JP2002150508A - Composite integrated thin film magnetic head and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ring type composite integrated thin-film magnetic head capable of achieving high density and high speed transfer of 100 bpsi and 1 Gbps or higher in combination with a single layer vertical medium having low noise. SOLUTION: Both rectangular plates of the longitudinal laminated layer thin film of a leading core, and the horizontal thin film of a trailing core constitute a T-shaped narrow gap ring head. A one-turn coil is wound on the tip of the leading core, and its Bs is high. Thus, a recording point is located at the gap edge thereof, and the slope is steep. This exhibits a high linear density vertical recording characteristic as a single pole ring head. The film forming layer of a main magnetic pole longitudinal laminated layer film directly becomes a sub-quarter micron precision width, achieving a high track density. Also, a high speed is obtained by eddy current reduction by the thin film, and the magnetic flux flow of only magnetization rotation by the laminated layer film. The T-shaped structure is made by the integrated thin film process of two stages orthogonal to each other. Then, lateral thin film cores, and for example, a shield type MR reader or the like are integrated on an embedded wafer formed by slicing a block obtained by integrating, stacking and glass-welding longitudinal laminated layer film cores on a virgin wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite integrated thin-film magnetic head comprising a magnetoresistive read head (hereinafter referred to as "MR reader") and an inductive write head, and more particularly to a write head suitable for combination with a single-layer perpendicular medium. It relates to the structure and its manufacturing method.

[0002]

2. Description of the Related Art The density of magnetic recording has been rapidly increasing, and in a few years, an ultra-high areal density of 100 Gbps and the accompanying 1G
We aim for a high transfer rate of bps. In such a high-density region, it is considered that the current longitudinal recording method cannot overcome thermal instability and must be shifted to the perpendicular recording method.

The first perpendicular recording system is a combination of a single pole head and a perpendicular double-layer medium. The magnetic flux penetrates the recording layer immediately below the main magnetic pole core, is absorbed into the soft magnetic underlayer, and spreads widely with a low magnetic flux density to the return path core, which spreads apart in the layer and returns. In this way, a strong perpendicular magnetic field can be applied to the recording layer, and the recording point is at the pole edge of the main pole core on the medium outflow side, where the magnetic field gradient is steep. The perpendicular magnetic field distribution characteristic shown in FIG. 2A has already demonstrated a high linear recording density of 600 kbpi or more.

However, in this method, since the soft magnetic backing layer having a relatively large macro area functions as a part of the head magnetic path, the signal magnetic flux from the recording bit magnet, which is becoming increasingly finer with higher density, is There is a problem that noise magnetic flux from the backing layer is masked. Further, there is no guarantee that the effective magnetic permeability of the backing layer at ultrahigh frequency is high and uniform during one round of the recording track, and it is expected that it is difficult to maintain uniform recording sensitivity.

The second perpendicular recording system combines a symmetric ring head and a single-layer perpendicular medium without a soft magnetic underlayer. About 20 years before the first method was proposed, both the spacing between head media and the thickness of the recording layer were large. The recording magnetic field of the ring head at the recording layer position under that condition has a weak vertical magnetic field component compared to a strong longitudinal magnetic field component, and the gradient at the recording point is not steep, so the ring head is not the best for the vertical method. It has not been. It should be noted that the medium of the second type includes a vertical in-plane composite medium intended to improve the perpendicular recording characteristics. This is because the backing layer (in-plane layer) is not thick and has high magnetic permeability acting as a part of the head core.

However, at present, the recording layer is thin (about 25).
nm) The spacing is approximately 1 by the contact slider.
0 nm has been realized. Under this condition, the symmetrical ring head also has a sufficiently strong perpendicular recording magnetic field H as shown in FIG.
y. Even so, the steepness of the magnetic field gradient at the recording point is insufficient, so that AC demagnetizing recording demagnetization occurs, which causes a decrease in output and a reversal magnetic domain noise. As a result, perpendicular recording at an extremely high linear density cannot be performed as it is. For comparison, the longitudinal magnetic field (Hx) for longitudinal recording is calculated at the recording point (Hx =
Hc) shows that it is steep.

[0007] Onodera et al. Examined the condition of high linear density recording of a combination of a vertically oriented ME tape as a single-layer medium and an asymmetric MIG type ring head by computer simulation. (J. Mag. Soc. Jap
an: Suppl. As a result, it was found that high-density perpendicular recording was possible by using a head in which soft magnetic materials having saturation magnetic flux densities Bs of 2T (tesla) and 1T were disposed on the leading core side and the trailing core side, respectively.

The operation is shown in FIG. Writing is performed near the gap edge of the reading core (recording point Hy = Hc), and there is no rewriting in the trailing core. The gradient at the recording point is steep due to the narrow gap, and no recording demagnetization occurs. In this asymmetric ring head, a high-Bs leading core in which writing is performed immediately below the gap edge has a main magnetic pole, and a low-Bs trailing core that dilutes and broadly absorbs and returns magnetic flux (to the extent that there is no writing to the medium) returns. It corresponds to each pass core. Thus, this asymmetric head would be appropriately functionally called a single pole ring head. (Here, the display of the coordinates is in accordance with a custom, and the medium traveling (longitudinal) direction is X, the direction perpendicular to the medium surface is Y, and the lateral direction is Z).

The "single-pole ring head" is one of the important concepts of the present invention, as will be described later, and will be described here. In general, a symmetric ring head is a double magnetic pole, and vertical writing and rewriting are performed at two locations of positive and negative | Hy |> Hc on both core poles. If the Hy-X distribution of the ring head is made asymmetric and | Hy |> Hc only on the leading pole, writing is performed with only one pole (single magnetic pole, main magnetic pole), and the recording point is at the gap edge. , Its gradient is also steep. As a result, perpendicular recording can be performed in the same manner as a single pole head, and high recording sensitivity can be obtained without a soft magnetic underlayer (which also acts as a noise source) because the ring head is a (narrow gap) ring head. For a 170 nm thick ME tape, this single pole ring head showed high linear density,
Much higher linear densities should be obtained by contact recording on current vertical hard disk media with a thickness of 25 nm and a vertical squareness ratio of 0.98.

Generally, HDD (hard disk drive)
Most of the densification of has been achieved in accordance with the scaling law. The vertical single-pole ring head should also be put into practical use by shifting from a bulk MIG head to a small integrated thin film head. However, even with the current paddle (pancake type) core type thin film head, the recording sensitivity is not very good in a structure in which a spiral coil film having many turns is arranged around a closed magnetic portion. In the merged composite thin film head, as shown in FIG. 3, Muraoka et al.
An exciting high recording sensitivity is obtained by winding and exciting a 5-turn coil. (J. Mag. Soc. Japan,
Suppl-2, 1997)

To achieve a high areal density of 100 Gbpsi, it is necessary to increase the track density with an ultra-narrow track width of sub-quarter microns. Making the tip of the main magnetic pole core of the paddle core type thin film head so narrow in track width is impossible with the extension of the current photolithography technology. Regarding the ultra-narrow track width, the whole is a single pole head having a bulk structure. However, a DSMT (deep submicron track) single pole head of Nakamura et al. Is promising in terms of structural manufacturing method. (FIG. 4) In this method, the film thickness on the substrate is directly used as the track width of the longitudinal film core, so that an ultra-narrow track width can be accurately formed and lamination described below is also easy. Further, this longitudinal film structure effectively enhances a large pole effect, which is an important head medium interaction in perpendicular recording. (J. Mag. Soc.
Japan, Suppl. 1,583, 1994)

Ultra-high speed (1 Gbps or more) is also an object to be achieved together with ultra-high areal density. For that purpose, the magnetic flux flowing around the ring core magnetic path must be caused only by high-speed magnetization rotation from the easy anisotropic axis. No. The easy axis is provided in the Z direction in the paddle type lateral hand film and in the X direction in the DSMT longitudinal film. However, if the tip of the paddle-type core film is made narrower, the ratio of the return magnetic domains appearing on both side edges increases, and it cannot move at high speed. It is known that a magnetic film core having no return magnetic domains may be formed by a laminated film structure with a non-magnetic intermediate layer interposed therebetween so as to form an antiparallel single magnetic domain laminated structure. However, even if a paddle-type core is laminated, it is meaningless for an ultra-narrow track-width processed one because the anisotropy is not applied in the film plane (YZ plane) due to a large demagnetizing field. With the above-mentioned DSMT longitudinal film, lamination (XY plane) would be effective.

There is another problem in increasing the speed and increasing the frequency. Overwrite degradation and non-linear shift (NLTS) due to eddy currents in the metal magnetic film. As a countermeasure, the development of a high-resistance magnetic material has been strongly performed. However, if the DSMT longitudinal thin film is used instead of the thick paddle-type core film, the eddy current will be reduced for geometric reasons. Therefore, the selection of the core magnetic material, which must meet various requirements, including the resistivity, should be selected. Will expand.

In contrast to the longitudinal magnetic recording in which a volume magnetic charge appears at the bit boundary surface, in the perpendicular recording, the bit pattern appears as a surface magnetic charge on the sliding surface. Therefore, contact sliding recording between the medium and the soft magnetic head core is indispensable for realizing the high density of the vertical system. Fortunately, a three-point pad slider has been developed that performs stable contact running using the meniscus force of the lubricating liquid (Yanagisawa, Journal of the Japan Society of Applied Magnetics, Vol. 2, 1239, 1).
998), if a soft magnetic film of high hardness without uneven wear could be incorporated into the main pole, the feasibility of contact perpendicular recording would be enhanced.

The main magnetic pole of the ring head operating as a single magnetic pole requires a high Bs soft magnetic material. (0007,0008)
As a material having the above-mentioned high hardness, for example, FeT
Iron-based nanocrystalline soft magnetic materials such as aN (Bs1.6T, Vickers hardness Hv1000) have already been developed and can be used. However, this magnetic material has a high temperature (550
° C) heat treatment, so that GMR or T
After film formation of MR reproducing part (including this FeTaN etc.)
Current manufacturing processes for forming recordings cannot be used. It is desired to design a reverse arrangement structure of the recording / reproducing section.

In order to attain high density, an MR reader such as a shield type GMR or a TMR having a high reproduction sensitivity is largely used. Therefore, unlike the case of the inductive recording / reproduction, a high recording sensitivity head could be made in a few turns. [0010] In the composite head, it is necessary to reduce the gap between the gaps between the recording and reproducing in order to reduce the skew angle difference between the recording and reproducing gaps in the rotary actuator, and it is considered that all or a part of the core is shared. I have. The merge type, which shares a part of the core, is currently the mainstream. The new head must have a core structure that can incorporate some merged composite type.

[0017]

To summarize the above recent advances, a single pole ring head combined with a single layer perpendicular medium is used for high linear density, and a main pole core is used for high track density and high speed transfer. In order to increase the recording sensitivity, a one-turn coil is wound around the tip of the main pole thin film core of the composite integrated head, and the ring core is made to have an ultra short magnetic path. The present invention provides 100 Gbpsi,
In order to realize 1 Gbps, a new structure that satisfies all other necessary conditions and a new manufacturing method that satisfies all other necessary conditions while integrating these element technologies into a composite head based on integrated thin film technology without any inconvenience will be introduced to the third vertical application. It is intended to be provided as a system.

[0018]

Means for Solving the Problems When a single pole ring head for performing recording on a single layer perpendicular medium with high linear density, high track density, high speed and high recording sensitivity is constituted as a composite type integrated thin film magnetic head, The structure is as shown in FIG. That is, a long laminated thin-film core of high Bs and sub-quarter micron thickness of main pole operation is embedded in the rear surface of the contact slider together with the one-turn coil conductor film, and a low Bs of return path core operation is sandwiched across a narrow gap. The T-shaped ring head is constituted by the lateral thin film core. As a composite, for example, the shield type MR reader is formed on the rectangular horizontal thin film core in common. The outline is described in detail below.

In order to give the longitudinal laminated thin film core having a sub-quarter micron track width a main magnetic pole effect, first, it is formed as a leading core which is embedded at right angles to the rear surface of the slider. However, this process is carried out by the first half of a manufacturing method described later, that is, an integrated two-stage integrated thin film process. Secondly, a structure is used in which a soft magnetic material having a high Bs and a high Hv is used for the longitudinal core and a one-turn conductive film coil is wound around the tip of the core. To be precise, a simple three-layered structure in which a pair of U-shaped conductor films consisting of a coil part and a lead part are arranged on both sides with an alumina insulating layer sandwiched around the longitudinal core was made, In the latter half of the process, the coil portions are connected to complete a one-turn winding coil.

Next, the connecting portion of the coil is covered with a modified U-shaped cross section, and a low Bs transverse thin film core comprising a throat portion intermediate film, a back closed magnetic portion intermediate film, and a flat rectangular plate-like film of the main portion is formed by a slider. The insulating film is appropriately formed on the rear surface with an insulating film interposed therebetween. The longitudinal core and the lateral core form a T-shaped ring head with a narrow gap interposed therebetween. The lateral core acts as a return path core and forms a single-pole ring head with respect to the main pole of the longitudinal core. I have.

For high-speed head transfer, it is first necessary to reduce eddy currents in the metal core. This problem can be solved by using a magnetic material of several tens of micro-ohm cm if the longitudinal film has a sub-quarter micron thickness and the lateral film thickness (the main rectangular plate portion) is at most twice as thick. Also, the magnetic flux flow of the ring core must be due to magnetization rotation. Therefore, the main magnetic pole longitudinal thin film core has a laminated structure sandwiching a non-magnetic intermediate layer of several nm, and has anisotropy Hk in the longitudinal direction (X) perpendicular to the magnetomotive force direction (Y) of the coil. The exchange interaction is interrupted by the non-magnetic film so that the magnetic flux flows in the closed magnetic portion twice at an angle of 45 ° so as to form a magnetostatic coupling so that an orbital closed magnetic path is efficiently formed. Hk of the right-angled triangular portion sandwiched between them is inclined at 45 ° from the X direction.

In the lateral thin film core, Hk is applied in the lateral direction (Z). Therefore, the magnetic flux flowing from the longitudinal thin film core through the boundary surface becomes a magnetic flux of magnetization rotation orthogonal to the Z axis in the back closed magnetic portion intermediate film of the horizontal core. It gradually turns in the Y direction as it goes deeper into the lateral core. Magnetic flux is H
It flows in the Y direction in the lateral core as the magnetization rotation in the direction perpendicular to k, returns to the longitudinal core with the inside and outside (recording leakage magnetic field) of the narrow gap closed, and the short ring core magnetic path is closed. Regarding lamination, lamination was essential so that return magnetic domains did not appear on the gap side serving as the main effective magnetic path in the main pole-like longitudinal core. However, in the Yokote core, the return magnetic domains only appear at the opposite ends, so lamination does not have much effect on the effective high-speed magnetic flux flow. Therefore, the adoption or non-adoption of lamination may be comprehensively selected, including the high speed, the magnetic material, and the manufacturing process.

The reason why the arrangement of the two core halves constituting the integrated thin film ring head is not an in-line type but a T-type (long core and lateral core) will be described in relation to the structure and operation. (A) A precise narrow gap can be easily formed.
(B) It is suitable for the merge type, and the skew angle difference between recording and reproduction is extremely small. In addition, it is easy to make a delicate MR reader. (C) The permeance in the leakage recording magnetic field between the two core halves sandwiching the narrow gap is larger in the T type. (D) Since the orthogonal two-stage integrated thin film process includes a bulk process (machining and glass fusion), there is a non-interval between the vertical arrangement of the matrix of coiled longitudinal cores appearing on the polished surface of an embedded wafer (described later). Equal spacing and non-straightness are inevitable. Therefore, in the integrated process of collectively exposing the horizontal core matrix by photolithography in the second stage, the T-type having higher tolerance in track alignment and the like has higher productivity.

High recording sensitivity characteristics are also important. (The inductive recording head is abbreviated as a writer.) The writer LS1 achieves low power and high speed, high reliability by avoiding heat generation of the coil, and short magnetic path of the core by one-turn and thin coil. Because. Each element of the structure contributing to higher sensitivity is listed here. Note that the recording sensitivity here is somewhat specialized and relates to a current required for recording and magnetizing a thin (about 25 nm) perpendicular single-layer medium during contact traveling. (A) Although it is a ring head with a narrow gap,
The high-speed (high-frequency) magnetic flux of magnetization rotation is directed in the Y direction perpendicular to Hk, because the turn coil orbits the tip of the main magnetic pole core and the longitudinal core has a laminated thin film structure. Therefore, even if there is no soft magnetic underlayer, Hy is predominant, side fringing is small, and short circuit between gaps is reduced. (B) The magnetic flux due to the magnetomotive force of the coil circling the longitudinal thin film core is efficiently focused and saturated on the gap side, which is the recording point. (C) The anisotropic magnetic fields Hk (X direction (mainly) and Z direction, respectively) applied to the longitudinal core of the XY plane thin film and the lateral core of the YZ plane thin film are considerably small because the demagnetizing fields in each direction are small. Can be set. Therefore, the magnetic permeability of the magnetization rotation relating to them is large, and the recording sensitivity is also large. (D)
In conventional narrowing of longitudinal recording, pole trimming is required to reduce side fringing, and the effective magnetic permeability cannot be reduced. In the perpendicular recording with a single-pole T-ring head, the need for the horizontal core which is the return path core is unnecessary for the reason described in (0009).
The original high magnetic permeability can be used. (E) In single pole ring head recording, there is no recording demagnetization, so that the recording sensitivity is indirectly improved.

After the integration of the T-type ring head as a writer, a merged shield type TMR or GMR reader is formed, for example, by using the flat, high-speed, high-permeability transverse thin-film core. Therefore, the recording / reproducing relationship is reversed from that of the conventional merged head, and there is no thermal damage to the MR reader, which tends to occur in the conventional case where a writer is formed later. Conversely, it is possible to use high-Bs and high-Hv nanocrystalline magnetic materials, etc. that require high-temperature heat treatment for the main pole-like longitudinal core material of the writer. Can be realized stably.

The above-described structure of a single pole T-ring with high density, high speed, and high recording sensitivity cannot be manufactured by a conventional method, but is realized by a novel manufacturing method including two orthogonal integrated thin film processes. It is possible. The first stage is mainly an integrated thin film process on the XY plane (when the head is formed). As shown in FIG. 5, m × n matrices of a set of a pair of longitudinally laminated thin film cores and coil conductor film halves are formed in three layers on a rectangular virgin wafer with an insulating film appropriately interposed therebetween. Similarly, a film is formed on one wafer. These are stacked and fused to form a block. Here, when the thin film core is a nanocrystalline magnetic material, heat treatment and anisotropy are performed for that purpose. The block is sliced into n pieces along the YZ plane. When these surfaces are polished flat, an m × l set matrix composed of a track width cross section serving as a gap wall surface of a longitudinal core, a coil section of two conductive film halves serving as a one-turn coil, and a film thickness cross section of a lead tip portion is obtained. appear. In this manner, n embedded wafers are obtained.

This manufacturing method has an advantage that, unlike the conventional method, a long laminated core having a track width of sub-quarter micron can be obtained with high smoothness and high precision as it is.
However, as mentioned in (0023) (d),
Vertical arrangement of longitudinal thin film cores on an embedded wafer (Y
It is difficult to ensure the high accuracy of the straightness of the direction) and their uniformity. In order to take advantage of the integrated thin film process of the batch exposure, an effort and a device for reducing this difficulty are particularly necessary.

A point in the virgin wafer integration process for that purpose will be described with reference to FIG. 6 which shows a YZ cross section of a film-formed virgin wafer serving as a longitudinal thin film core gap wall surface. After an insulating alumina layer is sputter-deposited on an (altic) wafer of the same thickness standard, a U-shaped lower half of the conductor film composed of a coil portion and a lead portion is formed by a copper frame plating method. Alumina is formed. The generated irregularities are flattened and polished to a first specified thickness T1. High B on it
An s-high Hv longitudinal core laminated film is formed by photolithography and sputtering into a shape with additional portions as shown in FIG. Further, an alumina film is again formed thereon, and the upper half of the conductor film is plated on the surface. After again forming an alumina film thereon, it is planarized and polished to a second specified thickness T2. Glass is sputtered on it for several tens of nm to complete the integrated thin film process of each virgin wafer. The accuracy of T1 and T2 for all one wafer is the key to straightness and equal spacing. In order to avoid short-circuiting and the like in the subsequent process due to insufficient accuracy that still remains, the distance between the longitudinal thin film core and the conductor film is set to be slightly wider (about 2 μm thick) to allow for tolerance.

It is also necessary to devise a way to give the uniaxial anisotropy Hk in the plane of the longitudinal core film. As described in (0021), Hk is tilted in the X direction at the main portion and at 45 ° in the closed magnetic portion. In order to apply Hk in two directions at the same time, an additional magnetic film (yoke) is provided as shown in FIG. 7, and a non-magnetic groove is provided so that an external magnetic field in the intermediate direction can be applied to the magnetic film. Is applied in each Hk direction. The anisotropy is performed at the same time as the heat treatment of the nanocrystalline magnetic film when or after the glass is fused into blocks. The additional magnetic film portion will be removed later as a vertical cut when slicing into an embedded wafer and as a horizontal cut when slicing into a rover. Become.

Similarly, one virgin wafer on which a film is formed is obtained. This is obtained by exactly (1) depositing the same matrix (m × n) at the same position with respect to the outer edge on the original virgin wafer surface of the same size square. Further, the outer edges of the l sheets are aligned exactly (3), and then thermocompression-bonded with glass to form a block including l × m × n elements (longitudinal cores). The slice is sliced into n pieces so that a cross section (YZ plane) serving as a gap plane of the longitudinal thin film core appears. The surface on the side of the long thin film core is subjected to the most precise flattening and polishing to the level L1 in FIG. 8 to obtain an embedded wafer including 1 × m elements. By taking account of the accuracy of (1), (2) and (3) and improving the uniformity of (0028), the longitudinal thin-film core matrix with the conductor film pair on the embedded wafer is vertically aligned with micron order accuracy. Equal spacing of the directional and lateral arrangements is maintained.

In the integrated thin film process of the second stage, a film is formed on the YZ plane on the embedded wafer so as to be orthogonal to the longitudinal thin film core film (XY plane). This will be described with reference to FIG. First, alumina is sputtered on the entire surface as a gap layer and an insulating layer.
In order to make through holes in the cross section of the coil and lead terminals of the conductor film, and the cross section of the long thin-film core, first apply a positive resist and then apply a wide pattern exposure, development, etching, resist on these cross sections. Peel off. Next, in order to form a U-shaped plate-shaped coil connection portion as shown in FIG. 1 and a lead portion to a pair of L-shaped folded plate-shaped terminals, a positive resist is applied, and the coil portion (the above-mentioned 2) is formed.
Pattern exposure, development, and frame plating of a copper film are performed on the cross section of the lead terminal section and the subsequent lead section to the bonding terminal section. Remove the flame resist.

After applying a positive resist, the throat portion and the back magnetic closed portion of the lateral thin film core were subjected to pattern exposure and development to obtain a low Bs
Frame-plated soft magnetic material. At this time, plating is performed while applying a magnetic field in the Z direction to give a uniaxial anisotropy Hk. The remaining resist is stripped away leaving the resist in the lead area to the terminal. Alumina is sputtered, and the throat portion and the back closed magnetic portion are flattened and polished to a predetermined height (level L2). The main part of the rectangular plate-shaped horizontal thin film core is frame-plated in a magnetic field (Z direction) so that it can be covered over the throat part and the closed magnetic part by applying a positive resist, pattern exposure, and development. Form the core. After the resist is removed and alumina is sputtered, flattening and polishing are performed until the upper surface of the magnetic film is exposed (level L3), and the horizontal thin film core process is completed. At the same time, the manufacture of the inductive recording head is completed.

The reason why the soft magnetic material of the lateral thin film core is a plated film that does not require high-temperature heat treatment is that the soft magnetism including the anisotropy of the longitudinal core applied in the previous stage is not impaired. The plating film does not provide Hv as high as the nanocrystalline magnetic film, but the lateral core is a return-pass core and does not require uneven wear resistance as long as the main core. As the plating magnetic film, one having Bs lower than that of the longitudinal core, an electric resistance equal to or higher than that of the longitudinal core, and Hv higher than permalloy (for example, NiFeP) is selected. To further improve the high frequency characteristics, a laminated plating film with a non-magnetic intermediate metal layer (for example, NiW or the like) is used. Note that an amorphous sputtered film can be used as a soft magnetic material that does not require high-temperature heat treatment.

Since the present invention does not relate to the GMR or TMR reader itself, its description is omitted, and the arrangement and structure related to this writer as a composite head will be described. The flattened horizontal core of the writer also serves as one shield of the merged recording / playback head, on which the thermal structurally delicate ultra-thin multilayered structure of the GMR or TMR main part is well integrated. Can be. In particular, the portion relating to sub-quarter micron track alignment during recording / reproducing cannot be performed by batch exposure due to the lack of accuracy of equal spacing of the longitudinal thin film core arrangement on the embedded wafer. For this purpose, a monitor is provided for each vertical line, and each is exposed and formed by electron beam or ion beam lithography. The same magnetic film having substantially the same shape as the lateral core is formed as a top shield by a frame plating method, and the entire process of the MR reader is completed. An alumina protective film is sputtered thereon.

After the integrated film process of the recording / reproducing element is completed, the embedding wafer is subjected to (a) a wafer test, (b) sliced on a row bar, (c) adhered to a tooling bar, and cut into a slider as it is according to the prior art. , (D) ABS processing on the 3-pad contact slider, and (e) fine processing on the throat height, and then the slider is separated into the (f) slider. FIG. 9 shows an external view of a contact slider of a reverse arrangement merge type T-ring head (composite integrated thin film magnetic head).

Finally, in view of the difficulty of fine processing due to further ultra-high density in the future, a simplified head structure shown in FIG. 10 is additionally provided. Except for the throat portion intermediate film of the lateral thin film core, the one-turn conductive film coil is made to reach the medium sliding surface (ABS) at the tip of the long thin film core. The decrease in the recording magnetic field due to the increase in the gap is compensated to some extent by the increase in the magnetic field due to the proximity of the coil position to the ABS, and the electric short circuit is avoided by improving the DLC protective film on the head surface.

[0037]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention has a structure as a third perpendicular recording system,
Since the novelty is widely adopted in the production method, a rather specific detailed explanation is given in (Means) for understanding the action. Therefore, in the embodiments, only substances, numerical values, and the like are described without duplication. Target 100 Gbpsi is 6
Assuming that 00 kbpi × 160 ktpi, the track width (film thickness) of the longitudinal thin film core is 160 nm, the pole length is 5 μm, and the gap wall length (height) is 18 μm. The laminated film structure is composed of FeTaN (Bs 1.6 T, 50 micro ohm cm, Hv 1000) 40, 80, 40 n sandwiching a 2.5 nm non-magnetic intermediate layer (alumina or silica).
The layer was sputtered with a thickness of m.

The horizontal thin film core has a width (Z direction) of 8 μm, a height of 18 μm, a thickness of 0.5 μm for both the main portion and the intermediate layer of the closed magnetic portion, and a thickness of 0.35 for the throat portion.
Micron, throat height 0.5-2 microns. The magnetic film material to be frame plated is Ni ₆₄ Fe ₂₉ P ₇ (Bs
1.0T, 85 microohm cm) or lower Bs. The width of the copper plating film of the U-shaped conductor film is 5 μm on the vertical part and the longitudinal part on the ABS side, 20 μm on the back part of the longitudinal part, the film thickness is 0.5 μm, and the coil connection part and the bonding terminal have the YZ plane. The film thickness of the lead portion is 0.2 μm. The insulating layer between the coil connection and the longitudinal thin film core is 0.15 microns, the same as the gap layer. Millions of nano-sliders can be obtained as m × n × l nano-sliders from a block composed of one 4-inch square wafer.

[0039]

According to the integrated thin film process of two stages perpendicular to each other, a high Bs longitudinal laminated thin film core with a sub-quarter micron track width is embedded as a leading core on the slider rear surface together with a one-turn tip coil, and a low Bs
It has become possible to form a T-shaped ring head with a horizontal thin film core. By using a single-layer perpendicular medium while avoiding the soft magnetic backing layer noise and combining with this single-pole type ring head, high linear density perpendicular magnetic recording and high track density can be simultaneously achieved, and 100 Gbpsi can be achieved.
C degaussing noise (reverse magnetic domain noise) is also eliminated. In addition, high-speed and high-recording sensitivity of 1 Gbps can be obtained by the magnetization rotating magnetic flux flow due to the laminated structure, the eddy current reduction due to the thinness of the core film, and the inductance reduction due to the short magnetic path and the thinness due to the one-turn coil structure.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a structure of an inductive recording head of a composite integrated thin film magnetic head according to the present invention. Only half of the lateral thin film core is shown.

FIG. 2 is an explanatory diagram showing a structure of a recording head and a magnetic field distribution. (A) Single pole head, (b) Symmetric ring head, (c) Asymmetric (single pole) ring head.

FIG. 3 is a merged integrated thin film single pole head having a main pole tip coil.

Fig. 4 Single pole head (bulk type) with DSMT longitudinal film core main pole

FIG. 5 is an explanatory view of an orthogonal two-stage integrated thin film process according to the manufacturing method of the present invention.

FIG. 6 is a YZ sectional view showing the integration of a longitudinal thin film core, a conductive film, and the like on a virgin wafer.

FIG. 7 is also an explanatory view showing a part of a matrix of a longitudinal thin film core on a virgin wafer and an additional magnetic film for making anisotropy.

FIG. 8 is also an XY cross-sectional view showing a second-stage integration process on an embedded wafer.

FIG. 9 is an external view of a contact slider on which an inverted arrangement type merged head (composite integrated thin film magnetic head) according to the present invention is mounted.

FIG. 10 is an XY cross-sectional view of a simplified structure in which the throat intermediate layer core of the inductive recording unit of the present invention is omitted.

[Explanation of symbols]

10: longitudinal thin film core, 11: main part, 12: closed magnetic part,
13: high Bs magnetic film, 14: non-magnetic intermediate layer, 15: additional magnetic film, 16: non-magnetic groove, 20: horizontal thin film core, 21: main part, 22: throat part intermediate film, 23: same Back magnetic section intermediate film, 24: low Bs magnetic film, 30: coil conductor film, 3
1: The same coil part, 32: The same coil connection part, 33: The same lead part, 34: The lead part to the same bonding terminal,
40: MR reader, 41: shield core, 50: gap (g), 51: insulating layer on the same plane as the gap, 6
0: Wafer Altic Layer, 61: Insulating Layer, 62: Glass Layer, 70: Virgin Wafer, 71: Embedded Wafer, 72: Block, 73: Cut White, 80: Perpendicular Recording Layer, 81: Soft Magnetic Underlayer , 90: single pole head, 91:
Main pole core or main pole core, 92: return path core or return path core.

Claims (5)

[Claims] A high integrated Bs (saturated) thin-film magnetic head composed of an inductive recording head and a magnetoresistive reproducing head (hereinafter referred to as an MR reader) for perpendicular recording on a single-layer perpendicular medium or a composite medium in a perpendicular plane. Magnetic flux density), a laminated film structure of a high-hardness soft magnetic material and a non-magnetic intermediate layer, and a longitudinal thin film core (XY plane) whose sub-quarter micron film thickness becomes the track width as it is is the tip of the longitudinal thin film core. Orbit 1
Along with the turn conductor film coil, it is embedded at right angles to the element surface (rear surface, YZ surface) of the contact slider. The transverse thin film core (YZ plane) of the low Bs soft magnetic material is perpendicular to the longitudinal thin film core and sandwiches a gap to contact the back closed magnetic portion to form a T-shaped ring head. A composite integrated thin-film magnetic head comprising the inductive recording head and an MR reader sharing a core with the recording head. 2. The medium-sliding surface (ABS) at the tip of a longitudinal thin-film core is positioned at the upper end of a one-turn conductive film coil of a T-shaped ring head.
2. The structure of an inductive recording head, wherein the throat portion intermediate film of the lateral thin film core is omitted.
Composite integrated thin film magnetic head. 3. A merged MR reader in which the lateral thin-film core of the T-shaped ring head is shared with one of the shields of the MR reader is a constituent element, and has an inverted arrangement structure (the MR reader is on the trailing side). The composite integrated thin film magnetic head according to claim 1, wherein 4. A pair of U-shaped conductive thin film halves of a longitudinal thin film core and a one-turn conductive thin film coil surrounding the core so as to form an m × n matrix on a virgin wafer (XY plane). Are integrated into three layers. One of the integrated virgin wafers is aligned and fused by thermocompression bonding to form a m × n × l
Make a block containing the individual elements. This block is sliced so that a YZ cross section serving as a gap wall surface of the longitudinal thin film core is obtained, thereby obtaining n embedded wafers. A gap insulating layer film is formed thereon, and a conductive film serving as a lead from the connection portion of the coil portion and the end of the lead portion to the bonding terminal is formed by plating. A transverse thin film core is formed by plating or the like so as to form a T-shaped ring head core by sandwiching the gap with the longitudinal thin film core and straddling the back closed magnetic portion across the connection portion of the coil portion. A method of manufacturing a composite-type integrated thin-film magnetic head, comprising forming an inductive recording head by the above-described orthogonal two-stage integrated thin-film process. 5. An inductive recording head formed by an orthogonal two-stage integrated thin-film process, wherein a lateral thin-film core is shared as a lower shield, on which a multilayer element of an MR reader and an upper shield thin-film core are integrated. 5. The method of manufacturing a composite integrated thin film magnetic head according to claim 4, wherein: