JP2002138121A5 - - Google Patents
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- JP2002138121A5 JP2002138121A5 JP2000337226A JP2000337226A JP2002138121A5 JP 2002138121 A5 JP2002138121 A5 JP 2002138121A5 JP 2000337226 A JP2000337226 A JP 2000337226A JP 2000337226 A JP2000337226 A JP 2000337226A JP 2002138121 A5 JP2002138121 A5 JP 2002138121A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- thermosetting resin
- epoxy acrylate
- acid
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Description
【特許請求の範囲】
【請求項1】 エポキシアクリレート(A)中に存在する水酸基の一部または全部に多塩基酸無水物を付加させてなる酸変性エポキシアクリレート(B)と、熱可塑性ポリマー(C)と、一分子中に少なくとも二個以上の二重結合を有する化合物(D)と、一分子中に一個の二重結合を有する反応性単量体(E)とを含有することを特徴とする熱硬化性樹脂組成物。
【請求項2】 前記酸変性エポキシアクリレート(B)がハーゼン色数100以下であることを特徴とする請求項1記載の熱硬化性樹脂組成物。
【請求項3】 前記熱硬化性樹脂組成物がハーゼン色数100以下であることを特徴とする請求項1または2記載の熱硬化性樹脂組成物。
【請求項4】 前記酸変性エポキシアクリレート(B)がエステル化触媒としてイミダゾ−ル誘導体、重合禁止剤としてヒンダードフェノール系化合物を用いて形成されたものであることを特徴とする請求項1〜3のいずれか1項記載の熱硬化性樹脂組成物。
【請求項5】 前記熱可塑性ポリマー(C)が、ポリメチルメタクリレート、ポリスチレン、ポリスチレンの部分架橋体、スチレンとメチルメタクリレートのブロック共重合体、スチレンとブタジエンのブロック共重合体からなる群より選ばれる少なくとも1種のポリマーであり、その配合量が前記酸変性エポキシアクリレート(B)100重量部に対して1〜30重量部であることを特徴とする請求項1〜4のいずれか1項記載の熱硬化性樹脂組成物。
【請求項6】 前記化合物(D)の配合量が、前記酸変性エポキシアクリレート(B)100重量部に対して0〜50重量部、さらに前記反応性単量体(E)の配合量が前記酸変性エポキシアクリレート(B)100重量部に対して2〜100重量部であることを特徴とする請求項1〜5のいずれか1項記載の熱硬化性樹脂組成物。
【請求項7】 更に増粘剤(F)、硬化剤(G)、内部離型剤(H)、充填材(I)及び/又は繊維材(J)を含有することを特徴とする請求項1〜6のいずれか1項記載の熱硬化性樹脂組成物。
【請求項8】 前記繊維材(J)が、ガラス繊維、ビニロン繊維、アクリル繊維、炭素繊維からなる群より選ばれる少なくとも1種の繊維を含有することを特徴とする請求項7記載の熱硬化性樹脂組成物。
【請求項9】 請求項1〜8のいずれか1項記載の熱硬化性樹脂組成物を、常温〜50℃で熟成することによりタックのない成型用材料とし、成型温度80℃〜160℃、成型圧力1〜15MPaで加熱加圧硬化することにより得られることを特徴とする人工大理石。
[Claims]
An acid-modified epoxy acrylate (B) obtained by adding a polybasic acid anhydride to part or all of the hydroxyl groups present in the epoxy acrylate (A), a thermoplastic polymer (C), and one molecule Thermosetting resin characterized by containing a compound (D) having at least two double bonds therein and a reactive monomer (E) having one double bond in one molecule Composition.
2. The thermosetting resin composition according to claim 1, wherein the acid-modified epoxy acrylate (B) has a Hazen color number of 100 or less.
3. The thermosetting resin composition according to claim 1, wherein the thermosetting resin composition has a Hazen color number of 100 or less.
4. The method according to claim 1, wherein the acid-modified epoxy acrylate (B) is formed by using an imidazole derivative as an esterification catalyst and a hindered phenol compound as a polymerization inhibitor. 4. The thermosetting resin composition according to any one of 3.
5. The thermoplastic polymer (C) is selected from the group consisting of polymethyl methacrylate, polystyrene, a partially crosslinked polystyrene, a block copolymer of styrene and methyl methacrylate, and a block copolymer of styrene and butadiene. The polymer according to claim 1 , wherein the compound is at least one polymer, and the compounding amount is 1 to 30 parts by weight based on 100 parts by weight of the acid-modified epoxy acrylate (B). Thermosetting resin composition.
6. The compounding amount of the compound (D) is 0 to 50 parts by weight based on 100 parts by weight of the acid-modified epoxy acrylate (B), and the compounding amount of the reactive monomer (E) is The thermosetting resin composition according to any one of claims 1 to 5 , wherein the amount is 2 to 100 parts by weight based on 100 parts by weight of the acid-modified epoxy acrylate (B).
7. The composition according to claim 1, further comprising a thickener (F), a curing agent (G), an internal release agent (H), a filler (I) and / or a fiber material (J). The thermosetting resin composition according to any one of 1 to 6.
8. The thermosetting material according to claim 7, wherein the fiber material (J) contains at least one kind of fiber selected from the group consisting of glass fiber, vinylon fiber, acrylic fiber, and carbon fiber. Resin composition.
9. A thermosetting resin composition of any one of claims 1 to 8, a molding material with no tack by ripening at room temperature to 50 ° C., molding temperature 80 ° C. to 160 ° C., An artificial marble characterized by being obtained by heating and curing at a molding pressure of 1 to 15 MPa.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000337226A JP2002138121A (en) | 2000-11-06 | 2000-11-06 | Thermosetting resin composition and artificial marble using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000337226A JP2002138121A (en) | 2000-11-06 | 2000-11-06 | Thermosetting resin composition and artificial marble using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002138121A JP2002138121A (en) | 2002-05-14 |
JP2002138121A5 true JP2002138121A5 (en) | 2007-11-22 |
Family
ID=18812645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000337226A Pending JP2002138121A (en) | 2000-11-06 | 2000-11-06 | Thermosetting resin composition and artificial marble using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002138121A (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2028202B1 (en) | 2006-06-13 | 2012-10-31 | Showa Denko K.K. | Radical polymerizable resin composition |
WO2008139602A1 (en) | 2007-05-14 | 2008-11-20 | Showa Highpolymer Co., Ltd. | Fiber reinforced plastic molding material and fiber reinforced plastic molded article |
KR101270415B1 (en) | 2010-04-20 | 2013-06-07 | (주)엘지하우시스 | A marble chip, a marble comprising the same and preparation method thereof |
KR101270349B1 (en) | 2010-10-19 | 2013-05-31 | (주)엘지하우시스 | Synthetic acrylic marble having pearl-containing pattern and method of preparing the same |
KR101548342B1 (en) * | 2011-12-26 | 2015-08-28 | 제일모직주식회사 | Artificial Marble Chip, Artificial Marble Using Same, and Method for Preparing thereof |
BR112020025244A2 (en) * | 2018-06-12 | 2021-03-09 | Nouryon Chemicals International B.V. | PROCESS OF PRODUCTION OF COMPOUND ARTICLES AND FORMULATION OF ORGANIC PEROXIDE |
JP7399624B2 (en) * | 2019-03-28 | 2023-12-18 | トクラス株式会社 | Painted object |
CN110698800B (en) * | 2019-10-11 | 2021-08-10 | 陕西理工大学 | Acrylic table board and preparation method thereof |
CN113773452B (en) * | 2021-09-02 | 2022-09-02 | 佛山市欧泊石业有限公司 | Artificial marble and preparation method thereof |
CN114395089B (en) * | 2022-01-14 | 2024-04-16 | 东莞市比翼新材料科技有限公司 | Molded vinyl resin and preparation method thereof |
CN115677948B (en) * | 2022-11-18 | 2023-09-22 | 广东热浪新材料科技有限公司 | High specific gravity transparent resin composition and method for preparing particles thereof |
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2000
- 2000-11-06 JP JP2000337226A patent/JP2002138121A/en active Pending
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