JP2002137381A - Nozzle plate and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a nozzle plate having a nozzle hole tapered to decrease the diameter gradually in the ink ejecting direction, and its manufacturing method. SOLUTION: The nozzle plate 1 has a water repellent layer 3 formed on the surface of a plate substrate 2 and a nozzle hole 4 is made through the plate substrate 2 and the water repellent layer 3. The nozzle hole 4 is tapered such that the diameter decreases gradually from the side of the plate substrate 2 opposite to the water repellent layer 3 toward the water repellent layer 3 and one point 5, where the variation angle of diameter varies discontinuously, is present on the taper surface. Since the difference of diameter between the ink inflow side and ink delivery side is increased even if the angle of the taper shape itself is small, a stabilized and excellent ink drop ejection performance can be realized resulting in an inexpensive and highly accurate image output.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nozzle plate and a method of manufacturing the nozzle plate, and more particularly, to a nozzle plate having a nozzle hole tapered in the direction of ink ejection and having a smaller diameter. And a method for manufacturing a nozzle plate for easily and accurately manufacturing a nozzle plate.

[0002]

2. Description of the Related Art An ink jet recording apparatus does not require processes such as development and fixing, and can perform recording in a non-contact manner. Therefore, noise during recording is extremely low, and high-speed printing is possible. Attention has been paid to the fact that the ink has a high degree of freedom and has many advantages such as use of inexpensive plain paper.

Such an ink jet recording apparatus has a plurality of nozzles and actuators arranged corresponding to the respective nozzles. The ink is ejected from the nozzle holes by the displacement or heat generation of the actuator, and the ink is discharged from a paper or the like. Recording on recording material.

[0004] However, if the size of the nozzle hole varies, the amount and speed of the ink to be ejected varies.
There is a problem that the size and position of the ink droplets on the recording material vary and the image quality of the recorded image deteriorates.

Further, if ink remains in the nozzle hole after the ink is ejected, the ejection direction of the ink ejected by the remaining ink is deflected when the next ink is ejected, and the ink is ejected on the recording material. Ink position shifts in this case, and a good image cannot be obtained.

Accordingly, members having a nozzle hole include:
The uniformity of the nozzle holes and the water repellency near the nozzle holes are required.

Therefore, the present applicant first forms a resist pattern having an outer diameter corresponding to a desired nozzle diameter with a dry film resist on a substrate which has been previously subjected to a mold release treatment, A metal such as nickel is electrodeposited around the pattern, and when the thickness of the electrodeposition reaches the thickness of the resist pattern, the outermost surface of the electrodeposited metal is subjected to nickel plating containing tetrafluoride resin. Then, there has been proposed a method of manufacturing an ink jet nozzle for removing the electrodeposit from the substrate and then removing the dry film resist (see JP-A-63-3963).

That is, in this method of manufacturing an ink jet nozzle, a thick film matrix is formed from a dry film resist on a substrate, and a nozzle plate and a water-repellent film are successively electrodeposited to manufacture an ink jet nozzle.

In a conventional method of manufacturing an ink jet printer head having a nozzle base having a parallel portion with an ink discharge port in a head substrate, a first resist is applied on an insulating substrate plated with a conductor. A first resist coating step, and a first resist coating step having a shape larger than the diameter of the parallel portion.
Through the first mask member provided with the pattern
A first exposing step of exposing the resist, and after the first exposing step, the first pattern is formed in the same shape as the first pattern.
A first developing step of forming a resist table on the conductor plating while leaving the resist, and a length of the concave portion on the resist table and the conductor plating exposed during the first developing step. A second resist application step of applying a second resist having the above thickness, and a second pattern provided on a second mask member and the resist table facing each other with the same process as the parallel portion; A second exposure step of exposing the second resist through a second mask member, and after the second exposure step, a nozzle hole forming resist having the same diameter as the second pattern is left on the resist table. A second developing step, and a plating step of growing plating by the same length as the parallel portion toward the top of the nozzle hole forming resist from the insulating substrate side along the surface of the nozzle hole forming resist. Method of manufacturing an inkjet printer head equipped has been proposed (JP-A 10-162
No. 36).

That is, this method of manufacturing an ink jet printer head includes the steps of: providing a first resist layer and a second resist layer having a smaller diameter than the first resist layer on a substrate; depositing nickel from the substrate; Is formed.

Further, conventionally, at least a step of forming a resist layer on a substrate, an etching mask is formed on the resist layer, and reactive ion etching is performed using a mixed gas of oxygen gas and fluorine gas for coating. A step of forming a patterned resist layer by performing etching,
There has been proposed a method of manufacturing a resist pattern having the following (see JP-A-9-31460).

In other words, when this method of manufacturing a resist pattern is applied to a method of manufacturing a nozzle plate, this method mixes a reaction product that normally deposits on a resist side wall with fluorine gas when etching a resist by reactive ion etching. The etching is performed on the resist side wall, and the resist sidewall is also etched to form a resist pattern having a tapered tapered cross section. Using this resist pattern as a mold, an inverted shape, that is, a nozzle whose diameter on the ink inflow side is larger than that on the ejection side can be formed by plating.

[0013]

However, the techniques described in the above publications still require improvement in manufacturing a nozzle plate having good ejection performance.

That is, in the method of manufacturing an ink jet nozzle described in JP-A-63-3963, the cross-sectional shape of the obtained resist is usually an inverted trapezoid in which the substrate side is narrowed. Thus, the diameter on the ink inflow side is smaller than the diameter on the ejection side. However, in such a nozzle shape, the pressure gradually decreases in the ink discharge direction, and energy loss generated by the actuator occurs, thereby lowering the discharge efficiency.

In the method of manufacturing an ink jet printer head described in Japanese Patent Application Laid-Open No. H10-16236, a water-repellent treatment is performed on the ink ejection surface after the resist is removed from the substrate. , The water-repellent layer penetrates into the inside of the nozzle holes, and the degree thereof varies among the nozzle holes. As a result, there is a problem that the ink meniscus position differs between the nozzle holes, and the ejection characteristics may be deteriorated.

Furthermore, in the method of manufacturing a resist pattern described in Japanese Patent Application Laid-Open No. 9-31460, a fluorine gas is mixed with a reaction product that normally deposits on the resist side wall when the resist is etched by reactive ion etching. Since etching is performed on the resist side wall by removing with a gas, if a nozzle plate is manufactured by this method, an etching-resistant layer is provided on the resist, patterning is performed on the etching-resistant layer, and the cost is further increased. It is necessary to form a pattern by a dry process that requires a complicated apparatus, and there is a problem that the manufacturing cost is high and the nozzle plate is expensive.

Therefore, according to the first aspect of the present invention, the nozzle hole is formed in a tapered shape whose cross section decreases in diameter from the liquid chamber side to the ink ejection side, and the tapered surface has a large diameter. Is formed in a shape having at least one or more discontinuous points where the ink is discontinuously changed, and the surface on the ink ejection side is subjected to a water-repellent treatment. The difference between the diameter of the ink jet side and the diameter of the ink jet side increases, realizing stable and excellent ink droplet ejection performance (ink droplet ejection characteristics), and providing a low-cost and highly accurate image output nozzle plate. It is intended to provide.

According to a second aspect of the present invention, the number of parts is reduced by forming an ink flow path forming recess which defines an ink flow path together with the liquid chamber substrate on the surface of the nozzle plate on the liquid chamber substrate side. It is an object of the present invention to provide a nozzle plate that can output a highly accurate image at a lower cost.

According to a third aspect of the present invention, when the surface of the nozzle plate on the liquid chamber substrate side is formed to have a roughness of 0.3 μm or more, sufficient bonding can be performed when the nozzle plate is bonded to the liquid chamber substrate with an adhesive. Provided is a nozzle plate capable of securing an area, obtaining a high bonding strength, realizing more stable and excellent ink droplet ejection performance, and being inexpensive and capable of performing more accurate image output. It is intended to be.

According to a fourth aspect of the present invention, at least two layers of resist materials having different characteristics are laminated on a substrate having at least a surface having conductivity, and a photomask for forming a nozzle hole in the laminated resist material is provided. The resist material is solidified by irradiating divergent light therethrough, and the resist material other than the solidified portion is removed by development to generate the solidified portion as a resist pattern, and the resist pattern is formed on the substrate on which the resist pattern is formed. A predetermined metal film thinner by a predetermined amount than the thickness is electrodeposited, a water-repellent layer is continuously provided on the surface of the metal film, and the metal film and the water-repellent layer are separated from the substrate as a nozzle plate, and then separated. By removing the resist material remaining on the nozzle plate, the diameter decreases from the ink inflow side to the ink discharge side in one exposure and development process. By forming a nozzle plate having a tapered nozzle hole and performing a water-repellent treatment in a state where the resist material protrudes from the nozzle hole portion of the nozzle plate, the water-repellent member does not enter the nozzle hole, A method of manufacturing a nozzle plate capable of performing stable and excellent ink droplet ejection performance (ink droplet ejection characteristics) by performing a water-repellent treatment only on the ink ejection surface of the nozzle plate, and capable of outputting an inexpensive and highly accurate image. It is intended to provide.

According to a fifth aspect of the present invention, the first resist material is formed on at least the surface of the substrate having conductivity on the surface at the same thickness as the depth of the ink flow path forming recess, thereby forming the ink flow path forming recess. After exposing through a photomask for solidifying the first resist material, at least one layer of a resist material having a characteristic different from that of the first resist material is laminated on the first resist material. Irradiating divergent light through a photomask to form nozzle holes in all the laminated resist materials to solidify the resist material,
The resist material other than the solidified portion is removed by development, and the solidified portion is formed into a resist pattern for a nozzle hole and a resist pattern for an ink flow path forming recess, and an ink flow path is formed on the substrate on which the resist pattern is formed. Deposit a predetermined metal film thicker than the resist pattern for the concave portion, and a predetermined amount smaller than the thickness of the resist pattern for the nozzle hole, and continuously form a water-repellent layer on the surface of the metal film. After the metal film and the water-repellent layer are peeled off from the substrate as a nozzle plate, by removing the resist material remaining on the peeled nozzle plate, a single exposure and development process is performed from the ink inflow side to the ink ejection side. Forming a nozzle plate having a tapered nozzle hole having a reduced diameter and an ink flow path forming recess, By performing the water-repellent treatment with the resist material protruding from the hole, the water-repellent treatment is applied only to the ink ejection surface of the nozzle plate without the water-repellent member entering the nozzle hole, and stable and excellent ink is obtained. It is an object of the present invention to provide a method of manufacturing a nozzle plate capable of realizing droplet discharge performance and outputting an image with higher precision and lower cost.

According to a sixth aspect of the present invention, a resist having a thickness of several tens μm is used by using a dry film resist as a resist material and using a dry film resist having a higher exposure sensitivity as the dry film resist on the substrate side. In addition, it is possible to easily form a resist material on the substrate which requires the above, and it is also possible to reduce variations in the thickness of the resist material. In addition to the use of a liquid resist, the step of drying the resist can be omitted, and the mixing of the mutual resist materials can be performed even when different types of resist materials are used in layers. Manufacture of nozzle plates that can be avoided and that can produce high-precision nozzle plates more easily and cheaply It is an object of the present invention to provide a law.

According to a seventh aspect of the present invention, a single exposure and development process is performed by using a dry film resist as a resist material and using a dry film resist having a longer development time as the dry film resist on the substrate side. In the process, a tapered nozzle hole whose diameter decreases from the ink inflow side toward the ink discharge side can be formed more easily and easily, and a more accurate and inexpensive nozzle plate with higher precision can be manufactured. It is an object of the present invention to provide a method of manufacturing a nozzle plate that can perform the method.

[0024] The invention according to claim 8 is characterized in that as the exposure step,
A diffuser is placed on a photomask, and the diffuser is irradiated with parallel light and divergent light is irradiated into the resist material. To provide a nozzle plate manufacturing method capable of performing an exposure process in a conventional process without requiring the introduction of new or new equipment, and capable of manufacturing a nozzle plate with higher precision and lower cost. It is an object.

[0025]

According to the first aspect of the present invention, there is provided a nozzle plate in which a plurality of nozzle holes communicating with a plurality of liquid chambers filled with ink are formed, and a liquid chamber to be joined is formed. Between the substrate, a common liquid chamber and an ink flow path that supplies ink from the common liquid chamber to each of the liquid chambers, and a nozzle plate that discharges ink in each of the liquid chambers from the nozzle holes, The nozzle hole is formed in a tapered shape whose cross section decreases in diameter from the liquid chamber side toward the ink ejection side, and the diameter of the tapered surface changes discontinuously. The above-mentioned object is achieved by being formed in a shape having at least one or more discontinuous points, and by performing a water-repellent treatment on the surface on the ink ejection side.

According to the above configuration, the nozzle hole is formed in a tapered shape whose cross section decreases in diameter from the liquid chamber side toward the ink discharge side, and the tapered surface has a discontinuous diameter. Is formed in a shape having at least one or more discontinuous points that change in shape, and the surface on the ink ejection side is subjected to a water-repellent treatment. The difference from the diameter on the ink ejection side becomes large, so that stable and excellent ink droplet ejection performance (ink droplet ejection characteristics) can be realized, and inexpensive and highly accurate image output can be performed.

In this case, for example, as described in claim 2, the nozzle plate is provided on the surface on the liquid chamber substrate side.
An ink flow path forming recess that defines the ink flow path together with the liquid chamber substrate may be formed.

According to the above configuration, since the ink flow path forming recess that defines the ink flow path together with the liquid chamber substrate is formed on the surface of the nozzle plate on the liquid chamber substrate side, the number of parts can be reduced. It is possible to output an image at a lower cost and with higher accuracy.

Further, for example, as described in claim 3, the nozzle plate has a surface facing the liquid chamber substrate.
It may be formed with a roughness of 0.3 μm or more.

According to the above configuration, the surface of the nozzle plate on the side of the liquid chamber substrate is formed to have a roughness of 0.3 μm or more. , High bonding strength can be obtained, and even more stable and excellent ink droplet ejection performance can be realized.
An even more accurate image output can be performed.

According to a fourth aspect of the invention, there is provided a method of manufacturing a nozzle plate, wherein a plurality of nozzle holes communicating with a plurality of liquid chambers filled with ink are formed, and a liquid chamber substrate to be joined is formed. A method for manufacturing a nozzle plate that defines a common liquid chamber and an ink flow path that supplies ink from the common liquid chamber to each of the liquid chambers, and discharges the ink in each of the liquid chambers from the nozzle holes. A resist laminating step of laminating at least two layers of resist materials having different characteristics on a substrate having conductivity at least on the surface, and diverging light through a photomask for forming the nozzle holes in the laminated resist material. An exposure step of irradiating and solidifying the resist material, and removing the resist material other than the solidified portion by development to form the solidified portion as a resist pattern A developing step for forming the resist pattern; an electrodeposition step of depositing a predetermined metal film on the substrate on which the resist pattern is formed by a predetermined amount smaller than the thickness of the resist pattern; A water repellent step of providing a water layer, a peeling step of peeling the metal film and the water repellent layer from the substrate as a nozzle plate, and a finishing step of removing the resist material remaining on the peeled nozzle plate. Achieves the above object.

According to the above-described structure, at least two layers of resist materials having different characteristics are laminated on a substrate having at least a surface having conductivity, and a photomask for forming a nozzle hole is formed in the laminated resist material. The resist material is solidified by irradiating divergent light, the resist material other than the solidified portion is removed by development to produce the solidified portion as a resist pattern, and the resist pattern is formed on the substrate on which the resist pattern has been formed. Also, a predetermined amount of a thin metal film is electrodeposited, a water-repellent layer is continuously provided on the surface of the metal film, and the metal film and the water-repellent layer are separated from the substrate as a nozzle plate. Since the remaining resist material is removed, the diameter decreases from the ink inflow side to the ink discharge side in one exposure and development process. A nozzle plate having a par-shaped nozzle hole can be formed, and the water-repellent member enters the nozzle hole by performing the water-repellent treatment with the resist material protruding from the nozzle hole portion of the nozzle plate. Nozzle plate that can perform water-repellent treatment only on the ink discharge surface of the nozzle plate, realizes stable and excellent ink droplet discharge performance (ink droplet ejection characteristics), and performs high-precision image output Can be manufactured at low cost.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a nozzle plate, wherein a plurality of nozzle holes communicating with a plurality of liquid chambers filled with ink are formed, and a plurality of nozzle holes are formed. In between, a common liquid chamber and an ink flow path that supplies ink from the common liquid chamber to each of the liquid chambers are defined, and ink in each of the liquid chambers is ejected from the nozzle holes, and the ink flow path is In the method of manufacturing a nozzle plate in which an ink flow path forming recess for forming the ink flow path forming recess is formed together with the liquid chamber substrate, at least a depth of the ink flow path forming recess is formed on a substrate having at least a surface having conductivity. A first resist forming step of forming one resist material, and an exposing step of exposing through a photomask for forming the ink flow path forming recess to solidify the first resist material; A second resist forming step of laminating at least one layer of a resist material having characteristics different from that of the first resist material on the first resist material; and forming the nozzle holes in all the resist materials laminated on the substrate. An exposure step of irradiating divergent light through a photomask to form the resist material, and removing the resist material other than the solidified portion by development to remove the solidified portion from the resist pattern for the nozzle hole And a developing step of generating a resist pattern for the ink flow path forming concave portion, and a thickness of the nozzle hole larger than the thickness of the resist pattern for the ink flow path forming concave portion on the substrate on which the resist pattern is formed. An electrodeposition step of depositing a predetermined metal film thinner by a predetermined amount than the thickness of the resist pattern, and continuously depositing the metal film on the surface of the metal film. A water-repellent step of providing a water-repellent layer, a peeling step of peeling the metal film and the water-repellent layer from the substrate as a nozzle plate, and a finishing step of removing the resist material remaining on the peeled nozzle plate. The above purpose is achieved by providing.

According to the above arrangement, the first resist material is formed on the substrate having at least the surface having conductivity at the same thickness as the depth of the ink flow path forming recess, and the ink flow path forming recess is formed. After exposing through a photomask to solidify the first resist material, at least one layer of a resist material having a characteristic different from that of the first resist material is laminated on the first resist material. The resist material is solidified by irradiating divergent light through a photomask for forming the nozzle holes to all the resist materials, and the resist material other than the solidified portions is removed by development to remove the solidified portions to the nozzle holes. A resist pattern for the ink flow path forming recess is formed on the substrate on which the resist pattern is formed. A predetermined metal film, which is thicker and thinner than the resist pattern for the nozzle hole by a predetermined amount, is electrodeposited, and a water-repellent layer is continuously provided on the surface of the metal film to repel the metal film. After the water layer is peeled off from the substrate as a nozzle plate, the resist material remaining on the peeled nozzle plate is removed, so that the diameter decreases from the ink inflow side to the ink discharge side in a single exposure and development process. It is possible to form a nozzle plate having a tapered nozzle hole and an ink flow path forming recess, and to perform a water repellent treatment in a state where the resist material protrudes from the nozzle hole portion of the nozzle plate, thereby repelling the nozzle hole. Water-repellent treatment can be applied only to the ink ejection surface of the nozzle plate without intrusion of water members, realizing stable and excellent ink droplet ejection performance and high accuracy The nozzle plate capable of performing image output can be more inexpensively manufactured.

In each of the above cases, for example, as described in claim 6, the resist material is a dry film resist, and the dry film resist has a higher exposure sensitivity as the dry film resist on the substrate side. There may be.

According to the above configuration, as the resist material,
Since a dry film resist is used and the exposure sensitivity is higher as the dry film resist on the substrate side, a resist material requiring a thickness of several tens of μm can be easily formed on the substrate. In addition, the thickness variation can be reduced, the height of the ink flow path forming concave portion determined by the resist thickness can be easily made constant, and compared with the case where a liquid resist is used. Therefore, it is possible to omit a resist drying step and the like, and to avoid mixing of resist materials even when different types of resist materials are used one upon another. Nozzle plate can be manufactured.

Also, for example, as described in claim 7, the resist material is a dry film resist, and the dry film resist has a longer development time as the dry film resist on the substrate side. Good.

According to the above configuration, as the resist material,
Using a dry film resist, as the dry film resist, the longer the development time of the dry film resist on the substrate side, so one exposure,
In the development process, a tapered nozzle hole whose diameter decreases from the ink inflow side to the ink discharge side can be formed more easily and easily, and a more accurate and inexpensive high-precision nozzle plate is manufactured. can do.

Further, for example, in the exposure step, in the exposing step, a diffusion plate is arranged on the photomask, and the diffusion plate is irradiated with parallel light to diverge light into the resist material. May be irradiated.

According to the above configuration, in the exposure step, the diffusion plate is disposed on the photomask, and the diffusion plate is irradiated with parallel light to radiate divergent light into the resist material. By simply inserting a diffusion plate in the optical path, it is not necessary to repair equipment or introduce new equipment, and the exposure process can be performed in the conventional process, making it even more inexpensive, and
A highly accurate nozzle plate can be manufactured.

[0041]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. It should be noted that the embodiments described below are preferred embodiments of the present invention, and therefore, various technically preferable limitations are added. However, the scope of the present invention is not limited to the following description. The embodiments are not limited to these embodiments unless otherwise specified.

FIGS. 1 to 8 show a first embodiment of a nozzle plate and a method of manufacturing a nozzle plate according to the present invention. FIG. 1 shows a nozzle plate and a method of manufacturing a nozzle plate according to the present invention. It is a front sectional view of the nozzle plate to which a 1st embodiment is applied.

In FIG. 1, a nozzle plate 1 has a water-repellent layer 3 formed on the surface of a plate substrate 2, and nozzle holes 4 are formed in the plate substrate 2 and the water-repellent layer 3. The nozzle hole 4 is formed in a tapered shape in which the diameter becomes smaller toward the water repellent layer 3 from the surface of the plate substrate 2 opposite to the water repellent layer 3, and the diameter of the nozzle hole 4 is divided by the discontinuous point 5. Different inclination angles. That is, the nozzle hole 4 is
It has one discontinuous point 5 at which the inclination angle of the tapered surface changes, and a plurality of discontinuous points 5 may exist as long as there is at least one.

The nozzle plate 1 is manufactured by the following manufacturing steps shown in FIGS. That is, first,
As shown in FIG. 2, as the substrate 10, a member having conductivity on at least the surface thereof, for example, stainless steel (SUS) 3
04, the substrate 10 has a sufficient thickness so as not to be deformed by a stress generated by Ni electrodeposition described later.

The substrate 10 has its surface (upper surface in FIG. 2) in advance.
Is made to have a roughness of 0.3 μm or more by an abrasive or the like. As shown in FIG. 3, two layers of DFR (dry film resist) 11 having different characteristics are provided on the substrate 10. Then, a resist lamination process for laminating 12 is performed. The resist material is not limited to the DFR. If the number of resist materials to be laminated is two or more, a plurality of resist materials can be laminated, and the number of the discontinuous points 5 increases according to the number of laminated layers. It will be. The first-layer DFR 11 formed directly on the substrate 10 has a first-layer DFR
The DFR 12 having a high exposure sensitivity to the second layer DFR 12 formed on the FR 11 and having a long development time.
Is used. For example, Asahi Kasei Sunfort AQ2558 can be used as the first layer DFR11, and Nichigo Morton ALPH can be used as the second layer DFR12.
O NIT225 can be used.

Next, as shown in FIG. 4, the DF of the second layer
A mask 13 is provided on R12 as a photomask for forming the nozzle holes 4, and a diffusion plate 14 is further provided on the mask 13.
Are arranged, and an exposure process is performed to perform exposure in this state.
As the diffusion plate 14, for example, an LSD series (Nava Corporation) can be used.

As shown in FIG. 8, the light intensity distribution after passing through the diffusion plate 14 is distributed in a steep range with a scatter angle according to the specification. FIG. 8 shows a case where the diffusion plate 14 is a diffusion plate having a specification of a diffusion angle of 20 degrees.

Therefore, the light that has passed through the mask 13 is
The light progresses while spreading to the peripheral portion in accordance with the diffusion angle, and the DFR 11 and the DFR 12 are cross-linked and hardened to become insoluble in the developing solution in accordance with the irradiation amount of the light. As a result, D
The photosensitive regions of the FR 11 and the DFR 12 extend from the opening of the mask 13 to the periphery as the distance from the mask 13 increases, forming a tapered shape. Also, the first layer DFR
No. 11 is a material having a high exposure sensitivity to the DFR 12 of the second layer.
At the interface between the DFR 11 of the layer and the DFR 12 of the second layer, the DFR 11 of the first layer has a larger area remaining after development, and the DFR 11 of the first layer has a tapered shape having a larger diameter. It is formed. And the DF of the second layer
Since R12 has a low exposure sensitivity, in order to obtain a target diameter, it is possible to perform more exposure than when only the first layer DFR11 is used up to the required thickness, and the first layer The diameter of the DFR 11 can be further increased.

Next, after the diffusion plate 14 and the mask 13 are removed, a development process is performed to remove the DFRs 11 and 12 by developing with a developing solution. As shown in FIG. A discontinuous point 16 is formed in the resist pattern 15 at the boundary between the DFR 11 and the DFR 12. Resist pattern 15
The angle of the diameter of the tapered shape is different from this discontinuous point 16.

Next, as shown in FIG. 6, using the substrate 10 on which the resist pattern 15 is formed as described above as a cathode, Ni is added to the total thickness of the DFR 11 and the DFR 12, that is, not more than the height of the resist pattern 15. Electrodeposition is performed to deposit a predetermined thickness to form a plate substrate 2 that is a predetermined metal film, and then, as shown in FIG. A water-repellent process is performed to form a water-repellent layer 3 on the surface. The water-repellent layer 3 may be formed as a eutectoid plating layer by, for example, electrodeposition in a plating bath in which PTFE (polytetrafluoroethylene) particles are dispersed, or a coating-type water-repellent material is rotated and developed. Alternatively, it may be formed.

Then, after performing a peeling process for peeling off the Ni substrate, the plate substrate 2 and the water repellent layer 3 from the substrate 10, the DFRs 11 and 12, which are the resist materials remaining on the plate substrate 2 and the water repellent layer 3, are removed. When the finishing process for removing is performed, the nozzle plate 1 shown in FIG. 1 is created.
The nozzle plate 1 thus formed has a tapered shape in which the resist pattern 15 is removed from the surface opposite to the water-repellent layer 3 of the plate substrate 2 so that the diameter decreases toward the water-repellent layer 3 side. The nozzle hole 4 which is formed and whose diameter changes discontinuously at the discontinuous point 16 portion of the resist pattern 15 is formed.

In the nozzle plate 1 thus formed, the surface on which the electrodeposited Ni is grown and the surface on which the water-repellent layer 3 is formed is the ink ejection side, and the substrate 10 of the plate substrate 2
The surface peeled from the surface becomes a bonding surface with another component such as a liquid chamber substrate on which an ink flow path or the like of the inkjet head is formed.

On this joint surface, the roughness of the substrate 10 is faithfully transferred, and when the surface of the substrate 10 is exposed at the beginning of the manufacturing process, the roughness is controlled so that The joining surface with the component can be made to have an appropriate roughness.

When the roughness Ra of the bonding surface of the plate substrate 2 with other components is set to Ra ≧ 0.3 μm, the surface of the plate substrate 2 at the time of bonding with another member of the ink jet head, such as a liquid chamber substrate, via an adhesive may be used. The joining strength can be made sufficiently strong.

Further, the roughness of the bonding surface of the plate substrate 2 with other components is substantially equal to the roughness of the surface of the substrate 10, and this roughness depends on the adhesion between the first layer DFR 11 and the substrate 10. The surface roughness Ra of the substrate 10 is Ra ≧ 0.3 μm
By doing so, it is possible to greatly reduce the occurrence of problems such as pattern flow during development and electrodeposition of the DFRs 11 and 12.

As described above, in the nozzle plate 1 of the present embodiment, the nozzle hole 4 is formed in a tapered shape in which the cross section decreases in diameter from the liquid chamber side to the ink discharge side, and the nozzle hole 4 has the tapered shape. The surface is formed in a shape having discontinuous points 5 where the size of the diameter changes discontinuously, and the surface on the ink ejection side is subjected to a water-repellent treatment.

Therefore, even if the angle of the taper shape itself is small, the difference between the diameter on the ink inflow side and the diameter on the ink discharge side becomes large, thereby realizing stable and excellent ink droplet discharge performance (ink droplet ejection characteristics). It is possible to perform inexpensive and highly accurate image output.

Further, the nozzle plate 1 of the present embodiment
Has a surface on the liquid chamber substrate side having a roughness of 0.3 μm or more.

Therefore, when joining the nozzle plate 1 to the liquid chamber substrate with an adhesive, a sufficient joining area is secured,
High bonding strength can be obtained, more stable and excellent ink droplet ejection performance can be realized, and inexpensive and more accurate image output can be performed.

The nozzle plate 1 has two layers of DFRs 11 and 12, which are resist materials having different characteristics, laminated on at least a substrate 10 having a conductive surface, and the nozzle holes 4 are formed in the laminated DFRs 11 and 12. Irradiating divergent light through a mask 13 for forming the DFR 11,
12 is solidified, and the DFRs 11 and 1 other than the solidified portion are solidified.
2 is removed by development to form the solidified portion as a resist pattern 15, and a Ni film is deposited on the substrate 10 on which the resist pattern 15 is formed by a predetermined thickness smaller than the thickness of the resist pattern 15, thereby forming a Ni film. After the water repellent layer 3 is continuously provided on the surface of the substrate 10, the plate substrate 2 and the water repellent layer 3, which are Ni films, are separated from the substrate 10 as the nozzle plate 1, and the DFR 11 remaining on the separated nozzle plate 1.
12 has been removed.

Therefore, the nozzle plate 1 having the tapered nozzle hole 4 whose diameter decreases from the ink inflow side to the ink discharge side in one exposure and development process.
By performing the water-repellent treatment with the resist pattern 15 as the DFR 12 protruding from the nozzle hole 4 portion of the nozzle plate 1, the water-repellent member does not enter the nozzle hole 4. Nozzle plate 1
The water repellent treatment can be performed only on the ink ejection surface of the nozzle plate 1 to realize a stable and excellent ink droplet ejection performance, and the nozzle plate 1 capable of outputting a highly accurate image can be manufactured at low cost.

In the present embodiment, DFRs (dry film resists) 11 and 12 are used as resist materials, and the DFRs 11 and 12 are the DFs on the substrate 10 side.
The exposure sensitivity is higher as R11.

Therefore, DF requiring a thickness of several tens μm
R11 and R12 can be easily formed on the substrate 10, the thickness variation can be reduced, and a resist drying step and the like can be omitted as compared with the case where a liquid resist is used. Even if DFRs 11 and 12 of different types can be overlapped with each other,
Can be avoided, making it easier and cheaper,
A highly accurate nozzle plate 1 can be manufactured.

Further, in this embodiment, DFRs 11 and 12 are used as resist materials,
As 2, the DFR 11 on the substrate 10 has a longer developing time.

Therefore, it is possible to more easily and easily form the tapered nozzle hole 4 whose diameter decreases from the ink inflow side to the ink discharge side in a single exposure and development step. A high-precision nozzle plate 1 can be manufactured at low cost.

In the present embodiment, as an exposure step, a diffusion plate 14 is disposed on the mask 13, and the diffusion plate 14 is irradiated with parallel light to irradiate divergent light into the DFRs 11 and 12. .

Therefore, the diffusing plate 1 is placed in the normal exposure light path.
4, it is possible to perform the exposure process in the conventional process without the need for repair of equipment or introduction of new equipment, and a more inexpensive and highly accurate nozzle plate 1.
Can be manufactured.

FIGS. 9 to 17 are views showing a second embodiment of a nozzle plate and a method of manufacturing a nozzle plate according to the present invention. FIG. 9 shows a nozzle plate and a method of manufacturing a nozzle plate according to the present invention. It is a front sectional view of a nozzle plate to which a 2nd embodiment is applied.

In FIG. 9, the nozzle plate 20 has a water-repellent layer 22 formed on the surface of a plate substrate 21.
Nozzle holes 23 are formed in the plate substrate 21 and the water-repellent layer 22. The nozzle hole 23 is formed in a tapered shape in which the diameter decreases toward the water-repellent layer 22 from the surface of the plate substrate 21 opposite to the water-repellent layer 22, and the diameter of the nozzle hole 23 is divided by the discontinuous point 24. Different inclination angles. That is, the nozzle hole 23 has one discontinuous point 24 at which the inclination angle of the tapered surface changes, and if there is one or more discontinuous points 24, a plurality of discontinuous points 24 may exist.

Further, on the side opposite to the ink ejection side of the nozzle hole 23 of the plate substrate 21, that is, on the surface on the ink supply side, an ink flow path forming recess 25 is formed. An ink flow path is defined and formed between the nozzle plate 20 and a liquid chamber substrate, which is a member forming a liquid chamber of an inkjet head (not shown) to be joined.
The ink flow path communicates the respective liquid chambers having the nozzle holes 23 with the common liquid chamber, and supplies ink from the common liquid chamber to the respective liquid chambers.

This nozzle plate 20 is shown in FIGS.
It is manufactured by the following manufacturing process shown in FIG. That is,
First, as shown in FIG. 10, a substrate 30 having at least a surface having conductivity, for example, stainless steel (S
US) 304, and the substrate 30 has a sufficient thickness so as not to be deformed by a stress generated by Ni electrodeposition described later.

The surface of the substrate 30 (upper surface in FIG. 10) is previously roughened to 0.3 μm or more with an abrasive or the like. Then, a first resist forming step process for laminating the first layer DFR 31 which is a resist material is performed. The DFR 31 of the first layer is a DFR having a high exposure sensitivity and a long development time, but the resist material is not limited to the DFR. As shown in FIG. 12, on the DFR 31, a mask 32 for the ink flow path forming concave portion is arranged, exposed, and subjected to an exposure process for cross-linking and curing the portion of the DFR 31 where the ink flow path forming concave portion is formed. Therefore, the first layer DFR 31 is formed to have the same thickness as the depth of the ink flow path forming recess 25 to be formed.

Next, after removing the mask 32, the second layer DFR 33 as a resist material is replaced with the first layer DFR 3
The first DFR 31 is laminated on the first DFR 31 and the exposure sensitivity of the first DFR 31 is higher than that of the second DFR 33 formed on the first DFR 31 as described above. High D and long development time
In the FR, for example, as in the first embodiment, the first
As the DFR 31 of the layer, Sunfort AQ2558 manufactured by Asahi Kasei can be used, and as the DFR 33 of the second layer, ALPHO NIT225 manufactured by Nichigo Morton can be used.

Next, as shown in FIG. 14, the second layer D
A mask 34, which is a photomask for forming the nozzle holes 23, is provided on the FR 33. Further, a diffusion plate 35 is disposed on the mask 34, and an exposure process is performed in which exposure is performed in this state. As the diffusion plate 14, the same one as in the first embodiment can be used.

In this exposure, the light that has passed through the mask 34 travels while spreading to the peripheral portion according to the diffusion angle.
The DFR 31 and the DFR 33 correspond to the light irradiation amount.
However, it crosslinks and hardens, and becomes insoluble in the developer. As a result, the photosensitive areas of the DFR 31 and the DFR 33
As the distance from the mask 4 increases, the mask 34 expands from the opening to the periphery to form a tapered shape. Further, since the first layer DFR 31 is a material having a higher exposure sensitivity than the second layer DFR 33, crosslinking proceeds even with a small amount of exposure, and the first layer DFR 31 and the second layer DFR 33 In the interface portion, the first layer DFR 31 has a larger area after development, and the first layer DFR 31 has a tapered shape having a larger diameter. Since the second layer DFR 33 has a low exposure sensitivity, in order to obtain a target diameter, it is necessary to expose more than the case where only the first layer DFR 31 is used up to the required thickness. Thus, the diameter of the first layer DFR 31 can be further increased.

Next, after the diffusion plate 35 and the mask 34 are removed, a development process for removing the DFRs 31 and 33 by developing with a developing solution is performed to form a substantially conical nozzle hole as shown in FIG. A resist pattern 36 for forming the ink flow path forming concave portion and a resist pattern 37 for forming the ink flow path forming concave portion are formed.
A discontinuous point 38 is formed at the boundary between the and the DFR 33. The resist pattern 36 for forming the nozzle holes has different tapered diameter angles around the discontinuity point 38.

Next, as shown in FIG. 16, using the substrate 30 on which the resist pattern 36 and the resist pattern 37 are formed as described above as a cathode, Ni is used for the thickness of the DFR 31, that is, for forming the ink flow passage forming recess. To a predetermined thickness not less than the height of the resist pattern 37 for use and the total thickness of the DFRs 31 and 33, that is, not more than the height of the resist pattern 36, to form the plate substrate 21 as a metal film. Then, as shown in FIG. 17, a water-repellent process for forming a water-repellent layer 22 on the surface of the plate substrate 21 is performed. The water-repellent layer 22 may be formed as a eutectoid plating layer by, for example, electrodeposition in a plating bath in which PTFE (polytetrafluoroethylene) particles are dispersed, similarly to the first embodiment. Alternatively, a coating type water repellent material may be formed by rotating and developing.

Then, after performing a peeling process for peeling off the Ni substrate, the plate substrate 21 and the water repellent layer 22 from the substrate 30, DFRs 31 and 33, which are the resist materials remaining on the plate substrate 21 and the water repellent layer 22, are removed. When the finishing process for removing is performed, the nozzle plate 20 shown in FIG.
6 is formed in a tapered shape in which the diameter decreases from the surface of the plate substrate 21 opposite to the water repellent layer 22 toward the water repellent layer 22, and the diameter of the resist pattern 36 The nozzle hole 23 that changes discontinuously at the continuous point 38 is formed, and the ink flow path forming concave portion 25 is formed at a portion of the surface opposite to the water repellent layer 22 where the resist pattern 37 is removed. Becomes

In the nozzle plate 20 thus formed, the surface on which the electrodeposited Ni is grown, the surface on which the water-repellent layer 22 is formed is the ink ejection side, and the surface of the plate substrate 21 separated from the substrate 30 Is the bonding surface of the ink jet head with the liquid chamber substrate.

On this joint surface, the roughness of the substrate 30 is faithfully transferred, and when the surface of the substrate 30 is exposed at the beginning of the above manufacturing process, the roughness of the substrate 30 is controlled. The joint surface with the chamber substrate can be made to have an appropriate roughness.

When the roughness Ra of the bonding surface of the plate substrate 21 with the liquid chamber substrate is Ra ≧ 0.3 μm, the bonding strength when the nozzle plate 20 is bonded to the liquid chamber substrate via an adhesive is sufficient. It can be strong.

The roughness of the bonding surface of the plate substrate 21 with the liquid chamber substrate is substantially equal to the roughness of the surface of the substrate 30, and this roughness depends on the adhesion between the first layer DFR 31 and the substrate 30. The surface roughness Ra of the substrate 30 is defined as Ra ≧ 0.3 μm.
By setting m, the occurrence of problems such as pattern flow during development and electrodeposition of the DFRs 31 and 33 can be greatly reduced.

As described above, in the nozzle plate 20 of the present embodiment, the ink flow path forming recess 25 that defines the ink flow path together with the liquid chamber substrate is formed on the surface on the liquid chamber substrate side.

Therefore, the number of parts can be reduced, and an even more inexpensive and highly accurate image output can be performed.

Then, the nozzle plate 2 of the present embodiment
No. 0 is for forming the DFR 31 as the first resist material at the same thickness as the depth of the ink flow path forming recess 25 on at least the surface of the substrate 30 having conductivity on the surface, and forming the ink flow path forming recess 25. Exposure through mask 32
After solidifying R31, the DFR31 is placed on DFR31.
DFRs 33 having different characteristics from each other are laminated, and all of the laminated DFRs 31 and 33 on the substrate 30 are irradiated with divergent light via a mask 34 for forming the nozzle holes 23 to thereby form the DFR 3.
1 and 33 are solidified and DFR3 other than the solidified portion
The solidified portions are removed by development to form a resist pattern 36 for the nozzle holes and a resist pattern 37 for the concave portion for forming the ink flow path.
An Ni film is deposited on the substrate 30 on which the Ni and Ni films 6 and 37 are formed by a predetermined amount smaller than the thickness of the resist pattern 37 for the ink passage forming concave portion and the thickness of the resist pattern 36 for the nozzle hole. After the water repellent layer 22 is continuously provided on the surface of the Ni film, the plate substrate 21 and the water repellent layer 22 which are the Ni films are separated from the substrate 30 as the nozzle plate 20 and then remain on the separated nozzle plate 30. DF to do
R31 and 33 have been removed.

Therefore, in a single exposure and development process, the tapered nozzle hole 23 and the ink flow path forming recess 2 whose diameter decreases from the ink inflow side to the ink discharge side.
5 can be formed, and the DFR 33, that is, the water repellent treatment is performed in a state where the resist pattern 36 protrudes from the nozzle hole 23 portion of the nozzle plate 20. A nozzle plate capable of performing a water-repellent treatment only on the ink ejection surface of the nozzle plate 20 without invading members, realizing stable and excellent ink droplet ejection performance, and performing high-precision image output. 30 can be manufactured even more cheaply.

Further, since the ink flow path forming recess 25 which defines the ink flow path together with the liquid chamber substrate is formed on the surface of the nozzle plate 30 on the liquid chamber substrate side, the number of parts can be reduced. Even more inexpensive and highly accurate image output can be performed.

As described above, the invention made by the present inventor has been specifically described based on the preferred embodiments. However, the present invention is not limited to the above, and various modifications can be made without departing from the gist of the invention. It goes without saying that it is possible.

[0089]

According to the nozzle plate of the first aspect of the present invention, the nozzle hole is formed in a tapered shape in which the cross section decreases in diameter from the liquid chamber side toward the ink discharge side. Since the surface is formed in a shape having at least one or more discontinuous points where the size of the diameter changes discontinuously, and the surface on the ink ejection side is subjected to a water-repellent treatment, the angle of the tapered shape itself is reduced. Even if the diameter is small, the difference between the diameter on the ink inflow side and the diameter on the ink discharge side becomes large, and stable and excellent ink droplet discharge performance (ink droplet ejection characteristics) can be realized. It can be performed.

According to the nozzle plate of the second aspect of the present invention, since the ink flow path forming recess that defines the ink flow path together with the liquid chamber substrate is formed on the surface of the nozzle plate on the liquid chamber substrate side. It is possible to reduce the number of parts, and to output an image at lower cost and with higher accuracy.

According to the nozzle plate of the third aspect, the surface of the nozzle plate on the liquid chamber substrate side is 0.3 μm
Since it is formed with the above roughness, a sufficient bonding area can be secured when bonding to the liquid chamber substrate with an adhesive, high bonding strength can be obtained, and more stable and excellent ink droplet ejection. The performance can be realized, and an inexpensive image output with higher accuracy can be performed.

According to the method of manufacturing a nozzle plate according to the fourth aspect of the invention, at least two resist materials having different characteristics are laminated on a substrate having at least a surface having conductivity, and a nozzle hole is formed in the laminated resist material. Forming a resist pattern by irradiating divergent light through a photomask to form a resist material, solidifying the resist material, removing the resist material other than the solidified portion by development, and forming the solidified portion as a resist pattern; Electrodepositing a predetermined metal film thinner by a predetermined amount than the thickness of the resist pattern on the formed substrate, providing a water-repellent layer continuously on the surface of the metal film, and using the metal film and the water-repellent layer as a nozzle plate After peeling from the substrate, the resist material remaining on the peeled nozzle plate is removed. A nozzle plate having a tapered nozzle hole whose diameter decreases toward the exit side can be formed, and the water repellent treatment is performed in a state where the resist material protrudes from the nozzle hole portion of the nozzle plate. Without the water-repellent member entering the hole,
A water-repellent treatment can be applied only to the ink ejection surface of the nozzle plate, realizing stable and excellent ink droplet ejection performance (ink droplet ejection characteristics), and providing a low-cost nozzle plate that can output highly accurate images. Can be manufactured.

According to the method of manufacturing a nozzle plate according to the fifth aspect of the present invention, the first resist material is formed on at least the surface of the substrate having conductivity on the surface to the same thickness as the depth of the ink flow path forming recess, After exposing through a photomask for forming the ink flow path forming recesses to solidify the first resist material, at least a resist material having characteristics different from those of the first resist material is formed on the first resist material. One layer is laminated, and all resist materials laminated on the substrate are irradiated with divergent light through a photomask for forming a nozzle hole to solidify the resist material, and the resist material other than the solidified portion is developed. To form a resist pattern for the nozzle hole and a resist pattern for the ink flow path forming recess, and the solidified portion is formed on the substrate on which the resist pattern is formed. Greater than the thickness of the resist pattern for the channel forming recess, and electrodeposited thin predetermined metal film by a predetermined amount than the thickness of the resist pattern for nozzle holes,
After providing a water-repellent layer continuously on the surface of the metal film, after peeling the metal film and the water-repellent layer from the substrate as a nozzle plate,
Since the resist material remaining on the peeled nozzle plate has been removed, the tapered nozzle hole and the ink flow path forming concave part whose diameter decreases from the ink inflow side to the ink discharge side in a single exposure and development process are formed. And a water repellent treatment performed in a state where the resist material protrudes from the nozzle hole portion of the nozzle plate, so that the water repellent member does not enter the nozzle hole, and the ink in the nozzle plate can be formed. A nozzle plate capable of performing water-repellent treatment only on the ejection surface, realizing stable and excellent ink droplet ejection performance, and capable of performing high-accuracy image output can be manufactured at a lower cost.

According to the method of manufacturing a nozzle plate according to the present invention, a dry film resist is used as a resist material, and the dry film resist is
Since the exposure sensitivity is higher for the dry film resist on the substrate side, a resist material requiring a thickness of several tens of μm can be easily formed on the substrate and the thickness variation is reduced. The height of the ink flow path forming recesses determined by the resist thickness can be easily made constant, and the resist drying step and the like can be omitted as compared with the case where a liquid resist is used. In addition, even when different types of resist materials are used one upon another, mixing of the resist materials with each other can be avoided, so that a highly accurate nozzle plate can be manufactured more easily and inexpensively.

According to the method of manufacturing a nozzle plate according to the present invention, a dry film resist is used as a resist material, and the dry film resist is
Since the development time of the dry film resist on the substrate side is longer, the tapered nozzle hole whose diameter decreases from the ink inflow side to the ink discharge side in one exposure and development process is even easier. In addition, the nozzle plate can be formed easily, and a highly accurate nozzle plate can be manufactured more easily and inexpensively.

According to the method of manufacturing a nozzle plate of the present invention, as an exposure step, a diffusion plate is arranged on a photomask, and the diffusion plate is irradiated with parallel light to diverge light into the resist material. The exposure process can be performed in the conventional process without the need for equipment modification or the introduction of new equipment, just by inserting the diffusion plate in the normal exposure light path, making it even more inexpensive. In addition, a highly accurate nozzle plate can be manufactured.

[Brief description of the drawings]

FIG. 1 is a front sectional view of a nozzle plate to which a first embodiment of a nozzle plate and a method of manufacturing the nozzle plate according to the present invention is applied.

FIG. 2 is a front view of a substrate used for manufacturing the nozzle plate of FIG. 1;

FIG. 3 is a front view showing a state in which two DFRs are stacked on the substrate of FIG. 2;

FIG. 4 is a front view showing a state in which a mask and a diffusion plate are provided on the DFR of FIG. 3 to perform exposure.

FIG. 5 is a front view showing a state where the DFR, the mask, and the diffusion plate of FIG. 4 are removed and a resist pattern is formed on the substrate;

FIG. 6 is a front view showing a state where a Ni film serving as a plate substrate is electrodeposited on the substrate on which the resist pattern of FIG. 5 is formed.

FIG. 7 is a front view of a state in which a water-repellent layer is laminated on the Ni film in FIG. 6;

FIG. 8 is a view showing diffusion characteristics of the diffusion plate of FIG. 4;

FIG. 9 is a front sectional view of a nozzle plate to which a second embodiment of a nozzle plate and a method of manufacturing the nozzle plate according to the present invention is applied.

FIG. 10 is a front view of a substrate used for manufacturing the nozzle plate of FIG. 9;

FIG. 11 is a front view showing a state where a DFR is formed on the substrate of FIG. 10;

12 is a front view of a state in which a mask for an ink flow path forming recess is provided on the DFR of the substrate in FIG. 11 and exposure is performed.

FIG. 13 is a front view showing a state in which the mask of the substrate of FIG. 12 is removed and a second-layer DFR is provided.

14 is a front view of a state in which a mask for a nozzle hole and a diffusion plate are provided on the DFR of FIG. 13 to perform exposure.

FIG. 15 is a front view showing a state in which the DFR, the mask, and the diffusion plate of FIG. 14 are removed, and a resist pattern for a nozzle hole and a resist pattern for an ink flow path forming portion are formed on a substrate.

FIG. 16 is a front view showing a state where a Ni film serving as a plate substrate is electrodeposited on the substrate on which the resist pattern of FIG. 15 is formed.

FIG. 17 is a front view showing a state in which a water-repellent layer is laminated on the Ni film in FIG. 16;

[Explanation of symbols]

 Reference Signs List 1 nozzle plate 2 plate substrate 3 water repellent layer 4 nozzle hole 5 discontinuous point 10 substrate 11, 12 DFR 13 mask 14 diffuser plate 15 resist pattern 16 discontinuous point 20 nozzle plate 21 plate substrate 22 water repellent layer 23 nozzle hole 24 non Contiguous point 25 Ink channel forming recess 30 Substrate 31 DFR 32 Mask 33 DFR 34 Mask 35 Diffusion plates 36, 37 Resist pattern 38 Discontinuous point

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Yasushi Yamada 1-3-6 Nakamagome, Ota-ku, Tokyo F-term in Ricoh Co., Ltd. (reference) 2C056 EA04 EA24 HA16 HA17 HA19 HA24 2C057 AF21 AF93 AF99 AG01 AG07 AG08 AP13 AP21 AP60 AQ06

Claims (8)

[Claims] A plurality of nozzle holes communicating with a plurality of liquid chambers filled with ink, respectively;
A common liquid chamber and an ink flow path for supplying ink from the common liquid chamber to each of the liquid chambers are defined between the liquid chamber substrates to be joined, and the ink in each of the liquid chambers is ejected from the nozzle holes. In the nozzle plate to be formed, the cross section of the nozzle hole is formed in a tapered shape in which the diameter decreases from the liquid chamber side toward the ink ejection side, and the tapered surface does not have the size of the diameter. A nozzle plate formed in a shape having at least one or more discontinuous points that continuously change, and a surface on the ink ejection side is subjected to a water-repellent treatment. 2. The nozzle plate according to claim 1, wherein an ink flow path forming recess that defines the ink flow path together with the liquid chamber substrate is formed on a surface on the liquid chamber substrate side. The described nozzle plate. 3. The nozzle plate according to claim 1, wherein a surface of the nozzle plate on the side of the liquid chamber substrate is formed to have a roughness of 0.3 μm or more. 4. A plurality of nozzle holes communicating with a plurality of liquid chambers filled with ink, respectively, and a common liquid chamber and the common liquid chamber are provided between the liquid chamber substrates to be joined. A method for manufacturing a nozzle plate that defines an ink flow path for supplying ink to each of the liquid chambers from the nozzles and discharges the ink in each of the liquid chambers from the nozzle holes. A resist laminating step of laminating at least two layers of different resist materials, and an exposing step of irradiating divergent light through a photomask for forming the nozzle holes on the laminated resist material to solidify the resist material; A developing step of removing the resist material other than the solidified portion by development to generate the solidified portion as a resist pattern; and forming the resist pattern. An electrodeposition step of depositing a predetermined metal film thinner by a predetermined amount than the thickness of the resist pattern on the substrate, a water-repellent step of continuously providing a water-repellent layer on the surface of the metal film, And a finishing step of removing the resist material remaining on the peeled-off nozzle plate, and a finishing step of removing the water-repellent layer from the substrate as a nozzle plate. 5. A plurality of nozzle holes which are respectively connected to a plurality of liquid chambers filled with ink, and
A common liquid chamber and an ink flow path for supplying ink from the common liquid chamber to each of the liquid chambers are defined between the liquid chamber substrates to be joined, and the ink in each of the liquid chambers is ejected from the nozzle holes. And a method of manufacturing a nozzle plate having an ink flow path forming recess for defining the ink flow path together with the liquid chamber substrate, wherein the ink flow path forming recess is formed on a substrate having at least a surface having conductivity. Forming a first resist material to the same thickness as the depth of the first resist material, and exposing the first resist material to light through a photomask for forming the ink flow path forming concave portion. An exposure step, a second resist forming step of laminating at least one layer of a resist material having a characteristic different from that of the first resist material on the first resist material, An exposure step of irradiating the resist material with divergent light through a photomask for forming the nozzle holes to solidify the resist material, and removing the resist material other than the solidified portion by development to form the solidified portion Developing a resist pattern for the nozzle hole and a resist pattern for the ink flow path forming recess, and calculating the thickness of the resist pattern for the ink flow path forming recess on the substrate on which the resist pattern is formed. An electrodeposition step of depositing a predetermined metal film, which is also thicker and thinner by a predetermined amount than the thickness of the resist pattern for the nozzle hole, and providing a water-repellent layer continuously on the surface of the metal film A step of separating the metal film and the water-repellent layer from the substrate as a nozzle plate; and Method of manufacturing a nozzle plate, characterized in that a finishing step of removing the strike material. 6. The nozzle plate according to claim 4, wherein the resist material is a dry film resist, and the dry film resist has a higher exposure sensitivity as the dry film resist on the substrate side. Manufacturing method. 7. The method according to claim 4, wherein the resist material is a dry film resist, and the dry film resist has a longer development time as the dry film resist on the substrate side. 3. The method for manufacturing a nozzle plate according to item 1. 8. The exposing step includes disposing a diffusion plate on the photomask, irradiating the diffusion plate with parallel light, and irradiating the resist material with diverging light. A method for manufacturing a nozzle plate according to any one of claims 1 to 7.