JP2002151465A5 - - Google Patents
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- Publication number
- JP2002151465A5 JP2002151465A5 JP2000349027A JP2000349027A JP2002151465A5 JP 2002151465 A5 JP2002151465 A5 JP 2002151465A5 JP 2000349027 A JP2000349027 A JP 2000349027A JP 2000349027 A JP2000349027 A JP 2000349027A JP 2002151465 A5 JP2002151465 A5 JP 2002151465A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000349027A JP4437611B2 (en) | 2000-11-16 | 2000-11-16 | Manufacturing method of semiconductor device |
| US09/826,038 US20020056700A1 (en) | 2000-11-16 | 2001-04-05 | Method and system for manufacturing semiconductor device |
| TW090116345A TW507266B (en) | 2000-11-16 | 2001-07-04 | Method and system for manufacturing semiconductor device |
| KR10-2001-0041821A KR100437221B1 (en) | 2000-11-16 | 2001-07-12 | Method and system for manufacturing semiconductor device, and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000349027A JP4437611B2 (en) | 2000-11-16 | 2000-11-16 | Manufacturing method of semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002151465A JP2002151465A (en) | 2002-05-24 |
| JP2002151465A5 true JP2002151465A5 (en) | 2007-12-20 |
| JP4437611B2 JP4437611B2 (en) | 2010-03-24 |
Family
ID=18822503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000349027A Expired - Fee Related JP4437611B2 (en) | 2000-11-16 | 2000-11-16 | Manufacturing method of semiconductor device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20020056700A1 (en) |
| JP (1) | JP4437611B2 (en) |
| KR (1) | KR100437221B1 (en) |
| TW (1) | TW507266B (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1546876A4 (en) * | 2002-08-28 | 2008-11-19 | Tokyo Electron Ltd | Method and system for dynamic modeling and recipe optimization of semiconductor etch processes |
| US6842661B2 (en) * | 2002-09-30 | 2005-01-11 | Advanced Micro Devices, Inc. | Process control at an interconnect level |
| US7265382B2 (en) * | 2002-11-12 | 2007-09-04 | Applied Materials, Inc. | Method and apparatus employing integrated metrology for improved dielectric etch efficiency |
| JP2004319574A (en) * | 2003-04-11 | 2004-11-11 | Trecenti Technologies Inc | Method of manufacturing semiconductor device, method and system for automatically operating semiconductor manufacturing device, and method of automatically operating cmp device |
| US8257546B2 (en) * | 2003-04-11 | 2012-09-04 | Applied Materials, Inc. | Method and system for monitoring an etch process |
| KR20060061343A (en) * | 2003-07-31 | 2006-06-07 | 에프 에스 아이 인터내셔날,인코포레이티드 | Controlled growth of highly uniform, oxide layers, especially ultrathin layers |
| US20050098194A1 (en) * | 2003-09-11 | 2005-05-12 | Christenson Kurt K. | Semiconductor wafer immersion systems and treatments using modulated acoustic energy |
| TW200515475A (en) * | 2003-09-11 | 2005-05-01 | Fsi Int Inc | Acoustic diffusers for acoustic field uniformity |
| JP4305401B2 (en) * | 2005-02-28 | 2009-07-29 | セイコーエプソン株式会社 | Semiconductor device |
| JP2006245036A (en) * | 2005-02-28 | 2006-09-14 | Seiko Epson Corp | Forming method of element isolation layer, manufacturing method of electronic device, and cmp apparatus |
| US7596421B2 (en) | 2005-06-21 | 2009-09-29 | Kabushik Kaisha Toshiba | Process control system, process control method, and method of manufacturing electronic apparatus |
| US8070972B2 (en) * | 2006-03-30 | 2011-12-06 | Tokyo Electron Limited | Etching method and etching apparatus |
| JP4990548B2 (en) | 2006-04-07 | 2012-08-01 | 株式会社日立製作所 | Manufacturing method of semiconductor device |
| JP5076426B2 (en) | 2006-09-29 | 2012-11-21 | 富士通セミコンダクター株式会社 | Manufacturing method of semiconductor device |
| JP4971050B2 (en) | 2007-06-21 | 2012-07-11 | 株式会社日立製作所 | Semiconductor device dimension measuring device |
| JP5401797B2 (en) | 2008-02-06 | 2014-01-29 | 富士通セミコンダクター株式会社 | Semiconductor device manufacturing method and semiconductor device manufacturing system |
| JP2010087300A (en) * | 2008-09-30 | 2010-04-15 | Toshiba Corp | Method of manufacturing semiconductor device |
| JP5853382B2 (en) * | 2011-03-11 | 2016-02-09 | ソニー株式会社 | Semiconductor device manufacturing method and electronic device manufacturing method |
| US9005464B2 (en) * | 2011-06-27 | 2015-04-14 | International Business Machines Corporation | Tool for manufacturing semiconductor structures and method of use |
| CN104409348B (en) * | 2014-11-10 | 2017-08-08 | 成都士兰半导体制造有限公司 | The preparation method of trench device |
| WO2018211568A1 (en) * | 2017-05-15 | 2018-11-22 | 三菱電機株式会社 | Method for manufacturing semiconductor device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6060731A (en) * | 1983-09-14 | 1985-04-08 | Hitachi Ltd | Manufacture of semiconductor device |
| US5399229A (en) * | 1993-05-13 | 1995-03-21 | Texas Instruments Incorporated | System and method for monitoring and evaluating semiconductor wafer fabrication |
| KR19980014172A (en) * | 1996-08-08 | 1998-05-15 | 김광호 | Method of overlay measurement of semiconductor manufacturing process |
| JP2867982B2 (en) * | 1996-11-29 | 1999-03-10 | 日本電気株式会社 | Semiconductor device manufacturing equipment |
| US6148239A (en) * | 1997-12-12 | 2000-11-14 | Advanced Micro Devices, Inc. | Process control system using feed forward control threads based on material groups |
| KR100251279B1 (en) * | 1997-12-26 | 2000-04-15 | 윤종용 | Method for controlling a thickness of a layer deposited in a semiconductor fabricating equipment |
| KR100382021B1 (en) * | 2000-02-03 | 2003-04-26 | 가부시끼가이샤 도시바 | Semiconductor device manufacturing method, manufacturing support system and manufacturing apparatus for manufacturing the same |
-
2000
- 2000-11-16 JP JP2000349027A patent/JP4437611B2/en not_active Expired - Fee Related
-
2001
- 2001-04-05 US US09/826,038 patent/US20020056700A1/en not_active Abandoned
- 2001-07-04 TW TW090116345A patent/TW507266B/en not_active IP Right Cessation
- 2001-07-12 KR KR10-2001-0041821A patent/KR100437221B1/en not_active IP Right Cessation