JP2002150256A - Ic module with fingerprint sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate a theft of information from a circuit, falsification of the information, and misuse of it by incorporating a circuit transmitting the result of fingerprint identification into an IC module for an IC card. SOLUTION: This IC module with the fingerprint sensor is characterized in that a terminal surface for connection to an external device is formed on the surface of the IC module substrate, the terminal divided into a plurality of parts is electrically connected to a terminal of an IC chip fixed to the rear side of the IC module substrate, the fingerprint sensor is fixed to the terminal surface of the IC chip via an insulating sealing resin, either one of the fingerprint sensor or the divided terminal is electrically connected to each other, and the fingerprint sensor surface and the terminal surface are parallel to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module for a small IC card, and more particularly, a plurality of fingerprint sensors for detecting the unevenness of a fingerprint on the back surface of the IC module are laid on an integrated circuit. Module I
The present invention relates to an IC module with a fingerprint sensor electrically connected to a C chip.

[0002]

2. Description of the Related Art In a highly information-oriented society, when purchasing goods or exchanging important information from a personal computer or a mobile phone by using the Internet, it is necessary to surely prove the identity of the person. I do. For that purpose, the key of the person is registered, and information and money are transmitted using the key, so that anyone other than the person concerned cannot open and peek the information.

[0003] Further, a system has been put to practical use in which a fingerprint is collated to confirm whether or not the user is the person himself / herself and to control whether or not to enter a building. There are roughly two known techniques for converting this fingerprint into information. One is a method of optically reading a fingerprint image and converting it into data. Another method is a method of reading a pressure difference generated when the unevenness of the fingerprint is pressed against the sensor and converting it into data.

The above-described optical reading method is a method in which a fingerprint is captured as optical image data by using light reflection and a CCD image sensor, and collation is performed (Japanese Patent Laid-Open No. 61-1986).
221883). Another method of converting the pressure difference due to the unevenness of the fingerprint into an electric signal is a method of laying a plurality of pixels having a sensor circuit in an array and detecting the fingerprint of the finger as an electric signal by touching the finger, This is a method in which a fingerprint memory in which fingerprint data is registered in advance, an electric signal transmitted from a sensor means at each use, and the fingerprint data in the fingerprint memory are collated, and a collation result is transmitted by the fingerprint recognition means (Japanese Patent Laid-Open No. 2000-2000). No. 242771).

[0005] The above-mentioned method using light has a problem that it is difficult to reduce the size of the device, and its use is limited. In addition, since the method of reading the unevenness of the fingerprint can reduce the size of the device, it can be used as a means for approving access to the IC card by mounting it on an IC card, for example, as well as a device using a database. Can be used. Japanese Patent Laid-Open No. 11-39 discloses a method of mounting a sensor for reading the unevenness of the fingerprint on a card, approving access to the card, and transmitting information of the card owner to an information terminal.
Although introduced in Japanese Patent No. 483, there is a possibility that the fingerprint confirmation information may be stolen because it is transmitted independently via the interface.

[0006]

In order to solve the above-mentioned problems, a circuit for transmitting a result of fingerprint confirmation is incorporated in an IC module for an IC card, so that information can be stolen from the circuit and the information can be stolen. It tries to make it impossible to falsify.

[0007]

SUMMARY OF THE INVENTION Therefore, claim 1 of the present invention is provided.
In the IC module with a fingerprint sensor described in the above, a terminal surface for connecting an external device is formed on the front side of the IC module substrate,
The plurality of divided terminals are electrically connected to terminals of an IC chip fixed on the back side of the IC module substrate, and a fingerprint sensor is provided on a terminal surface of the IC chip via an insulating sealing resin. Is fixed, and the fingerprint sensor and one of the divided terminals are electrically connected, and the fingerprint sensor surface and the terminal surface are parallel to each other.

According to a second aspect of the present invention, there is provided an IC module with a fingerprint sensor according to the first aspect, wherein the fingerprint sensor has a sensor circuit for converting a pressure difference caused by unevenness of a fingerprint into an electric signal. Spread in a plurality of arrays, sensor means for detecting the fingerprint of the finger as an electrical signal by contacting the finger, for each pixel or for each group of pixels, a fingerprint memory for registering fingerprint data in advance, A fingerprint recognizing unit that compares an electric signal provided from a sensor unit and fingerprint data in a fingerprint memory, which is provided for each pixel or a group of the pixels, and sends a matching result, and a matching unit that sends out a matching result. The data bus for transferring the result and the data bus connected to the data bus receive the collation result. Is set so as to approve access to the module.

According to a third aspect of the present invention, there is provided an IC module with a fingerprint sensor according to any one of the first and second aspects, wherein the IC module is mounted on a small-sized IC card and is detachable from a terminal device. In addition, it is characterized by being used fixedly.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An IC module with a fingerprint sensor according to the present invention will be described below with reference to the drawings.

FIG. 1 is a front plan view for explaining an external terminal connection terminal surface of an IC module with a fingerprint sensor of the present invention, and FIG. 2 is a diagram for explaining a fingerprint sensor surface of the IC module with a fingerprint sensor of the present invention. 3 is a plan view for describing an IC module substrate on a fingerprint sensor mounting surface of the IC module with a fingerprint sensor of the present invention, FIG. 4 is a configuration diagram for describing a fingerprint recognition integrated circuit, FIG. 5 is a sectional view taken along line AA of FIG.
FIG. 6 shows an example of an IC with a fingerprint sensor mounted on a small IC card.
FIG. 7 is a plan view from the external terminal surface of the C module, FIG. 7 is a plan view from the fingerprint sensor surface of the IC module with the fingerprint sensor mounted on the small IC card, and FIG. FIG. 9 is a view for explaining a state in which a small IC card is loaded in an external terminal, and FIG. 9 is a view for explaining a state in which a finger is pressed against a fingerprint sensor. FIG. FIG. 11 is a diagram for explaining the role of each terminal of the external terminal, and FIG. 11 is a sectional view taken along line BB of FIG.

In FIG. 1, the white part of the IC module 1 with a fingerprint sensor is an IC module substrate. For the IC module substrate, an electrically insulating material, for example, a physically and chemically strong and heat resistant material such as glass epoxy, glass BT resin, polyimide, polyester, ABS, and polycarbonate is used. . The hatched portion is the external terminal 2 of the IC module, which is a contact for connecting to an external terminal device.
The external terminals 2 of this IC module are divided by vertical and horizontal grooves, and each is formed in an independent state. Although the role of each divided terminal will be described with reference to FIG. 10, the module substrate of the IC module with a fingerprint sensor 1 of the present invention is configured such that the power supply of the fingerprint sensor formed on the back surface of the IC module is supplied from the external terminals on the front surface. In order to supply, a multi-layer board in which a plurality of circuit boards are stacked is adopted. Therefore, the power supply unit of the fingerprint sensor unit is shared with the power supply unit of the IC module, and the power supply terminal 101 and the ground terminal 105 shown in FIG.
Are formed and are electrically connected to the IC chip and the fingerprint sensor control unit. Also, through holes 3 are formed in spare terminals 104 and 108 which are not currently used in the IC card. This is used to connect to an input terminal of an IC chip as an input terminal of a fingerprint collation result signal transmitted from a control unit of the fingerprint sensor, and the through hole 3 is also formed.

Next, a description will be given of a surface substrate on which external terminals are formed, of the laminated substrate. First, for example, the above-mentioned tape-like polyimide (100 to 150 μm in thickness)
A hole for conducting the guide hole, the IC chip, and the external terminal is formed in the module substrate material. At the same time when 5-8 guide holes are opened for conduction,
Alternatively, it is opened after the guide hole is formed. After bonding the copper foil to both sides of the module substrate, a negative pattern is formed on the copper foil with a resist ink by, for example, a printing method, and the resist is cured. A resist is formed except for a portion separating the terminals on the external terminal surface of the IC module shown in FIG. 1 and a conductive circuit portion for plating. Feeding of the module substrate during printing is performed by the guide holes. Next, as for the patterning of the back surface, similarly to FIG. 1, a resist ink is printed on a pedestal portion for bonding the IC chip 5 on the copper foil. The guide holes are also used for printing on the back surface. After the ink is dried and cured as a resist, the resist is immersed in a corrosive (etching) solution, the portion on which the resist is not placed is dissolved until the surface of the module substrate comes out, and the surface is washed with water to complete the etching.

After the resist ink is removed from the surface of the remaining copper foil, a resist is applied again on the entire back surface and dried.
Nickel and gold plating are applied to the surface of the copper foil. In some cases, gold plating is not performed to reduce costs. After plating is completed, the resist on the back surface is peeled off and dried.

In addition to the above, as a method of manufacturing a module substrate, a hole for connecting an IC chip and a terminal of a module is formed by punching or the like on a sheet-like film, and a copper foil is formed on both surfaces of the module substrate 4. After adhering, there is also a method of forming a resist ink in a pattern on the copper foil on each side by a printing method or the like, and corroding (etching) portions without the ink.

A circuit board for connecting to the control unit of the fingerprint sensor is also prepared in the same manner as the above-mentioned surface board. This circuit board is often not plated with nickel or gold. A dam (5 in FIG. 5) for supporting a sealing resin for protecting an IC chip and a bonding wire described later.
The above-mentioned circuit board and the above-mentioned surface layer board are laminated using, for example, a thermosetting adhesive, with 1) interposed therebetween.

The multi-layer substrate after the lamination has through holes for conduction formed therein, forms an underlayer by electroless plating with copper or the like, and further forms a circuit of each layer by electroless or electrolytic plating. Is conducted. Finally, a protective film of nickel, gold or the like is formed to complete the multilayer substrate. At the time of plating, circuit surfaces that do not require plating are covered with a masking material.

As shown in FIG. 2, on the back side of the IC module with the fingerprint sensor, the fingerprint sensor 4
Is formed on. The back side of the fingerprint sensor 4 is a sealing resin surface that covers an IC chip and a bonding wire that connects each terminal of the IC chip to an external terminal of the IC module. Further, the electric circuit formed on the dam which is a part of the multilayer substrate is connected to the external terminal on the surface by a through hole, and the electric circuit is connected to the control unit connection terminal 3 on the back side of the fingerprint sensor and the anisotropically. Are electrically connected via the conductive film.

FIG. 3 shows an embodiment of the back surface of the IC module before the fingerprint sensor 4 shown in FIG. 2 is mounted.
As described in FIG. 2, the inside of the dam 51 formed on the module substrate 5 (the portion shown in white is an adhesion allowance for adhering the IC module to the card base of the small IC card). The sealing resin (shaded portion) is injected so that the surface becomes flat. In this figure, four through-holes are exposed on the surface of the dam 51, electricity is supplied to the fingerprint sensor through the through-holes, and an authentication signal from the sensor is transmitted to the I / O module of the IC module.
Send to C chip. Although not shown in the figure, the dam 51
May have an electric circuit formed on the surface.

FIG. 4 shows a fingerprint sensor portion of the fingerprint sensor 4. On the surface of the fingerprint sensor, a fine pixel unit 42 for converting the unevenness of the fingerprint into an electric signal is arranged like a grid. The fingerprint information stored and received, and the fingerprint information sent from each pixel are controlled by the fingerprint information control unit 41 for each pixel unit and the recognition results are totaled, and the totaling result signal is directed to the IC chip of the IC module. To send.

Here, the pixel unit 42 shown in FIG. 4 will be described. The plurality of pixel units 42 arranged in a matrix on the surface of the fingerprint sensor are each a concave / convex sensor unit having a sensor circuit below the sensor unit, a fingerprint memory,
It consists of a recognition circuit. The registered fingerprint information is divided and stored in a fingerprint memory in each pixel unit. The sensor element in the sensor circuit disposed on the sensor layer includes a contact electrode having a contact surface disposed on an interlayer insulating film and a wiring layer connected to the contact electrode, and a part of the sensor circuit includes the contact electrode and the wiring layer. Is configured. The contact electrode is disposed on the outermost surface of the pixel unit, and detects and detects a capacitance generated when a finger performing recognition and registration directly contacts. The signal detected by the contact electrode is transmitted to the recognition circuit in the wiring layer. In this sensor element, the capacitance of the contact electrode is measured, and the unevenness of the fingerprint at the portion touched by the contact surface is detected.

In FIG. 5, which is a cross-sectional view taken along the line AA of FIG. 2, first, external terminals 2 are formed on the front surface of the module substrate 5. A dam 51 is formed on the back surface of the module substrate.
Are fixed to the back side of the module substrate. Each terminal of the IC chip 6 and the external terminal are electrically connected by a bonding wire 61, and a part of the external terminal and the fingerprint sensor 4 are connected by the through hole 3 via the anisotropic conductive film 11. ing. The sealing resin 12 is injected into the inside of the dam 51 to a height corresponding to the sum of the dam 51 and the anisotropic conductive film 11.

FIG. 6 is a plan view of an external terminal surface in a state in which the IC module 1 with a fingerprint sensor of the present invention is mounted on a small IC card base 10. This small IC card has a long side of 25 mm and a short side. It has a rectangular shape with a cutout of about 15 mm and a thickness of about 0.8 mm. This size is known as SIM (Subscriber Identity)
(Ty Module) size, and the small IC card is sometimes called a SIM card. This SI
As an application of the M card, for example, when a user wants to use a mobile phone lent by a company for personal purposes, the user inserts a SIM card storing his / her mobile phone number into a predetermined location of the mobile phone lent by the company. When using it, or when using it as a key for a file that cannot be opened by anyone other than yourself on a company personal computer, or in the near future, give the SIM card a credit card child number and insert it into the slot of the watch Used when reserving an electronic ticket or purchasing goods on the Internet. There are many other possible applications, but the concepts of use are similar.

FIG. 7 shows the back surface of the small IC card in which the fingerprint sensor portion of the fingerprint sensor 4 is exposed on the back surface of FIG.
Here, a cross section taken along line BB of FIG. 7 will be described with reference to FIG. FIG.
FIG. 1 is a view in which the IC module 1 with a fingerprint sensor of the present invention shown in FIG. 5 is mounted on a small IC card base 10, and an opening (not shown) is previously formed in the small IC card base 10.
And a larger IC is used for the small IC
It is formed on the front side by cutting the same thickness as the surface layer substrate of the IC module of the card. IC module with fingerprint sensor
It is adhered and fixed via an adhesive 14 to the small IC substrate having the opening and the adhesion margin. At this time, the thickness of the small IC card base 10 and the thickness of the IC module 1 with the fingerprint sensor are set to be the same. Since the thickness of the small IC card is determined by ISO, the thickness of the IC module with the fingerprint sensor is adjusted to the thickness of the small IC card base 10.

FIG. 8 shows a state in which a small IC card is contacted to a contact (not shown) of the external device 200 with the fingerprint sensor on the upper side and the external terminal of the IC module on the lower side. . In order to make the terminals of the small IC card 10 come into contact with the contacts firmly, the small IC card 10 is slid in the direction of the arrow along the small IC card storage section 202 under the fixing section 201 provided on three sides. The storage unit 202 is a small IC
The recess is formed in a slide shape so that the card 10 can be easily set.

As shown in FIG. 9, a small IC card is opened to an external device, for example, a back cover of a portable telephone, and a small IC card storing fingerprint information of a predetermined finger is stored in a storage portion of the portable telephone. To receive power from the mobile phone via the external terminal of the IC module.
00 is pressed against the fingerprint sensor as shown in FIG. The control unit of the fingerprint sensor performs the confirmation work,
The confirmation signal is transmitted to the IC chip. If the transmitted content is OK, the operation of the IC chip is started. When a predetermined procedure is performed between the external device and the small IC card, and the permission to use the mobile phone is issued, the power is turned on and the mobile phone enters a start state. As described above, the small IC card is designed to be carried by the person who uses it in a storage device, and the external device is borrowed and used. For example, in a mobile phone, a small IC card contains a code of a telephone used in one's own home, and a usage fee is added to a home telephone charge and deducted from a bank account. When the amount of money is recorded in advance on the small IC card in advance, the usage fee is reduced and the remaining amount is displayed on the display unit of the mobile phone. In any case, the external device is often a compatible rental device.

FIG. 10 is a diagram for explaining the role of each terminal of the IC module. 101 is a power supply terminal, 102 is a reset terminal, 103 is a clock terminal, 104 is a spare terminal, and 105 is a spare terminal. , Ground terminal, 1
06 is a spare (unused) terminal, 107 is a transmission (I /
O) The terminal 108 is a spare terminal. In many cases, the ground terminal 105 is often connected to a central terminal as shown in the figure. In the embodiment described this time, the power supply to the fingerprint sensor for power supply is performed by the power supply terminal 101,
Performed from the ground terminal 105. In addition, the spare terminal 104 and the spare terminal 108 were used to transmit the fingerprint collation result to the IC chip.

[0028]

According to the prior art, an ordinary IC card is
Install the module and fingerprint sensor at an interval
After inserting the card into the contact, verify the fingerprint and
The C chip was driven. For this conventional technology,
According to the technique of the present invention and a method of using the same, an IC card is miniaturized and, for example, a fingerprint sensor formed on the back side of an external terminal is used to authenticate a fingerprint while the SIM card is set in the device, and the device is driven. With this IC module with a fingerprint sensor, an operation method with extremely high security could be proposed.

[Brief description of the drawings]

FIG. 1 is a front plan view for explaining an external terminal connection terminal surface of an IC module with a fingerprint sensor according to the present invention.

FIG. 2 is a rear plan view for describing a fingerprint sensor surface of the IC module with a fingerprint sensor according to the present invention.

FIG. 3 is a plan view for explaining an IC module substrate on a fingerprint sensor mounting surface of the IC module with a fingerprint sensor according to the present invention;

FIG. 4 is a configuration diagram for explaining a fingerprint recognition integrated circuit;

FIG. 5 is a sectional view taken along line AA of FIG. 2;

FIG. 6 shows an I with a fingerprint sensor mounted on a small IC card.
Top view of external terminal of C module

FIG. 7: I with fingerprint sensor mounted on a small IC card
Plan view from the fingerprint sensor surface of C module

FIG. 8 is a diagram for explaining a state in which a small IC card is loaded in an external terminal.

FIG. 9 shows a state in which a small IC card is loaded in an external terminal;
Diagram for explaining a state where a finger is pressed against a fingerprint sensor

FIG. 10 is a diagram for explaining the role of each terminal of an external terminal of the IC module;

FIG. 11 is a sectional view taken along line BB of FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC module 2 External terminal of IC module 3 Through hole 4 Fingerprint sensor 5 Module board 6 IC chip 10 Small IC card (SIM card) base 11 Anisotropic conductive film 12 Sealing resin 14 IC module fixing material (adhesive) 15 Bridge 16 Frame 41 Control unit 42 Pixel unit 51 Dam 61 Bonding wire 101 Power supply terminal 102 Reset terminal 103 Clock terminal 104 Reserved terminal 105 Ground terminal 106 Reserved (unused) terminal 107 Transmission (I / O) terminal 108 Reserved terminal 200 Terminal Apparatus 201 Fixed section 202 Storage section for small IC card (SIM card) 300 Finger

Claims (3)

[Claims] 1. A terminal surface for connecting an external device is formed on a front side of an IC module substrate, and the plurality of divided terminals are electrically connected to terminals of an IC chip fixed on the back side of the IC module substrate. A fingerprint sensor is fixed to a terminal surface of the IC chip via an insulating sealing resin, and one of the fingerprint sensor and the divided terminal is electrically connected to the fingerprint sensor. A surface and the terminal surface are parallel to each other, wherein the IC module with a fingerprint sensor is provided. 2. The fingerprint sensor according to claim 1, wherein a plurality of pixels each having a sensor circuit for converting a pressure difference due to the unevenness of the fingerprint into an electric signal are spread in an array, and the fingerprint of the finger is detected as an electric signal by touching the finger. Sensor means, a fingerprint memory provided in advance for each pixel or group of pixels, for registering fingerprint data in advance, and an electric signal and fingerprint output from the sensor means provided for each pixel or group of pixels. Check with fingerprint data in memory,
A fingerprint recognizing means for transmitting the collation result, a data bus for transmitting the collation result transmitted by the fingerprint recognizing means, connected to the data bus, receiving the collation result transmitted to the data bus, and if the collation result matches, 2. The IC module with a fingerprint sensor according to claim 1, wherein the IC module is set so as to approve access to the IC module. 3. The IC with a fingerprint sensor according to claim 1, wherein said IC module is mounted on a small-sized IC card and used detachably and fixed to a terminal device. module.