for example, contact detectors 61, 61,...). .
Then, after this scanning, when the polishing start switch 171 provided on the control panel is operated, the control device 170 operates the electric motors M1 to M7 in accordance with the polishing process program used at the time of scanning, and the polishing is performed on the workpiece surface 11. Tool 5
While the rotating table 40 and the polishing tool 50 are relatively rotated in a state in which the polishing cloth 53 of 0 is in contact with a substantially constant force,
The polishing is performed by moving the polishing tool 50 on a predetermined path (path set by a polishing stroke program).

【0041】制御装置170は、上述のように、工作物
表面11に研磨布53をほぼ一定の力で接触させた状態
で、回転テーブル40及び研磨工具50を相対回転させ
つつ、研磨工具50を予め定めた行路で移動させて(例
えば、図5や図6に示すような行路を複数回移動させ
て)工作物表面11の研磨を行うが、この際、接触面積
データ記憶装置180により記憶された上記データに基
づいて、工作物表面11と研磨布53との接触面積が予
め設定した基準面積とほぼ一致するように接触面積可変
手段(例えばアクチュエータ63,63,…)を作動さ
せる。この接触面積可変手段の具体的な作動は、上記第
1の本発明に係るレンズ研磨装置の場合と同様である。
As described above, the controller 170 controls the polishing tool 50 while rotating the rotary table 40 and the polishing tool 50 relative to each other with the polishing cloth 53 in contact with the workpiece surface 11 with a substantially constant force. The workpiece surface 11 is polished by moving along a predetermined path (for example, by moving the paths as shown in FIGS. 5 and 6 a plurality of times). Based on the above data, the contact area varying means (for example, the actuators 63, 63,...) Is operated so that the contact area between the workpiece surface 11 and the polishing pad 53 substantially coincides with a preset reference area. The specific operation of the contact area varying means is the same as in the case of the lens polishing apparatus according to the first aspect of the present invention.

【0042】このように第2の本発明に係る研磨装置
(及びこの研磨装置を用いて行う研磨方法)において
は、工作物表面11と研磨布紙53とをほぼ一定の力で
接触させた状態で走査を行ったときに得られる工作物表
面11と研磨布紙53との接触面積のデータに基づい
て、工作物表面11の研磨の際、工作物表面11と研磨
布紙53との接触面積が常時ほぼ一定になるように上記
接触面積を制御するようになっている。このため、上記
第1の本発明の場合と同様、工作物表面11の研磨の際
には、常に工作物表面11と研磨布紙53との接触圧力
がほぼ一定となり、うねり等の形状崩れが生じることが
防止されて工作物10の一様研磨精度が向上する。ま
た、このような研磨装置(及び研磨方法)により工作物
表面11を研磨して得られた工作物(ここではレンズ)
10も、うねり等の形状崩れのない、精研削形状精度を
高精度に維持した非球面レンズとなる。
As described above, in the polishing apparatus according to the second aspect of the present invention (and the polishing method performed by using the polishing apparatus), the workpiece surface 11 is brought into contact with the polishing cloth 53 with a substantially constant force. Based on the data on the contact area between the workpiece surface 11 and the polishing cloth 53 obtained when scanning is performed, the contact area between the workpiece surface 11 and the polishing cloth 53 when polishing the workpiece surface 11 The contact area is controlled so that is always substantially constant. For this reason, as in the case of the first aspect of the present invention, when polishing the workpiece surface 11, the contact pressure between the workpiece surface 11 and the polishing cloth 53 is almost constant at all times, and the shape collapse such as undulation is caused. uniform polishing accuracy that is prevented workpiece 10 resulting is improved. Furthermore, such a polishing apparatus (and a polishing method) workpieces obtained by polishing the workpiece surface 11 by (where lens)
10 is also an aspherical lens which maintains the precision ground shape precision with high precision without shape deformation such as undulation.

【0043】なお、この第2の本発明に係る研磨装置及
び研磨方法は、回転テーブル40及び研磨工具50を予
め定めた行路で相対移動させて行う研磨において、同一
形状の工作物10の研磨を次々に行うような場合に、特
に適している。
[0043] The polishing apparatus and polishing method according to the second invention, in the polishing for rotating table 40 and the polishing tool 50 in a predetermined path by relative movement, the polishing of the workpiece 10 of the same shape It is particularly suitable when performing one after another.

【0044】また、この第2の本発明に係る研磨装置
(及び研磨方法)においても、研磨対象たる工作物10
がレンズのように透明の材料からなっている場合には、
工作物表面11と研磨布53との接触面積を検出する接
触面積検出手段は、上記のようなアクチュエータ63,
63,…の先端部に設けられる接触検出器61,61,
…を用いたものに代えて、工作物10の非研磨面側(回
転テーブル40の上面側)から工作物10たるレンズを
透して見ることのできる工作物表面11と研磨布53と
の接触部分の形状(工作物表面11と研磨布53との接
触部分が回転テーブル40の上面に投影して得られる形
状)に基づいて、その面積を算出する構成のものとする
ことができる。
In the polishing apparatus (and polishing method) according to the second aspect of the present invention, the workpiece 10 to be polished is
Is made of a transparent material like a lens,
The contact area detecting means for detecting the contact area between the workpiece surface 11 and the polishing cloth 53 includes the actuator 63,
63, contact detectors 61, 61,
Instead, the contact between the work surface 11 and the polishing cloth 53 which can be seen through the lens serving as the work 10 from the non-polishing surface side of the work 10 (the upper surface of the turntable 40). The configuration may be such that the area is calculated based on the shape of the portion (the shape obtained by projecting the contact portion between the workpiece surface 11 and the polishing pad 53 onto the upper surface of the turntable 40).

【0045】更に、工作物表面11と研磨布53との接
触面積を変化させる接触面積可変手段も、上記第1の本
発明の場合と同様、上記アクチュエータ63,63,…
を用いるものに代えて、研磨工具50を工作物10と接
近させ、或いは離間させる方向に移動可能なアクチュエ
ータ、すなわちスピンドル29を軸方向に移動させるこ
とができるアクチュエータを用い、検出された工作物表
面11と研磨布53との接触面積が予め設定した基準面
積よりも小さいときには、研磨工具50が工作物表面1
1に接近する側にスピンドル29を移動させて接触面積
を大きくし、検出された工作物表面11と研磨布53と
の接触面積が基準面積よりも大きいときには、研磨工具
50が工作物表面11から離間する側にスピンドル29
を移動させて接触面積を小さくするようにしてもよい。
Further, the contact area varying means for changing the contact area between the workpiece surface 11 and the polishing pad 53 is also provided with the actuators 63, 63,.
Instead of those using, polishing tool 50 was close to the workpiece 10, or the actuator movable in the direction away, i.e. using an actuator capable of moving the spindle 29 in the axial direction, the detected workpiece surface When the contact area between the polishing pad 11 and the polishing pad 53 is smaller than a predetermined reference area, the polishing tool 50
On the side closer to 1 by moving the spindle 29 to increase the contact area, when the contact area between the detected workpiece surface 11 and the polishing pad 53 is larger than the reference area, the polishing tool 50 from the workpiece surface 11 Spindle 29 on the side to be separated
May be moved to reduce the contact area.

【0046】これまで本発明の好ましい実施形態につい
て説明してきたが、本発明の範囲は上述のものに限定さ
れない。例えば、上述の実施形態における研磨布53の
代わりに研磨紙を用いてもよい。
[0046] While there have been described the preferred embodiments of the present invention, the scope of the present invention is not limited to the above. For example, abrasive paper may be used instead of the abrasive cloth 53 in the above embodiment.

【0047】また、上述の実施形態では、回転テーブル
40すなわち工作物10に対して研磨工具50を移動さ
せることにより研磨を行う構成であったが、これは回転
テーブル40及び研磨工具50を予め定めた行路で相対
移動させることができればよいのであって、研磨工具5
0に対して回転テーブル40を移動させる構成、或いは
双方を移動させる構成であってもよい。更に、工作物1
0の研磨は回転テーブル40及び研磨工具50を相対回
転させつつ行えばよいのであって、上述の実施形態のよ
うに双方を回転させる必要は必ずしもなく、一方は回転
させない構成であっても構わない。
In the above-described embodiment, the polishing is performed by moving the polishing tool 50 with respect to the rotary table 40, that is, the workpiece 10. However, the rotary table 40 and the polishing tool 50 are determined in advance. It is only necessary to be able to relatively move along the path, and the polishing tool 5
A configuration in which the turntable 40 is moved with respect to 0, or a configuration in which both are moved may be employed. Workpiece 1
The polishing of 0 may be performed while rotating the rotary table 40 and the polishing tool 50 relative to each other, and it is not necessary to rotate both as in the above-described embodiment, and one of them may not be rotated. .

【0048】また、上述の実施形態においては、本発明
がレンズの研磨を行うレンズ研磨装置に適用される例を
示したが、本発明に係る研磨装置(及び研磨方法)は、
その研磨対象がレンズに限られるわけではなく、他の工
作物(例えば半導体ウエハ)とすることもできる。
Further, in the above-described embodiment, an example is shown in which the present invention is applied to a lens polishing apparatus for polishing a lens, but the polishing apparatus (and polishing method) according to the present invention
The object to be polished is not limited to a lens, but may be another workpiece (for example, a semiconductor wafer).

【0049】また、本発明では、研磨対象たる工作物を
保持する工作物保持部(上記実施形態では回転テーブル
40)と、支持部材に取り付けられた弾性体に研磨布紙
を覆設してなる研磨工具とを有した構成の研磨装置一般
に適用することができ、これらを支持するフレーム(上
記実施形態では支持フレーム20)の構成は、上記実施
形態に示したものに限定されるものではない。
[0049] In the present invention, the workpiece holding portion for holding a polishing object serving workpiece and (rotary table 40 in the above embodiment), formed by Kutsugae設 the coated abrasive to the elastic member attached to the support member The present invention can be generally applied to a polishing apparatus having a configuration including a polishing tool, and the configuration of a frame (the support frame 20 in the above-described embodiment) that supports them is not limited to that described in the above-described embodiment.

【0050】[0050]

【発明の効果】以上説明したように、第1の本発明に係
る研磨装置及び研磨方法においては、工作物表面の研磨
の際、工作物表面と研磨布紙との接触面積が常時ほぼ一
定になるように、工作物表面と研磨布紙との接触面積を
制御するようになっているので、工作物表面の研磨の際
には、常に工作物表面と研磨布紙との接触圧力がほぼ一
定となり、うねり等の形状崩れが生じることが防止され
て工作物の一様研磨精度が向上する。
As described above, according to the present invention, in the polishing apparatus and a polishing method according to the first invention, during the polishing of the workpiece surface, approximately the area of contact with the coated abrasive and the workpiece surface is constant at all times The contact area between the surface of the workpiece and the abrasive cloth is controlled so that the contact pressure between the surface of the workpiece and the abrasive cloth is almost constant when polishing the surface of the workpiece. Thus, the occurrence of shape deformation such as undulation is prevented, and the uniform polishing accuracy of the workpiece is improved.

【0051】また、第2の本発明に係る研磨装置及び研
磨方法においては、工作物表面と研磨布紙とをほぼ一定
の力で接触させた状態で走査を行ったときに得られる工
作物表面と研磨布紙との接触面積のデータに基づいて、
工作物表面の研磨の際、工作物表面と研磨布紙との接触
面積が常時ほぼ一定になるように上記接触面積を制御す
るようになっているので、上記第1の本発明の場合と同
様、工作物表面の研磨の際には、常に工作物表面と研磨
布紙との接触圧力がほぼ一定となり、うねり等の形状崩
れが生じることが防止されて工作物の一様研磨精度が向
上する。なお、この第2の本発明に係る研磨装置及び研
磨方法は、工作物保持部と研磨工具とを予め定めた行路
で相対移動させて行う研磨において、同一形状の工作物
の研磨を次々に行うような場合に、特に適している。
In the polishing apparatus and the polishing method according to the second aspect of the present invention, the workpiece surface obtained when scanning is performed in a state where the workpiece surface and the polishing cloth are in contact with substantially constant force. Based on the data of the contact area between
When the work surface is polished, the contact area is controlled so that the contact area between the work surface and the abrasive cloth is always substantially constant, so that it is the same as in the first embodiment of the present invention. When polishing the surface of the workpiece, the contact pressure between the workpiece surface and the polishing cloth is almost constant at all times, and the deformation of the workpiece such as undulation is prevented, and the uniform polishing accuracy of the workpiece is improved. . In the polishing apparatus and the polishing method according to the second aspect of the present invention, the workpieces having the same shape are successively polished in the polishing performed by relatively moving the workpiece holder and the polishing tool in a predetermined path. In such a case, it is particularly suitable.

【図面の簡単な説明】[Brief description of the drawings]

【図1】第1の本発明に係る研磨装置の一実施形態が適
用されるレンズ研磨装置の構成図である。
FIG. 1 is a configuration diagram of a lens polishing apparatus to which an embodiment of a polishing apparatus according to a first invention is applied.

【図2】この研磨装置における研磨工具の構成を示す断
面図である。
FIG. 2 is a sectional view showing a configuration of a polishing tool in the polishing apparatus.

【図3】この研磨装置における信号伝送系統を示すブロ
ック図である。
FIG. 3 is a block diagram showing a signal transmission system in the polishing apparatus.

【図4】この研磨装置における接触検出器と接触面積算
出器とにより、工作物表面と研磨布とが接触している部
分の面積を求める過程を説明する図であり、(A)は工
作物表面と研磨布とが接触している状態を示し、(B)
はその接触部の領域内に位置する接触検出器及びその接
触検出器が取り付けられた研磨布の微小区画部分を示し
ている。
FIG. 4 is a view for explaining a process of obtaining an area of a portion where a workpiece surface and a polishing cloth are in contact with each other by a contact detector and a contact area calculator in the polishing apparatus; (B) shows a state where the surface and the polishing cloth are in contact with each other;
Indicates a contact detector located in the area of the contact portion and a minute section of the polishing pad to which the contact detector is attached.

【図5】レンズ研磨時における研磨工具の行路の例をレ
ンズの上方から見て示す図である。
FIG. 5 is a diagram illustrating an example of a path of a polishing tool when polishing a lens as viewed from above a lens.

【図6】レンズ研磨時における研磨工具の行路の例をレ
ンズの上方から見て示す図である。
6 is a diagram showing a look at an example of a path of the abrasive tool from above the lens during lens grinding.

【図7】レンズ研磨時における研磨工具の揺動動作をレ
ンズの側方から見た図である。
7 is a view of the swinging operation of the polishing tool from the side of the lens during lens grinding.

【図8】(A)は、工作物が非球面レンズである場合に
おける研磨工具の揺動動作をレンズの側方から見た図で
あり、(B)は工作物表面と研磨布との接触部分を回転
テーブル上面に投影して得られる形状の例を示す図であ
る。
FIG. 8A is a diagram showing the swinging operation of the polishing tool when the workpiece is an aspherical lens as viewed from the side of the lens, and FIG. 8B is a view showing the contact between the workpiece surface and the polishing cloth; It is a figure which shows the example of the shape obtained by projecting a part on a rotating table upper surface.

【図9】この研磨装置の変形例に対応する信号伝送系統
を示すブロック図である。
FIG. 9 is a block diagram showing a signal transmission system corresponding to a modification of the polishing apparatus.

【図10】第2の本発明に係る研磨装置の一実施形態が
適用されるレンズ研磨装置における信号伝送系統を示す
ブロック図である。
FIG. 10 is a block diagram showing a signal transmission system in a lens polishing apparatus to which an embodiment of the polishing apparatus according to the second invention is applied.

【符号の説明】 10 工作物 20 支持フレーム 40 回転テーブル(工作物保持部) 50 研磨工具 51 支持部材 52 弾性体 53 研磨布(研磨布紙) 61 接触検出器(接触面積検出手段) 62 接触面積算出器(接触面積検出手段) 63 アクチュエータ(接触面積可変手段) 70 制御装置(制御手段)DESCRIPTION OF SYMBOLS 10 Workpiece 20 Support frame 40 Rotary table (Workpiece holding part) 50 Polishing tool 51 Support member 52 Elastic body 53 Polishing cloth (polishing cloth paper) 61 Contact detector (Contact area detecting means) 62 Contact area Calculator (contact area detection means) 63 Actuator (contact area variable means) 70 Control device (control means)

Claims (10)

【特許請求の範囲】[Claims] 【請求項1】 研磨対象たる工作物を保持する工作物保
持部と、支持部材に取り付けられた弾性体に研磨布紙を
覆設してなる研磨工具とを有し、前記工作物の表面と前
記研磨布紙とをほぼ一定の力で接触させた状態で、前記
工作物保持部と前記研磨工具とを相対移動させて前記工
作物表面の研磨を行う研磨装置において、 前記工作物表面と前記研磨布紙との接触面積を検出する
接触面積検出手段と、 前記工作物表面と前記研磨布紙との接触面積を変化させ
る接触面積可変手段と、 前記工作物表面の研磨の際、前記接触面積検出手段から
の検出情報に基づいて、前記工作物表面と前記研磨布紙
との接触面積が常時ほぼ一定になるように前記接触面積
可変手段を作動させる制御を行う制御手段とを備えたこ
とを特徴とする研磨装置。
1. A workpiece holding portion for holding a workpiece to be polished, and a polishing tool comprising an elastic body attached to a support member and a polishing cloth covered with a polishing tool, wherein the surface of the workpiece is In a polishing apparatus for polishing the surface of the workpiece by relatively moving the workpiece holding unit and the polishing tool in a state where the polishing cloth is in contact with the polishing cloth at a substantially constant force, the workpiece surface and the polishing A contact area detecting means for detecting a contact area with the abrasive cloth; a contact area variable means for changing a contact area between the workpiece surface and the abrasive cloth; and the contact area when polishing the workpiece surface. Control means for controlling the operation of the contact area varying means so that the contact area between the workpiece surface and the polishing cloth is always substantially constant based on the detection information from the detection means. Characteristic polishing equipment.
【請求項2】 研磨対象たる工作物を保持する工作物保
持部と、支持部材に取り付けられた弾性体に研磨布紙を
覆設してなる研磨工具とを有し、前記工作物の表面と前
記研磨布紙とをほぼ一定の力で接触させた状態で、前記
工作物保持部と前記研磨工具とを予め定めた行路で相対
移動させて前記工作物表面の研磨を行う研磨装置におい
て、 前記工作物表面と前記研磨布紙との接触面積を検出する
接触面積検出手段と、 前記工作物表面と前記研磨布紙との接触面積を変化させ
る接触面積可変手段と、 前記工作物表面と前記研磨布紙とをほぼ一定の力で接触
させた状態で前記工作物保持部と前記研磨工具とを前記
行路で相対移動させる走査を行ったときに得られる前記
接触面積検出手段からの検出情報に基づいて、前記行路
に対応する前記工作物表面と前記研磨布紙との接触面積
のデータを記憶する接触面積データ記憶手段と、 前記工作物表面の研磨の際、前記接触面積データ記憶手
段により記憶された前記データに基づいて、前記工作物
表面と前記研磨布紙との接触面積が常時ほぼ一定になる
ように前記接触面積可変手段を作動させる制御を行う制
御手段とを備えたことを特徴とする研磨装置。
2. A workpiece holding portion for holding a workpiece to be polished, and a polishing tool comprising an elastic body attached to a support member and a polishing cloth covered with a polishing tool, wherein the surface of the workpiece is In a polishing apparatus for polishing the surface of the workpiece by relatively moving the workpiece holding portion and the polishing tool in a predetermined path in a state where the polishing cloth and the polishing cloth are contacted with a substantially constant force, A contact area detecting means for detecting a contact area between a work surface and the polishing cloth; a contact area variable means for changing a contact area between the work surface and the polishing cloth; Based on detection information from the contact area detection means obtained when a scan is performed in which the workpiece holding unit and the polishing tool are relatively moved along the path while the cloth paper is being contacted with a substantially constant force. The workpiece corresponding to the path A contact area data storage means for storing data of a contact area between a surface and the polishing cloth; and, when polishing the workpiece surface, the workpiece based on the data stored by the contact area data storage means. polishing and wherein the contact area of the surface and the abrasive cloth paper and control means for controlling to operate said contact area varying means to be substantially constant at all times.
【請求項3】 前記接触面積検出手段が、前記研磨布紙
の表面を構成する微小区画部分の各々が前記工作物表面
と接触しているか否かを検出して前記工作物表面と前記
研磨布紙との接触面積を検出する構成になっていること
を特徴とする請求項1又は2記載の研磨装置。
3. The workpiece surface and the polishing cloth by detecting whether or not each of the micro-partitions constituting the surface of the polishing cloth paper is in contact with the workpiece surface. 3. The polishing apparatus according to claim 1, wherein the polishing apparatus is configured to detect a contact area with paper.
【請求項4】 前記工作物が透明の材料からなってお
り、前記接触面積検出手段が、前記工作物の非研磨面側
から前記工作物を透して測定される前記工作物表面と前
記研磨布紙との接触部の形状に基づいて前記接触部の面
積を求める構成になっていることを特徴とする請求項1
又は2記載の研磨装置。
Wherein serves from the workpiece of transparent material, the contact area detecting means, the polishing and the workpiece surface from the non-polishing surface side of the workpiece is measured it through the workpiece claim, characterized in that it is configured to determine the area of the contact portion based on the shape of the contact portion between the fabric sheet 1
Or the polishing apparatus according to 2.
【請求項5】 前記接触面積可変手段が、前記研磨工具
内に設けられ、前記研磨布紙の表面を構成する微小区画
部分の各々を前記工作物表面と接触させ、或いは離間さ
せることが可能な複数のアクチュエータから構成されて
いることを特徴とする請求項1〜4のいずれかに記載の
研磨装置。
5. The contact area varying means is provided in the polishing tool, and is capable of bringing each of the micro-partitions constituting the surface of the polishing cloth into contact with or away from the workpiece surface. The polishing apparatus according to any one of claims 1 to 4, comprising a plurality of actuators.
【請求項6】 前記接触面積可変手段が、前記研磨工具
を前記工作物と接近させ、或いは離間させる方向に移動
可能なアクチュエータから構成されていることを特徴と
する請求項1〜4のいずれかに記載の研磨装置。
6. The apparatus according to claim 1, wherein said contact area changing means comprises an actuator movable in a direction to move said polishing tool toward or away from said workpiece. A polishing apparatus according to claim 1.
【請求項7】 研磨対象たる工作物を保持する工作物保
持部と、支持部材に取り付けられた弾性体に研磨布紙を
覆設してなる研磨工具とを、前記工作物の表面と前記研
磨布紙とをほぼ一定の力で接触させた状態で相対移動さ
せて前記工作物表面の研磨を行う研磨方法において、 前記工作物表面と前記研磨布紙との接触面積が常時ほぼ
一定になるように制御しながら前記工作物表面の研磨を
行うことを特徴とする研磨方法。
7. A polishing apparatus comprising: a workpiece holder for holding a workpiece to be polished; and a polishing tool comprising an elastic body attached to a support member and a polishing cloth covered with the polishing tool. In a polishing method for polishing the surface of the workpiece by relatively moving the workpiece while contacting the cloth with a substantially constant force, a contact area between the workpiece surface and the polishing cloth is always substantially constant. Polishing the workpiece surface while controlling the polishing method.
【請求項8】 研磨対象たる工作物を保持する工作物保
持部と、支持部材に取り付けられた弾性体に研磨布紙を
覆設してなる研磨工具とを、前記工作物の表面と前記研
磨布紙とをほぼ一定の力で接触させた状態で予め定めた
行路で相対移動させて前記工作物表面の研磨を行う研磨
方法において、 前記工作物表面と前記研磨布紙とをほぼ一定の力で接触
させた状態で前記工作物保持部と前記研磨工具とを前記
行路で相対移動させる走査を行い、前記行路に対応する
前記工作物表面と前記研磨布紙との接触面積のデータを
取得する第1の工程と、 前記第1の工程において取得された前記データに基づい
て、前記工作物表面と前記研磨布紙との接触面積が常時
ほぼ一定になるように制御しながら前記工作物表面の研
磨を行う第2の工程とを有することを特徴とする研磨方
法。
8. A polishing apparatus comprising: a workpiece holder for holding a workpiece to be polished; and a polishing tool comprising an elastic body attached to a support member and a polishing cloth covered with the polishing tool. In a polishing method for polishing the surface of the workpiece by relatively moving the cloth in a predetermined path in a state of contacting the cloth with a substantially constant force, a substantially constant force is applied between the surface of the workpiece and the polishing cloth. the workpiece holding portion and the said polishing tool performs scanning for relatively moving in the path, to acquire data of the contact area between the workpiece surface and the abrasive cloth paper corresponding to the path in a state in which in contacted A first step, based on the data obtained in the first step, while controlling the contact area between the workpiece surface and the polishing cloth to be substantially constant at all times, And a second step of polishing. Polishing method according to claim.
【請求項9】 請求項1〜6のいずれかに記載の研磨装
置又は請求項7若しくは8記載の研磨方法により前記工
作物を研磨して得られたことを特徴とする工作物。
9. A workpiece obtained by polishing the workpiece by the polishing apparatus according to any one of claims 1 to 6 or the polishing method according to claim 7 or 8.
【請求項10】 前記工作物が非球面レンズであること
を特徴とする請求項9記載の工作物。
10. The workpiece according to claim 9, wherein said workpiece is an aspheric lens.
JP2000371588A 2000-12-06 2000-12-06 Polishing device, polishing method and workpiece obtained with use of the device or method Pending JP2002172550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000371588A JP2002172550A (en) 2000-12-06 2000-12-06 Polishing device, polishing method and workpiece obtained with use of the device or method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000371588A JP2002172550A (en) 2000-12-06 2000-12-06 Polishing device, polishing method and workpiece obtained with use of the device or method

Publications (1)

Publication Number Publication Date
JP2002172550A true JP2002172550A (en) 2002-06-18

Family

ID=18841287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000371588A Pending JP2002172550A (en) 2000-12-06 2000-12-06 Polishing device, polishing method and workpiece obtained with use of the device or method

Country Status (1)

Country Link
JP (1) JP2002172550A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7413503B2 (en) 2004-11-09 2008-08-19 Seiko Epson Corporation Elastic polishing tool and lens polishing method
DE102007013563A1 (en) * 2007-03-21 2008-09-25 Carl Zeiss Smt Ag Method and device for producing an element with at least one free-form surface with high dimensional accuracy and low surface roughness
CN102794689A (en) * 2012-07-30 2012-11-28 中国人民解放军国防科学技术大学 Electromagnetic drive type active stress disc
JP2013066997A (en) * 2011-09-05 2013-04-18 Canon Inc Processing apparatus and optical member manufacturing method
CN105658376A (en) * 2013-10-25 2016-06-08 埃西勒国际通用光学公司 Surfacing tool for optical purposes

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7413503B2 (en) 2004-11-09 2008-08-19 Seiko Epson Corporation Elastic polishing tool and lens polishing method
DE102007013563A1 (en) * 2007-03-21 2008-09-25 Carl Zeiss Smt Ag Method and device for producing an element with at least one free-form surface with high dimensional accuracy and low surface roughness
JP2013066997A (en) * 2011-09-05 2013-04-18 Canon Inc Processing apparatus and optical member manufacturing method
CN102794689A (en) * 2012-07-30 2012-11-28 中国人民解放军国防科学技术大学 Electromagnetic drive type active stress disc
CN105658376A (en) * 2013-10-25 2016-06-08 埃西勒国际通用光学公司 Surfacing tool for optical purposes
US10189139B2 (en) 2013-10-25 2019-01-29 Essilor International Surfacing tool for optical purposes

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