JP2002116715A5 - - Google Patents
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- JP2002116715A5 JP2002116715A5 JP2001189397A JP2001189397A JP2002116715A5 JP 2002116715 A5 JP2002116715 A5 JP 2002116715A5 JP 2001189397 A JP2001189397 A JP 2001189397A JP 2001189397 A JP2001189397 A JP 2001189397A JP 2002116715 A5 JP2002116715 A5 JP 2002116715A5
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- JP
- Japan
- Prior art keywords
- insulating layer
- electrode
- polybenzoxazole
- display device
- synthesis example
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920002577 polybenzoxazole Polymers 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 8
- -1 quinonediazide compound Chemical class 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 230000002194 synthesizing Effects 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N precursor Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atoms Chemical group C* 0.000 description 4
- 125000000962 organic group Chemical group 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- 229920001721 Polyimide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- FAYMLNNRGCYLSR-UHFFFAOYSA-M Triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ZMANZCXQSJIPKH-UHFFFAOYSA-N triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 2
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 1
- KHLBYJOGKPIERQ-UHFFFAOYSA-N 5-naphthoquinonediazidesulfonyl group Chemical group [N-]=[N+]=C1C=CC2=C(C=CC=C2S(=O)=O)C1=O KHLBYJOGKPIERQ-UHFFFAOYSA-N 0.000 description 1
- BCMCBBGGLRIHSE-UHFFFAOYSA-N Benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000002971 oxazolyl group Chemical group 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Description
【請求項1】基板上に形成された第一電極と、第一電極を部分的に露出せしめるように第一電極上に形成された絶縁層と、第一電極に対向して設けられた第二電極とを含む表示装置であって、前記絶縁層が下記一般式(1)で表される構造単位を主成分とするポリマーと光酸発生剤を必須成分とするポジ型感光性ポリベンゾオキサゾールをパターン形成してなることを特徴とする表示装置。
【化1】
(R1は少なくとも2個以上の炭素原子を有する2価の有機基、R2は少なくとも2個以上の炭素原子を有する2価から4価の有機基を示す。mは3から100000までの整数を示す。)
1. A first electrode formed on a substrate, an insulating layer formed on the first electrode so as to partially expose the first electrode, and a second electrode provided facing the first electrode. A display device including two electrodes, in which the insulating layer is a positive photosensitive polybenzoxazole containing a polymer whose main component is a structural unit represented by the following general formula (1) and a photoacid generator as essential components. A display device characterized in that the pattern is formed.
[Chemical 1]
(R 1 represents a divalent organic group having at least 2 or more carbon atoms, R 2 represents a divalent to tetravalent organic group having at least 2 or more carbon atoms. M is an integer from 3 to 100,000. Shows.)
【0010】
【課題を解決するための手段】
本発明の表示装置は、基板上に形成された第一電極と、第一電極を部分的に露出せしめるように第一電極上に形成された絶縁層と、第一電極に対向して設けられた第二電極とを含む表示装置であって、前記絶縁層が下記一般式(1)で表される構造単位を主成分とするポリマーと光酸発生剤を必須成分とするポジ型感光性ポリベンゾオキサゾールをパターン形成してなることを特徴とする表示装置である。
0010
[Means for solving problems]
The display device of the present invention is provided with a first electrode formed on a substrate, an insulating layer formed on the first electrode so as to partially expose the first electrode, and facing the first electrode. A display device including a second electrode, wherein the insulating layer is a positive photosensitive poly containing a polymer whose main component is a structural unit represented by the following general formula (1) and a photoacid generator as essential components. It is a display device characterized by forming a pattern of benzoxazole .
本発明では絶縁層がポジ型感光性ポリベンゾオキサゾールをパターン形成してなることを特徴とする。感光性ポリベンゾオキサゾールとは、ポリベンゾオキサゾール前駆体のエネルギー照射部分の現像液に対する溶解度が、非照射部分のそれと異なることを利用して直接的にパターニングを行うことが可能なものの総称である。その後キュアすることでポリベンゾオキサゾールを得ることができる。照射するエネルギーとしては電子線なども利用できるが、多くの場合には電磁波、特に青色から紫外(UV)領域の光が利用されるので、エネルギー照射のことを露光と呼ぶ。また、溶解度の差を利用して、ポリベンゾオキサゾール前駆体膜の所望の部分を除去することを現像と呼ぶ。絶縁層を感光性ポリベンゾオキサゾールとすることで、従来必要であった、非感光性ポリイミド前駆体上へのレジストの塗布・露光・現像や、非感光性ポリイミド前駆体をエッチングした後のレジスト除去の工程などが不要となり、絶縁層のパターニングに必要な工程を大幅に減らすことができる。 The present invention is characterized in that the insulating layer is formed by forming a pattern of positive photosensitive polybenzoxazole. Photosensitive polybenzoxazole is a general term for substances that can be directly patterned by utilizing the fact that the solubility of the energy-irradiated portion of the polybenzoxazole precursor in the developing solution is different from that of the non-irradiated portion. Polybenzoxazole can be obtained by curing thereafter. Although electron beams and the like can be used as the energy to irradiate, in many cases electromagnetic waves, especially light in the blue to ultraviolet (UV) region, are used, so energy irradiation is called exposure. Further, removing a desired portion of the polybenzoxazole precursor membrane by utilizing the difference in solubility is called development. By using photosensitive polybenzoxazole as the insulating layer, it is necessary to apply, expose, and develop a resist on a non-photosensitive polyimide precursor, and to remove the resist after etching the non-photosensitive polyimide precursor. The steps required for patterning the insulating layer can be significantly reduced by eliminating the need for the above steps.
感光性ポリベンゾオキサゾールには、露光することで溶解性が増大し、露光部分を除去するタイプのポジ型と、露光することで硬化し、非露光部分を除去するタイプのネガ型の2種類がある。感光性ポリベンゾオキサゾール前駆体を露光した場合には、膜の表面部分で光が強く吸収され、内部になるに従って吸光量は少なくなる傾向にある。つまり、ポジ型では膜の表面部分の溶解性の方が内部のそれよりも大きくなり、ネガ型ではその逆になる傾向にある。本発明では絶縁層が原理的に順テーパー形状が得られやすいポジ型感光性ポリベンゾオキサゾール前駆体をパターン形成してなることが好ましい。 There are two types of photosensitive polybenzoxazole: a positive type, which increases solubility when exposed and removes exposed parts, and a negative type, which cures when exposed and removes unexposed parts. is there. When the photosensitive polybenzoxazole precursor is exposed, light is strongly absorbed at the surface portion of the film, and the amount of light absorption tends to decrease toward the inside. That is, in the positive type, the solubility of the surface portion of the film is greater than that of the inside, and in the negative type, the opposite tends to be made. In the present invention, it is preferable that the insulating layer is formed by patterning a positive photosensitive polybenzoxazole precursor which can easily obtain a forward taper shape in principle.
本発明において、一般式(1)で表されるポリマーは、加熱あるいは適当な触媒により、オキサゾール環を有するポリマーとなり得るものである。環構造となることで、耐熱性、耐溶剤性が飛躍的に向上する。 In the present invention, the polymer represented by the general formula (1) can be a polymer having an oxazole ring by heating or a suitable catalyst. The ring structure dramatically improves heat resistance and solvent resistance.
本発明において感光性ポリベンゾオキサゾールに含まれるポリマーは、一般式(1)で表される構造単位のみからなるものであっても良いし、他の構造単位との共重合体あるいはブレンド体であってもよい。その際、一般式(1)で表される構造単位を90モル%以上含有していることが好ましい。共重合あるいはブレンドに用いられる構造単位の種類および量は、最終加熱処理温度によって得られるポリマーの耐熱性を損なわない範囲で選択することが好ましい。 In the present invention , the polymer contained in the photosensitive polybenzoxazole may consist of only the structural unit represented by the general formula (1), or may be a copolymer or a blend with other structural units. You may. At that time, it is preferable that the structural unit represented by the general formula (1) is contained in an amount of 90 mol% or more. The type and amount of structural units used for copolymerization or blending are preferably selected within a range that does not impair the heat resistance of the polymer obtained by the final heat treatment temperature.
一般式(1)において、R2は少なくとも2個以上の炭素原子を有する2価から4価の有機基を示す。本発明におけるポリマーの耐熱性から、R2は芳香族または芳香族複素環を含有し、かつ炭素数6〜30の4価の有機基であることが好ましい。−(OH)R2 (OH)−の好ましい具体例としては、3,3’−ジアミノ−4,4’−ジヒドロキシジフェニルエーテル、4,4’−ジアミノ−3,3’−ジヒドロキシジフェニルエーテル、3,4’−ジアミノ−3,4’−ジヒドロキシジフェニルエーテルなどの残基が挙げられる。このような例として、下記に示すような構造のものがあげられるが、本発明はこれらに限定されない。また、−(OH)R2 (OH)−はこれらのうち1種から構成されていても良いし、2種以上から構成される共重合体であっても構わない。 In the general formula (1), R 2 represents a divalent to tetravalent organic group having at least two or more carbon atoms. From the heat resistance of the polymer in the present invention, R 2 is preferably a tetravalent organic group containing an aromatic or aromatic heterocycle and having 6 to 30 carbon atoms. Preferred specific examples of − (OH) R 2 (OH) − are 3,3'-diamino-4,4'-dihydroxydiphenyl ether, 4,4'-diamino-3,3'-dihydroxydiphenyl ether, 3,4. Residues such as'-diamino-3,4'-dihydroxydiphenyl ether can be mentioned. Examples of such a structure include those having the following structures, but the present invention is not limited thereto. Further, − (OH) R 2 (OH) − may be composed of one of these types, or may be a copolymer composed of two or more types.
合成例3 キノンジアジド化合物(2)の合成
乾燥窒素気流下、TrisP−HAP(商品名、本州化学工業(株)製)、15.3g(0.05モル)と5−ナフトキノンジアジドスルホニル酸クロリド40.3g(0.15モル)を1,4−ジオキサン450gに溶解させ、室温にした。ここに、1.4−ジオキサン50gと混合させたトリエチルアミン15.2gを用い、合成例2と同様にしてキノンジアジド化合物(2)を得た。
Synthesis Example 3 Synthesis of quinonediazide compound (2) Under a dry nitrogen stream, TrisP-HAP (trade name, manufactured by Honshu Kagaku Kogyo Co., Ltd.), 15.3 g (0.05 mol) and 5-naphthoquinonediazidesulfonyl acid chloride 40. 3 g (0.15 mol) was dissolved in 450 g of 1,4-dioxane and brought to room temperature. Here, 15.2 g of triethylamine mixed with 50 g of 1.4-dioxane was used to obtain a quinonediazide compound (2) in the same manner as in Synthesis Example 2.
合成例5
合成例4において、ヘキサフルオロ−2,2−ビス(3−アミノ−4−ヒドロキシフェニル)プロパンの代わりに、合成例1で得られたヒドロキシル基含有ジアミン102.7g(0.17モル)を用い、キノンジアジド化合物(1)の代わりに合成例3で得られたキノンジアジド化合物(2)2gを溶解させた以外は、合成例4と同様に行い、ワニスBを得た。
Synthesis example 5
In Synthesis Example 4, 102.7 g (0.17 mol) of the hydroxyl group-containing diamine obtained in Synthesis Example 1 was used instead of hexafluoro-2,2-bis (3-amino-4-hydroxyphenyl) propane. , The varnish B was obtained in the same manner as in Synthesis Example 4 except that 2 g of the quinone diamine compound (2) obtained in Synthesis Example 3 was dissolved instead of the quinone diamine compound (1).
【0092】
【発明の効果】
本発明の、絶縁層がポジ型感光性ポリベンゾオキサゾールをパターン形成してなることを特徴とする表示装置は、従来技術のようにフォトレジストを使用する必要がなく、ポリベンゾオキサゾールからなる絶縁層を簡単で、より少ない工程でパターニングすることができる。さらに、絶縁層の境界部分の断面を容易に順テーパー形状とすることができるので、例えばその上に形成される薄膜層などがスムーズに形成され、表示装置の動作の安定性を損なうことがない。
[0092]
【Effect of the invention】
The display device of the present invention characterized in that the insulating layer is formed by forming a pattern of positive photosensitive polybenzoxazole does not require the use of a photoresist as in the prior art, and is an insulating layer made of polybenzoxazole. Can be patterned easily and with fewer steps. Further, since the cross section of the boundary portion of the insulating layer can be easily formed into a forward taper shape, for example, a thin film layer formed on the thin film layer can be smoothly formed without impairing the operational stability of the display device. ..
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001189397A JP4982928B2 (en) | 2000-06-28 | 2001-06-22 | Display device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-194019 | 2000-06-28 | ||
JP2000194019 | 2000-06-28 | ||
JP2000194019 | 2000-06-28 | ||
JP2001189397A JP4982928B2 (en) | 2000-06-28 | 2001-06-22 | Display device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002116715A JP2002116715A (en) | 2002-04-19 |
JP2002116715A5 true JP2002116715A5 (en) | 2008-07-03 |
JP4982928B2 JP4982928B2 (en) | 2012-07-25 |
Family
ID=26594837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2001189397A Expired - Lifetime JP4982928B2 (en) | 2000-06-28 | 2001-06-22 | Display device |
Country Status (1)
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JP (1) | JP4982928B2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100555078C (en) | 2003-06-02 | 2009-10-28 | 东丽株式会社 | Photosensitive resin composition and with the electronic component and the display device of its preparation |
JP4453385B2 (en) * | 2004-02-13 | 2010-04-21 | ソニー株式会社 | Manufacturing method of display device |
WO2010070800A1 (en) * | 2008-12-18 | 2010-06-24 | パナソニック株式会社 | Organic el light emitting device |
JP5593676B2 (en) | 2009-10-22 | 2014-09-24 | ソニー株式会社 | Display device and manufacturing method of display device |
JP2012059470A (en) * | 2010-09-07 | 2012-03-22 | Kobe Steel Ltd | Reflecting anodic electrode for organic el display |
US20170293224A1 (en) | 2014-09-26 | 2017-10-12 | Toray Industries, Inc. | Organic el display device |
WO2016143740A1 (en) | 2015-03-11 | 2016-09-15 | 東レ株式会社 | Organic el display device and method for manufacturing same |
KR102309954B1 (en) | 2016-03-18 | 2021-10-08 | 도레이 카부시키가이샤 | Cured film and positive photosensitive resin composition |
KR20220146440A (en) | 2020-02-25 | 2022-11-01 | 도레이 카부시키가이샤 | An organic EL display device, a method for manufacturing a cured product, and a manufacturing method for an organic EL display device |
WO2022039028A1 (en) | 2020-08-17 | 2022-02-24 | 東レ株式会社 | Photosensitive resin composition, cured product, display device, semiconductor device and method for producing cured product |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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DE2931297A1 (en) * | 1979-08-01 | 1981-02-19 | Siemens Ag | HEAT-RESISTANT POSITIVE RESISTS AND METHOD FOR PRODUCING HEAT-RESISTANT RELIEF STRUCTURES |
JP2734464B2 (en) * | 1990-02-28 | 1998-03-30 | 出光興産株式会社 | Electroluminescence device and method of manufacturing the same |
JP2828736B2 (en) * | 1990-05-29 | 1998-11-25 | 住友ベークライト株式会社 | Positive photosensitive resin composition |
JPH1197182A (en) * | 1997-09-24 | 1999-04-09 | Pioneer Electron Corp | Luminous display pannel |
-
2001
- 2001-06-22 JP JP2001189397A patent/JP4982928B2/en not_active Expired - Lifetime
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