JP2002111163A - Electrical board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrical board which can handle a plurality of electronic units without requiring an extra part. SOLUTION: In the electric board, a front conductive part 6a and a rear conductive part 6b are formed on a main board 1. A surface conductive part 15 is formed on a common board 3 connected to the main board 1. A common board 2 has no conductive part for connection. When the main board 1, the common board 3, and the common board 2 are joined under pressure, the front conductive part 6a of the main board 1 is covered with the common board 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electric board incorporated in an electronic device.

[0002]

2. Description of the Related Art Conventionally, many techniques relating to a substrate having terminals for connecting the substrates have been disclosed.
Normally, terminals are used in the form of being connected to some part, and when incorporated into equipment, in most cases, the terminal is designed as a dedicated electric board so that the terminal does not contact other parts Is often considered.

[0003] There are electric boards shared by a plurality of devices,
Few have been made to address the problem of electrical shorts and the like that occur with the form of connection.

In recent years, a manufacturing method has been adopted in which an electric board having a plurality of terminals is connected to each other at the time of assembling and is incorporated in the device.

[0005]

However, as described above, there is no production technique for manufacturing equipment products in which terminals are incorporated in an unused state, that is, in an open state. In this case, the terminal as the electrical connection contact portion that is left open is a technology for dealing with a short circuit when the board is stored in the device or a short circuit due to the interposition of the connection fitting at the terminal portion. Was not disclosed. Therefore, a need has arisen for measures to prevent short circuit accidents.

In order to avoid such an accident, there has been a technique in which another insulating member or a shielding member is newly added, but this is not preferable because it increases not only the assembling process but also the number of parts required for the product. Was.

[0007] Therefore, the present invention has been made in view of the above situation, and an object of the present invention is to provide an electric board which does not generate extra parts and can be used for a plurality of electronic devices. .

[0008]

That is, according to the present invention, there is provided a first substrate having a conductor portion for connection, a second substrate having a conductor portion connected to the first substrate, and a conductor portion for connection. A third substrate that does not have the third substrate, wherein when the first substrate and the second substrate are not connected,
The present invention is characterized in that the connection conductor portion of the first substrate is covered.

In the electric board of the present invention, the first board has a connecting conductor, and the second board has a conductor connected to the first board. Further, it is assumed that the third substrate has no connection conductor. When the first substrate is not connected to the second substrate, the third substrate covers the connection conductor of the first substrate.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an embodiment of the present invention, in which a terminal (hereinafter referred to as an additional substrate, which will be described in detail later) having various additional functions has no function (terminal). FIG. 3 is a development view illustrating a configuration of an electric board mounted on an electronic device (in which the electronic board is incorporated in an unused state).

In FIG. 1, the present electric board is a board (hereinafter, referred to as a main board) 1 having a main function of an electronic device.
And substrates (hereinafter, referred to as a common substrate) 2 and 3 that provide functions common to electronic devices, such as a substrate having a power supply circuit.

The main board 1 has a center hole 5 for fixing the board to a central boss 19 described later. A plurality of front surface conductors 6a and back surface conductors 6b are arranged at predetermined intervals around the center hole 5. The surface conductor 6a and the back conductor 6
b are arranged in pairs on the front side, which is one side of the main substrate 1, and on the rear side, which is the other side.

Further, the surface conductor portion 6a of the main substrate 1
In addition, board positioning holes 7a and 7b are formed at predetermined intervals from the back surface conductor 6b so as to be fitted to positioning bosses 20a and 20b described later.

The common substrate 2 is a substrate arranged near a position where the common substrate 3 and the main substrate 1 are connected, and can cover a plurality of surface conductors 6a formed on the main substrate 1. It has an external shape.

The common substrate 2 has a central hole 10 formed at a predetermined position for fixing the substrate at a position corresponding to the central hole 5 of the main substrate 1. Further, two positioning holes 11a and 11b are formed at a predetermined interval from the center hole 10. In addition, the common substrate 2
Does not have a conductor portion for connection.

The surface of the common substrate 2 is formed of a cover film layer.

A center hole 14 is formed in the common substrate 3 at a position corresponding to the center hole 5 of the main substrate 1. Around the center hole 14, a plurality of front surface conductors 15 correspond to the back surface conductor 6b of the main substrate 1.
Are arranged at predetermined intervals. This common substrate 3
No conductor portion is formed on the back side of the substrate.

Further, the board positioning holes 7a and 7 are located at a predetermined distance from the surface conductor 15 of the common board 3.
Similarly to b, substrate positioning holes 16a and 16b are formed.

The main board 1 and the common boards 2 and 3
The center holes 5, 10 and 14 are aligned with the substrate positioning holes 7a, 7b, 11a, 11b and 16a, 16b, respectively. The center holes 5, 10, 14 aligned with the center boss 19 and the positioning bosses 20a, 20b formed on the base 18 and the substrate positioning hole 7
a, 7b, 11a, 11b, 16a, 16b are fitted.

The common board 2, the main board 1, and the common board 3 are sequentially placed on the pedestal 18, and a screw 24 is attached to the center boss of the pedestal 18 via an elastic member 22 and a metal washer 23. 19, it is fixed. In this case, the back surface conductor 6b of the main substrate 1 and the front surface conductor 15 of the common substrate 3 are electrically connected by pressure welding. When an additional substrate (not shown) is incorporated, the front surface conductor 6a is connected to the conductor of the additional substrate.

FIG. 2 is an assembled sectional view of the electric board shown in FIG.

A common substrate 2 is placed on the main substrate 1,
The cover film layer 2c covers the conductor 6a.

That is, the common substrate 3 is placed on the pedestal 18. The common substrate 3 is a single-sided substrate, and includes a base material layer 3a, a conductor layer 3b, and a cover film layer 3c.

The conductor layer 3b is adhered to the base material layer 3a by an adhesive layer (not shown). Further, a cover film layer 3c having an opening so that a part of the conductor layer 3b is exposed is adhered to the conductor layer 3b with an adhesive layer (not shown). That is, the portion of the conductor layer 3b exposed by the opening becomes the surface conductor portion 15 shown in FIG.

In FIG. 2, the main board 1 is mounted on the common board 3. The main substrate 1 is composed of a double-sided substrate, and includes a base material layer 1a, conductor layers 1b and 1d.
And cover film layers 1c and 1e.

On one side of the base material layer 1a,
The conductor layer 1b is adhered by an adhesive layer (not shown). Further, a cover film layer 1c having an opening formed such that a part of the conductor layer 1b is exposed is adhered to the conductor layer 1b with an adhesive layer (not shown).

On the other hand, on the other surface side of the base material layer 1a, a conductor layer 1d is adhered by an adhesive layer (not shown). Furthermore, on this conductor layer 1d (the lower side in FIG. 2),
A cover film layer 1e having an opening formed so as to expose a part of the conductor layer 1d is adhered to an adhesive layer (not shown).

The portion of the conductor layer 1b exposed by the opening becomes the surface conductor portion 6a shown in FIG. Similarly, the conductor layer 1 exposed by the opening
The portion d becomes the back surface conductor 6b shown in FIG.

Further, in FIG. 2, on the main substrate 1, a common substrate 2 composed of a single-sided substrate is mounted. The common substrate 2 includes a base material layer 2a and a conductor layer 2b.
And the cover film layer 2c.

In FIG. 2, a conductor layer 2b is adhered to an underside of the base material layer 2a, which is a lower side, by an adhesive layer (not shown). Further, a cover film layer 2c is adhered on the conductor layer 2b (on the lower side in the figure) with an adhesive layer (not shown) so that the conductor layer 2b is not exposed.

Further, while the common board 3, the main board 1, and the common board 2 are placed on the pedestal 18, the common board 3, the main board 1, and the common board 2 are connected via the elastic member 22 and the metal washer 23.
A screw 24 is fastened to the central boss 19. by this,
The common board 3, the main board 1, and the common board 2 are fixed on the pedestal 18.

At this time, the conductor layers exposed from the respective substrates, that is, the front conductor portion 15 of the common substrate 3 and the rear conductor portion 6b of the main substrate 1 are pressed against each other by fastening the screws 24 and come into contact with each other. An electrical connection is made. When an additional substrate (not shown) is incorporated, the front surface conductor 6a is connected to the conductor of the additional substrate.

FIG. 3 is a diagram showing a state of the electric board pressed by the screw 24.

Common board 2 having no connecting conductor
By completely covering the plurality of surface conductor portions 6a formed on the main board 1, the short circuit caused by the metal washer 23 is prevented. Further, the connection conductor can be prevented from being short-circuited with another conductor in the device.

Further, even if an additional board (not shown) is added, it can be easily coped with simply by adding it between the common board 2 and the main board 1.

FIG. 4 is a diagram showing a state where the connection portion fastened as shown in FIG. 1 is viewed from above.

An elongated substrate such as the common substrate 2
In many cases, a flexible printed circuit board is used, and since the material is soft, positioning is difficult, and when assembling, workability is often poor such as being caught by an exterior member (not shown). However, as shown in FIGS. 1 and 3, the common substrate 2 is passed through the positioning bosses 20a and 20b, and is fixed to the pedestal 18 together with other substrates using the screws 24 on the central boss 19, so that the common substrate 2 is not caught. There is also an effect that prevention is performed and workability is improved.

FIG. 5 is a developed view showing the structure of an electric board mounted on an electronic device in which all the terminals are incorporated in a used state.

In FIG. 5, the electric board includes a main board 1, an additional board 27 having various additional functions, and a common board 3.

A center hole 28 is formed in the additional substrate 2 at a position corresponding to the center hole 5 of the main substrate 1. Around the center hole 28, a plurality of back surface conductors 29 corresponding to the surface conductor 6a of the main board 1 are provided.
Are arranged at predetermined intervals. This additional board 2
No surface conductor portion is formed on the surface side of.

Further, the board positioning holes 7a and 7b are located at a predetermined distance from the back conductor 11 of the additional board 2.
Similarly to b, substrate positioning holes 30a and 30b are formed.

The main board 1, the additional board 27 and the common board 3 have center holes 5, 28 and 14 and board positioning holes 7a, 7b, 30a, 30b and 16a, 16 respectively.
b is aligned. The central holes 5, 28, 14 and the substrate positioning holes 7a, 7b, 30a, 30b, 16a, 16b, which are aligned, are fitted to the central boss 19 and the positioning bosses 20a, 20b formed on the pedestal 18. Are combined.

The additional board 27, the main board 1, and the common board 3 are fixed to the center boss 19 of the pedestal 18 by screws 24 via an elastic member 22 and a metal washer 23.

Other structures are the same as those of the above-described embodiment, and therefore, the same reference numerals are given and the description is omitted.

FIG. 6 is an assembled sectional view of the electric board shown in FIG.

In FIG. 6, on the main substrate 1,
An additional board 27 composed of a single-sided board is placed. The additional substrate 27 includes a base material layer 27a, a conductor layer 2
7b and a cover film layer 27c.

In FIG. 6, the lower base material layer 27a
On the back side of the conductor layer 27b, an adhesive layer (not shown) is used.
Is glued. Further, on the conductor layer 27b (lower side in the figure), an adhesive layer (not shown)
A cover film layer 27c having an opening formed so as to expose a part of b is adhered. That is, the portion of the conductor layer 27b exposed by the opening becomes the back surface conductor portion 29 shown in FIG.

Then, with the common board 3, the main board 1, and the additional board 27 placed on the pedestal 18, the screw 24 is fastened to the central boss 19 via the elastic member 22 and the metal washer 23. Is done. Thereby, the common substrate 3,
The main board 1 and the additional board 27 are fixed on the base 18.

At this time, the conductor layers exposed from the respective substrates, that is, the surface conductor 15 of the common substrate 3 and the back conductor 6b of the main substrate 1, and the surface conductor 6a of the main substrate 1 and the additional substrate 27 The back conductor part 29 and the screw 24
Are brought into pressure contact by the fastening, and by making contact with each other, electrical connection is made.

According to the above embodiment of the present invention, the following configuration can be obtained.

That is, (1) a first substrate having a first conductor portion for connection and a second substrate having a second conductor portion connected to the first conductor portion of the first substrate. And a third substrate having no connecting conductor portion, wherein when the first conductor portion and the second conductor portion are not connected, the third substrate is the same as the first substrate. An electric board covering the first conductor.

[0053]

As described above, according to the present invention, it is possible to provide an electric board capable of supporting a plurality of electronic devices without generating extra parts.

[Brief description of the drawings]

FIG. 1 is an exploded view showing a configuration of an electric board mounted on an electronic device in a case where a function realized by an additional board is not provided in an embodiment of the present invention.

FIG. 2 is an assembled sectional view of the electric board shown in FIG. 1;

FIG. 3 is a view showing a state of the electric board having the structure of FIGS. 1 and 2 pressed by a screw 24;

FIG. 4 is a diagram showing a state where the connection portion fastened as shown in FIG. 1 is viewed from above.

FIG. 5 is a development view showing a configuration of an electric board mounted on an electronic device in which all terminals are incorporated in a use state.

6 is a diagram showing a state of the electric board having the structure of FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Main board, 1a, 2a, 3a Base material layer, 1b, 1d, 2b, 3b Conductive layer, 1c, 1e, 2c, 3c Cover film layer, 2, 3 Common board, 5, 10, 14 Center hole, 6a, 15 front conductor part, 6b back conductor part, 7a, 7b, 11a, 11b, 16a, 16b board positioning hole, 18 pedestal, 19 center boss, 20a, 20b positioning boss, 22 elastic member, 23 washer, 24 screw.

Claims (3)

[Claims] 1. A first substrate having a conductor portion for connection, a second substrate having a conductor portion connected to the first substrate, and a third substrate having no conductor portion for connection. An electric board, comprising: the third board covering a connection conductor of the first board when the first board and the second board are not connected. 2. The electric board according to claim 1, wherein the third board is a board disposed near a position where the first board and the second board are connected. . 3. The electric board according to claim 1, wherein the third board is a flexible printed board.