JP2002155381A - Coating type etching method and apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coating type etching method and apparatus therefor which can make the manufacturing time shorter, the manufacturing cost lower and the yield higher by eliminating the need for forming a mask on the surface of a work for protecting the segments unnecessary for etching treatment in case partially etching the surface of the work is carried out and can effectively use a liquid chemical by realizing the etching treatment with the minimum consumption of the liquid chemical. SOLUTION: A coating means impregnated with the liquid chemical is slid on the surface of the work in the state of bringing the coating means into contact with the surface of the work, thereby, the liquid chemical is applied to the surface of the work and the surface of the work is etched.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method and an apparatus for etching a work such as a semiconductor wafer (hereinafter sometimes simply referred to as a wafer).

[0002]

2. Description of the Related Art Conventionally, in a spin etching process, which is one mode of wet etching, a work, for example, a wafer is vacuum-sucked or mechanically chucked on a wafer holding portion of a rotating disk, and a tubular member is rotated while rotating. The wafer surface is etched by flowing a chemical solution (also referred to as an etching solution) from the wafer.

However, in such a spin etching method, a chemical solution flows down over the entire surface of the wafer. Therefore, when performing partial etching in the surface of the wafer or etching in a desired shape, etc., the etching process is performed. In order to protect unnecessary portions, a mask such as a resist film or a protective tape had to be formed on the surface of the wafer.

[0004] For this reason, masking is troublesome and time and cost disadvantageous. In addition, poor masking causes a reduction in yield.

[0005] Also, since the chemical is simply allowed to flow down,
It is very difficult to adjust the amount of the chemical used, and there is a drawback that a large amount of the chemical is wasted.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and has been made in consideration of the above circumstances. Eliminates the need to form a mask on the surface, shortening the manufacturing time, reducing the manufacturing cost and improving the yield, and realizing the etching process with the minimum amount of the chemical solution to efficiently use the chemical solution. It is an object of the present invention to provide a coating type etching method and apparatus which can be used for the above.

[0007]

According to a first aspect of the present invention, there is provided a coating type etching method in which a coating solution impregnated with a chemical is brought into contact with a surface of a workpiece. By sliding the means, a chemical solution is applied to the surface of the work and the surface of the work is etched.

That is, the application means is slid while being in contact with the surface of the work, so that the chemical is applied directly to the surface of the work, and only the portion where the application means abuts is etched. Therefore, it is not necessary to perform masking for protecting an unnecessary portion of etching, and since a chemical solution impregnated in the application unit is used, etching can be performed with a minimum necessary amount of the chemical solution.

In this aspect, since the application means is slid, this is a suitable aspect, for example, when it is desired to etch a desired portion of the surface of the work in a desired shape.

Next, in a coating type etching method according to a second aspect of the present invention, the work is moved while the coating means impregnated with the chemical is in contact with the surface of the work.
It is characterized in that a chemical is applied to the surface of the work and the surface of the work is etched.

That is, by moving the work while the surface of the work is in sliding contact with the application means, only the portion where the application means is in contact is etched.

In this aspect, since the work is moved,
For example, it is suitable when a predetermined motion such as a rotation motion is repeated.

If the surface of the work is circularly etched by rotating the work, only the circular portion such as the edge of the surface of the work or the end of the work is uniformly and rapidly etched. This is a good mode.

[0014] It is preferable that the coating means is composed of a coating member impregnated with a chemical solution and a holding member for holding the coating member.

It is preferable that a chemical liquid supply means is connected to the holding means to supply a chemical liquid to the coating member, so that a stable and continuous supply of the chemical liquid is possible.

The work is preferably a wafer. In recent years, since wafers, particularly semiconductor wafers, have a tendency to be subjected to high-precision fine processing, it is extremely useful to apply the present invention to a wafer capable of realizing a flexible etching mode.

Further, the coating type etching apparatus of the present invention comprises:
A rotating disk, a work holding part provided at the center of the upper surface of the rotating disk, an application unit for applying a chemical to the work held by the work holding unit, and a chemical supply unit for supplying a chemical to the application unit And a moving means for moving the applying means to an arbitrary position.

If the moving means is an XYZ table movable in the X-axis direction, the Y-axis direction and the Z-axis direction, the coating member can be freely moved in the X-axis direction, the Y-axis direction and the Z-axis direction. This is preferable because it can be moved.

It is preferable that the application means is constituted by an application member impregnated with a chemical solution, and a holding member for holding the application member.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the accompanying drawings. However, various changes or modifications can be made to these embodiments without departing from the technical idea of the present invention. Needless to say. The following description is for the case where the workpiece is a wafer.

As shown in FIGS. 1 and 2, the coating type etching apparatus 1 of the present invention includes a moving unit 10 and a rotating disk 2, and a wafer holding unit 4 is provided at the center of the upper surface of the rotating disk 2. The wafer holding unit 4 holds the wafer W from a vacuum chuck.

The moving means 10 is, for example, an XYZ table, and includes an X-axis moving means 10x, a Y-axis moving means 10y, a Z-axis moving means 10z, and an arm A.
The arm A can be movably operated in each direction of the shaft.

The application means includes an application means 12 and a holding means 14
This is a means composed of As the coating means,
In the technical field of writing instruments, pen-shaped means that are structurally similar to pens, such as felt pens, felt pens, and marker pens, are preferably used.

A chemical liquid supply means 16 is connected to the holding member 14, and a chemical liquid is supplied from the chemical liquid supply means 16 to the holding member 14.
Is supplied as appropriate.

The holding member 14 is a tubular body having a hollow inside, and is configured so that a chemical solution can be filled and circulated.

The application member 12 is attached to the lower end of the holding member 14, and a chemical solution from a chemical solution supply unit 16 is supplied through the holding member 14.

The coating member 12 is made of a ciliary material such as felt, and sucks out the chemical supplied through the holding member 14 by the capillary action and the gravitational action.
Is configured to be exuded on the outer surface of the. In addition,
The coating member 12 is only required to have a function of impregnating a chemical solution and continuously applying and supplying it to a work surface such as a wafer, and is not limited to the above structure.

The applying means (the applying member 12 and the holding member 14) is connected to the moving means 10 via the arm A. Thereby, the application means can be freely moved to a desired position by operating the movement means 10.

Next, the coating type etching method of the present invention will be described. As shown in FIG. 3, when the edge of the wafer W is etched in an annular shape, the coating means (the coating member 1) is used.
2 and the holding member 14) are moved to a predetermined position by the arm A, and the arm A is stopped in a state where the coating member 14 is in sliding contact with the surface of the wafer W.

When the rotating disk 2 is driven to rotate, the coating member 12 slides on the surface of the wafer W to apply a chemical solution, and an annular etching process is performed on the surface of the wafer.

In this way, it is possible to form the annular etching portion 20a on the surface of the wafer W.

Further, as shown in FIG.
In the case of etching an arbitrary part of the above with an arbitrary shape, first, the rotating disk 2 is stopped.

Then, the application means (the application member 12 and the holding member 14) is moved to a desired portion by the arm A, and is brought into sliding contact with the surface of the wafer W. Next, the application means is slid by the arm A so as to draw a desired shape on the surface of the wafer W, and a chemical solution is applied.

In this manner, it is possible to form the etching portions 20b and 20c of an arbitrary shape at arbitrary positions on the surface of the wafer W.

[0035]

As described above, according to the coating type etching method and apparatus of the present invention, when performing partial etching of the work surface, the work surface for protecting the unnecessary portion of the etching process is protected. Eliminating the necessity of forming a mask can shorten the manufacturing time, reduce the manufacturing cost and improve the yield, and realize the etching process with the minimum amount of the chemical solution, and efficiently use the chemical solution. It has a great effect that it can be done.

[Brief description of the drawings]

FIG. 1 is a schematic perspective explanatory view of a coating type etching apparatus of the present invention.

FIG. 2 is a schematic side view of FIG. 1;

FIG. 3 is a schematic explanatory view in the case of performing annular etching.

FIG. 4 is a schematic explanatory view in a case where an arbitrary portion is etched in an arbitrary shape.

[Explanation of symbols]

2: rotating disk, 4: wafer holding unit, 10: moving means,
10x: X-axis moving means, 10y: Y-axis moving means, 10
z: Z-axis moving means, 16: chemical liquid supply means, 14: holding member, 12: coating member, 20a, 20b, 20c: etching portion, A: arm, W: wafer.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B05D 1/40 B05D 1/40 A 3/00 3/00 D 3/10 3/10 C H01L 21/306 H01L 21/306 J F term (reference) 4D075 AC57 AC65 AC84 AC93 BB66X DA08 DB14 DC22 EA06 4F040 AA12 AB20 AC01 BA04 BA07 CA13 CA17 4F042 AA07 BA08 DD11 DF28 4K057 WA20 WB17 WM11 WM20 WN01 5F043 AA01

Claims (10)

[Claims] 1. A method in which a chemical solution is applied to a surface of a work by sliding the application device in a state in which the application device impregnated with the chemical solution is brought into contact with the surface of the work to etch the surface of the work. Coating type etching method characterized by the above-mentioned. 2. The method according to claim 1, wherein the work is moved while the application means impregnated with the chemical is in contact with the surface of the work, whereby the chemical is applied to the surface of the work and the surface of the work is etched. Coating type etching method. 3. The coating type etching method according to claim 2, wherein the surface of the work is circularly etched by rotating the work. 4. The coating etching method according to claim 1, wherein said coating means comprises a coating member impregnated with a chemical and a holding member for holding said coating member. . 5. A chemical liquid supply means is connected to the holding means,
The coating type etching method according to claim 4, wherein a chemical solution is supplied to the coating member. 6. The coating type etching method according to claim 1, wherein the workpiece is a wafer. 7. A rotating disk, a work holding part provided at the center of the upper surface of the rotating disk, an application means for applying a chemical to the work held by the work holding part, and a chemical liquid applied to the applying means. A coating type etching apparatus comprising: a chemical solution supply unit for supplying; and a moving unit for moving the coating unit to an arbitrary position. 8. The coating type etching apparatus according to claim 7, wherein said moving means is an XYZ table movable in an X-axis direction, a Y-axis direction and a Z-axis direction. 9. The coating type etching apparatus according to claim 7, wherein said coating means comprises a coating member impregnated with a chemical solution, and a holding member for holding said coating member. 10. The coating type etching apparatus according to claim 7, wherein the workpiece is a wafer.