JP2002160157A - Polishing and machining method for thin plate material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing and machining method for a thin plate material capable of achieving superior flatness of a surface of a pressing plate, which is the thin plate material, and excellent in mass-productivity. SOLUTION: The pressing plate 8 is placed on a rotatable plane grinding wheel 2, and an elastic body 9 comprising a pat 11 and a pressing pat 12 is placed on a top surface of the pressing plate 8. The plane grinding wheel 2 is rotated while an upper surface plate 5 presses the pressing plate 8 to the plane grinding wheel 2 side through the elastic body 9. Thus, the surface of the pressing plate 8 is polished and machined.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of polishing a thin plate, and more particularly to a method of polishing a thin plate such as a press plate of a camera part.

[0002]

2. Description of the Related Art Prior to the description of the prior art, the use of a pressure plate 101 of a camera component, which is a kind of thin plate, will be described with reference to FIG. The pressure plate 101 is a component having a function of guiding the film surface when the film loaded in the camera travels. When the film is wound and moved, the film surface contacts the flat portion 102 on one surface of the pressure plate 101 so that the film surface is moved. To run.

Therefore, it is necessary to increase the flatness and surface roughness of the flat portion 102 by lapping. The four L-shaped legs 103 of the pressure plate 101 are necessary for attaching to a leaf spring provided on the camera cover,
An L-shape is formed by press working in the previous step.

Generally, in order to lap one side of the pressure plate 101, the pressure plate 101 is placed on a flat grindstone,
The lapping process is performed while pressing the pressure plate 101 from above and rotating the plane grindstone. During such processing, water is caused to flow through the plane grindstone to prevent clogging of the plane grindstone.

Next, a method of polishing a semiconductor wafer 105, which is a kind of a thin plate material, using a lapping machine as disclosed in Japanese Patent Application Laid-Open No. 6-99347 will be described with reference to FIG.

This polishing method uses a rotatable lower platen 104.
The semiconductor wafer 105 is placed on the upper side of the
Semiconductor wafer 1 guided by carrier 107
The polishing is performed while the lower platen 104 is rotated while directly pressing the substrate 05.

At this time, the thickness (tc) of the carrier 107 holding the semiconductor wafer 105 is
By making the thickness of the upper surface plate 106 0.35 tw (μm) or more smaller than the thickness (tw) of the substrate 05, the sagging phenomenon of the upper platen 106 is suppressed, and the semiconductor wafer 105 having good flatness is obtained.

[0008]

However, as shown in FIG.
Considering the case where one surface of the pressure plate 101 is polished as shown in FIG. 10, it is necessary to mount a flat grinding wheel 108 dedicated to polishing in which abrasive grains and an adhesive are mixed on the lower platen 104 as shown in FIG. This flat grindstone 108 is a very soft and elastic grindstone.

When the polishing method disclosed in Japanese Patent Application Laid-Open No. 6-99347 is adopted,
As shown in FIG. 10, the upper surface of the flat grindstone 108 is gradually deformed into a concave shape in which the center is recessed from the periphery, as shown in FIG.

As a result, the lower surface of the upper platen 106 cannot be kept parallel to the upper surface of the flat grindstone 108, and the flatness of the pressure plate 101 to be polished is necessarily reduced.

That is, in the case of such a polishing method, when the film is run due to a decrease in the flatness of one side of the pressure plate 101, the film cannot run smoothly, and a serious defect in the function of the camera is caused. You will be invited.

The present invention has been made in view of the above circumstances, and provides a method of polishing a thin plate material which can obtain a good flatness of the surface of the thin plate material to be polished and which is excellent in mass productivity. To provide.

[0013]

According to the first aspect of the present invention,
In a method of polishing a thin plate material for polishing a surface of the thin plate material, the thin plate material is placed on a rotatable flat grindstone, an elastic body is arranged on the upper surface of the thin plate material, and the upper platen interposes the elastic body. The surface of the thin plate is polished by rotating the flat grindstone while pressing the thin plate toward the flat grindstone.

According to the present invention, a thin plate material to be polished is placed on a rotatable flat grindstone, and an elastic body is arranged on the upper surface of the thin plate material. By rotating the plane whetstone while pressing the plate material to the plane whetstone side, the surface of the thin plate material is polished, so that the surface of the thin plate material to be polished is always pressed against the whetstone surface of the plane whetstone. In the case where the flatness of the grinding wheel surface of the flat whetstone is irregular, the irregularity can be absorbed by the elasticity of the elastic body, whereby the good flatness of the polished surface of the thin plate material can be achieved. Can be obtained.

According to a second aspect of the present invention, there is provided a polishing method for a thin plate material for polishing a surface of a thin plate material, wherein a plurality of thin plate materials are loaded into respective holes provided in a carrier on a rotatable flat grindstone. Placed in the state, the pressing pad which is an elastic body is arranged on the upper surface of the thin plate material in each hole, the carrier, the pad which is an elastic body is arranged on the upper surface of each holding pad, the holding pad on the upper surface plate, The surface of each of the thin plate materials is polished by rotating the flat whetstone while pressing the thin plate material toward the flat whetstone via a pad.

According to the present invention, the carrier is provided with a plurality of windows for holding the sheet material, and each of the windows is loaded with the sheet material, and an elastic pad is provided on the upper surface of each sheet material. The carrier and the pressing pad which is an elastic body are disposed on the upper surface of each pad, and the flat grinding wheel is pressed on the flat grinding wheel side through the pressing pad and the pad with the upper polishing plate. Is rotated to grind the surface of each thin plate material.

Therefore, the surface of each sheet material is always polished while being pressed against the grindstone surface of the flat whetstone, whereby a good and uniform flatness of the surface of each sheet material can be obtained. . Furthermore, the above-mentioned polishing of many thin plate materials can be performed at the same time, and a polishing method which is extremely excellent in mass productivity can be provided.

According to a third aspect of the present invention, in the method of polishing a thin plate according to the second aspect, the depth dimension of the hole provided in the carrier is set to be equal to the total thickness of the thin plate and the pad. It is characterized by the following.

According to the present invention, the depth dimension of the hole provided in the carrier is set equal to the total thickness of the thin plate material and the pad, so that the carrier of the carrier pressed simultaneously with the pad on the upper platen. In a state where each thin plate material is securely held in each hole, each thin plate material on the lower side of the pad can be evenly pressed against the grindstone surface of the flat grindstone and polished, so that the surface of each thin plate material is good and An even flatness can be obtained.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (Structure) A polishing method for a thin plate according to an embodiment of the present invention will be described with reference to FIG.

As shown in FIG. 1, a flat grindstone 2 is arranged on a base 1a of a lapping machine 1 which is a kind of polishing machine, and is rotated by a motor (not shown).

Above the flat grinding wheel 2, an upper housing 1b
Are provided, and these cylinders 3 can be moved up and down with respect to the plane grinding wheel 2 by operating the operation lever 4 provided on the upper housing 1b.

An upper surface plate 5 is rotatably attached to a protruding tip of each of the cylinders 3 via a bearing (not shown). In FIG. 1, reference numeral 14 denotes an upper housing 1b.
It is an operation panel prepared for.

FIG. 2 shows a disc-shaped carrier 6 used for polishing a pressure plate 8 which is a kind of a thin plate material to be polished. The carrier 6 functions as a jig for holding the pressure plate 8. The thickness of the carrier 6 is formed to be larger than the thickness of the pressure plate 8. This is for securely holding the pressure plate 8.

The carrier 6 is provided with a total of 52 rectangular windows 7 as shown in FIG. 2 in order to polish a large amount of the pressure plate 8 at one time.

FIG. 3 shows a disk-shaped elastic body 9 used for uniformly pressing the pressure plate 8 during polishing of the pressure plate 8.

The elastic body 9 is used to press the carrier 6 and each pressure plate 8 at the same time.
And 52 pads 11 arranged on the lower surface side.

52 pats 11 are arranged on the lower surface side of the holding pad 10 in an arrangement corresponding to the rectangular windows 7 of the carrier 6, and as shown in FIG. Each of them is brought into contact with the 52 pressure plates 8 disposed therein and pressed against the flat grindstone 2 side.

As shown in FIG. 4, relief portions (notches) 12 for releasing the L-shaped feet 8a (see FIG. 7) of the pressure plate 8 are formed at the four corners of the pad 11. .

The material of the holding pad 10 and the pad 11 of the elastic body 9 can be arbitrarily selected from rubber, sponge and the like as long as it is an elastic member.

FIG. 5 shows the relationship between the plate thickness k of the carrier 6, the plate thickness a of the pressure plate 8, and the plate thickness p of the pad 11, and the relationship of plate thickness k = plate thickness a + plate thickness p. Is set to This is to ensure that the pressure plate 8 is pressed against the flat grindstone 2 by the pad 11 and that the carrier 6 and the pad 11 are pressed simultaneously by the holding pad 10.

FIG. 6 shows that the carrier 6 and the elastic body 9 are
As shown in FIG. 7, a retainer ring 13 formed in a circular ring shape that functions as a guide member that is held below the upper platen 5 and reliably rotates together with the upper platen 5 is shown. .

(Operation) Next, a method of polishing the pressure plate 8 by the lapping machine of the present embodiment will be described.

Four retainer rings 13 are mounted on the flat grindstone 2 so that the retainer rings 13 are roughly positioned below the upper surface plate 5.

Next, the carriers 6 are put inside the respective retainer rings 13, and the pressure plates 8 are loaded into the respective windows 7 of the carrier 6.

Next, the lower surface of each pad 11 of the elastic body 9 is brought into contact with the upper surface of each pressure plate 8 so that each pad 11
The holding pad 10 of the elastic body 9 is placed on the above.

Next, by operating the operation lever 4, each shilling 3 is advanced (downward) from the upper side of the flat grindstone 2, and each upper platen 5 is brought into contact with the elastic body 9.

Then, a motor (not shown) is started to rotate the plane grinding wheel 2 in the direction of the arrow shown in FIG. Thereby, the retainer ring 13, the pressure plate 8, the carrier 6, the elastic body 9, and the upper platen 5 rotate in the same direction as the plane grindstone 2, and one surface of each pressure plate 8 is lapped.

In this lapping machine, the press plate 8 is wrapped using four carriers 6 at a time.
The lapping of a total of 208 pressure plates 8 in a lot can be performed simultaneously, which is extremely excellent in mass productivity.

The pressing pad 10 for the elastic body 9
The pressure from the cylinder 3 can be evenly transmitted to each pressure plate 8 via the pad 11. Therefore, the individual pressure plates 8
The lapping process can be performed on one side of the platen under the same pressure, and the flatness of the polished surface of each pressure plate 8 can be made uniform.

(Effects) According to the present embodiment, the pressure applied to each pressure plate 8 that simultaneously performs lapping can be always kept uniform, and even if the surface shape of the flat grindstone 2 becomes concave, The change in the surface shape can be absorbed by the elasticity of the elastic body 9, and the pressure plate 8 having a stable flatness can be obtained.

Further, the lapping of a total of 208 pressure plates 8 in one lot can be performed simultaneously, and a polishing method for a thin plate material which is extremely excellent in mass productivity can be provided.

[0043]

According to the present invention described above, a good flatness of the polished surface of a thin plate material can be obtained, and a polishing method for a thin plate material can be provided.

Further, according to the present invention, it is possible to provide a method for polishing a thin sheet material which is extremely excellent in mass productivity and can simultaneously finish the polished surfaces of a large number of thin sheet materials to a good flatness.

[Brief description of the drawings]

FIG. 1 is a perspective view of a lapping machine according to an embodiment of the present invention.

FIG. 2 is a plan view of the carrier according to the present embodiment.

FIG. 3 is a partially cutaway side view of the elastic body of the present embodiment.

FIG. 4 is a perspective view of the pad of the present embodiment.

FIG. 5 shows a carrier, a pressure plate,
It is a fragmentary sectional view showing arrangement of a pad, a control pad, and a retainer ring.

FIG. 6 is a perspective view of a retainer ring according to the present embodiment.

FIG. 7 is a partial cross-sectional view showing a state in which the pressure plate is polished by the lapping machine of the present embodiment.

FIG. 8 is a perspective view of a commonly used pressure plate.

FIG. 9 is an explanatory view showing a state in which a semiconductor wafer is polished by a conventional lapping machine.

FIG. 10 is an explanatory view showing a flat grindstone deformed into a concave shape in a conventional lapping machine.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lapping machine 2 Plane grindstone 3 Cylinder 4 Operation lever 5 Upper surface plate 6 Carrier 7 Window 8 Pressure plate 8a L-shaped leg 9 Elastic body 10 Holding pad 11 Pad 12 Escape part 13 Retainer ring

Claims (3)

[Claims] In a polishing method for a thin plate material for polishing a surface of the thin plate material, the thin plate material is placed on a rotatable flat grindstone, an elastic body is arranged on an upper surface of the thin plate material, and the upper platen is used. A polishing method for a thin plate material, wherein the surface of the thin plate material is polished by rotating the flat grindstone while pressing the thin plate material toward the flat grindstone via the elastic body. 2. A method of polishing a thin plate material by polishing a surface of the thin plate material, wherein a plurality of the thin plate materials are placed on a rotatable flat grindstone while being loaded in respective holes provided in a carrier. An elastic pad is arranged on the upper surface of the thin plate material in the hole, the carrier, a pressing pad which is an elastic member is arranged on the upper surface of each pad, and the thin plate material is placed on the upper platen through the pressing pad and the pad. A polishing method for a thin plate material, wherein the surface of each of the thin plate materials is polished by rotating the flat grindstone while pressing against the flat grindstone side. 3. A depth dimension of a hole provided in the carrier,
3. The method of polishing a thin plate according to claim 2, wherein the total thickness of the thin plate and the pad is set to be equal to the total thickness.