JP2002161197A - Flame resisting resin composition, prepreg and laminated sheet using the same - Google Patents
Flame resisting resin composition, prepreg and laminated sheet using the sameInfo
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- JP2002161197A JP2002161197A JP2000383272A JP2000383272A JP2002161197A JP 2002161197 A JP2002161197 A JP 2002161197A JP 2000383272 A JP2000383272 A JP 2000383272A JP 2000383272 A JP2000383272 A JP 2000383272A JP 2002161197 A JP2002161197 A JP 2002161197A
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- flame
- resin composition
- resin
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- molecule
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- Compositions Of Macromolecular Compounds (AREA)
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Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明はハロゲン系難燃剤を
使用しなくても優れた難燃性を有する樹脂組成物プリプ
レグ及び積層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition prepreg and a laminate having excellent flame retardancy without using a halogen-based flame retardant.
【0002】エポキシ樹脂等に代表される熱硬化性樹脂
はその優れた特性から電気及び電子機器部品等に広く使
用されており、火災に対する安全性を確保するため難燃
性が付与されている場合が多い。これらの樹脂の難燃化
は従来臭素化エポキシ樹脂等のハロゲン含有化合物を用
いることが一般的であった。これらのハロゲン含有化合
物は高度な難燃性を有するが、芳香族臭素化合物は熱分
解で腐食性の臭素、臭化水素を分離するだけでなく、酸
素存在下で分解した場合に毒性の高いポリブロモジベン
ゾフラン、及びポリジブロモベンゾオキシンを形成する
可能性がある。また、臭素を含有する老朽廃材の処分は
極めて困難である。このような理由から臭素含有難燃剤
に代わる難燃剤としてリン化合物や窒素化合物が検討さ
れている。[0002] Thermosetting resins represented by epoxy resins are widely used for electric and electronic equipment parts due to their excellent characteristics, and are provided with flame retardancy to ensure fire safety. There are many. Conventionally, these resins have generally used a halogen-containing compound such as a brominated epoxy resin. Although these halogen-containing compounds have high flame retardancy, aromatic bromine compounds not only separate corrosive bromine and hydrogen bromide by thermal decomposition, but also have high toxicity when decomposed in the presence of oxygen. May form bromodibenzofuran, and polydibromobenzooxin. Further, disposal of aging waste material containing bromine is extremely difficult. For these reasons, phosphorus compounds and nitrogen compounds have been studied as flame retardants instead of bromine-containing flame retardants.
【0003】前述のように、リン化合物及び窒素化合物
によって難燃化を実現できる。その機構は、窒素化合物
及びリン化合物が樹脂の炭化を促進し燃焼を防ぐという
ものである。難燃化のために用いられるリン化合物とし
ては様々なものが検討されているが、熱硬化性樹脂の特
性を損なわないためには、樹脂となんらかの化学反応に
よって樹脂骨格にリン化合物を組み込むことが望まし
い。[0003] As described above, flame retardancy can be realized by a phosphorus compound and a nitrogen compound. The mechanism is that nitrogen compounds and phosphorus compounds promote carbonization of the resin and prevent combustion. Various phosphorus compounds have been studied as flame retardants.However, in order not to impair the properties of the thermosetting resin, it is necessary to incorporate the phosphorus compound into the resin skeleton by some kind of chemical reaction with the resin. desirable.
【0004】エポキシ樹脂骨格中にリン化合物を組み込
むためには、エポキシ基と反応するリン化合物を用いれ
ばよい。かるリン化合物である9,10−ジヒドロ−9
−オキサ−10−ホスファフェナントレン−10−オキ
シドはエポキシ基と反応するため、エポキシ樹脂の難燃
剤として有用である。またトリアジン変性ノボラック樹
脂は分子内にトリアジン環をもつため窒素系の難燃剤と
して有用である。In order to incorporate a phosphorus compound into the epoxy resin skeleton, a phosphorus compound which reacts with an epoxy group may be used. 9,10-dihydro-9 which is a phosphorus compound
Since -oxa-10-phosphaphenanthrene-10-oxide reacts with an epoxy group, it is useful as a flame retardant for epoxy resins. Further, the triazine-modified novolak resin has a triazine ring in the molecule and is therefore useful as a nitrogen-based flame retardant.
【0005】しかし9,10−ジヒドロ−9−オキサ−
10−ホスファフェナントレン−10−オキシドとトリ
アジン変性ノボラック樹脂を併用し、エポキシ樹脂とと
もに溶解させてワニスとした場合、ワニスの可使用時間
がきわめて短くなる欠点があった。However, 9,10-dihydro-9-oxa-
When 10-phosphaphenanthrene-10-oxide and a triazine-modified novolak resin are used in combination and dissolved together with an epoxy resin to form a varnish, there is a drawback that the usable time of the varnish becomes extremely short.
【0006】[0006]
【発明が解決しようとする課題】本発明は、このような
問題を解決すべく検討結果なされたものであり、分子内
に2個以上のカルボキシル基を有するカルボン酸を併用
することで、9,10−ジヒドロ−9−オキサ−10−
ホスファフェナントレン−10−オキシドとトリアジン
変性ノボラック樹脂を併用してもワニスの可使用時間が
十分であり、かつハロゲンを使用せずとも十分な難燃性
を有する樹脂組成物、プリプレグ及びプリプレグから得
られた積層板を提供するものである。DISCLOSURE OF THE INVENTION The present invention has been made in order to solve such a problem, and the use of a carboxylic acid having two or more carboxyl groups in a molecule has resulted in 9,9. 10-dihydro-9-oxa-10-
Even when phosphaphenanthrene-10-oxide and a triazine-modified novolak resin are used in combination, the varnish has a sufficient usable time, and is obtained from a resin composition, prepreg and prepreg having sufficient flame retardancy without using halogen. To provide a laminated plate.
【0007】[0007]
【課題を解決するための手段】本発明は、(1)(A)
1分子内に2個以上のエポキシ基を有する非ハロゲン化
エポキシ樹脂、(B)トリアジン変性ノボラック樹脂か
らなる硬化剤、(C)分子内に2個以上のカルボキシル
基を有するカルボン酸(D)9,10−ジヒドロ−9−
オキサ−10−ホスファフェナントレン−10−オキシ
ドを必須成分として含有することを特徴とする難燃性樹
脂組成物、(2)(A)成分のエポキシ樹脂の一部又は
全部がノボラックエポキシ樹脂である第(1)項記載の
難燃性樹脂組成物、(3)(C)分子内に2個以上のカ
ルボキシル基を有するカルボン酸がイタコン酸又はシト
ラコン酸であることを特徴とする第(1)又は(2)項
記載の難燃性樹脂組成物、(4)第(1)、(2)また
は(3)項記載の難燃性樹脂組成物を基材に含浸させて
なることを特徴とするプリプレグ、(5)第(4)項記
載のプリプレグを1枚又は2枚以上重ね合わせ加熱加圧
してなることを特徴とする難燃性積層板又は銅張積層
板、である。The present invention provides (1) (A)
A non-halogenated epoxy resin having two or more epoxy groups in one molecule, a curing agent comprising (B) a triazine-modified novolak resin, (C) a carboxylic acid having two or more carboxyl groups in the molecule (D) 9 , 10-Dihydro-9-
Flame-retardant resin composition containing oxa-10-phosphaphenanthrene-10-oxide as an essential component, (2) Part or all of epoxy resin (A) is a novolak epoxy resin (1) wherein the carboxylic acid having two or more carboxyl groups in the molecule is itaconic acid or citraconic acid. Or, the base material is impregnated with the flame-retardant resin composition according to (2) or (4) the flame-retardant resin composition according to (1), (2) or (3). (5) A flame-retardant laminate or a copper-clad laminate obtained by laminating one or more of the prepregs described in (4) and heating and pressing.
【0008】前述のように、9,10−ジヒドロ−9−
オキサ−10−ホスファフェナントレン−10−オキシ
ドはP−H結合を分子内に有するリン化合物であるが、
P−H基は弱酸性基であるため、ワニス中で徐々にトリ
アジン変性ノボラック樹脂のアミノ基と相互作用する。
このため徐々にワニスのゲルタイムが変化する。As mentioned above, 9,10-dihydro-9-
Oxa-10-phosphaphenanthrene-10-oxide is a phosphorus compound having a P—H bond in the molecule,
Since the PH group is a weakly acidic group, it gradually interacts with the amino group of the triazine-modified novolak resin in the varnish.
For this reason, the gel time of the varnish gradually changes.
【0009】本発明においてはこの問題を解決するた
め、9,10−ジヒドロ−9−オキサ−10−ホスファ
フェナントレン−10−オキシドとトリアジン変性ノボ
ラック樹脂と分子内に2個以上のカルボキシル基を有す
るカルボン酸を使用する。カルボン酸は酸性が強いため
P−H基よりも強く速くトリアジン変性ノボラック樹脂
のアミノ基と相互作用する。ワニス調合時に速やかに相
互作用が起きるためワニス調合時と使用時のゲルタイム
変化が少ない。これにより9,10−ジヒドロ−9−オ
キサ−10−ホスファフェナントレン−10−オキシド
とトリアジン変性ノボラック樹脂を同時に使用でき十分
な難燃性が得ることができる。また分子内に2個以上の
カルボキシル基を有するカルボン酸はエポキシ基と反応
し、しかも二官能のため硬化物の特性を低下させない。
分子内に2個以上のカルボキシル基を有するカルボン酸
の中でもイタコン酸又はシトラコン酸が特に好ましい。
イタコン酸は融点が167℃、シトラコン酸は91℃で
あり、融解すると速やかに分解する。このためプリプレ
グ塗布時およびプレス成型時にイタコン酸やシトラコン
酸は樹脂組成物中に残存せず、硬化物の特性を低下させ
ない。本発明の樹脂組成物は9,10−ジヒドロ−9−
オキサ−10−ホスファフェナントレン−10−オキシ
ドとトリアジン変性ノボラック樹脂と分子内に2個以上
のカルボキシル基を有するカルボン酸を使用すること
で、ハロゲン化合物を使用しにで十分な難燃性を発現さ
せることを技術骨子とするものである。In the present invention, in order to solve this problem, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, a triazine-modified novolak resin, and a compound having two or more carboxyl groups in the molecule. Use carboxylic acids. The carboxylic acid is strongly acidic and interacts with the amino group of the triazine-modified novolak resin faster and stronger than the PH group. Since the interaction occurs promptly during varnish preparation, there is little change in gel time between varnish preparation and use. Thereby, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and a triazine-modified novolak resin can be used simultaneously, and sufficient flame retardancy can be obtained. In addition, a carboxylic acid having two or more carboxyl groups in a molecule reacts with an epoxy group and does not deteriorate the properties of a cured product because it is bifunctional.
Among carboxylic acids having two or more carboxyl groups in the molecule, itaconic acid or citraconic acid is particularly preferred.
Itaconic acid has a melting point of 167 ° C. and citraconic acid has a melting point of 91 ° C. and decomposes quickly upon melting. For this reason, itaconic acid and citraconic acid do not remain in the resin composition during prepreg coating and press molding, and do not lower the properties of the cured product. The resin composition of the present invention comprises 9,10-dihydro-9-
By using oxa-10-phosphaphenanthrene-10-oxide, a triazine-modified novolak resin and a carboxylic acid having two or more carboxyl groups in the molecule, sufficient flame retardancy is exhibited by using a halogen compound. The main point is to make it technical.
【0010】本発明で用いる(A)成分のエポキシ樹脂
としては、ビスフェノールAエポキシ樹脂、ビスフェノ
ールFエポキシ樹脂、ビスフェノールAノボラックエポ
キシ樹脂、フェノールノボラックエポキシ樹脂、クレゾ
ールノボラックエポキシ樹脂、テトラキス(グリシジル
オキシフェニル)エタンなどがあげられるが、これらに
限定されるものではなく、また数種類を同時に用いても
差し支えない。耐熱性を考慮すると、ビスフェノールA
ノボラックエポキシ樹脂、フェノールノボラックエポキ
シ樹脂、クレゾールノボラックエポキシ樹脂などのノボ
ラックエポキシ樹脂が好ましい。The epoxy resin of component (A) used in the present invention includes bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol A novolak epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, tetrakis (glycidyloxyphenyl) ethane However, the present invention is not limited thereto, and several types may be used at the same time. Considering heat resistance, bisphenol A
Novolak epoxy resins such as novolak epoxy resin, phenol novolak epoxy resin and cresol novolak epoxy resin are preferred.
【0011】本発明で用いる(B)成分のトリアジン変
性フェノールノボラック樹脂としては、メラミン変性ノ
ボラック樹脂、ベンゾグアナミン変性ノボラック樹脂、
アセトグアナミン変性ノボラック樹脂などがあげられ
る。トリアジン変性ノボラック樹脂の配合量は樹脂全体
に対し窒素含有量が0.5%から2.5%となるように
配合するのが好ましい。0.5%未満では難燃性が不十
分となり、2.5%を越えると吸水率が大きくなり好ま
しくない。The triazine-modified phenol novolak resin (B) used in the present invention includes a melamine-modified novolak resin, a benzoguanamine-modified novolak resin,
Acetoguanamine-modified novolak resin and the like. The compounding amount of the triazine-modified novolak resin is preferably such that the nitrogen content is 0.5% to 2.5% based on the whole resin. If it is less than 0.5%, the flame retardancy becomes insufficient, and if it exceeds 2.5%, the water absorption increases, which is not preferable.
【0012】本発明で用いる(C)成分の分子内に2個
以上のカルボキシル基を有するカルボン酸としてはアジ
ピン酸、イタコン酸、シトラコン酸、シュウ酸、酒石
酸、フマル酸、マロン酸、マレイン酸、フタル酸、テレ
フタル酸などがあげられるが、これらに限定されるもの
ではない。これらの中でもイタコン酸又はシトラコン酸
は、成形時に分解する割合が高く、積層板に残留する量
が少なくなるので好ましい。本発明でイタコン酸又はシ
トラコン酸を用いる場合は、9,10−ジヒドロ−9−
オキサ−10−ホスファフェナントレン−10−オキシ
ド10重量部に対し、0.5重量部〜3重量部が好まし
い。0.5重量部未満ではワニス保存性が不十分とな
り、3重量部を越えると硬化阻害を起こすので好ましく
ない。The carboxylic acid having two or more carboxyl groups in the molecule of the component (C) used in the present invention includes adipic acid, itaconic acid, citraconic acid, oxalic acid, tartaric acid, fumaric acid, malonic acid, maleic acid, and the like. Examples include, but are not limited to, phthalic acid and terephthalic acid. Among them, itaconic acid or citraconic acid is preferable because it has a high rate of decomposition during molding and the amount remaining on the laminate is reduced. When itaconic acid or citraconic acid is used in the present invention, 9,10-dihydro-9-
0.5 parts by weight to 3 parts by weight is preferable for 10 parts by weight of oxa-10-phosphaphenanthrene-10-oxide. If the amount is less than 0.5 part by weight, the varnish preservability becomes insufficient, and if it exceeds 3 parts by weight, curing inhibition is caused, which is not preferable.
【0013】本発明の難燃性樹脂組成物は、上述したエ
ポキシ樹脂とトリアジン変性ノボラック樹脂と分子内に
2個以上のカルボキシル基を有するカルボン酸と9,1
0−ジヒドロ−9−オキサ−10−ホスファフェナント
レン−10−オキシド必須成分として含有するが、本発
明の目的に反しない範囲において、その他の樹脂、硬化
促進剤、カップリング剤、その他の成分を添加すること
は差し支えない。硬化剤としてフェノールアラルキル樹
脂、ナフタレンアラルキル樹脂などを併用すれば低吸水
となり好ましい。The flame-retardant resin composition of the present invention comprises the epoxy resin described above, a triazine-modified novolak resin, a carboxylic acid having two or more carboxyl groups in the molecule,
Although it is contained as an essential component of 0-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, other resins, curing accelerators, coupling agents, and other components may be used within a range not inconsistent with the object of the present invention. It can be added. It is preferable to use a phenol aralkyl resin, a naphthalene aralkyl resin, or the like as a curing agent in combination, since water absorption is low.
【0014】本発明の難燃性樹脂組成物は種々の形態で
利用されるが、基材に含浸する際には通常溶剤に溶解し
たワニスの形で使用される。用いられる溶剤は組成に対
して良好な溶解性を示すことが望ましいが、悪影響を及
ぼさない範囲で貧溶媒を使用しても構わない。The flame-retardant resin composition of the present invention is used in various forms. When impregnating a substrate, it is usually used in the form of a varnish dissolved in a solvent. It is desirable that the solvent used has good solubility in the composition, but a poor solvent may be used as long as it does not adversely affect the composition.
【0015】本発明の難燃性樹脂組成物を溶剤に溶解し
て得られるワニスは、ガラス繊布、ガラス不繊布、ある
いはガラス以外を成分とする繊布又は不繊布等の基材に
塗布、含浸させ、80〜200℃で乾燥させることによ
りプリプレグを得ることが出来る。かかるプリプレグは
加熱加圧して積層板又は銅張積層板を製造することに用
いられる。本発明の難燃性樹脂組成物はハロゲン化合物
を含有しなくとも高度な難燃性を有する熱硬化性樹脂組
成物であり、特に、プリント配線板用の積層板等に好適
に使用されるものである。The varnish obtained by dissolving the flame-retardant resin composition of the present invention in a solvent is applied and impregnated to a substrate such as glass woven cloth, glass non-woven cloth, or woven cloth or non-woven cloth containing components other than glass. The prepreg can be obtained by drying at 80 to 200 ° C. Such a prepreg is used for producing a laminate or a copper-clad laminate by heating and pressing. The flame-retardant resin composition of the present invention is a thermosetting resin composition having high flame retardancy even without containing a halogen compound, and is particularly preferably used for a laminated board for printed wiring boards and the like. It is.
【0016】[0016]
【実施例】(実施例1)クレゾールノボラックエポキシ
樹脂(大日本インキ化学工業(株)製エピクロンN−6
90)100重量部、トリアジン変性フェノールノボラ
ック樹脂(大日本インキ化学工業(株)製LA−705
4)26重量部、アジピン酸3.3重量部、9,10−
ジヒドロ−9−オキサ−10−ホスファフェナントレン
−10−オキシド22.5重量部及びフェノールアラル
キル樹脂(三井化学(株)製ミレックスXLC−LL)
20.8重量部にメチルセルソルブを加え、不揮発分濃
度60重量%となるようにワニスを調整した。このとき
エポキシ樹脂、リン化合物及び硬化剤の合計100重量
%に対し、リン成分が1.9重量%、窒素成分が1.8
重量%となった。このワニスを用いて、ガラス繊布(厚
さ0.18mm、日東紡績(株)製)100重量部にワ
ニス固形分で80重量部含浸させて、150℃の乾燥機
炉で5分乾燥させ、樹脂含有量44.4%のプリプレグ
を作成した。上記プリプレグを6枚重ね、上下に厚さ3
5μmの電解銅箔を重ねて、圧力40kgf/cm2 、
温度190℃で120分加熱加圧成形を行い、厚さ1.
2mmの両面銅張積層板を得た。(Example 1) Cresol novolak epoxy resin (Epiclon N-6 manufactured by Dainippon Ink and Chemicals, Inc.)
90) 100 parts by weight of triazine-modified phenol novolak resin (LA-705 manufactured by Dainippon Ink and Chemicals, Inc.)
4) 26 parts by weight, adipic acid 3.3 parts by weight, 9,10-
22.5 parts by weight of dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and phenol aralkyl resin (Mirex XLC-LL manufactured by Mitsui Chemicals, Inc.)
Methylcellosolve was added to 20.8 parts by weight, and the varnish was adjusted so that the nonvolatile content concentration was 60% by weight. At this time, the phosphorus component was 1.9% by weight and the nitrogen component was 1.8% based on 100% by weight of the total of the epoxy resin, the phosphorus compound and the curing agent.
% By weight. Using this varnish, 100 parts by weight of glass fiber cloth (0.18 mm thick, manufactured by Nitto Boseki Co., Ltd.) was impregnated with 80 parts by weight of varnish solids, dried in a dryer oven at 150 ° C. for 5 minutes, and dried. A prepreg having a content of 44.4% was prepared. Stack the 6 prepregs above and 3
5μm electrolytic copper foil is overlaid, pressure 40kgf / cm 2 ,
Heat and pressure molding was performed at a temperature of 190 ° C. for 120 minutes, and the thickness was 1.
A 2 mm double-sided copper-clad laminate was obtained.
【0017】(実施例2〜8、及び比較例1〜2)表1
及び表2に示した配合処方で、これ以外は全て実施例1
と同様の方法で両面銅張積層板を作成した。(Examples 2 to 8, and Comparative Examples 1 and 2)
And the formulation shown in Table 2 except that
A double-sided copper-clad laminate was prepared in the same manner as described above.
【0018】樹脂ワニスについては、調整直後と23℃
で7日間放置した後における170℃でのゲル化までの
時間を測定した。得られた銅張積層板については難燃
性、半田耐熱性およびピール強度を測定した。難燃性は
UL−94規格に従い垂直法により評価した。半田耐熱
性、ピール強度についてはJIS C 6481に準じて
測定し、半田耐熱性は煮沸2時間の吸湿処理を行った
後、260℃の半田槽に120秒浸漬した後の外観の異
常の有無を調べた。評価結果を表1及び表2に示す。実
施例に示す銅張積層板はいずれも耐燃性、半田耐熱性に
すぐれている。また樹脂ワニスを23℃で7日間放置し
た後のゲル化までの時間は調整直後と実質的に変化せ
ず、可使用時間が優れていることがわかる。For the resin varnish, immediately after adjustment and at 23 ° C.
And the time until gelation at 170 ° C. after standing for 7 days was measured. The obtained copper-clad laminate was measured for flame retardancy, solder heat resistance and peel strength. Flame retardancy was evaluated by the vertical method according to the UL-94 standard. Solder heat resistance and peel strength were measured in accordance with JIS C 6481. Solder heat resistance was determined by performing a moisture absorption treatment for 2 hours after boiling and then immersing in a solder bath at 260 ° C for 120 seconds for abnormal appearance. Examined. The evaluation results are shown in Tables 1 and 2. All of the copper-clad laminates shown in Examples have excellent flame resistance and solder heat resistance. In addition, the time until gelling after the resin varnish was left at 23 ° C. for 7 days did not substantially change from that immediately after the adjustment, indicating that the usable time was excellent.
【0019】[0019]
【表1】 [Table 1]
【0020】[0020]
【表2】 [Table 2]
【0021】表の注 (1)大日本インキ化学工業(株)製 エピクロンN−
690、エポキシ当量=210 (2)大日本インキ化学工業(株)製 エピクロンN−
770、エポキシ当量=190 (3)大日本インキ化学工業(株)製 LA−705
4、水酸基当量=125、窒素含有率=12重量% (4)三井化学(株)性 ミレックスXLC−LL、水
酸基当量=175 (5)9,10−ジヒドロ−9−オキサ−10−ホスフ
ァフェナントレン−10−オキシドNotes to Table (1) Epicron N- manufactured by Dainippon Ink and Chemicals, Inc.
690, epoxy equivalent = 210 (2) Epicron N- manufactured by Dainippon Ink and Chemicals, Inc.
770, epoxy equivalent = 190 (3) LA-705 manufactured by Dainippon Ink and Chemicals, Inc.
4. Hydroxyl equivalent = 125, nitrogen content = 12% by weight (4) Mitsui Chemicals, Inc. MILEX XLC-LL, hydroxyl equivalent = 175 (5) 9,10-dihydro-9-oxa-10-phosphaphenanthrene -10-oxide
【0022】[0022]
【発明の効果】本発明の難燃性樹脂組成物、これを用い
たプリプレグ及び積層板は、ハロゲン化合物を添加する
ことなく高度な難燃性を有し、半田耐熱性等の特性も優
れている。従って今後要求される非ハロゲン材料として
新規で有用な熱硬化性樹脂組成物を提供するものであ
る。The flame-retardant resin composition of the present invention, the prepreg and the laminate using the same, have high flame retardancy without adding a halogen compound, and have excellent properties such as solder heat resistance. I have. Accordingly, the present invention provides a novel and useful thermosetting resin composition as a non-halogen material required in the future.
フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H05K 1/03 610 H05K 1/03 610L Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (Reference) H05K 1/03 610 H05K 1/03 610L
Claims (5)
を有する非ハロゲン化エポキシ樹脂、(B)トリアジン
変性ノボラック樹脂からなる硬化剤、(C)分子内に2
個以上のカルボキシル基を有するカルボン酸(D)9,
10−ジヒドロ−9−オキサ−10−ホスファフェナン
トレン−10−オキシドを必須成分として含有してなる
ことを特徴とする難燃性樹脂組成物。1. A non-halogenated epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent comprising a triazine-modified novolak resin;
A carboxylic acid (D) having at least two carboxyl groups,
A flame-retardant resin composition comprising 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide as an essential component.
部がノボラックエポキシ樹脂である請求項1記載の難燃
性樹脂組成物。2. The flame-retardant resin composition according to claim 1, wherein part or all of the epoxy resin (A) is a novolak epoxy resin.
基を有するカルボン酸がイタコン酸又はシトラコン酸で
あることを特徴とする請求項1又は2記載の難燃性樹脂
組成物。3. The flame-retardant resin composition according to claim 1, wherein (C) the carboxylic acid having two or more carboxyl groups in the molecule is itaconic acid or citraconic acid.
組成物を基材に含浸させてなることを特徴とするプリプ
レグ。4. A prepreg comprising a substrate impregnated with the flame-retardant resin composition according to claim 1, 2 or 3.
枚以上重ね合わせ加熱加圧してなることを特徴とする難
燃性積層板又は銅張積層板。5. One or two prepregs according to claim 4,
A flame-retardant laminate or a copper-clad laminate, characterized by being laminated and heated and pressed.
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JP2000383272A JP3963344B2 (en) | 2000-09-12 | 2000-12-18 | Flame retardant resin composition, prepreg and laminate using the same |
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JP2000-276343 | 2000-09-12 | ||
JP2000276343 | 2000-09-12 | ||
JP2000383272A JP3963344B2 (en) | 2000-09-12 | 2000-12-18 | Flame retardant resin composition, prepreg and laminate using the same |
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JP2002161197A true JP2002161197A (en) | 2002-06-04 |
JP3963344B2 JP3963344B2 (en) | 2007-08-22 |
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ID=26599745
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002226556A (en) * | 2001-02-07 | 2002-08-14 | Dainippon Ink & Chem Inc | Epoxy resin composition |
WO2006057498A1 (en) | 2004-11-26 | 2006-06-01 | Lg Chem, Ltd. | Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same |
JP2006137838A (en) * | 2004-11-11 | 2006-06-01 | Fujikura Ltd | Epoxy-based resin composition, epoxy resin-based adhesive composition, cover lay for flexible printed circuit board, copper-clad laminated board for flexible printed circuit board, the resultant flexible printed circuit board, prepreg, copper-clad laminated board, photosensitive dry film, photosensitive liquid resist, and printed wiring board |
EP2090618A3 (en) * | 2008-02-15 | 2010-08-18 | Schill + Seilacher "Struktol" Aktiengesellschaft | Hardenable epoxy resin formulation with polyester flame retardant |
EP2557085A1 (en) | 2011-08-08 | 2013-02-13 | EMPA Eidgenössische Materialprüfungs- und Forschungsanstalt | Novel phosphonamidates - synthesis and flame retardant applications |
CN115678206A (en) * | 2022-11-11 | 2023-02-03 | 中南民族大学 | Recyclable flame-retardant epoxy resin and preparation method thereof |
-
2000
- 2000-12-18 JP JP2000383272A patent/JP3963344B2/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002226556A (en) * | 2001-02-07 | 2002-08-14 | Dainippon Ink & Chem Inc | Epoxy resin composition |
JP2006137838A (en) * | 2004-11-11 | 2006-06-01 | Fujikura Ltd | Epoxy-based resin composition, epoxy resin-based adhesive composition, cover lay for flexible printed circuit board, copper-clad laminated board for flexible printed circuit board, the resultant flexible printed circuit board, prepreg, copper-clad laminated board, photosensitive dry film, photosensitive liquid resist, and printed wiring board |
JP4707998B2 (en) * | 2004-11-11 | 2011-06-22 | 株式会社フジクラ | Epoxy resin adhesive composition for flexible printed circuit board, coverlay for flexible printed circuit board, copper-clad laminate for flexible printed circuit board, and flexible printed circuit board |
WO2006057498A1 (en) | 2004-11-26 | 2006-06-01 | Lg Chem, Ltd. | Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same |
US7521120B2 (en) | 2004-11-26 | 2009-04-21 | Lg Chem, Ltd. | Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same |
EP2090618A3 (en) * | 2008-02-15 | 2010-08-18 | Schill + Seilacher "Struktol" Aktiengesellschaft | Hardenable epoxy resin formulation with polyester flame retardant |
EP2557085A1 (en) | 2011-08-08 | 2013-02-13 | EMPA Eidgenössische Materialprüfungs- und Forschungsanstalt | Novel phosphonamidates - synthesis and flame retardant applications |
WO2013020696A2 (en) | 2011-08-08 | 2013-02-14 | Empa Eidgenössische Materialprüfungs- Und Forschungsanstalt | Novel phosphonamidates-synthesis and flame retardant applications |
CN115678206A (en) * | 2022-11-11 | 2023-02-03 | 中南民族大学 | Recyclable flame-retardant epoxy resin and preparation method thereof |
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