JP2002111263A - Electronic apparatus having heat radiation/insulation structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of removing heat generated in a sealed frame. SOLUTION: The electronic apparatus having a sealed frame 103 for housing electronic circuits with the frame downside directly exposed to outside air comprises a heat sink 101 having through-holes 102. The heat sink 101 is hermetically fixed in the closed frame so that the through-holes 102 serve as vent holes for venting air from the downside of the closed frame to the upside. Heat generated from heating components 108 conducts to the heat sink 101 and is thermally dispersed with a gas flowing through the through-holes 102 and exhausted with exhaust 111, thus removing the heat generated in the sealed frame of the electronic apparatus.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device, such as a roadside device for controlling a traffic signal or a terminal device of a traffic flow measuring system, in which an electronic circuit is mounted in a closed casing, and more particularly to heat generated from the electronic circuit. And is configured to block direct heat and reflected heat of the sun.

[0002]

2. Description of the Related Art In an electronic device in which an electronic unit is arranged in a housing, the inside of the housing reaches a high temperature due to heat generated by energization, and the electronic components deteriorate. Therefore, in the electronic device, various measures have been taken to lower the temperature inside the housing.

[0003] In an electronic device arranged indoors, air is usually cooled by passing air through a housing, and a cooling effect is enhanced by improving a flow path of the wind or installing a fan. In addition, as shown in FIG. 47, in order to cool an electronic device 1 in which a plurality of electronic units 2 are installed in multiple stages, a wind control plate 4 is provided between the electronic units 2 as shown in FIG.
And a heat pipe 9 having a plurality of heat-absorbing fins 5 and heat-dissipating fins 7. The heat-absorbing fins 5 and the baffle plate 4 are integrated to absorb heat inside the housing. A configuration for dissipating heat is disclosed.

[0004]

However, in a roadside device for traffic signal control or a terminal device for traffic flow measurement installed outdoors, the circuit board is housed in a closed casing due to the need for waterproofing and dustproofing. The air cannot pass through the housing. Therefore, the heat generated from the electronic components is trapped in the housing, and the temperature inside the housing increases.

[0005] In addition, in these electronic devices installed outdoors, the temperature inside the closed casing often reaches 80 degrees Celsius or more because the direct sunlight of the sun and the reflected light from the road irradiate.

[0006] Such a rise in temperature shortens the life of electronic circuit components and makes the operation of electronic devices unstable.

The present invention has been made to solve the above-mentioned conventional problems, and provides an electronic device capable of eliminating heat generated in a sealed housing and of shielding solar heat applied from the outside. It is intended to be.

[0008]

SUMMARY OF THE INVENTION Accordingly, the present invention provides a heat sink having a through-hole in an electronic device provided with a closed housing for housing an electronic circuit, wherein the lower portion of the housing is directly in contact with the outside air. The airtight hole is secured inside the sealed housing so that the hole is a ventilation hole that passes from the lower part to the upper part of the sealed housing.

Further, the housing has a double structure of an inner housing and an outer housing, a closed housing is formed by the inner housing, and a ventilation path from a lower portion to an upper portion of the housing is formed between the outer housing and the inner housing. .

Further, the housing has a double structure of an inner housing and an outer housing, a closed housing is formed by the inner housing, and a heat insulating material is arranged between the outer housing and the inner housing.

Further, the casing has a sealed double structure of an inner casing and an outer casing, and the pressure between the outer casing and the inner casing is reduced to maintain a vacuum or a state close thereto.

[0012] Further, the sealed housing is configured to include a laminated structure of a good heat conductor having a plurality of chimney-shaped ventilation holes, and a poorly-heated conductor or a heat insulating material disposed inside the good heat conductor. An air passage is formed along the closed casing to guide airflow from the lower part to the upper part of the closed casing.

Further, a cylindrical body formed of a heat insulating material is securely fixed in the closed housing so that the tube becomes a ventilation hole passing from a lower portion to an upper portion of the closed housing, and is generated from heat-generating components in the closed housing. The heat generated is guided to the outside of the cylinder via a heat pipe, and is radiated through a radiator plate.

Further, a cylindrical body formed of a heat insulating material is securely fixed in the closed housing such that the tube is formed as a ventilation hole extending from a lower portion to an upper portion of the closed housing, and generated from heat-generating components in the closed housing. Heat that is conducted outside the cylinder by the Peltier element,
It is configured to radiate heat through the heat sink.

Therefore, the heat generated in the closed casing of the electronic device can be excluded to the outside, and the solar heat applied to the closed casing from the outside can be cut off.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) In an electronic device according to a first embodiment, a heat sink (a heat conducting plate) having a ventilation hole is arranged so as to penetrate a closed casing.

As shown in FIG. 3, this electronic device is a roadside device for traffic signal control mounted in the middle of a column, and has a housing body 103 and a door 104 which constitute a closed housing. 103 has a heat sink with a through hole 102
101 is arranged. FIG. 1A is a front sectional view of the electronic device when it is cut horizontally (from the position BB ′ of FIG. 1B), and FIG. 1B is a sectional view of FIG. A-
FIG. 4 shows a side cross-sectional view when the electronic device is cut vertically along line A ′.

The door 104 is pivotally supported on the housing body 103 by a hinge 105 so as to be openable and closable. When the door 104 is closed,
Packing 107 is provided around the opening of the housing
When the door 104 is closed and the lock lock 106 is rotated to lock the locking piece at the tip of the lock lock 106 to the housing main body 103, the door 104 comes into close contact with the housing main body 103 via the packing 107. The inside of the housing is sealed.

The heat sink 101 made of a metal having high thermal conductivity such as aluminum has a plate-like outer shape.
There are provided a large number of through holes 102 extending through the plate in a direction parallel to the plate surface. In the heat sink 101, the lower end of the through hole 102 is exposed from the lower side of the housing body 103, and the through hole 10
The upper end of the housing 2 is fixed to the housing main body 103 by a structure that does not hinder the hermetically sealed state inside the housing so that the upper end is exposed from above the housing main body 103.

FIG. 2 shows an example of a structure for attaching the heat sink 101 to the housing main body 103. In this case, a step is formed on the upper part of the heat sink 101, and this step is abutted on the inside of the housing main body 103 via the packing 112, and the lower end of the heat sink 101 is fixed to the housing main body 103 with screws 114. It is supported by support pieces 113.

As described above, the heat sink 101 is
By attaching to the through hole 102 of the heat sink 101
Act as ventilation holes.

The electronic unit in the housing generates heat when energized and acts as a heating element. These heating elements 108 are fixed to the surface of the heat sink 101. Therefore, the heat of the heating element 108 is conducted to the heat sink 101, and the temperature of the heat sink 101 rises. When the temperature of the heat sink 101 rises, the air in the through-hole 102 warms and rises, and is discharged from the upper exhaust port, and instead, low-temperature outside air is sucked from the lower intake port. In FIG. 2B, reference numeral 111 denotes exhaust gas discharged from the upper exhaust port, and reference numeral 110 denotes intake air sucked from the lower intake port.

In this way, an air flow is generated in the through hole 102 by the same operation as the chimney, and the low-temperature outside air is taken in, so that heat conduction from the heat sink to the air flow is promoted, which also increases the air flow. Encourage and promote air flow. As a result, the heat in the closed casing is transmitted to the air flow and discharged, and it is possible to suppress a rise in temperature inside the closed casing while maintaining the sealed state of the closed casing.

In this electronic device, a space is formed below the bottom surface of the housing where the through hole 102 of the heat sink 101 is exposed so that air can be taken in from the bottom surface of the closed housing. It is necessary to install so that it touches. As an installation structure of the electronic device, in addition to being mounted in the middle of the column as shown in FIG. 3, as shown in FIG. 4, a closed housing such as a post is mounted on a thin column,
As shown in FIG. 5, it is supported by a pair of plate-like legs, as shown in FIG. 6, a suspended structure, or as shown in FIG.
It is possible to adopt a structure of being installed on the wall 20 apart from the floor surface 21.

Further, as a through hole of the heat sink 101,
As shown in FIG. 8, a plurality of rows of small-diameter through holes 401 may be provided. FIG. 8A shows the state when the heat sink 101 is cut horizontally (from the position of BB ′ in FIG. 8B).
FIG. 8B is a cross-sectional view of FIG.
It is sectional drawing from the position of. Thus small through-hole 40
By providing a plurality of rows of 1, the contact area of the heat sink with the air flow can be increased as compared with the case where a large diameter through-hole is provided in a row, and the heat transfer to the air flow can be made more efficient.

Further, as shown in FIG.
The diameter of the upper portion (d2) of the through hole 102 is made shorter (d2 <d1) than the diameter (d1) of the lower portion, and the shape of the through hole 102 is increased. The amount of ventilation can be increased.

The shape of the through-hole 102 is not limited to a circle, but may be formed into a complex irregular shape as shown in FIGS. 10 (a), 10 (b) and 10 (c) to increase the surface area of the through-hole 102. ,
Heat dissipation performance can be improved.

As shown in FIG. 11A, the heat sink is made of a member 601 divided into two parts including a through hole, and as shown in FIG. You may do it. Further, as shown in FIG. 11B, these members 601 are pivotally supported at one ends by hinges, and rotate these members 601 in the overlapping direction.
They may be combined as shown in FIG. By adopting such a configuration, the manufacturing process of the heat sink becomes easy.

As shown in FIG. 12, a heat generating element 108 mounted on a circuit board and a heat sink 101 are connected to a heat pipe 20.
1 and connect the heat generated by the heating element 108 to the heat sink 101
It can also be configured to conduct.

In the heat pipe, a liquid is sealed in a metal tube whose pressure has been reduced, and heat is absorbed from one end by evaporation of the liquid and released at the other end by vapor condensation.

Thus, no matter how the circuit board is arranged in the closed casing, heat can be directly transmitted from the heating element 108 mounted on the circuit board to the heat sink 101.

As described above, in the electronic device according to the first embodiment, by disposing the heat sink having the through-hole in the closed casing, heat generated in the closed casing is discharged while maintaining the sealed state of the closed casing. can do.

(Second Embodiment) The electronic device of the second embodiment has a configuration for preventing a temperature rise due to radiant heat such as sunlight.

In this electronic device, as shown in FIG. 13, the housing main body has a double structure of an inner housing 701 and an outer housing 702, and the door has a double structure of an inner door 711 and an outer door 712. are doing. The inner housing 701 and the inner door 711 have a sealed structure, and when the door is closed, the inner housing 701 and the inner door 711 form a sealed space. On the other hand, the outer casing 702 has an intake port 7
17. An exhaust port 716 is provided at the upper part, and the outer door 712 is provided with an intake port 703 at a lower part and an exhaust port 704 at an upper part. FIG.
Is a perspective view of the electronic device, and shows an upper exhaust port 716 of the outer housing 702 and an upper exhaust port 704 of the outer door 712.

The outer housing 702 and the outer door 712 prevent the direct sunlight 710 and the reflected light 715 from the road surface from directly reaching the inner housing 701 and the inner door 711 forming the closed space.

Also, between the inner housing 701 and the outer housing 702,
And, the spaces 713, 714 between the inner door 711 and the outer door 712,
The air 707, 708 entering from the lower intake ports 717, 703 forms an air passage that passes through the upper exhaust ports 716, 704. When the direct sunlight 710 of the sun and the reflected light 715 from the road surface irradiate the housing and the air in the spaces 713 and 714 is heated, the air becomes an updraft and is discharged from the upper exhaust ports 716 and 704.
Low-temperature air is taken in from the lower intake ports 717 and 703.

Thus, the space 71 between the double structures of the housing is obtained.
The air flow is generated by the passages 3 and 714, and the heat received from the outside is dissipated.

Therefore, in this electronic device, even if heat rays such as direct sunlight and reflected light of the sun are received from the outside, the outer casing 702
In addition, the outer door 712 blocks the heat rays, and at the same time, an air flow is generated in the spaces 713 and 714 between the double structures to dissipate the heat, thereby suppressing a rise in temperature inside the closed casing.

FIG. 15 shows an electronic device having both the configuration of FIG. 13 and the configuration of the first embodiment.
A heat sink 101 having a through hole is disposed in an inner housing 701 having a double structure. In this device, it is possible to suppress a rise in temperature of the closed casing due to a heat ray from the outside, and to discharge heat generated in the closed casing.

(Third Embodiment) The electronic device of the third embodiment uses a heat insulating material to prevent the temperature of the closed casing from rising.

As shown in FIG. 16, the apparatus has a double body structure between an inner housing 701 and an outer housing 702 of a housing body, and a double structure door having an inner door 711 and an outer door 712.
A heat insulating material is sealed between them.

In this electronic device, even when heat rays such as direct sunlight 710 and reflected light 715 of the sun are received from the outside, the outer casing 702 and the outer door 712 block the heat rays, and the heat insulating material 804 serves as a heat sealed casing. To prevent conduction to Therefore, a temperature rise inside the closed casing is suppressed.

FIG. 17 shows an electronic device having both the configuration of FIG. 16 and the configuration of the first embodiment.
The heat sink 101 having a through hole is arranged in the housing bodies 701 and 702 having a double structure. In this device, it is possible to suppress a rise in temperature of the closed casing due to a heat ray from the outside, and to discharge heat generated in the closed casing.

(Fourth Embodiment) In the fourth embodiment,
A configuration for further enhancing the heat shielding effect of the double-structured housing will be described.

FIG. 18 shows a space 713 serving as an air flow passage between the outer casing 702 and the inner casing 701 in FIG.
This shows a case where a layer of a heat insulating material 806 is provided. FIG.
In FIG. 1A, a heat insulating material 806 is provided on the outer housing 702 side, and FIG.
In FIG. 8B, the heat insulating material 806 is provided on the inner housing 701 side. In these configurations, the heat insulation effect of the heat insulating material 806 is added to the heat radiation effect of the airflow passing through the space 713, and the heat shielding effect for the double-structured closed casing is improved.

FIG. 19 shows an outer casing of a double casing.
The heat ray reflective layer 902 is provided on the inner casing 701, and the heat ray reflective layer 9 is
03 is shown. FIG. 19A shows the state of FIG.
FIG. 19B shows a case where the present invention is applied to the outer casing 702 and the inner casing 701 having the double structure shown in FIG. A heat ray reflective layer (902 or 903) may be provided on only one of the outer housing 702 and the inner housing 701.

The heat ray reflective layers 902 and 903 are, for example, at shield color (NTT Advanced Technology Co., Ltd.)
), Or after forming a heat ray reflective plating layer such as glossy aluminum or nickel, and then applying a transparent coating for rust prevention.

The heat ray reflective layer 902 of the outer casing 702 reflects most of the direct rays of the sun and the heat rays of the reflected light.
The first heat ray reflective layer 903 reflects the heat ray that has passed through the outer housing 702. Therefore, by forming such a heat ray reflective layer, the heat shielding effect on the sealed housing having the double structure is further improved.

FIG. 20 shows a case in which a heat insulating material 807 is arranged inside a double inner housing 701. FIG.
FIG. 20A shows a case where the present invention is applied to the inner housing 701 in FIG. 13, and FIG. 20B shows a case where the present invention is applied to the inner housing 701 in FIG.

The heat insulating material 807 mitigates the influence of the outside air on the closed casing, performs a function of keeping heat in winter, and prevents the temperature inside the closed casing from lowering.

FIG. 21 shows the outer casing 70 of the double structure shown in FIG.
2 and the inner housing 701, heat ray reflective layers 902, 9 similar to FIG.
03 is shown.

FIG. 22 shows a case where a heat insulating material having a heat ray reflective layer 904 made of a heat ray reflective coating or a heat ray reflective film on its surface is used. FIG. 22A shows FIG.
A heat insulating material having a heat ray reflective layer 904 formed thereon is used as the heat insulating material 806 in FIG. 8A, and FIG.
As for 6, FIG. 22 (c) uses the heat insulating material 807 of FIG. 20 (a), and FIG. 22 (d) uses the heat insulating material having the heat ray reflective layer 904 as the heat insulating material 807 of FIG. 20 (b). are doing. Since the heat rays from the outside are reflected by the presence of the heat ray reflection layer 904, the heat shielding effect on the closed enclosure having the double structure is further improved.

FIG. 23 shows the inner housing 70 of the double structure shown in FIG.
FIG. 24 shows a case where a heat insulating material 807 is arranged inside of FIG.
FIG. 23 shows a case where a heat insulating material having a heat ray reflecting layer 904 made of a heat ray reflecting coating or a heat ray reflecting film on the surface is used as the heat insulating material in FIG.

FIG. 25 shows the heat insulating material of FIG.
The case where a heat insulating material having a heat ray reflective layer 904 formed on the surface is used is shown.

As described above, by combining the heat ray reflective layer and the heat insulating material, the heat shielding effect of the double-structured housing can be further enhanced.

(Fifth Embodiment) In an electronic device according to a fifth embodiment, the gap of a double-structured housing is evacuated to realize heat shielding in a closed housing.

In this apparatus, as shown in FIG. 26, a sealed space is formed between an outer casing 1002 and an inner casing 1001 constituting a casing main body, and an outer door 1012 and an inner door 1012 constituting a door are formed.
A sealed space is formed between the sealed space 1011 and the sealed space, and the air in these sealed spaces is evacuated to maintain a vacuum or a state close thereto. The door of this vacuum structure seals the housing body of the vacuum structure via the packing 107.

In this apparatus, the door and the vacuum area of the housing body are
Since 1013 has a very high heat insulating performance, it is possible to effectively block the influence of the outside world on the closed casing.

FIG. 27 shows an electronic device in which the configuration of FIG. 26 and the configuration of the first embodiment are combined.
A heat sink 101 having a through hole 102 is disposed in a housing body having a vacuum structure. In this apparatus, it is possible to suppress a rise in the temperature of the closed casing due to a heat ray from the outside, and to discharge heat generated by the heating element 108 in the closed casing.

FIG. 28 shows a case where a heat ray reflective layer 1014 is formed on the surfaces of the outer casing 1002 and the outer door 1012 in FIG. The presence of the heat ray reflective layer 1014 can further enhance the heat shielding effect on the closed casing.

FIG. 29 shows an electronic device in which the configuration shown in FIG. 26 and the configuration shown in FIG. 13 are combined. The outermost layer having an upper exhaust port 1104 and a lower intake port 1103 is provided in a housing body having a vacuum structure. An outer casing 1101 is formed, and an outermost outer door 1102 having an upper exhaust port 1106 and a lower intake port 1105 is formed on a door having a vacuum structure.

In this apparatus, the heat insulating effect of the vacuum housing and the heat dissipation effect of the air flow formed in the gap between the outermost outer housing and the vacuum housing are combined to obtain a high heat shielding effect for the closed housing. it can.

FIG. 30 shows a case where an outer casing 1101 of the outermost layer and an outer door 1102 of the outermost layer are provided in the configuration of FIG.

FIG. 31 shows a configuration in which heat generated from the heating element 108 disposed in the closed casing of FIG. 26 is discharged to the outside of the casing using the heat pipe 201. Heat pipe 20
1 is drawn out of the housing from the housing through the housing body of the vacuum structure, and a heat pipe 120 in contact with the heating element 108 is fixed to the heat pipe 201 in the closed housing, and the heat pipe 201 outside the housing is fixed. , A plurality of heat sinks 1203 are fixed. Further, the heat radiating plate 1203 is surrounded by a heat ray shielding plate 1202 through which the ventilation 1204 can pass.

In this electronic device, the heat of the heating element 108 is guided to the outside of the housing by the heat pipe 201 via the heat sink 1201, and is radiated from the heat radiating plate 1203 to the outside air 1204.

FIG. 32 shows a case in which the heat discharging structure of FIG. 31 is applied to the structure of FIG. 29 including the outer casing 1101 of the outermost layer. At this time, the heat radiating plate 1203 connected to the heat pipe 201 is arranged in a space between the outer casing 1101 of the outermost layer and the casing main body having a vacuum structure. Therefore, the heat generated from the heating element 108 and guided to the heat radiating plate 1203 is generated by the airflow 1204 entering from the lower intake port of the outer casing 1101 in the outermost layer.
And is discharged from the upper exhaust port of the outer casing 1101 in the outermost layer.

(Sixth Embodiment) The electronic device according to the sixth embodiment has a closed casing made of a metal body having a chimney-shaped ventilation path.

In this electronic device, as shown in FIG. 33 (a), a metal body 2001 having a large number of chimney-like ventilation paths 2002 and having a high thermal conductivity is brought into close contact with a casing outer plate 2003, and the metal body 2001 A layer of heat-defective conductor 2004 such as plastic is provided inside,
The closed casing is constituted by the three-layer structure of the casing outer plate 2003, the metal body 2001, and the thermally defective conductor 2004.

In this device, the flow of air through the ventilation passage 2002 is promoted by the chimney action of the ventilation passage 2002 of the metal body 2001 as compared with the space having the double structure. Therefore, the heat radiation efficiency by the air flow can be increased. Further, the thermally defective conductor layer 2004 provided inside the metal body 2001 prevents heat conduction to the inside of the housing.

FIG. 33 (b) shows a chimney-shaped ventilation passage 20.
This shows an example in which a closed casing is formed by a two-layer structure of a metal body 2001 having a 02 and a heat insulating material 2006. In this case, since the number of layers of the housing is reduced, the manufacturing process of the closed housing can be simplified.

(Seventh Embodiment) In an electronic apparatus according to a seventh embodiment, heat insulation from the outside is realized by disposing a bagged heat insulating material inside a housing.

In this device, as shown in FIG. 34, a packaged heat insulating material 2402 is arranged inside the housing main body 103 and the door 104, and the heat insulating material 2402 surrounds the space inside the housing. The heat insulating material 2402 is made of a material obtained by shredding old cardboard, used paper, computer output printing paper, or the like by shredding, or a crushed piece of old timber as a material of the core material 2401, and using this material as polyethylene. After being stored in a plastic bag, the air in the bag is sucked, and the inside of the bag is sealed with a state close to vacuum.

As described above, the heat insulating material 2402 in a state close to a vacuum
By using, a heat insulating effect can be enhanced, and a recycled material can be used as a core material of the heat insulating material.

The core material 2401 may be housed in a resin container instead of a plastic bag, and the air in the resin container may be sucked, and the interior may be sealed in a state close to vacuum.

FIG. 35 shows a case in which a heat reflecting layer 2404 is formed on the surface of the heat insulating material 2402 by subjecting the plastic bag or the resin container of the heat insulating material 2402 to aluminum evaporation or the like. The presence of the heat reflection layer 2404 improves the heat shielding effect.

FIG. 36 shows a case where a cushion material 2405 such as a foamed resin is sealed together with a core material 2401 in a plastic bag of a heat insulating material 2402. This cushion material 2405 is arranged at a position where the heat insulating materials 2402 are in contact with each other. In this way, the heat insulation material 2402
Can be placed inside the housing so that no gap is created,
The work of assembling the heat insulating material into the housing can be facilitated, and the heat insulating effect can be enhanced.

(Eighth Embodiment) In an electronic apparatus according to an eighth embodiment, a protective body having a large number of holes is arranged on the outer periphery of a closed casing.

In this apparatus, as shown in FIG. 37, a housing protector 2102 in which a Teflon (registered trademark) coating is applied to a punching metal is attached to a housing main body 103 with a stay 2101, and a similar door is connected to the door 104. Protective body 2103 is attached with stay 2101.

Protective bodies 2102 and 2103 having a large number of holes
Has a function of a shade and ventilation for a closed housing, and also prevents a poster or the like from being attached to an electronic device. Since the protective bodies 2102 and 2103 have a large number of holes, they have a small actual area for application, and are coated with Teflon, so that they can be immediately peeled off even if a poster or the like is applied.

Further, as the protective members 2102 and 2103, a net or the like coated with Teflon can be used.

FIG. 38 shows that the protective body 2102 having a large number of holes has white vertical stripes 2302 and black vertical stripes 232 in order to enhance the heat dissipation effect.
03 is alternately arranged. FIG. 38 (a)
Shows a front view of the protection body 2102, and FIG. 38 (b) shows a sectional view. This stripe pattern is formed by changing the coating color of the protective body 2102.

When a heat ray 2306 such as sunlight is uniformly applied to the protective body 2102, a black portion 23 of a vertical stripe pattern which easily absorbs heat is provided.
In 03, an updraft 2304 is generated, so new air 2305 flows from the surroundings into this portion, and between the protective body 2102 and the sealed housing, and on the front of the protective body 2102, along a vertical black stripe pattern. A steady airflow is formed. This air flow enhances the heat radiation effect, and can efficiently remove the heat externally applied to the closed casing. This principle is the same as the principle in which a zebra in a hot-spot cools the horse.

The vertical stripe pattern provided on the protective body 2102 may be a color other than white and black as long as it is a light and dark stripe pattern.

FIG. 39 shows two protective bodies having a large number of holes.
The case where 2103 and 2105 are arranged so that the holes do not overlap each other is shown. Thus, the two protective bodies 2103, 2105
By displacing the position of the hole of, without obstructing the ventilation function,
The awning effect can be improved.

(Ninth Embodiment) The electronic device of the ninth embodiment prevents heat from returning from the heat sink to the housing.

In this device, as shown in FIG. 40, a heat sink 101 having a large number of through holes 102 is arranged in a closed housing, and a heat generating element 108 is brought into contact with the heat sink 101, and the heat generating element 108 Heat sink 1 other than
The portion 01 is covered with a thermally defective conductor 2501 such as a plastic layer. By doing so, it is possible to prevent the heat conducted from the heating element 108 to the heat sink 101 from being dissipated from the heat sink 101 and returning to the inside of the closed casing.

FIG. 41 shows a case where the heat sink 101 is separately installed for each heating element 108. Only one heat generating element 108 is in contact with each heat sink 101, and the heat sinks other than the contact position of the heat generating element 108 of each heat sink 101 are covered with the thermally defective conductor 2501.

When a plurality of heating elements are in contact with one heat sink, heat generated from one heating element is transmitted to another heating element via the heat sink, which may have an adverse effect. As described above, by dividing the heat sink for each heating element, mutual interference between the heating elements 108 can be avoided.

(Embodiment 10) In an electronic device according to a tenth embodiment, a ventilation cylinder is disposed in a closed casing, heat in the closed casing is collected, and heat is radiated in the cylinder.

This device is shown in the vertical sectional view of FIG.
As shown in the horizontal cross-sectional view of FIG.
Is disposed in the housing body 103, and the heat pipe 201 is installed through the wall of the ventilation cylinder 2600. A heat sink 1201 in contact with the heating element 108 is fixed to the heat pipe 201 extending into the closed casing, and a heat sink 2601 having a plurality of heat radiation plates 2602 is fixed to the heat pipe 201 extending into the ventilation cylinder 2600. It is fixed.

In this electronic device, the heat of the heating element 108 is guided to the ventilation cylinder 2600 by the heat pipe 201, and is radiated to the airflow flowing through the ventilation cylinder 2600 through the radiator plate 2602. Since each heat radiating plate 2602 extends in the vertical direction of the chimney-shaped ventilation cylinder 2600, the air flow smoothly rises between the heat radiating plates 2602, and heat is efficiently radiated.

[0092] The heat pipe 201 transfers heat into the ventilation cylinder 2600 which is thermally isolated from the closed casing, so that heat can be transferred regardless of the position of the heating element 108 in the casing. In addition, the return of heat into the closed casing can be prevented.

FIG. 44 is a vertical cross-sectional view showing the case where the heating element 108 in the closed casing is thermally connected to the heat sink 2601 in the ventilation tube 2600 via the Peltier element 2603. FIG. The horizontal sectional view is shown. Peltier elements are constructed by joining different kinds of metals, and a current can flow between these metals to generate or absorb heat proportional to the current.The direction of the current is reversed to generate and absorb heat. And can be reversed.

Accordingly, when discharging the heat of the heating element 108, the Peltier element 2603 is energized so as to absorb the heat on the side of the heating element 108 and generate heat in the ventilation cylinder 2600. In addition, even when the outside air temperature increases, the Peltier element 2603
By controlling the energization of the sealed enclosure, it is possible to cool the enclosed enclosure to a predetermined temperature. Conversely, when the outside air temperature is too low in a cold region, the energization of the Peltier element 2603 is adjusted so that It can be heated to a predetermined temperature.

(Eleventh Embodiment) In an eleventh embodiment, an example will be described in which a heat-dissipating mechanism for a heat sink is applied to an electronic device used indoors.

This device is a terminal device installed at a fast food counter or the like.
As shown in the figure, a touch panel 3006 operated by an operator is arranged on one side, a showcase 3008 for decorating a product sample on the other side, and a display 3007 for displaying the product name and price input from the touch panel 3006 are provided. Are located.

The terminal device circuit board 3009 and the circuit component 30
10 is housed in a closed housing. In this sealed housing,
A heat sink 3000 having a plurality of through holes 3001 (FIG. 46)
(C)) is also arranged, and the circuit component 3010 acting as a heating element is thermally connected to the heat sink 3000.

At the upper part of the closed casing, only the vent of the through hole 3001 of the heat sink 3000 is exposed. Since the lower part of the closed casing is supported by the legs, a space is formed in the lower part of the closed casing, and the lower vent of the through hole 3001 of the heat sink 3000 is exposed in this space.

Therefore, the heat generated in the closed casing is transmitted to the heat sink 3000, radiated by the airflow passing through the through hole 3001, and discharged from the upper vent.

In this device, an electronic circuit including a heating element can be housed in a closed casing by introducing a heat sink having a heat discharging mechanism. Therefore, even if coffee, drinks, etc. are handled, liquids do not enter the housing and damage electronic circuits. Etc. can be completely protected.

[0101]

As is apparent from the above description, the electronic device of the present invention can eliminate heat generated in the sealed housing to the outside, and can block solar heat and the like externally applied to the sealed housing. can do.

Therefore, even in the case of an electronic device in which circuit components need to be housed in a closed casing for installation outdoors, temperature rise in the casing can be suppressed, the life of the circuit components can be extended, and stable operation can be achieved. You can continue.

Further, in the case of an electronic device used in a place where dust, oily smoke, moisture, etc. are present and adversely affects the electronic circuit, the present invention can be applied to make the housing hermetically sealed. It can be used without trouble even in an unfriendly environment.

[Brief description of the drawings]

FIG. 1A is a horizontal sectional view of an electronic device according to a first embodiment, FIG. 1B is a vertical sectional view of an electronic device according to a first embodiment,

FIG. 2 is a view showing a mounting structure of a heat sink in the electronic device according to the first embodiment;

FIG. 3 is a perspective view showing a first installation state of the electronic device;

FIG. 4 is a perspective view showing a second installation state of the electronic device;

FIG. 5 is a perspective view showing a third installation state of the electronic device;

FIG. 6 is a perspective view showing a fourth installation state of the electronic device;

FIG. 7 is a perspective view showing a fifth installation state of the electronic device;

8A is a horizontal cross-sectional view of a heat sink having a multi-row through-hole according to the first embodiment; FIG. 8B is a vertical cross-sectional view of a heat sink having a multi-row through-hole according to the first embodiment;

FIG. 9 is a vertical cross-sectional view of the heat sink having the truncated conical through hole of the first embodiment;

FIG. 10 is a view showing a different type of through-hole shape of the heat sink according to the first embodiment;

FIG. 11 is a view showing a heat sink having a divided structure according to the first embodiment;

FIG. 12A is a horizontal sectional view of an electronic device having a heating element mounting structure using the heat pipe according to the first embodiment;
(B) a vertical sectional view of an electronic device having a heating element mounting structure using the heat pipe of the first embodiment,

FIG. 13 is a vertical sectional view of the electronic device according to the second embodiment;

FIG. 14 is an exemplary perspective view of an electronic device according to a second embodiment;

FIG. 15 is a vertical sectional view of an electronic device in which the heat sink according to the second embodiment is arranged.

FIG. 16 is a vertical sectional view of the electronic device according to the third embodiment;

FIG. 17 is a vertical sectional view of an electronic device in which the heat sink according to the third embodiment is arranged.

FIG. 18 is a cross-sectional view of a housing having a first double structure in the electronic device according to the fourth embodiment;

FIG. 19 is an exemplary sectional view of a housing having a second double structure in the electronic device according to the fourth embodiment;

FIG. 20 is a sectional view of a housing having a third double structure in the electronic device according to the fourth embodiment;

FIG. 21 is a sectional view of a housing portion having a fourth double structure in the electronic device of the fourth embodiment;

FIG. 22 is a sectional view of a housing having a fifth double structure in the electronic device of the fourth embodiment;

FIG. 23 is a sectional view of a housing having a sixth double structure in the electronic device of the fourth embodiment;

FIG. 24 is a sectional view of a housing having a seventh double structure in the electronic device according to the fourth embodiment;

FIG. 25 is a sectional view of an eighth double-structured housing portion of the electronic device according to the fourth embodiment;

FIG. 26 is a vertical sectional view of an electronic device according to a fifth embodiment;

FIG. 27 is a vertical sectional view of an electronic device in which a heat sink according to a fifth embodiment is arranged.

FIG. 28 is a vertical sectional view of an electronic device on which the heat ray reflective layer according to the fifth embodiment is formed;

FIG. 29 is a vertical cross-sectional view of an electronic device provided with an outer casing of the outermost layer according to the fifth embodiment;

FIG. 30 is a vertical sectional view of an electronic device provided with an outer casing and a heat sink of the outermost layer according to the fifth embodiment;

FIG. 31 is a vertical sectional view of an electronic device having a heating element mounting structure using a heat pipe according to a fifth embodiment;

FIG. 32 is a vertical cross-sectional view of an electronic device having a heating element mounting structure using a heat pipe according to the fifth embodiment and an outer casing of the outermost layer.

FIG. 33 (a) 3 in the electronic device of the sixth embodiment.
Cross-sectional view of a housing portion having a layer structure, (b) cross-sectional view of a housing portion having a two-layer structure in the electronic device of the sixth embodiment,

FIG. 34 is a vertical sectional view of the electronic device according to the seventh embodiment;

FIG. 35 is a view showing a heat insulating material having a heat ray reflective layer used in the electronic device of the seventh embodiment;

FIG. 36 is a view showing a heat insulating material with a cushion material enclosed used in the electronic device of the seventh embodiment;

FIG. 37 is a vertical sectional view of the electronic device according to the eighth embodiment;

FIG. 38A is a front view of a vertically striped shield used in the electronic device according to the eighth embodiment; FIG. 38B is a cross-sectional view of the vertically striped shield used in the electronic device according to the eighth embodiment;

FIG. 39 is a vertical sectional view of an electronic device having a double shield according to the eighth embodiment;

FIG. 40 is a view showing a heat sink used in the electronic device according to the ninth embodiment;

FIG. 41 is a view showing a split heat sink used in the electronic device according to the ninth embodiment;

FIG. 42 is a vertical sectional view of the electronic device according to the tenth embodiment;

FIG. 43 is a horizontal sectional view of the electronic device according to the tenth embodiment;

FIG. 44 is a vertical sectional view of an electronic device using the Peltier device according to the tenth embodiment;

FIG. 45 is a horizontal sectional view of an electronic device using the Peltier device according to the tenth embodiment;

FIG. 46A is a perspective view illustrating an electronic device according to an eleventh embodiment; FIG. 46B is a cross-sectional view illustrating the electronic device according to the eleventh embodiment;
(C) a perspective view showing a heat sink used in the electronic device of the eleventh embodiment;

FIG. 47 is a view showing a conventional electronic device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic device 2 Electronic unit 4 Baffle plate 5 Heat absorption fin 7 Heat radiation fin 9, 201 Heat pipe 20 Wall 21 Floor surface 101, 3000 Heat sink 102, 401, 3001 Through hole 103 Housing body 104 Door 105 Hinge 106 Lock lock 107, 112 Packing 108 Heating element 110 Intake 111 Exhaust 113 Support piece 114 Screw 601 Heat sink member 701, 1001 Inner casing 702, 1002 Outer casing 703, 717, 1103, 1105 Inlet 704, 716, 1104, 1106 Exhaust port 707, 708 Air 710 Direct Light 711, 1011 Inner door 712, 1012 Outer door 713, 714 Space 715 Reflected light 804, 2006 Insulation 806, 807, 2402 Insulation 902, 903, 904, 1014 Heat ray reflective layer 1013 Vacuum area 1101 Outermost layer outer enclosure 1102 Outer layer outer door 1201, 2601 Heat sink 1202 Heat shield 1203, 2602 Heat sink 1204 Ventilation 2001 Metal body 2002 Ventilation path 2003 Housing outer panel 2004, 2501 Thermally defective conductor layer 2101 Stay 2102, 2104 Housing protective body 2103, 2105 Door protective body 2302 White vertical stripes 2303 Vertical stripes 2304 updraft 2305 air 2306 heat ray 2401 core 2404 thermally reflective layer 2405 cushioning material 2600 ventilation accommodating cylinder 2603 Peltier element 3006 touch panel 3007 display 3008 Showcase 3009 circuit board 3010 CC

Claims (35)

[Claims] 1. An electronic device, comprising: a hermetically sealed housing for accommodating an electronic circuit, wherein a lower portion of the housing is provided so as to be in direct contact with the outside air, wherein a heat sink having a through hole is provided; An electronic device, wherein the electronic device is fixed in the closed casing so as to form a ventilation hole that passes through. 2. The electronic device according to claim 1, wherein the heat sink has a plate-like outer shape, and a plurality of the through holes extend along a plate surface of the heat sink. 3. The electronic device according to claim 2, wherein the heat-generating component in the closed casing is in contact with a plate surface of the heat sink. 4. The electronic device according to claim 1, wherein the heat-generating component in the closed casing contacts the heat sink via a heat pipe. 5. The diameter of the through hole is largest on the lower side of the closed casing, and becomes closer to the upper part of the closed casing.
The electronic device according to claim 1, wherein the size of the electronic device is reduced. 6. The heat sink according to claim 1, wherein the heat sink has a plurality of rows of the through holes, and a plurality of the through holes are arranged in each of the rows. An electronic device as described. 7. The electronic device according to claim 1, wherein the through hole has a cross-sectional shape having a circumference longer than a circle. 8. The heat sink according to claim 1, wherein a plurality of members are united.
An electronic device according to any one of the above. 9. An electronic device comprising a closed casing for housing an electronic circuit, wherein the lower part of the casing is installed so as to be in direct contact with the outside air, wherein the casing has a double structure of an inner casing and an outer casing. Constitutes a closed casing, and an air passage extending from a lower portion to an upper portion of the casing is formed between the outer casing and the inner casing. 10. A heat sink having a through hole is secured in the closed casing so that the through hole is a ventilation hole that passes from a lower portion to an upper portion of the closed casing. An electronic device as described. 11. A closed housing for housing an electronic circuit,
In an electronic device installed such that a lower part of a closed housing is in direct contact with outside air, the housing has a double structure of an inner housing and an outer housing, the inner housing forms a closed housing, and the outer housing and the inner housing are formed. An electronic device, wherein a heat insulating material is arranged between the electronic device and the electronic device. 12. A heat sink having a through hole is fixed to the inner housing in a confidential manner so that the through hole serves as a ventilation hole extending from a lower portion to an upper portion of the outer housing and the inner housing. The electronic device according to claim 11. 13. The electronic device according to claim 9, wherein a heat insulating material is arranged on the side of the ventilation path of the outer casing or the inner casing within a range that does not block the ventilation path. 14. The electronic device according to claim 9, wherein a heat insulating material is disposed inside the inner housing. 15. The electronic device according to claim 9, wherein a heat ray reflective layer is formed on at least one outer surface of the inner housing and the outer housing. 16. The electronic device according to claim 11, wherein a heat ray reflective layer is formed on a surface of the heat insulating material. 17. An electronic device comprising a sealed housing for housing an electronic circuit, wherein the housing has a sealed double structure of an inner housing and an outer housing, and the pressure between the outer housing and the inner housing is reduced to a vacuum or An electronic device characterized by being held in a state close to it. 18. A heat sink having a through hole is confidentially fixed to the outer casing and the inner casing such that the through hole is a ventilation hole that passes from a lower part to an upper part of the outer casing and the inner casing. The electronic device according to claim 17, wherein 19. The electronic device according to claim 17, wherein a heat ray reflective layer is formed on an outer surface of the outer casing. 20. An external covering casing surrounding the outer casing, and a ventilation path extending from a lower part to an upper part of the outer covering casing is formed between the outer covering casing and the outer casing. The electronic device according to any one of claims 17 to 19, wherein: 21. The heat generating apparatus according to claim 17, wherein heat generated from heat-generating components in the inner housing is transferred to the outside of the outer housing via a heat pipe, and is radiated through a radiator plate. An electronic device according to any one of the above. 22. The electronic device according to claim 21, wherein the heat radiating plate is disposed in a ventilation path between the outer casing and the outer casing. 23. A closed housing for housing an electronic circuit,
An electronic device, wherein a lower portion of a housing is provided so as to be in direct contact with the outside air, wherein the hermetically sealed housing includes a heat conductor having a plurality of chimney-shaped ventilation holes, and a heat-defective conductor or a heat insulating material disposed inside the heat conductor. An electronic device, wherein the ventilation hole forms a ventilation path for guiding an airflow from a lower portion to an upper portion of the closed casing along the closed casing. 24. The heat insulating material according to claim 11, wherein the finely divided core material is housed in a plastic bag and the air in the bag is evacuated.
24. The electronic device according to 16 or 23. 25. The electronic device according to claim 24, wherein the core material is used paper, old corrugated cardboard, computer output printing paper, or finely divided old timber. 26. The electronic device according to claim 24, wherein a heat reflection layer is formed on the plastic bag in which the core material is sealed. 27. The electronic device according to claim 25, wherein a foamed resin having a cushioning property is used as a core material of a portion of the heat insulating material that is in contact with another heat insulating material. 28. The electronic device according to claim 1, wherein the outer periphery of the housing is covered with a porous housing protector. 29. The electronic device according to claim 28, wherein bright and dark vertical stripes are alternately formed on the housing protector. 30. The electronic device according to claim 28, wherein the housing protectors are double-placed on the outer periphery of the housing by shifting the positions of the holes. 31. The heat sink according to claim 1, wherein the heat sink is covered with a poorly-heated conductor except for a portion in contact with a heat generating source. 1
19. The electronic device according to 2 or 18. 32. The electronic device according to claim 31, wherein the heat sink is divided into a plurality of heat sinks for each heat generation source. 33. A closed housing for housing an electronic circuit,
In the electronic device installed such that the lower part of the housing is in direct contact with the outside air, the cylindrical body formed of a heat insulating material is so formed as to have a ventilation hole passing through the lower part of the closed enclosure to the upper part. An electronic device, wherein heat generated from a heat-generating component in the closed casing is guided into the cylindrical body through a heat pipe and is radiated through a radiator plate. 34. A closed housing for housing an electronic circuit,
In the electronic device installed such that the lower part of the housing is in direct contact with the outside air, the cylindrical body formed of a heat insulating material is so formed as to have a ventilation hole passing through the lower part of the closed enclosure to the upper part. An electronic device, wherein heat generated from heat-generating components in the closed casing is guided into the cylindrical body by a Peltier element and is radiated through a radiator plate. 35. An electronic device comprising: an operation unit; and a display unit for displaying an operation result of the operation unit, wherein an electronic circuit for driving the operation unit and the display unit is housed in the closed casing. The electronic device according to claim 1.