JP2002166899A - Reinforced container for space environment - Google Patents

Reinforced container for space environment

Info

Publication number
JP2002166899A
JP2002166899A JP2000365420A JP2000365420A JP2002166899A JP 2002166899 A JP2002166899 A JP 2002166899A JP 2000365420 A JP2000365420 A JP 2000365420A JP 2000365420 A JP2000365420 A JP 2000365420A JP 2002166899 A JP2002166899 A JP 2002166899A
Authority
JP
Japan
Prior art keywords
container
space environment
electronic component
copper wire
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000365420A
Other languages
Japanese (ja)
Inventor
Toshio Abe
俊雄 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2000365420A priority Critical patent/JP2002166899A/en
Publication of JP2002166899A publication Critical patent/JP2002166899A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a reinforced container for space environment shielding assuredly cosmic rays, which is light, low-cost, tolerable for a change in temperature and reliable. SOLUTION: This reinforced container for space environment 30 is formed with a closed aluminum container 11 and comprises a printed board 12 mounted on an inner surface of the closed container 11 and a household electronic component 13 mounted on the printed board 12 while a copper wire 14 allows electric connection of the electronic component 13 with outside. By setting a thickness of aluminum 3 mm the light and low-cost reinforced container 30 for pace environment can be obtained. By using the copper wire 14, the reinforced container 30 for space environment can be obtained prevented from cutting due to the change in temperature or an impact by vibration.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、宇宙空間におい
て、特に人工衛星や宇宙機に使用される電子部品を覆っ
て保護する宇宙環境耐性強化容器に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a container for enhancing space environment resistance, which protects and protects electronic components used in space, particularly for artificial satellites and spacecraft.

【0002】[0002]

【従来の技術】図7は、従来の電子部品を放射線から保
護する放射線遮蔽容器を示す概念図である。図7におい
て、従来の放射線遮蔽容器1は外部からの放射線を遮蔽
する重金属容器2(例えば、タングステン合金)により
構成されており、この重金属容器2の内面にブリント基
板3が設けられ、このプリント基板3上に電子部品であ
るパッケージの無いベアチップ4が設けられている。
2. Description of the Related Art FIG. 7 is a conceptual view showing a conventional radiation shielding container for protecting electronic components from radiation. In FIG. 7, a conventional radiation shielding container 1 is formed of a heavy metal container 2 (for example, a tungsten alloy) for shielding radiation from the outside, and a printed circuit board 3 is provided on the inner surface of the heavy metal container 2. A bare chip 4 which is an electronic component and has no package is provided on 3.

【0003】重金属容器2は、プリント基板3が半田付
け又は接着剤で接着されたベース材5と、このベース材
5の周縁に一方側がAu又はAgろうでろう付けされた
側面材6と、この側面材6の他方側に同じくAu又はA
gろうでろう付けされたカバー材7とを有している。ま
た、この重金属容器2は放射線遮蔽するために照射比率
や線量に応じて鉄、黒鉛、鉛等が添加されている。
The heavy metal container 2 includes a base member 5 to which the printed board 3 is soldered or bonded with an adhesive, a side member 6 whose one side is brazed to the periphery of the base member 5 with Au or Ag braze, Au or A on the other side of the side material 6
g cover material 7 brazed with brazing. The heavy metal container 2 is added with iron, graphite, lead or the like in accordance with the irradiation ratio or dose in order to shield radiation.

【0004】側面材6には、重金属容器2の内部と外部
とを電気的に接続するための端子8がガラス封止材9を
介して複数貫通されており、その内部側端部とベアチッ
プ4とはボンディングワイヤ10によって接続されてい
る。
A plurality of terminals 8 for electrically connecting the inside and the outside of the heavy metal container 2 are penetrated through the side member 6 via a glass sealing material 9, and the inner side end portion and the bare chip 4 are connected to each other. Are connected by a bonding wire 10.

【0005】上記構成により、放射線、特に中性子及び
γ線を遮蔽して容器内部の電子部品(ベアチップ等)を
保護していた。
[0005] With the above configuration, radiation, especially neutrons and γ-rays are shielded to protect electronic components (bare chips and the like) inside the container.

【0006】[0006]

【発明が解決しようとする課題】このように、従来の放
射線遮蔽容器は放射線に対する耐性強化対策が施されて
おり、宇宙空間を飛翔する人工衛星などの電子機器に用
いられる電子部品も特別に放射線対策が施されていた。
ところが近年、人工衛星などの価格を下げ、通信事業な
どの商業活動に供することが世界的に行われるようにな
ってきた。このような状況下で、人工衛星などに搭載さ
れる電子部品の価格を低下させる必要が生じ、このた
め、車や計算機、電話などに使用されている一般の民生
用電子部品を宇宙で使用することが強く要請されるよう
になってきた。
As described above, the conventional radiation shielding container is provided with measures to enhance the resistance to radiation, and the electronic components used in electronic devices such as artificial satellites flying in outer space are also specially radiation-sensitive. Measures had been taken.
However, in recent years, the price of artificial satellites and the like has been reduced, and the use of the satellites for commercial activities such as a communication business has been performed worldwide. Under such circumstances, it is necessary to reduce the price of electronic components mounted on artificial satellites and the like, and therefore, general consumer electronic components used in cars, computers, telephones, etc. are used in space. Has been strongly demanded.

【0007】ところが、一般の民生用電子部品はプラス
チックパッケージになっており、気密性が悪いことから
水分の侵入による故障や、パッケージから出る脱ガス
や、放射線に弱いという問題がある。さらに、プラスチ
ックパッケージの場合、地上で使用することを前提に設
計されており、熱の処理が伝導以外に空気対流による放
熱を予定しているので、真空かつ無重力のため熱対流を
利用することができない宇宙でそのまま使用することは
困難である。
However, general consumer electronic components are formed of a plastic package, and have poor airtightness. Therefore, there are problems such as failure due to intrusion of moisture, degassing from the package, and susceptibility to radiation. Furthermore, in the case of a plastic package, it is designed on the assumption that it will be used on the ground, and since heat treatment is scheduled to release heat by air convection in addition to conduction, it is possible to use thermal convection due to vacuum and zero gravity. It is difficult to use it as it is in a space where it cannot.

【0008】この電子部品を無理に宇宙環境の中で使用
しようとすると、複雑で高価な評価試験を行い宇宙環境
耐性を確認したものしか使用できないため、低価格化の
障害となっていた。
If this electronic component is forcibly used in a space environment, only components that have undergone complicated and expensive evaluation tests and have been confirmed to be resistant to the space environment can be used, which has been an obstacle to cost reduction.

【0009】また、上記放射線耐性強化対策は多くの重
金属を用いているため重量が大きく、スペースを多くと
り、人工衛星などの小型化や軽量化の妨げとなるという
問題があった。
In addition, the above-mentioned measures for enhancing radiation resistance have a problem in that the heavy weight and large space are required because many heavy metals are used, which hinders downsizing and weight reduction of artificial satellites and the like.

【0010】さらに、電子部品と端子との間はボンディ
ングワイヤで接続されているが、このボンディングワイ
ヤは温度変化により容易に切断し、故障し易いという問
題もあった。
[0010] Furthermore, although the electronic component and the terminal are connected by a bonding wire, there is a problem that the bonding wire is easily cut off due to a temperature change and is easily broken.

【0011】そこで、上記問題点を解決するために宇宙
空間で使用する一般の民生用電子部品を中に入れる容器
を低価格で供給し、重量を小さくするとともに電気的接
続の信頼性を向上する宇宙環境耐性強化容器を得ること
を目的とする。
[0011] In order to solve the above-mentioned problems, a container for accommodating general consumer electronic parts used in outer space is supplied at a low price to reduce the weight and improve the reliability of electrical connection. The purpose is to obtain a container with enhanced space environment resistance.

【0012】[0012]

【課題を解決するための手段】この発明によれば、上述
の課題を解決するための手段は次の通りである。 (1)請求項1に係る発明は、民生用電子部品を収納し
て宇宙空間の人工衛星軌道上における宇宙線から保護す
るために、前記宇宙線のうち電子及び陽子を主たる遮蔽
対象として選択した金属材料及び厚さ寸法を用いて前記
電子部品に悪影響を与えない程度に前記宇宙線を遮蔽し
たものである。
According to the present invention, means for solving the above-mentioned problems are as follows. (1) According to the first aspect of the present invention, electrons and protons among the cosmic rays are selected as main objects to be shielded in order to house the electronic components for consumer use and protect them from cosmic rays in a satellite orbit in outer space. The cosmic rays are shielded to such an extent that the electronic components are not adversely affected by using a metal material and a thickness dimension.

【0013】(2)請求項2に係る発明は、前記金属材
料は、アルミニウムであるものである。
(2) In the invention according to claim 2, the metal material is aluminum.

【0014】(3)請求項3に係る発明は、前記厚さ寸
法は、3mmであるものである。
(3) In the invention according to claim 3, the thickness dimension is 3 mm.

【0015】(4)請求項4に係る発明は、容器表面に
冷却板を有し、前記電子部品が容器内面に設けられてい
るものである。
(4) According to a fourth aspect of the present invention, a cooling plate is provided on the surface of the container, and the electronic component is provided on the inner surface of the container.

【0016】(5)請求項5に係る発明は、前記電子部
品は、容器外部から挿入された銅ワイヤに接続され、前
記銅ワイヤは間に容器内面に設けられた中継プレートを
介しているものである。
(5) The invention according to claim 5, wherein the electronic component is connected to a copper wire inserted from the outside of the container, and the copper wire is interposed between the relay plates provided on the inner surface of the container. It is.

【0017】(6)請求項6に係る発明は、容器内部を
真空としたものである。
(6) The invention according to claim 6 is that the inside of the container is evacuated.

【0018】[0018]

【発明の実施の形態】実施の形態1.通常、一般の民生
用電子部品は約1万RADの放射線吸収線量耐性を有す
ることが知られているので、この電子部品の放射線吸収
線量を1万RAD以下にすることによって民生用電子部
品を宇宙空間でも使用することができる。放射線吸収線
量を1万RAD以下にするために、電子部品を放射線を
遮蔽する密閉容器に収納する方法が採られている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Generally, it is known that general consumer electronic components have a radiation absorption dose resistance of about 10,000 RAD. Therefore, by reducing the radiation absorption dose of this electronic component to 10,000 RAD or less, the consumer electronic components can be used in space. Can also be used in space. In order to reduce the radiation absorption dose to 10,000 RAD or less, a method has been adopted in which electronic components are housed in a sealed container that shields radiation.

【0019】一般的に人工衛星軌道上の宇宙線は陽子及
び電子が殆どで、透過性の強い中性子やγ線は僅かであ
ることが知られている。よって、宇宙線の場合は、陽子
及び電子を遮蔽すれば内部にある電子部品を保護するこ
とができる。ここで、図3及び図4にそれぞれ宇宙線の
電子及び陽子の粒子エネルギと粒子密度との関係のグラ
フを示す。このグラフによれば、両方とも粒子エネルギ
の低い粒子即ち遮蔽の容易な粒子が多く、粒子エネルギ
の高い粒子即ち遮蔽の困難な粒子は急激に少なくなって
いる。このことから、粒子エネルギの低い粒子を遮蔽で
きる金属であれば比較的容易に宇宙線を遮蔽することが
できることが分かる。
Generally, it is known that cosmic rays in an orbit of an artificial satellite are mostly protons and electrons, and neutrons and γ-rays having high permeability are few. Therefore, in the case of cosmic rays, shielding the protons and electrons can protect the internal electronic components. Here, FIGS. 3 and 4 show graphs of the relationship between the particle energies and the particle densities of electrons and protons of cosmic rays, respectively. According to this graph, in both cases, particles having low particle energy, that is, particles that are easy to shield, are large, and particles having high particle energy, that is, particles that are difficult to shield are rapidly reduced. From this, it is understood that cosmic rays can be shielded relatively easily if the metal can shield particles having low particle energy.

【0020】また、図5はアルミニウムの厚さとこのア
ルミニウムでの放射線吸収線量との関係を示すグラフで
ある。図5において、アルミニウムの厚さが約3mm以
上であれば放射線吸収線量が1万RADを下回り、十分
に民生用電子部品の宇宙空間での使用が可能になること
が分かる。
FIG. 5 is a graph showing the relationship between the thickness of aluminum and the radiation absorption dose at this aluminum. In FIG. 5, it can be seen that when the thickness of the aluminum is about 3 mm or more, the radiation absorption dose is lower than 10,000 RAD, and the consumer electronic component can be sufficiently used in outer space.

【0021】そこで、図1及び図2に示すような実施の
形態1に係る宇宙環境耐性強化容器により効果的に宇宙
線を遮蔽することができる。即ち、宇宙環境耐性強化容
器30は、密閉容器11から成っており、この密閉容器
11の内面にプリント基板12が設けられ、このプリン
ト基板12上にプラスチックパッケージされた民生用電
子部品13が設けられている。また密閉容器11の外側
から電子部品13に電気的接続を可能にする銅ワイヤ1
4が密閉容器11の側面を貫通している。
Therefore, cosmic rays can be effectively shielded by the space environment resistance enhanced container according to the first embodiment as shown in FIGS. That is, the container 30 for strengthening space environment resistance is composed of a closed container 11, a printed circuit board 12 is provided on the inner surface of the closed container 11, and a consumer electronic component 13 in a plastic package is provided on the printed circuit board 12. ing. Also, a copper wire 1 for enabling electrical connection to the electronic component 13 from outside the sealed container 11
4 penetrates the side surface of the closed container 11.

【0022】密閉容器11はアルミニウムで作製されて
おり、プリント基板12が設けられた底板15と、この
底板15の周縁を取り囲むように立てられて溶接接続さ
れた側壁16と、この側壁16にかぶさるように溶接接
続されたふた板17とを有している。そして、この密閉
容器11の板厚は3mmとなっている。また、側壁16
には銅ワイヤ14がガラス封止材18を介して貫通して
おり、密閉容器11の内部と外部との電気的接続を可能
にしている。
The hermetically sealed container 11 is made of aluminum, and has a bottom plate 15 on which a printed board 12 is provided, a side wall 16 erected so as to surround the periphery of the bottom plate 15 and connected by welding, and covers the side wall 16. And a lid plate 17 which is connected by welding. The plate thickness of the closed container 11 is 3 mm. Also, the side wall 16
, A copper wire 14 penetrates through a glass sealing material 18 to enable electrical connection between the inside and the outside of the sealed container 11.

【0023】プリント基板12は、密閉容器11の底板
15に密着接続されている。
The printed circuit board 12 is in close contact with the bottom plate 15 of the closed casing 11.

【0024】銅ワイヤ14は、プリント基板12上に設
けられた中継プレート19を介してプラスチックパッケ
ージされた電子部品13に接続されている。この中継プ
レートは、銅ワイヤ14の電子部品13側14a及び外
側14bの中継地点になっており、それぞれ半田付けさ
れている。
The copper wire 14 is connected to an electronic component 13 packaged in a plastic via a relay plate 19 provided on the printed circuit board 12. The relay plate is a relay point on the electronic component 13 side 14a and the outer side 14b of the copper wire 14, and each is soldered.

【0025】このように、アルミニウムという軽金属で
しかも3mmの厚みで効率的に宇宙線を遮蔽することが
できるということが明らかになり、原子力などの放射線
とは異なる特性を持った宇宙線に対してこの特性に合っ
た遮蔽手段を適用することにより、従来に比べて低価格
で軽く取り扱い易い宇宙環境耐性強化容器を得ることが
できる。
As described above, it has been revealed that a light metal such as aluminum can efficiently shield cosmic rays with a thickness of 3 mm. By applying a shielding means suitable for this characteristic, it is possible to obtain a container with enhanced space environment resistance which is cheaper and easier to handle than conventional ones.

【0026】上記構成を有した宇宙環境耐性強化容器3
0は内部は真空となっており、銅ワイヤ14などに熱変
形などのストレスを与えることがなく、宇宙空間での動
作に空気が影響を及ぼさないように配慮している。
Space environment resistant container 3 having the above configuration
0 is a vacuum inside, so that stress such as thermal deformation is not applied to the copper wire 14 or the like, and care is taken to prevent the air from affecting the operation in the outer space.

【0027】また、銅ワイヤ14は、中継プレート19
にも半田によって確実に接続されているので、温度変化
や振動などにより銅ワイヤ14が切断する虞もなく、信
頼性が大きく向上する。
The copper wire 14 is connected to the relay plate 19
Also, since the connection is reliably performed by soldering, there is no possibility that the copper wire 14 is cut due to a change in temperature or vibration, and the reliability is greatly improved.

【0028】また、中継プレート19を介することによ
り、製作が容易になるとともに強度的にも大きくなり、
そして熱伝導の面でも優れた効果を奏する。
In addition, through the relay plate 19, the production becomes easy and the strength is increased.
And it has an excellent effect in terms of heat conduction.

【0029】なお、銅ワイヤ14が温度変化や振動に耐
えることができるだけの径を有していれば中継プレート
19はなくてもよい。
The relay plate 19 may be omitted if the copper wire 14 has a diameter enough to withstand a temperature change or vibration.

【0030】また、アルミニウム製の密閉容器11は宇
宙線を遮蔽して、電子部品13に宇宙線が電子部品13
に影響を及ぼさなければ、厚みを3mmに限定する必要
はない。さらに価格的及び重量的に従来の遮蔽容器より
優れているものは、例えばFeなど多くの金属が存在す
るが、その中で総合的に判断するとアルミニウムが最も
この宇宙環境耐性強化容器30に相応しい金属であるの
で、アルミニウムを使用するのが望ましい。
The aluminum sealed container 11 shields cosmic rays, and the cosmic rays are applied to the electronic components 13.
It is not necessary to limit the thickness to 3 mm if it does not affect the thickness. In addition, there are many metals such as Fe that are superior in price and weight to the conventional shielding container, but aluminum is the most suitable metal for the space environment resistant container 30 when comprehensively judged. Therefore, it is desirable to use aluminum.

【0031】また、図6に示すように、密閉容器11の
外面、特に底板15に冷却板20を設けることは、電子
部品13及び中継プレート19で発生した熱を効率的に
外側に伝導し、電子部品13及び銅ワイヤ14の温度上
昇を防止して信頼性を向上できるので望ましい。
As shown in FIG. 6, the provision of the cooling plate 20 on the outer surface of the closed casing 11, especially on the bottom plate 15, allows the heat generated by the electronic component 13 and the relay plate 19 to be efficiently conducted to the outside, This is desirable because the reliability can be improved by preventing the temperature of the electronic component 13 and the copper wire 14 from rising.

【0032】[0032]

【発明の効果】以上の説明から明らかな通り、この発明
の効果は次の通りである。 (1)請求項1に係る発明は、民生用電子部品を収納し
て宇宙空間の人工衛星軌道上における宇宙線から保護す
るために、前記宇宙線のうち電子及び陽子を主たる遮蔽
対象として選択した金属材料及び厚さ寸法を用いて前記
電子部品に悪影響を与えない程度に前記宇宙線を遮蔽し
たので、前記宇宙線を効果的に遮蔽し、低価格でしかも
容易に作製できるとともに確実に前記電子部品を保護す
る宇宙環境耐性強化容器を得ることができる。
As is clear from the above description, the effects of the present invention are as follows. (1) In the invention according to claim 1, in order to house consumer electronic components and protect them from cosmic rays on a satellite orbit in outer space, electrons and protons among the cosmic rays are selected as main shielding targets. Since the cosmic rays are shielded to such an extent that the electronic components are not adversely affected by using a metal material and a thickness dimension, the cosmic rays are effectively shielded, and the cosmic rays can be manufactured easily at a low cost and reliably. A space environment resistant container that protects components can be obtained.

【0033】(2)請求項2に係る発明は、前記金属材
料は、アルミニウムであるので、軽量で、安価に作製で
きるとともに確実に前記宇宙線を遮蔽して前記電子部品
を保護する宇宙環境耐性強化容器を得ることができる。
(2) The invention according to claim 2 is that, since the metal material is aluminum, it can be manufactured at a low weight and at a low cost, and can reliably shield the cosmic rays so as to protect the electronic components. A reinforced container can be obtained.

【0034】(3)請求項3に係る発明は、前記厚さ寸
法は、3mmであるので、前記電子部品に損傷を与える
ことなく、かつ、最も軽量で安価でしかも加工が容易な
宇宙環境耐性強化容器を得ることができる。
(3) In the invention according to claim 3, the thickness dimension is 3 mm, so that the electronic parts are not damaged, and the lightest, inexpensive and easy-to-work space environment resistant. A reinforced container can be obtained.

【0035】(4)請求項4に係る発明は、容器表面に
冷却板を有し、前記電子部品が容器内面に設けられてい
るので、前記電子部品で発生した熱を効果的に除去して
前記電子部品の信頼性を向上する宇宙環境耐性強化容器
を得ることができる。
(4) In the invention according to claim 4, since the cooling plate is provided on the surface of the container and the electronic component is provided on the inner surface of the container, the heat generated by the electronic component is effectively removed. A space environment resistant container that improves the reliability of the electronic component can be obtained.

【0036】(5)請求項5に係る発明は、前記電子部
品は、容器外部から挿入された銅ワイヤに接続され、前
記銅ワイヤは間に容器内面に設けられた中継プレートを
介しているので、前記銅ワイヤの接続強度が増加し、し
かも前記銅ワイヤで発生した熱を外部に除去することに
よる熱切断の防止を可能とする宇宙環境耐性強化容器を
得ることができる。
(5) In the invention according to claim 5, the electronic component is connected to a copper wire inserted from the outside of the container, and the copper wire is interposed between the relay plates provided on the inner surface of the container. In addition, it is possible to obtain a container with enhanced space environment resistance, in which the connection strength of the copper wire is increased and the heat generated by the copper wire is prevented from being thermally cut by removing the heat to the outside.

【0037】(6)請求項6に係る発明は、容器内部を
真空としたので、前記銅ワイヤなどに熱変形などのスト
レスを与えることがなく、宇宙空間での動作に空気が影
響を及ぼさない宇宙環境耐性強化容器を得ることができ
る。
(6) In the invention according to claim 6, since the inside of the container is evacuated, stress such as thermal deformation is not applied to the copper wire and the like, and air does not affect the operation in outer space. A space environment resistant container can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 この発明の実施の形態1に係る宇宙環境耐性
強化容器の構成を示す概略側面図である。
FIG. 1 is a schematic side view showing a configuration of a space environment resistance enhanced container according to Embodiment 1 of the present invention.

【図2】 この発明の実施の形態1に係る宇宙環境耐性
強化容器の構成を示す概略上面図である。
FIG. 2 is a schematic top view showing a configuration of a space environment resistance enhanced container according to Embodiment 1 of the present invention.

【図3】 宇宙線の構成要素である電子の粒子エネルギ
と粒子密度との関係を表すグラフである。
FIG. 3 is a graph showing the relationship between particle energy and particle density of electrons that are components of cosmic rays.

【図4】 宇宙線の構成要素である陽子の粒子エネルギ
と粒子密度との関係を表すグラフである。
FIG. 4 is a graph showing a relationship between particle energy and particle density of protons, which are components of cosmic rays.

【図5】 宇宙線に対するアルミニウムの厚さと放射線
吸収線量との関係を表すグラフである。
FIG. 5 is a graph showing the relationship between the thickness of aluminum with respect to cosmic rays and the radiation absorption dose.

【図6】 この発明の実施の形態1に係る別の宇宙環境
耐性強化容器の構成を示す概略側面図である。
FIG. 6 is a schematic side view showing a configuration of another space environment resistance enhanced container according to Embodiment 1 of the present invention.

【図7】 従来の放射線遮蔽容器の構成を示す概略側面
図である。
FIG. 7 is a schematic side view showing a configuration of a conventional radiation shielding container.

【符号の説明】[Explanation of symbols]

1 放射線遮蔽容器、2 容器、3 プリント基板、4
ベアチップ、8 端子、9 ガラス封止材、10 ボ
ンディングワイヤ、11 密閉容器、12 プリント基
板、13 電子部品、14 銅ワイヤ、19 中継プレ
ート、20 冷却板、30 宇宙環境耐性強化容器。
1 radiation shielding container, 2 container, 3 printed circuit board, 4
Bare chip, 8 terminals, 9 glass sealing material, 10 bonding wire, 11 hermetic container, 12 printed circuit board, 13 electronic components, 14 copper wire, 19 relay plate, 20 cooling plate, 30 container with enhanced space environment resistance.

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 民生用電子部品を収納して宇宙空間の人
工衛星軌道上における宇宙線から保護するために、前記
宇宙線のうち電子及び陽子を主たる遮蔽対象として選択
した金属材料及び厚さ寸法を用いて前記電子部品に悪影
響を与えない程度に前記宇宙線を遮蔽したことを特徴と
する宇宙環境耐性強化容器。
1. A metal material and a thickness dimension of a cosmic ray selected as a main shielding target in order to house a consumer electronic component and protect it from cosmic rays in a satellite orbit in outer space. Wherein the cosmic ray is shielded to such an extent that the electronic component is not adversely affected by using the above.
【請求項2】 前記金属材料は、アルミニウムであるこ
とを特徴とする請求項1に記載の宇宙環境耐性強化容
器。
2. The container according to claim 1, wherein the metal material is aluminum.
【請求項3】 前記厚さ寸法は、3mmであることを特
徴とする請求項2に記載の宇宙環境耐性強化容器。
3. The container according to claim 2, wherein the thickness dimension is 3 mm.
【請求項4】 容器表面に冷却板を有し、前記電子部品
が容器内面に設けられていることを特徴とする請求項1
乃至請求項3の何れかに記載の宇宙環境耐性強化容器。
4. The container according to claim 1, further comprising a cooling plate on a surface of the container, wherein the electronic component is provided on an inner surface of the container.
The container for enhancing space environment resistance according to any one of claims 3 to 3.
【請求項5】 前記電子部品は、容器外部から挿入され
た銅ワイヤに接続され、前記銅ワイヤは間に容器内面に
設けられた中継プレートを介していることを特徴とする
請求項1乃至請求項4の何れかに記載の宇宙環境耐性強
化容器。
5. The container according to claim 1, wherein the electronic component is connected to a copper wire inserted from outside the container, and the copper wire is provided via a relay plate provided on an inner surface of the container. Item 5. The container for enhancing space environment resistance according to any one of Items 4.
【請求項6】 容器内部を真空としたことを特徴とする
請求項1乃至請求項5の何れかに記載の宇宙環境耐性強
化容器。
6. The space environment resistant container according to claim 1, wherein the inside of the container is evacuated.
JP2000365420A 2000-11-30 2000-11-30 Reinforced container for space environment Pending JP2002166899A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000365420A JP2002166899A (en) 2000-11-30 2000-11-30 Reinforced container for space environment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000365420A JP2002166899A (en) 2000-11-30 2000-11-30 Reinforced container for space environment

Publications (1)

Publication Number Publication Date
JP2002166899A true JP2002166899A (en) 2002-06-11

Family

ID=18836191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000365420A Pending JP2002166899A (en) 2000-11-30 2000-11-30 Reinforced container for space environment

Country Status (1)

Country Link
JP (1) JP2002166899A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009517699A (en) * 2005-11-28 2009-04-30 テールズ Optical instrument including an entrance cavity where a mirror is installed
US8154719B2 (en) 2008-03-31 2012-04-10 Nuflare Technology, Inc. Mask inspection apparatus
JPWO2022208869A1 (en) * 2021-04-02 2022-10-06
EP4236643A1 (en) 2022-02-25 2023-08-30 NEC Corporation Ruggedizing apparatus and method for electronic equipment mounted on spacecraft
EP4243584A1 (en) 2022-03-10 2023-09-13 NEC Corporation Immersion cooling apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009517699A (en) * 2005-11-28 2009-04-30 テールズ Optical instrument including an entrance cavity where a mirror is installed
US8154719B2 (en) 2008-03-31 2012-04-10 Nuflare Technology, Inc. Mask inspection apparatus
JPWO2022208869A1 (en) * 2021-04-02 2022-10-06
WO2022208869A1 (en) * 2021-04-02 2022-10-06 三菱電機株式会社 Power semiconductor device
JP7325684B2 (en) 2021-04-02 2023-08-14 三菱電機株式会社 power semiconductor equipment
EP4236643A1 (en) 2022-02-25 2023-08-30 NEC Corporation Ruggedizing apparatus and method for electronic equipment mounted on spacecraft
EP4243586A2 (en) 2022-02-25 2023-09-13 NEC Corporation Ruggedizing apparatus and method for electronic equipment mounted on spacecraft
EP4243584A1 (en) 2022-03-10 2023-09-13 NEC Corporation Immersion cooling apparatus

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