JP2002163618A - Data memory element holding label - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a data memory element holding label, with which an article to become a sticking target or data memory element to be held is easily recycled and a release paper is unnecessitated as well. SOLUTION: An adhesive layer 12 formed on one side of a base material 11 and a data memory element 13 held on the base material 11 are included. This adhesive layer 12 is formed from an adhesive agent such as delayer adhesive agent, with which adhesion appears by prescribed external stimuli.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a data storage element holding label provided with a data storage element,
The present invention relates to a data storage element holding label that can be attached to an article as needed by laminating an adhesive layer that exhibits adhesiveness due to some external stimulus.

[0002]

2. Description of the Related Art Conventionally, an automatic recognition management system using a bar code has been used for merchandise management in distribution, sales and the like. The barcode is an information of the arrangement state of images (bars), and the information can be read by a dedicated barcode reader. For this reason, for example, merchandise management and distribution management are performed by attaching a barcode recording merchandise information to the merchandise. However, the barcode has a problem that a large amount of information cannot be described, information cannot be updated, and forgery is easy. Therefore, in recent years, RFID (Radio Frequency Identificati
A system called “on: radio frequency recognition” has attracted attention.

In this system, a large amount of information is stored in a semiconductor (IC) chip, and a planar antenna for transmitting and receiving information is connected to the IC chip. Then, when a radio wave of a predetermined frequency emitted by the reader is received by the antenna, information stored in the internal IC chip is transmitted to the reader via the antenna according to the radio wave. Update information from the reader is also transmitted to the IC chip via the antenna, and the information stored in the IC chip is updated. (Hereinafter, a combination of an IC chip, an antenna, and a capacitor attached thereto is referred to as a “data storage element”).

[0004] This data storage element is first put to practical use as an IC card. In this case, the data storage element is sandwiched between plastic films or the like and appropriately thermocompression-bonded, whereby an IC card in which the data storage element is held in hard plastic is manufactured. The IC card is provided to the user as appropriate, for example, as an employee ID card. On the other hand, from the viewpoint of merchandise management and physical distribution management, it is more convenient to attach the data storage element to a merchandise or the like. From such a thing,
Various types of adhesive labels incorporating a data storage element (hereinafter referred to as “data storage element holding labels”) have been proposed.

[0005]

This data storage element holding label is stored using a release paper before it is attached to a product or the like, and is difficult to peel off from the product or the like to be affixed once attached. Was something. However, for example, if the data storage element holding label is affixed to a cardboard box for packing products, the data storage element will have an adverse effect when recycling the used cardboard box. For this reason, it is necessary to cut the entire cardboard box material at the affixed portion and remove the label, and the like, and the efficiency of recycling has been significantly impaired. Further, even if the user intends to recover the data storage element at the time of sale or the like, the recovery is practically difficult because the product or the packaging material of the product is damaged. Further, there has been a problem that the release paper also becomes garbage as it is after pasting.

SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides a data storage element holding label that makes it easy to recycle a product or the like to be affixed, and to recycle a held data storage element, and does not require a release paper. That is the task. Furthermore, when a predetermined external stimulus is applied to the IC chip,
An object of the present invention is to provide a data storage element holding label in which a data storage element is not destroyed.

[0007]

According to the present invention, in order to solve the above-mentioned problems, an adhesive layer formed on one surface side of a substrate, and the adhesive layer held on the substrate and / or the adhesive layer are provided. A data storage element, wherein the pressure-sensitive adhesive layer is made of an adhesive that exhibits adhesiveness by a predetermined external stimulus.

According to the data storage element holding label of the present invention, the label does not have adhesiveness when no external stimulus is given, and therefore can be stored without a release paper. Further, even after once affixed to a product or the like, the adhesiveness is again exhibited by applying an external stimulus, so that the peeling becomes easy. For this reason, it becomes easy to recycle a product or the like to be affixed and to recycle a held data storage element.

In the present invention, it is desirable that the data storage element is held inside the base material. In this case, it is easy to protect the data storage element from external stimuli, especially pressure.
This is because a relatively strong material can be easily selected for the base material, which can be protected by holding the data storage element therein. Therefore, there is an advantage that the delicate IC chip can be easily protected against a pressing force at the time of attaching the data storage element holding label to a product or the like, a shock at the time of storage before pasting or at the time of distribution of the product.

[0010] The data storage element can be held in various places depending on the purpose other than being held inside the base material as described above. That is, the data storage element can be held inside the pressure-sensitive adhesive layer. In this case, since the base material protects the IC chip from external impacts received during distribution of the product and the like, and the pressure-sensitive adhesive layer surrounding the data storage element has elasticity, the external impact is also reduced. . Further, if an external stimulus for expressing adhesiveness is applied, not only the entire data storage element holding label can be peeled off from the product or the like, but also the data storage element can be easily separated from the base material. Therefore, it is easier to collect and reuse the data storage element.

Further, the data storage element can be held between the substrate and the pressure-sensitive adhesive layer. Again,
The base material is IC
In addition to protecting the chip, the pressure-sensitive adhesive layer existing between the data storage element and the product has elasticity, so that an external impact is also reduced. The data storage element and the base material may be fixed with a normal adhesive, printing, or the like, or may simply be in contact with each other. However, in the case of merely touching, in order to hold the data storage element, the area of the pressure-sensitive adhesive layer made of the adhesive whose adhesiveness is developed by an external stimulus should be sufficiently larger than the area of the data storage element. is necessary. When they are merely in contact with each other, it is easy not only to peel the entire data storage element holding label from the product or the like, but also to separate the data storage element from the base material. Therefore, it is easier to collect and reuse the data storage element.

Further, the data storage element can be held on the surface of the substrate opposite to the surface bonded to the pressure-sensitive adhesive layer. In this case, the data storage element can be added to the base material by a normal adhesive or printing, and is easy to manufacture.
Labels provided with a pressure-sensitive adhesive layer made of a pressure-sensitive adhesive that exhibits tackiness by an external stimulus are distributed as general-purpose labels, and a data storage element can be added to such a general-purpose label later. It is possible. Therefore, it is easy to manage the materials.

Further, the data storage element can be held on the surface of the pressure-sensitive adhesive layer opposite to the surface bonded to the base material. In this case, it is necessary that the area of the pressure-sensitive adhesive layer is larger than the area of the data storage element in order to secure a surface to be attached to a product or the like. When held in this manner, the base material protects the IC chip from external impacts received during distribution of the product, etc., and the adhesive layer existing between the data storage element and the base material has elasticity. This also reduces external impact. Further, since the area of the pressure-sensitive adhesive layer to be attached to a product or the like can be formed to be small, the entire data storage element holding label can be easily peeled off from the product or the like if an external stimulus for expressing adhesiveness is applied. It is also easy to separate the data storage element from the substrate. Therefore, it can be suitably used when the data storage element label is frequently peeled and collected and reused.

In each of the holding modes, the IC
The position of the chip is not particularly limited, and may be on the side facing the antenna to which the antenna is to be attached or on the opposite side.

In the present invention, the predetermined external stimulus is not particularly limited, and includes, for example, addition of heat, water, light, pressure, electricity and the like. Among them, stimulation to add heat or water is preferable from the viewpoint of simplicity. There is no particular limitation on the adhesive which develops adhesiveness by heating, and any adhesive may be used as long as the adhesiveness with the article is completed at the same time as the adhesiveness is developed. For example, a delayed type adhesive, a hot melt type adhesive, a side chain crystalline polymer having crystallinity in a side chain of a synthetic polymer, or the like can be used.

In the present invention, it is desirable that the pressure applied to the object be 100 Pa or less. This can prevent the delicate IC chip from being destroyed. The pressure at the time of sticking to the object mainly means the pressure at the time of pressure bonding to the object after the adhesiveness is developed.
Further, when the external stimulus for developing the adhesiveness is pressure, the pressure at which the adhesiveness is developed also becomes a problem.

As described above, if the pressure at the time of sticking to the object, especially the pressure at the time of pressure bonding to the object after the adhesiveness is developed, is likely to cause the destruction of the data storage element. The pressure required when crimping to this object is
It tends to increase as the storage modulus increases. Therefore, in the present invention, it is preferable that the storage elastic modulus when the tackiness is developed, that is, the storage elastic modulus of the pressure-sensitive adhesive layer in the bondable region is 10 Pa to 5000 Pa. Note that the lower limit is set to 10 Pa because if the pressure is less than 10 Pa, the flowability of the pressure-sensitive adhesive is large, and the label may be misaligned at the time of adhesion, thereby damaging the appearance.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. In the following drawings, the direction perpendicular to the surface of the substrate is significantly emphasized for explanation. However, the unevenness in the direction perpendicular to the surface of the base material is actually very small, and each member has some elasticity. Therefore, the surface of each data holding label is on both sides,
Practically, it can be regarded as a planar shape.

First, FIG. 1 shows a first embodiment of the present invention.
It is sectional drawing which shows one form of the data storage element holding | maintenance label in which the data storage element is hold | maintained inside the base material. The data storage element holding label 10 is provided on one surface 1 of the base material 11.
On 1a, an adhesive layer 12 that exhibits adhesiveness by a predetermined external stimulus is formed. The exposed surface 12a of the pressure-sensitive adhesive layer 12, that is, the surface on which the substrate 11 is not provided, can be attached to an object such as a product. The data storage element 13 is held inside the base material 11. The data storage element 13 includes a data storage unit 13a
(IC chip) and a transmission / reception unit 13b (antenna or the like). In the present embodiment, as a specific mode of holding the data storage element 13 inside the base material 11, a surface base material 11b and an internal base material 11c are prepared, and the data storage element 13 is interposed therebetween through an adhesive layer 14. Is sandwiched. Examples of the adhesive constituting the adhesive layer 14 include an adhesive for dry lamination, an adhesive for wet lamination, a hot-melt adhesive, and an adhesive having constant tackiness. If the surface substrate 11b and the inner substrate 11c can be sealed by heat, the adhesive layer 14 may be omitted and both substrates may be directly heat-sealed.

FIG. 2 is a sectional view showing an embodiment of a data storage element holding label in which a data storage element is held inside an adhesive layer according to a second embodiment of the present invention. The data storage element holding label 20 is provided on one surface 21 of the base 21.
The first pressure-sensitive adhesive layer 22 that exhibits tackiness by a predetermined external stimulus is formed on a. Further, a second pressure-sensitive adhesive layer 24 that exhibits tackiness by a predetermined external stimulus is formed on a surface 22a of the pressure-sensitive adhesive layer 22 opposite to the substrate 21. The exposed surface 24a of the second pressure-sensitive adhesive layer 24 opposite to the first pressure-sensitive adhesive layer 22 can be attached to an object such as a product. Then, the data storage unit 23a
(IC chip) and the data storage element 23 formed by the transmission / reception unit 23b (antenna or the like)
And the second pressure-sensitive adhesive layer 24. The entire periphery of the data storage element 23 is adhered to the adhesive layer 22 or the adhesive layer 24. The first pressure-sensitive adhesive layer 22
The second adhesive layer 24 and the second adhesive layer 24 may use the same adhesive or different adhesives.

FIG. 3 is a sectional view showing an embodiment of a data storage element holding label in which a data storage element is held between a base material and an adhesive layer according to a third embodiment of the present invention. The data storage element holding label 30 has an adhesive layer 32 on one surface 31a of a base material 31 that exhibits adhesiveness by a predetermined external stimulus. The exposed surface 32a of the pressure-sensitive adhesive layer 32 opposite to the base material 31 can be attached to an object such as a product. Then, the data storage unit 33
The data storage element 33 formed from a (IC chip) and the transmission / reception unit 33b (antenna or the like) is held between the base material 31 and the adhesive layer 32. The surface 33 c of the data storage element 33 on the side of the adhesive layer 32 is adhered to the adhesive layer 32.

FIG. 4 is a cross-sectional view showing one form of a data storage element holding label according to a fourth embodiment of the present invention, in which the data storage element is held on the surface of the base opposite to the adhesive layer. . The data storage element holding label 40 has an adhesive layer 42 on one surface 41a of a base material 41 which exhibits adhesiveness by a predetermined external stimulus. This adhesive layer 4
The exposed surface 42a on the opposite side of the second base material 41 can be attached to an object such as a product. The data storage element 43 formed by the data storage section 43a (IC chip) and the transmission / reception section 43b (antenna or the like)
Is fixed to the surface 41b opposite to the pressure-sensitive adhesive layer 42 by bonding, printing, or the like.

FIG. 5 is a cross-sectional view showing a form of a data storage element holding label according to a fifth embodiment of the present invention, in which the data storage element is held on the surface of the adhesive layer opposite to the base material. . In the data storage element holding label 50, an adhesive layer 52 is formed on one surface 51 a of a base material 51. The adhesive layer 52 develops adhesiveness by a predetermined external stimulus. Data storage unit 5
The data storage element 53 formed of the 3a (IC chip) and the transmission / reception unit 53b (antenna or the like) adheres to a part of the surface 52a of the adhesive layer 52 opposite to the base material 51 on the surface 53c. Is held. The exposed surface of the surface 52a to which the data storage element 53 is not adhered can be attached to an object such as a product.

FIG. 6 is a plan view of the data storage element holding label according to the first to fifth embodiments. As shown in FIG. 6, in any of the embodiments, the pressure-sensitive adhesive layer 1
2, 22, 24, 32, 42, and 52 are substrates 11,
21, 31, 41, and 51 are formed over the entire surface. Further, the transmitting and receiving units 13b, 23b,
33b, 43b, and 53b are base materials 11, 21, 3 respectively.
The area is smaller than that of 1, 41, 51, and is formed at the central portion thereof. The data storage units 13a, 23a, 33a, 43a, and 53a of the data storage element are each formed at one corner of the transmission / reception unit.

Here, in each of the above-described embodiments, the pressure-sensitive adhesive which exhibits tackiness by a predetermined external stimulus of the pressure-sensitive adhesive layer will be described. As described above, the pressure-sensitive adhesive preferably has a storage modulus of 10 Pa to 5000 Pa when the tackiness is developed, that is, the storage modulus of the pressure-sensitive adhesive layer in the bondable region. The storage elastic modulus refers to a dynamic viscoelasticity measuring device (RHEOVI manufactured by Orientec as an example of a measuring device).
This refers to the cosine component of each phase δ of the dynamic complex elastic modulus obtained when an adhesive resin formed into a plate having a thickness of about 2 mm is subjected to shear deformation at a frequency of 1 Hz using BRON DDV-25FP). In the present invention, since the storage elastic modulus in the bondable region is a problem, a predetermined external stimulus for developing adhesiveness, such as heating to 120 ° C., is applied to the adhesive resin formed into a plate shape. The stimulus is applied before the test.

The method of controlling the storage modulus includes the glass transition temperature and molecular weight of the thermoplastic resin, the softening point of the tackifier,
Adjustment of the melting point and molecular weight of the wax component may be mentioned. It is also effective to improve the compatibility of various materials by adjusting the mixing ratio and changing the composition of each of the thermoplastic resin, the tackifier, and the wax component. Hereinafter, as an easy-to-handle adhesive among pressure-sensitive adhesives that exhibit adhesiveness by a predetermined external stimulus, a delate-type adhesive, a hot-melt-type adhesive, and a re-wet-type adhesive, a desirable composition,
The properties and the like will be described in detail.

The delate type adhesive is an adhesive which develops tackiness when heated, and maintains its tackiness for a while even if the temperature is lowered to room temperature after heating. The composition of the delayed adhesive mainly comprises a thermoplastic resin, a solid plasticizer, and a tackifier. The thermoplastic resin is not particularly limited, and examples thereof include a (meth) acrylate copolymer, an ethylene-vinyl acetate copolymer, an ethylene- (meth) acrylate copolymer, and a styrene-butadiene-styrene copolymer. , A glass transition point of styrene-isoprene-styrene copolymer or the like is −40 ° C. to 50 ° C.,
Preferably, the temperature is from -20 ° C to 30 ° C. By the way, if the glass transition point is lower than −40 ° C., the adhesive layer may show tackiness even at room temperature. Conversely, if the temperature exceeds 50 ° C., the temperature of the softening point becomes extremely high, and a high temperature is required at the time of bonding, which may destroy the IC chip, and is not desirable in terms of economy and safety. These thermoplastic resins are used alone or in combination.

The solid plasticizer used for the delayed type adhesive is not particularly limited. For example, diphenyl phthalate, dihexyl phthalate, dicyclohexyl phthalate,
Dihydroabiethyl phthalate, dimethyl isophthalate,
Diisohexyl phthalate, sucrose benzoate, ethylene glycol dibenzoate, trimethylolethane tribenzoate, glyceride tribenzoate, pentaerythritol tetrabenzoate, sucrose octaacetate, tricyclohexyl citrate, N-cyclohexyl-p-toluenesulfone Examples thereof include amides and the like having a melting point of 50 to 100 ° C. These solid plasticizers are used alone or in combination. By the way, if the melting point is less than 50 ° C., the adhesiveness is exhibited even at room temperature,
Conversely, if the temperature exceeds 100 ° C., a large amount of heat energy is required to develop the adhesiveness, which is not efficient.

The tackifier used in the delayed type adhesive is not particularly limited. Examples thereof include rosin, polymerized rosin, disproportionated rosin and derivatives thereof, polyterpene resins, phenol-modified resins such as terpene phenol and rosin phenol, and alkylphenol. Resin, Coumarone-
Indene resin, xylene resin, aliphatic hydrocarbon resin, alicyclic saturated hydrocarbon resin, aromatic hydrocarbon resin and its hydrogenated product, styrene resin, vinyl toluene-α-methylstyrene copolymer and the like, Those having a softening point of 150 ° C. or less, preferably 50 ° C. to 130 ° C. can be applied. By the way, if the softening point exceeds 150 ° C., a high temperature is required at the time of bonding, which may destroy the IC chip, and is not desirable in terms of economy and safety. These tackifiers are used alone or in combination.

The mixing ratio of the thermoplastic resin, the solid plasticizer, and the tackifier in the delayed adhesive is about 20 to 60% by mass, about 20 to 60% by mass, and about 20 to 60% by mass, respectively, in the total solid content.
The content is about 60% by mass, and is appropriately adjusted depending on the adhesiveness, storage stability, and the like of the label. Also, if necessary, preservatives, dyes,
Various additives such as an ultraviolet absorber, an antioxidant, a pH adjuster, and an antifoaming agent can be added in a range that does not impair the adhesiveness.

Next, the hot-melt type adhesive is an adhesive which develops tackiness when heated, but is different from the derate type adhesive in that it is activated only at high temperatures and deactivated when the temperature is lowered to room temperature. is there. The composition of the hot melt adhesive mainly comprises a thermoplastic resin, a tackifier and a wax. There is no particular limitation on the thermoplastic resin, for example,
Heat of (meth) acrylate copolymer, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylate copolymer, styrene-butadiene-styrene copolymer, styrene-isoprene-styrene copolymer, etc. Examples thereof include those having a softening point of 40 ° C. to 100 ° C., preferably 60 ° C. to 80 ° C., such as an olefin-based polymer such as a plastic elastomer, amorphous polyalphaolefin such as polyethylene and polypropylene. Incidentally, if the softening point is lower than 40 ° C., the adhesive layer may exhibit tackiness even at room temperature. Conversely, if the softening point exceeds 100 ° C., a high temperature is required at the time of bonding, which may destroy the IC chip, and is not desirable in terms of economy and safety. These thermoplastic resins are used alone or in combination.

The tackifier used in the hot melt type adhesive is not particularly limited, and examples thereof include rosin, polymerized rosin, disproportionated rosin and derivatives thereof, polyterpene resins, phenol-modified resins such as terpene phenol and rosin phenol, Alkylphenol resin, Coumarone-
Indene resin, xylene resin, aliphatic hydrocarbon resin, alicyclic saturated hydrocarbon resin, aromatic hydrocarbon resin and its hydrogenated product, styrene resin, vinyl toluene-α-methylstyrene copolymer and the like, Those having a softening point of 150 ° C. or less, preferably 50 ° C. to 130 ° C. can be applied. By the way, if the softening point exceeds 150 ° C., a high temperature is required at the time of bonding, which may destroy the IC chip, and is not desirable in terms of economy and safety. These tackifiers are used alone or in combination.

The wax used in the hot-melt adhesive is not particularly limited. For example, petroleum waxes such as paraffin wax, montan wax, carbana wax, candelilla wax, micro wax, polyethylene wax, polypropylene wax, etc. Synthetic wax having a melting point of 50 ° C to 200 ° C, preferably 6 ° C
0 ° C to 120 ° C with a molecular weight of 300 to 200
0, preferably 500 to 1500. If the melting point is lower than 50 ° C., there is a problem in the preservability of the label. Conversely, if the melting point is higher than 200 ° C., a high temperature is required at the time of bonding, which may destroy the IC chip. Absent. On the other hand, when the molecular weight is less than 300, the pseudo-collecting force of the adhesive layer may decrease. Conversely, if the molecular weight is too high, the viscosity of the wax increases, so that the adhesive layer becomes hard, and a large pressure is required at the time of bonding, which may break the IC chip.

The mixing ratio of the thermoplastic resin, the tackifier and the wax of the hot melt type adhesive is 2% in the total solid content.
About 0 to 60% by mass, about 20 to 60% by mass, 20 to 6%
The content is about 0% by mass, and is appropriately adjusted depending on the adhesiveness, preservability and the like of the label. If necessary, various additives such as a preservative, a dye, an ultraviolet absorber, an antioxidant and the like can be added within a range that does not impair the adhesiveness.

The delayed adhesive and the hot melt adhesive are preferred examples of use because the storage elastic modulus of the adhesive decreases as the heating temperature increases, and the bonding can be completed with a light pressure.

Next, the rewetting type adhesive is an adhesive which exhibits adhesiveness by absorbing water. Examples of rewetting adhesives include glue, gum arabic, gum tragacanth, starches such as oxidized starch and etherified starch, dextrin, polyvinyl ethers such as polyvinyl alcohol, polyvinyl methyl ether, polyvinyl ethyl ether, polyvinyl isobutyl ether, and polyvinyl ether. Examples include cellulose derivatives such as pyrrolidone, methylcellulose, carboxymethylcellulose, hydroxyethylcellulose, ethylhydroxyethylcellulose, viscose, polyethylene glycol, polyethylene oxide, casein, gelatin, sodium alginate and the like. Among them, polyvinyl alcohol is preferred in terms of storage stability and adhesiveness in a humid environment.

The degree of saponification of polyvinyl alcohol used for the rewetting type adhesive layer can be 70 to 99%, preferably 70% to 85%. When the saponification degree is less than 70%, the storage stability in a humid environment is poor, and blocking tends to occur. If the degree of saponification exceeds 99%, activation of the re-wet adhesive layer is insufficient even when water is applied to the re-wet adhesive layer, so that a large pressure is required at the time of bonding, which may destroy the IC chip. There is.

The re-wet adhesive layer includes, for example, carbonates, oxides, hydroxides, sulfates and the like of aluminum, zinc, calcium, magnesium, barium, titanium, etc., natural silica, zeolite, kaolin, calcined Inorganic pigments including clays such as kaolin, starch, styrene resin, polyolefin resin, melamine resin, acrylic resin, paraffin, natural wax, synthetic wax and other anti-blocking agents, and if necessary, hardening agents, preservatives, Various additives such as a dye, an ultraviolet absorber, an antioxidant, a pH adjuster, and an antifoaming agent can be added as long as the adhesiveness is not impaired.

Next, the base material used in each of the above embodiments will be described. As the material of the base material, paper such as high-quality paper, art paper, coated paper, cast coated paper, kraft paper, polyethylene laminated paper, impregnated paper, foamed paper, polyolefin (eg, polyethylene, polypropylene, etc.), polyvinyl chloride (Eg, soft polyvinyl chloride, hard polyvinyl chloride, etc.), polyester (eg, polyethylene terephthalate, modified polyethylene terephthalate (commercialized as PET-G), etc.), resins such as polystyrene, polyurethane, cellophane, etc. Films, foamed films in which a foaming agent is blended with the resin and foamed, films such as porous films in which the resin is blended with an inorganic pigment, an organic pigment, etc. to form voids by stretching, or synthetic papers and nonwoven fabrics , And a laminated sheet obtained by laminating these. Thermal recording on one side of these sheets, pressure-sensitive recording, thermal transfer recording, can also be used as the formation of the various recording layer such as an ink jet recording. Usually, the thickness of the substrate is preferably about 10 to 150 μm.

In each of the above embodiments, a well-known coating apparatus is used for laminating an adhesive layer which exhibits adhesiveness by a predetermined external stimulus on a substrate or a substrate on which a data storage element is partially laminated. Is used. For example, roll coater, knife coater, bar coater, die coater, comma coater, lip coater, reverse gravure coater,
A variegated gravure coater or the like is appropriately used. The coating amount of the adhesive is adjusted in a range of about 1 to 50 g / m ^{2 on} a dry weight basis. By the way, if it is 1 g / m ² or less, the adhesiveness is poor,
If it exceeds 50 g / m ² , the adhesiveness is saturated and the economy is low.

In each of the above embodiments, the data storage element is not particularly limited, and includes a substantially flat transmission / reception unit (antenna unit) and a data storage and / or operation unit connected to the transmission / reception unit. Can be used. As such a data storage element, a data storage element practically used in an IC card or the like can be appropriately used. As the transmitting and receiving unit, a method of attaching a coil made of a wire such as silver or copper to an insulating sheet having a thickness of 20 to 100 μm made of a resin such as polyethylene terephthalate, polypropylene or polyethylene, etching copper or aluminum into a coil shape Method, using a conductive ink or the like on a coiled antenna printed in a coil shape using a conductive ink or the like, polyethylene terephthalate, polypropylene, a resin such as polyethylene or a 20 to 100 μm thick insulating sheet made of paper or the like. A plate antenna on which printing or metal such as copper or aluminum is deposited can be used. Various IC chips can be used as the data storage and / or operation unit. In addition, it is also possible to appropriately arrange a condenser and the like. Further, the data storage element may be fixed or protected by a resin film, a resin plate or the like.

In each of the above embodiments, in order to protect the data storage element from an external stimulus, in particular, a stimulus for causing the adhesive to exhibit adhesiveness, a part or all of the periphery of the data storage element is covered with a barrier layer. Can also be covered by Specifically, when the pressure-sensitive adhesive layer is formed with a delate-type adhesive or a hot-melt-type adhesive, by using a heat-insulating material such as hollow particles or a foamed film as a barrier layer, an additional layer is used to develop the adhesiveness. The data storage element can be protected from the applied heat. In the case where the pressure-sensitive adhesive layer is formed with a re-wet adhesive, the data storage element can be protected from water added to develop tackiness by using a waterproof material as the barrier layer. Therefore, rusting and the like can be prevented. Note that the barrier layer may be provided at a position directly in contact with the data storage element, or may be provided in the base material or the pressure-sensitive adhesive layer.

Of the above embodiments, the data storage element holding label 10 of the embodiment shown in FIG. 1 can be continuously manufactured using, for example, a manufacturing apparatus schematically shown in FIG.
This manufacturing apparatus includes sheet feeding means 72 for feeding a surface base sheet 15 having an adhesive layer 14 formed on one surface 11d of a surface base 11b, and an adhesive layer 14 of the fed surface base sheet 15. Data storage element 13 on side surface
Arranging means 60 for arranging so that one surface thereof faces each other.
And an adhesion means 80 for adhering the pressure-sensitive adhesive laminate sheet 16 in which the pressure-sensitive adhesive layer 12 and the internal base material 11c are laminated on the other surface 13d side of the data storage element 13 so as to be positioned.
And

Examples of the means for forming the adhesive layer 14 include a reverse roll coater, a knife coater, a bar coater, a slot die coater, a lip coater, an air knife coater, a reverse gravure coater, a variogravure coater and the like. 11b,
Thereafter, the surface base sheet 15 can be obtained by drying. Alternatively, the adhesive layer 14 may be formed by applying an adhesive to another substrate having releasability, and then transferring the adhesive layer 14 to the surface substrate 11b.

As described above, the adhesive layer 14 is formed on the surface substrate 11b.
The surface base sheet 15 formed above is fed out to the arranging means 60 by sheet feeding means 72 including a sheet feeding roll 74 and a release paper winding roll 76. Note that a release paper 71 may be temporarily disposed on the adhesive layer 14 of the surface base sheet 15 as needed. For this reason, in the illustrated example, the release paper 71 is wound up on the release paper take-up roll 76, and only the surface base sheet 15 is fed out from the sheet feed-out roll 74 to the arrangement means 60.

The arranging means 60 includes a gripping means 65 having a suction surface 62 for sucking and gripping the data storage element 13 and a suction surface 62 of the gripping means 65 via the adhesive layer 14 and the surface substrate 11b. A data storage having a pedestal 63 opposed to the front base material sheet 15 and a drive roll 91 for continuously feeding a predetermined number of data storage elements 13 from a data storage element roll 90 in which the data storage elements 13 are connected. Element supply means 61 is provided. The roll surface of the drive roll 91 is provided with an elastic body such as a cushion material, so that when the data storage element 13 is sandwiched, the data storage section 13a and the like are not broken. Further, a moving unit (not shown) is provided in the gripping means 65 so as to move up and down with respect to the fixed base 63. When the data storage element 13 reaches the vicinity of the adhesive layer 14, the data storage element 13 is detached from the suction surface 62, and the data storage element 13 is separated from the adhesive layer 1.
4 can be arranged on the surface. Further, the gripping means 65 is provided with a cut portion (not shown) for separating the data storage elements 13 from the data storage element roll 90 one by one. Further, at least one of the suction surface 62 and the surface 63a of the pedestal 65 facing the gripping means 65 is provided with an elastic body such as a cushion material, and is a data interposed between the suction surface 62 and the pedestal 63 in the arrangement step. The storage element 13 is not destroyed.

The adhesive means 80 holds the pressure-sensitive adhesive laminated sheet 16 composed of the internal base material 11c and the pressure-sensitive adhesive layer 12 which exhibits tackiness by a predetermined external stimulus, on the upper side of the data storage element 13, that is, on the other side of the data storage element 13. Is adhered to the surface 13d side with the internal base material 11c side down. The pressure-sensitive adhesive laminate sheet 16 is supplied between the twin roll 82 and the data storage element 13 from the laminate sheet feeding roll 78 of the supply means 70 provided in the adhesion means 80 via the guide roll 79. I have. And
Here, the data storage element 1 is controlled by the twin rolls 82, 82.
3. Twin roll 82,82
Also, the roll surface of at least one of the rolls is provided with an elastic body such as a cushion material, so that the data storage section 13a of the data storage element 13 is not broken during the pressure bonding step.

The means for forming the pressure-sensitive adhesive layer 12 includes:
Examples include a reverse roll coater, knife coater, bar coater, slot die coater, lip coater, air knife coater, reverse gravure coater, and variogravure coater. Lumber 11c
And then dried to obtain a pressure-sensitive adhesive laminated sheet 16.

In this manufacturing apparatus, the data storage section 13 in the data storage element holding label 10 before and after completion is further provided.
Monitors 100 and 101 are provided for remotely detecting the defect a. The monitors 100 and 101 can detect a defect in the data storage unit 13a that has occurred before the data is supplied from the data storage element supply unit 61 or during manufacturing.

When the data storage element label 10 of the embodiment illustrated in FIG. 1 is manufactured using this manufacturing apparatus, the surface base sheet 15 is gripped by the sheet feeding means 72 on the side of the adhesive layer 14 by the gripping means. 65, and the moving direction of the suction surface 62,
That is, it is fed out perpendicular to the vertical direction in FIG. Then, the arranging means 60 attaches the data storage element 1 supplied from the data storage element
The other surface side 13d of 3, that is, the transmitting / receiving section 13b side is sucked and gripped, and the data storage element 13 is separated from the data storage element roll 90 by the operation of the cutting section. afterwards,
When the moving unit holding the data storage element 13 is lowered, the data storage element 13 is attached to the adhesive layer 14 of the surface base sheet 15 on the facing surface 63a of the pedestal 63 disposed below the surface base sheet 15. And the data storage element 13 is detached from the suction surface 62. Next, after the pressure-sensitive adhesive laminated sheet 16 is disposed from the supply device 70 on the surface base sheet 15 on which the data storage elements 13 are disposed, the pressure-sensitive adhesive laminated sheet 16 is sandwiched and adhered by the twin rolls 82, 82. At this time,
The data storage section 13a of the data storage element 13 includes the adhesive layer 1
Overhang slightly to the side of 2. Then, the sheet to which these are adhered is wound up by a winding device (not shown), and then cut, whereby the data storage element holding label 10 can be manufactured.

[0051]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail below with reference to embodiments of a delivery slip, but of course the present invention is not limited thereto. In the examples, all percentages, parts, weights, ratios, coating amounts, and the like are indicated by solid weight unless otherwise specified. Further, the reference numerals in each embodiment are the same as those in FIG.

Example 1 As shown below, the data storage element holding label of the first embodiment was manufactured using a delayed type adhesive. (1) Adhesive Laminated Sheet A release base paper (trade name: OET50, manufactured by Oji Paper Co., Ltd.) coated on one side with a seal is prepared as the inner base material 11c, and a delayed adhesive (trade name) is provided on the seal layer side. : DW-20
10, manufactured by Toyo Ink Manufacturing Co., Ltd., using a comma coater so as to have a dry weight of 15 g / m ^2, and dried with a hot-air dryer at 40 ° C. to form an adhesive layer 12. (2) Data Storage Element As the data storage element 13, a data storage element in which an IC chip was laminated on a coil-shaped antenna obtained by etching aluminum into a coil shape on polyethylene terephthalate was used. (3) Surface Base Sheet As the surface base sheet, a heat-sensitive adhesive sheet for thermal transfer recording (trade name: TKP85 / P22 / G7W, manufactured by Oji Tack) was used. In this sheet, an adhesive layer 14 is formed on one surface of a surface substrate 11, and a thermal transfer layer is formed on the other surface. The adhesive layer 14 is commercially available with the release paper 71 disposed on the exposed surface. (4) Adhesion of data storage element to surface substrate sheet
The data storage element 13 having a smaller area than the adhesive layer 14 was bonded and laminated to the exposed adhesive layer 14. (5) Lamination of Adhesive Laminated Sheet Using the remaining surface to which the data storage element 13 was adhered, the inner substrate 11c side of the adhesive laminated sheet was bonded to the adhesive layer 14 of the surface substrate sheet. Thereby, the thermal transfer layer, the surface substrate 11c, the adhesive layer 14, the data storage element 1
3. A data storage element holding label was obtained in which the internal base material 11c and the pressure-sensitive adhesive layer 12 (delayed type) were laminated in this order.

Example 2 The data storage element holding label of the first embodiment was manufactured by using a rewetting adhesive as follows. (1) Adhesive laminated sheet A release base paper (trade name: OET50, manufactured by Oji Paper Co., Ltd.) coated with one side as an internal base material 11c is prepared. Coating was performed using a comma coater so that the weight was 15 g / m ^2, and the coating was dried with a hot-air dryer at 40 ° C. to form an adhesive layer 12. The re-wettable adhesive is polyvinyl alcohol having a saponification degree of 88% (trade name: P
VA204, manufactured by Kuraray Co., Ltd.) was dissolved in water heated to 90 ° C., and a rewetting adhesive having a solid content of 10% was used. (2) Data Storage Element As in the first embodiment, as the data storage element 13, a data storage element in which an IC chip was laminated on a coiled antenna obtained by etching aluminum in a coil shape on polyethylene terephthalate was used. (3) Surface base sheet An adhesive sheet for direct thermal recording (trade name: GP50 / P22 / G6B, manufactured by Oji Tack) was used as the surface base sheet. This sheet is commercially available with an adhesive layer 14 formed on one surface of a surface substrate 11 and a release paper 71 disposed on an exposed surface of the adhesive layer 14. (4) Adhesion of data storage element to surface substrate sheet The peeling sheet of the direct thermal recording adhesive sheet is peeled off, and the data storage element 13 having a smaller area than the adhesive layer 14 is bonded to the exposed adhesive layer 14. Laminated. (5) Lamination of Pressure-Sensitive Adhesive Sheet Using the remaining surface to which the data storage element 13 was adhered, the internal substrate 11c side of the pressure-sensitive adhesive laminated sheet was bonded to the adhesive layer 14 of the front substrate sheet. As a result, a data storage element holding label in which the surface base material 11c, the adhesive layer 14, the data storage element 13, the internal base material 11c, and the adhesive layer 12 (rewet type) were laminated in this order was obtained.

Each of the data storage element holding labels obtained in Examples 1 and 2 can be read and written by a reader / writer, can also be recorded by a printer corresponding to each, and furthermore, can be heated, Adhesion was developed by treatment with water or the like, and it was possible to adhere to a cardboard box or peel off as appropriate with a force that would not impact the built-in IC chip.

[0055]

The data storage element holding label of the present invention is
Usually, since there is no adhesiveness, a release paper is unnecessary, and printing with a printer is easy. When used for management of goods, etc., it has a data storage element, so it is possible to input and rewrite a large amount of information, and when necessary, give adhesiveness by treating with heat, water, etc., and stick directly to the goods Can be
Various usage forms are possible. Further, even after once affixed to a product or the like, application of a predetermined external stimulus causes the adhesiveness to reappear, thereby facilitating peeling. For this reason, it becomes easy to recycle a product or the like to be affixed and to recycle a held data storage element.

[Brief description of the drawings]

FIG. 1 is a sectional view of a data storage element holding label according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a data storage element holding label according to a second embodiment of the present invention.

FIG. 3 is a sectional view of a data storage element holding label according to a third embodiment of the present invention.

FIG. 4 is a sectional view of a data storage element holding label according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view of a data storage element holding label according to a fifth embodiment of the present invention.

FIG. 6 is a plan view of a data storage element holding label according to the first to fifth embodiments of the present invention.

FIG. 7 is a schematic configuration diagram illustrating an example of a data storage element manufacturing apparatus.

[Explanation of symbols]

10: data storage element holding label, 11: base material, 11b
... surface base material, 11c ... internal base material, 12 ... adhesive layer, 13
... data storage element, 13a ... data storage part, 13b ... transmission / reception part, 14 ... adhesive layer

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Takeshi Uemura 27-27, Hirade Industrial Park, Utsunomiya City, Tochigi Pref. BB09 CA23

Claims (6)

[Claims] 1. The pressure-sensitive adhesive layer comprising: a base material; a pressure-sensitive adhesive layer formed on one surface side of the base material; and a data storage element held by the base material and / or the pressure-sensitive adhesive layer. Wherein the label comprises a pressure-sensitive adhesive which exhibits adhesiveness by a predetermined external stimulus. 2. The data storage element holding label according to claim 1, wherein the data storage element is held inside the base material. 3. The data storage element holding label according to claim 1, wherein the predetermined external stimulus is heating. 4. The data storage element holding label according to claim 1, wherein the predetermined external stimulus is water. 5. The pressure applied to the object is 100 Pa.
The data storage element holding label according to any one of claims 1 to 4, wherein: 6. The data storage element holding label according to claim 1, wherein the storage elastic modulus of the pressure-sensitive adhesive layer when the pressure-sensitive adhesiveness is developed is 10 Pa to 5000 Pa.