JP2002103862A - Card - Google Patents
CardInfo
- Publication number
- JP2002103862A JP2002103862A JP2000295004A JP2000295004A JP2002103862A JP 2002103862 A JP2002103862 A JP 2002103862A JP 2000295004 A JP2000295004 A JP 2000295004A JP 2000295004 A JP2000295004 A JP 2000295004A JP 2002103862 A JP2002103862 A JP 2002103862A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sheet
- weight
- heat
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 18
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 17
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 17
- 230000004927 fusion Effects 0.000 claims abstract description 13
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical group OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920001971 elastomer Polymers 0.000 claims abstract description 6
- 239000011256 inorganic filler Substances 0.000 claims abstract description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 6
- 239000011342 resin composition Substances 0.000 claims abstract description 4
- 229920005668 polycarbonate resin Polymers 0.000 claims description 11
- 239000004431 polycarbonate resin Substances 0.000 claims description 11
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 claims description 7
- 239000005060 rubber Substances 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 229920001634 Copolyester Polymers 0.000 abstract description 4
- 239000004417 polycarbonate Substances 0.000 abstract description 4
- 229920000515 polycarbonate Polymers 0.000 abstract 2
- 239000000806 elastomer Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 17
- 229920001225 polyester resin Polymers 0.000 description 10
- 239000004645 polyester resin Substances 0.000 description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 230000007423 decrease Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 229920006038 crystalline resin Polymers 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 125000005027 hydroxyaryl group Chemical group 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 239000012945 sealing adhesive Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 150000003457 sulfones Chemical class 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- RSSGMIIGVQRGDS-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-phenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=CC=C1 RSSGMIIGVQRGDS-UHFFFAOYSA-N 0.000 description 1
- OVVCSFQRAXVPGT-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclopentyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCC1 OVVCSFQRAXVPGT-UHFFFAOYSA-N 0.000 description 1
- QHJPJZROUNGTRJ-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)octan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCCCCC)C1=CC=C(O)C=C1 QHJPJZROUNGTRJ-UHFFFAOYSA-N 0.000 description 1
- GRCXOICCGCYITB-UHFFFAOYSA-N 4-[2-[2-[2-(4-hydroxyphenyl)-3-methylphenyl]propan-2-yl]-6-methylphenyl]phenol Chemical compound CC1=CC=CC(C(C)(C)C=2C(=C(C)C=CC=2)C=2C=CC(O)=CC=2)=C1C1=CC=C(O)C=C1 GRCXOICCGCYITB-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Magnetic Record Carriers (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、コアシートとオー
バーシートとを積層して制作され、内部にICチップ等
を搭載したICカードや磁気ストライプカード等のカー
ドに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card such as an IC card or a magnetic stripe card which is produced by laminating a core sheet and an oversheet and has an IC chip or the like mounted therein.
【0002】[0002]
【従来の技術】一般的にカードの材料は、コアシートと
称せられる白色に着色された中心層とコアシートの表面
に積層され、カード裏表面に一対として被覆される透明
なオーバーシートから構成される。コアシート及びオー
バーシートの積層面の融着は熱融着を介してのドライラ
ミネート、もしくは熱融着接着剤を用いてのプレス融着
が使用される。これらのカード用シートは、一般に塩化
ビニルシートが用いられてきたが、焼却処理の問題から
ポリ塩化ビニール樹脂を敬遠する動きが近年見られ始め
ている。そのポリ塩化ビニール樹脂の代替品として、オ
レフィン系樹脂であるポリエチレンテレフタレート樹脂
やポリエチレンテレフタレート樹脂のエチレングリコー
ル成分をシクロヘキサンジメタノールに置換してなる共
重合ポリエステル樹脂が急速に市場に出回るようになっ
てきている。しかしながら、ポリエチレンテレフタレー
ト樹脂は熱融着特性に乏しく、熱融着接着剤を用いたプ
レス融着が必要となる為、ICチップ等を搭載したコア
シートと融着する場合ICチップへの悪影響がでてしま
う恐れがある。また、熱融着接着剤をオーバーシートに
塗布する工数とコストが掛かってしまう。また、ポリエ
チレンテレフタレート樹脂のエチレングリコール成分を
シクロヘキサンジメタノールに置換してなる共重合ポリ
エステル樹脂は、耐熱性が不足しており高温時(70
℃)にカードがたわんでしまう恐れがあった。2. Description of the Related Art Generally, a card material is composed of a white colored central layer called a core sheet and a transparent oversheet laminated on the surface of the core sheet and covered as a pair on the back surface of the card. You. For the fusion of the laminated surfaces of the core sheet and the oversheet, dry lamination via heat fusion or press fusion using a heat fusion adhesive is used. In general, vinyl chloride sheets have been used for these card sheets. However, in recent years, movements to avoid the use of polyvinyl chloride resin due to the problem of incineration have begun to be seen. As an alternative to the polyvinyl chloride resin, polyethylene terephthalate resin, which is an olefin resin, and copolyester resin obtained by substituting the ethylene glycol component of polyethylene terephthalate resin with cyclohexane dimethanol, are rapidly becoming available on the market. I have. However, polyethylene terephthalate resin has poor heat-sealing properties and requires press-sealing using a heat-sealing adhesive. Therefore, when fusing with a core sheet on which an IC chip or the like is mounted, there is an adverse effect on the IC chip. There is a risk that it will. In addition, the man-hour and cost for applying the heat-sealing adhesive to the oversheet are increased. Further, the copolymerized polyester resin obtained by substituting the ethylene glycol component of the polyethylene terephthalate resin with cyclohexane dimethanol has insufficient heat resistance and has a high temperature (70%).
(° C).
【0003】[0003]
【発明が解決しようとする課題】本発明は、自己融着性
及び耐熱性を有し、かつ安いコストで品質の安定したカ
ードを提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a card having a self-fusing property and heat resistance, and having a stable quality at a low cost.
【0004】[0004]
【課題を解決するための手段】本発明者らは、上記の問
題点を解決するため鋭意探索した結果、融着層と耐熱層
を有する多層シートを用いる事により解決できることを
見いだした。即ち本発明は、ポリエチレンテレフタレー
ト樹脂のエチレングリコール成分10〜70モル%をシ
クロヘキサンジメタノールに置換してなる共重合ポリエ
ステル70〜100重量部とポリカーボネート樹脂30
〜0重量部からなる樹脂100重量部に無機充填剤0〜
25重量部、ゴム性弾性体0〜15重量部を配合した樹
脂組成物からなるコアシートに対し、ポリエチレンテレ
フタレート樹脂のエチレングリコール成分の10〜70
モル%をシクロヘキサンジメタノールに置換してなる共
重合ポリエステルである融着層と、ポリカーボネート樹
脂からなる耐熱層を積層したことを特徴とする多層シー
トをオーバーシートとして使用したカードである。好ま
しくは、融着層と耐熱層との厚み構成比率が5:95〜
50:50であり、耐熱層の厚みが50ミクロン以上で
ある多層シートをオーバーシートとして使用したカード
である。Means for Solving the Problems The present inventors have conducted intensive searches to solve the above-mentioned problems, and as a result, have found that the problems can be solved by using a multilayer sheet having a fusion layer and a heat-resistant layer. That is, the present invention relates to 70 to 100 parts by weight of a copolymerized polyester obtained by substituting 10 to 70 mol% of an ethylene glycol component of a polyethylene terephthalate resin with cyclohexane dimethanol, and a polycarbonate resin 30.
0 to 100 parts by weight of resin consisting of 0 parts by weight of inorganic filler 0
25 parts by weight and a core sheet comprising a resin composition containing 0 to 15 parts by weight of a rubber elastic body, 10 to 70 parts of the ethylene glycol component of the polyethylene terephthalate resin.
This is a card using a multilayer sheet as an oversheet, characterized by laminating a fusion layer, which is a copolymerized polyester in which mol% is replaced with cyclohexanedimethanol, and a heat-resistant layer made of a polycarbonate resin. Preferably, the thickness composition ratio of the fusion layer and the heat-resistant layer is from 5:95 to
This is a card in which a 50:50 multilayer sheet having a heat-resistant layer thickness of 50 microns or more is used as an oversheet.
【0005】[0005]
【発明の実施の形態】本発明で使用される共重合ポリエ
ステル樹脂は、ポリエチレンテレフタレート樹脂におい
てエチレングリコール成分の10〜70モル%をシクロ
ヘキサンジメタノールに置換してなるものを使用する
が、エチレングリコール成分の置換量が10モル%未満
では熱融着性が劣り、融着後のシートの弾性率が低下す
る。これは、ポリエチレンテレフタレート樹脂は結晶性
樹脂であるため融着後の冷却時にシートの再結晶化が進
むことにより熱融着性が無くなり、シートの弾性率が低
下するためである。また逆に、エチレングリコール成分
の置換量が70モル%を越えると共重合ポリエステル樹
脂の弾性率が下がり、熱融着性が下がる。これは、共重
合ポリエステル樹脂の置換量が多くなると再結晶化が早
く進み、熱融着性が無くなってしまう為である。即ち、
エチレングリコール成分の10〜70モル%をシクロヘ
キサンジメタノールに置換する事により、共重合ポリエ
ステル樹脂は非結晶性の樹脂となり、熱融着性を持ち、
シートの弾性率の低下が無くなる。従って、エチレング
リコール成分のシクロヘキサンジメタノールへの置換量
は10〜70モル%が良く、好ましくは20〜35モル
%である。BEST MODE FOR CARRYING OUT THE INVENTION The copolymerized polyester resin used in the present invention is a polyethylene terephthalate resin obtained by substituting 10 to 70 mol% of an ethylene glycol component with cyclohexanedimethanol. When the substitution amount is less than 10 mol%, the heat-sealing property is inferior, and the elastic modulus of the fused sheet is reduced. This is because the polyethylene terephthalate resin is a crystalline resin, so that the recrystallization of the sheet proceeds during cooling after fusing, whereby the heat-fusing property is lost and the elastic modulus of the sheet decreases. Conversely, when the substitution amount of the ethylene glycol component exceeds 70 mol%, the elastic modulus of the copolymerized polyester resin decreases, and the heat fusibility decreases. This is because when the substitution amount of the copolymerized polyester resin increases, recrystallization proceeds quickly, and the heat-fusing property is lost. That is,
By substituting 10 to 70 mol% of the ethylene glycol component with cyclohexane dimethanol, the copolymerized polyester resin becomes a non-crystalline resin and has a heat-fusing property,
The elastic modulus of the sheet does not decrease. Therefore, the replacement amount of the ethylene glycol component with cyclohexanedimethanol is preferably 10 to 70 mol%, and more preferably 20 to 35 mol%.
【0006】本発明で使用するポリカーボネート樹脂
は、種々のジヒドロキシジアリール化合物とホスゲンと
を反応させるホスゲン法、またはジヒドロキシジアリー
ル化合物とジフェニルカーボネートなどの炭酸エステル
とを反応させるエステル交換法によって得られる重合体
である。The polycarbonate resin used in the present invention is a polymer obtained by a phosgene method of reacting various dihydroxydiaryl compounds with phosgene or a transesterification method of reacting a dihydroxydiaryl compound with a carbonate such as diphenyl carbonate. is there.
【0007】上記ジヒドロキシジアリール化合物として
は、ビスフェノールAの他に、ビス(4−ヒドロキシフ
ェニル)メタン、1,1−ビス(4−ヒドロキシフェニ
ル)エタン、2,2−ビス(4−ヒドロキシフェニル)
ブタン、2,2−ビス(4−ヒドロキシフェニル)オク
タン、ビス(4−ヒドロキシフェニル)フェニルメタ
ン、2,2−ビス(4−ヒドロキシフェニル−3−メチ
ルフェニル)プロパン、1,1−ビス(4−ヒドロキシ
−3−第三ブチルフェニル)プロパンのようなビス(ヒ
ドロキシアリール)アルカン類、1,1−ビス(4−ヒ
ドロキシフェニル)シクロペンタン、1,1−ビス(4
−ヒドロキシフェニル)シクロヘキサンのようなビス
(ヒドロキシアリール)シクロアルカン類、4,4’−
ジヒドロキシジフェニルエーテル、4,4’−ジヒドロ
キシ−3,3’−ジメチルジフェニルエーテルのような
ジヒドロキシジアリールエーテル類、4,4’−ジヒド
ロキシジフェニルスルフィド、4,4’−ジヒドロキシ
−3,3’−ジメチルジフェニルスルフィドのようなジ
ヒドロキシジアリールスルフィド類、4,4’−ジヒド
ロキシジフェニルスルホキシド、4,4’−ジヒドロキ
シ−3,3’−ジメチルジフェニルスルホキシドのよう
なジヒドロキシジアリールスルホキシド類、4,4’−
ジヒドロキシジフェニルスルホン、4,4’−ジヒドロ
キシ−3,3’−ジメチルジフェニルスルホンのような
ジヒドロキシジアリールスルホン類等が挙げられ、これ
らは単独だけでなく2種類以上混合して使用してもよ
い。As the above dihydroxydiaryl compounds, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, and 2,2-bis (4-hydroxyphenyl) are used in addition to bisphenol A.
Butane, 2,2-bis (4-hydroxyphenyl) octane, bis (4-hydroxyphenyl) phenylmethane, 2,2-bis (4-hydroxyphenyl-3-methylphenyl) propane, 1,1-bis (4 Bis (hydroxyaryl) alkanes such as -hydroxy-3-tert-butylphenyl) propane, 1,1-bis (4-hydroxyphenyl) cyclopentane, 1,1-bis (4
Bis (hydroxyaryl) cycloalkanes such as -hydroxyphenyl) cyclohexane, 4,4'-
Dihydroxydiaryl ethers such as dihydroxydiphenylether, 4,4'-dihydroxy-3,3'-dimethyldiphenylether, 4,4'-dihydroxydiphenylsulfide, and 4,4'-dihydroxy-3,3'-dimethyldiphenylsulfide; Dihydroxydiaryl sulfoxides, such as 4,4'-dihydroxydiphenyl sulfoxide, and 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfoxide, 4,4'-
Examples thereof include dihydroxydiaryl sulfones such as dihydroxydiphenyl sulfone and 4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfone, and these may be used alone or in combination of two or more.
【0008】本発明に使用されるポリカーボネート樹脂
の粘度平均分子量には特に制限はないが、成形加工性、
強度、耐熱性の面より通常10000〜100000、
好ましくは15000〜35000である。また、かか
るポリカーボネート樹脂を製造するに際し分子量調節
剤、触媒等を必要に応じて添加しても差し支えない。本
発明の多層シートの耐熱層の厚さは、50ミクロン以上
であることが好ましい。50ミクロン以下になると耐熱
性が不足しカードのたわみ等が発生する。The viscosity-average molecular weight of the polycarbonate resin used in the present invention is not particularly limited.
Normally from 10,000 to 100,000 from strength, heat resistance,
Preferably it is 15000-35000. In producing such a polycarbonate resin, a molecular weight regulator, a catalyst and the like may be added as necessary. The thickness of the heat-resistant layer of the multilayer sheet of the present invention is preferably 50 microns or more. When the thickness is less than 50 microns, the heat resistance is insufficient and the card is bent.
【0009】本発明の多層シートは融着層と耐熱層の二
層構成からなる。融着層と耐熱層との厚み構成比率は、
5:95〜50:50の範囲が好ましい。融着層の比率
が5未満では、融着性が低下し、50を超えると耐熱性
が低下する。[0009] The multilayer sheet of the present invention has a two-layer structure of a fusion layer and a heat-resistant layer. The thickness composition ratio of the fusion layer and the heat-resistant layer is
The range of 5:95 to 50:50 is preferred. If the ratio of the fusion layer is less than 5, the fusibility decreases, and if it exceeds 50, the heat resistance decreases.
【0010】本発明のコアシートは、ポリエチレンテレ
フタレート樹脂のエチレングリコール成分10〜70モ
ル%をシクロヘキサンジメタノールに置換してなる共重
合ポリエステル70〜100重量部とポリカーボネート
樹脂30〜0重量部からなる樹脂組成物100重量部に
対し、無機充填剤0〜25重量部、ゴム性弾性体0〜1
5重量部を配合した樹脂組成物である。ポリカーボネー
ト樹脂の配合量が、30重量部を越えるとカード作成後
の剛性が大きくなりエンボス加工後のカードの反りが大
きくなってしまうため好ましくない。無機充填剤が25
重量部を越えると樹脂との相溶性が悪くなり衝撃強度が
低下してしまいカードが脆くなってしまう。ゴム性弾性
体が15重量部を越えると耐熱性が低下するので好まし
くない。The core sheet of the present invention is a resin comprising 70 to 100 parts by weight of a copolyester obtained by substituting 10 to 70 mol% of an ethylene glycol component of a polyethylene terephthalate resin with cyclohexane dimethanol and 30 to 0 parts by weight of a polycarbonate resin. With respect to 100 parts by weight of the composition, 0 to 25 parts by weight of an inorganic filler, 0 to 1 parts of a rubbery elastic body
It is a resin composition containing 5 parts by weight. If the blending amount of the polycarbonate resin exceeds 30 parts by weight, the rigidity after the card is made large and the warp of the card after the embossing becomes large, which is not preferable. 25 inorganic fillers
If the amount is more than the weight part, the compatibility with the resin is deteriorated, the impact strength is reduced, and the card becomes brittle. When the amount of the rubber elastic body exceeds 15 parts by weight, heat resistance is undesirably reduced.
【0011】本発明において使用する無機充填剤として
は、タルク、マイカ、炭酸カルシウム、酸化チタン等が
挙げられる。中でも、平均粒子径0.5〜50μmのタ
ルクが好ましい。The inorganic filler used in the present invention includes talc, mica, calcium carbonate, titanium oxide and the like. Among them, talc having an average particle size of 0.5 to 50 μm is preferable.
【0012】本発明において使用するゴム性弾性体とし
ては、アルキルアクリレートやアルキルメタクリレート
を主体とするアクリル系重合体やメタクリル系重合体、
ブタジエンやイソプレンなどの共役ジエンを主体とする
ジエン系重合体、ポリオルガノシロキサンを主体とする
シリコーン系重合体の一種又は二種以上の共重合体を挙
げることができる。また、ビニル系単量体としては例え
ば、スチレン、α-メチルスチレンなどの芳香族ビニル
化合物、(メタ)アクリル酸メチル、(メタ)アクリル
酸エチルなどの(メタ)アクリル酸エステル、アクリロ
ニトリルなどのシアン化ビニル化合物などが挙げられ
る。かかるゴム状弾性体は、メチルメタアクリレート・
ブチルアクリレート・スチレン樹脂(以下、MAS樹脂
と略す)、メチルメタアクリレート・ブタジエン・スチ
レン樹脂(以下、MBS樹脂と略す)、ブチルアクリレ
ート・イソプレン・スチレン樹脂(以下、MAIS樹脂
と略す)などがあり公知のものを用いることができる。
特に、MBS樹脂が好ましい。The rubbery elastic material used in the present invention includes acrylic polymers and methacrylic polymers mainly composed of alkyl acrylate and alkyl methacrylate,
Examples thereof include one or two or more copolymers of a diene-based polymer mainly containing a conjugated diene such as butadiene and isoprene, and a silicone-based polymer mainly containing polyorganosiloxane. Examples of the vinyl monomer include aromatic vinyl compounds such as styrene and α-methylstyrene, (meth) acrylates such as methyl (meth) acrylate and ethyl (meth) acrylate, and cyanates such as acrylonitrile. And vinyl chloride compounds. Such a rubber-like elastic body is methyl methacrylate.
There are known butyl acrylate / styrene resin (hereinafter abbreviated as MAS resin), methyl methacrylate / butadiene / styrene resin (hereinafter abbreviated as MBS resin), butyl acrylate / isoprene / styrene resin (hereinafter abbreviated as MAIS resin) and the like. Can be used.
Particularly, MBS resin is preferable.
【0013】上記以外のゴム性弾性体としては、例えば
ブタジエンゴム、スチレン−ブタジエンゴム、アクリロ
ニトリル−ブタジエン−スチレン、イソブチレン−イソ
プレンゴム、エチレン−プロピレンゴム、エチレン−プ
ロピレン−ジエンゴム、アクリロニトリル−ブタジエン
ゴム、スチレン−ブタジエン−スチレンゴム、スチレン
−ブタジエンゴムの水素化物、スチレン-イソプレン−
スチレンゴム、スチレン−イソプレンゴムの水素化物な
どを挙げることができる。Examples of the rubbery elastic body other than those described above include, for example, butadiene rubber, styrene-butadiene rubber, acrylonitrile-butadiene-styrene, isobutylene-isoprene rubber, ethylene-propylene rubber, ethylene-propylene-diene rubber, acrylonitrile-butadiene rubber, styrene -Butadiene-styrene rubber, hydride of styrene-butadiene rubber, styrene-isoprene-
Styrene rubber and hydride of styrene-isoprene rubber can be exemplified.
【0014】これらの上記ゴム性弾性体は、一種あるい
は二種以上組み合わせて使用しても良い。These rubbery elastic bodies may be used alone or in combination of two or more.
【0015】本発明の多層シート及びコアシートには、
所望により通常に使用される添加剤、例えば安定剤、滑
剤、補強剤、加工助剤、顔料、帯電防止剤、酸化防止
剤、中和剤、紫外線吸収剤、分散剤、増粘剤、その他無
機充填剤等、または他の合成樹脂を含有させることもで
きる。The multilayer sheet and the core sheet of the present invention include:
Additives commonly used as desired, such as stabilizers, lubricants, reinforcing agents, processing aids, pigments, antistatic agents, antioxidants, neutralizing agents, ultraviolet absorbers, dispersants, thickeners, and other inorganics Fillers and the like, or other synthetic resins can also be included.
【0016】本発明の多層シート及びコアシートをシー
ト状に加工するためには、従来よりカレンダリング法、
押し出し法、プレス法、キャスト法などがあるが、ここ
で特に限定するものではない。In order to process the multilayer sheet and the core sheet of the present invention into a sheet, a conventional calendering method is used.
There are an extrusion method, a pressing method, a casting method, and the like, but there is no particular limitation here.
【0017】[0017]
【実施例】以下実施例により本発明を説明するが、これ
は単なる例示であり、本発明はこれに限定されるもので
はない。 《オーバーシートの作製》表1に示した融着層A、耐熱
層Bを、表2に示した構成比率で押し出し法を用いて、
多層シートを作成した。 《コアシートの作製》表3の組成内容のペレットを作成
した後、シート状に押し出した。シートの厚みは、50
0μmとした。 《実施例、比較例》作製したオーバーシート及びコアシ
ートを用い、融着性、耐熱特性のテストを実施した。こ
の結果を表4に示す。各種評価については、下記に基づ
いて実施した。 (1)融着性:ポリエチレンテレフタレート樹脂のエチ
レングリコール成分30モル%をシクロヘキサンジメタ
ノールに置換してなる共重合ポリエステル樹脂のコアシ
ートと表4の比率で作成したオーバーシートを150℃
で10分間プレスした後、切り込みを入れ2枚のシート
が剥離してしまうかどうか確認した。 ○:シートが完全に融着しているもの △:シートが一部剥離してしまったが使用できるレベル
もの ×:シートが完全に剥離してしまったもの (2)耐熱試験:70℃のオーブンにシートを立て掛
け、シートがたわむかどうかを確認した。 ○:たわまなかったもの △:少したわむが使用できるレベルのもの ×:完全にたわんだものEXAMPLES The present invention will be described below by way of examples, which are merely examples, and the present invention is not limited to these examples. << Preparation of Oversheet >> The extruding method was applied to the fusion layer A and the heat-resistant layer B shown in Table 1 at the composition ratios shown in Table 2.
A multilayer sheet was created. << Preparation of Core Sheet >> After pellets having the composition shown in Table 3 were prepared, they were extruded into a sheet. The thickness of the sheet is 50
It was set to 0 μm. << Examples and Comparative Examples >> Using the prepared oversheet and core sheet, tests of the fusing property and heat resistance were performed. Table 4 shows the results. Various evaluations were performed based on the following. (1) Fusing property: A copolymer polyester resin core sheet obtained by substituting 30 mol% of an ethylene glycol component of a polyethylene terephthalate resin with cyclohexane dimethanol and an oversheet prepared at a ratio of Table 4 at 150 ° C.
After pressing for 10 minutes, a cut was made and it was confirmed whether or not the two sheets were peeled off. ○: Sheet completely fused △: Sheet partially peeled but usable level ×: Sheet completely peeled (2) Heat resistance test: 70 ° C. oven We leaned the sheet and checked whether the sheet flexed. :: Undeflected △: Slightly deflected but usable level ×: Completely deflected
【0018】表中の記号は、以下の通りである。 (1)PETG樹脂−1:ポリエチレンテレフタレート
樹脂においてエチレングリコール成分の30モル%をシ
クロヘキサンジメタノールに置換した共重合ポリエステ
ル樹脂。(Tg=69℃) (2)PETG樹脂−2:ポリエチレンテレフタレート
樹脂においてエチレングリコール成分の5モル%をシク
ロヘキサンジメタノールに置換した共重合ポリエステル
樹脂。(Tg=85℃) (3)PETG樹脂−3:ポリエチレンテレフタレート
樹脂においてエチレングリコール成分の80モル%をシ
クロヘキサンジメタノールに置換した共重合ポリエステ
ル樹脂。(Tg=88℃) (4)PC樹脂−1:ポリカーボネート樹脂(Tg=1
20℃) (5)PC樹脂−2:ポリカーボネート樹脂(Tg=1
35℃) (6)タルク : 平均粒子径2.75(MW HS−
T 林化成(株)製) (7)ゴム状弾性体 : MBS樹脂(B−56 鐘淵
化学製)The symbols in the table are as follows. (1) PETG resin-1: A copolymerized polyester resin obtained by substituting 30 mol% of an ethylene glycol component in a polyethylene terephthalate resin with cyclohexanedimethanol. (Tg = 69 ° C.) (2) PETG resin-2: A copolymerized polyester resin in which 5 mol% of an ethylene glycol component in a polyethylene terephthalate resin is substituted with cyclohexanedimethanol. (Tg = 85 ° C.) (3) PETG resin-3: A copolymerized polyester resin in which 80 mol% of an ethylene glycol component in a polyethylene terephthalate resin is substituted with cyclohexanedimethanol. (Tg = 88 ° C.) (4) PC resin-1: polycarbonate resin (Tg = 1
(20 ° C.) (5) PC resin-2: polycarbonate resin (Tg = 1)
(35 ° C) (6) Talc: average particle size 2.75 (MW HS-
T Hayashi Kasei Co., Ltd.) (7) Rubber-like elastic material: MBS resin (B-56, manufactured by Kanegafuchi Chemical)
【0019】[0019]
【表1】 [Table 1]
【0020】[0020]
【表2】 [Table 2]
【0021】[0021]
【表3】 [Table 3]
【0022】[0022]
【表4】 [Table 4]
【0023】[0023]
【発明の効果】本発明のポリエステル系樹脂シートによ
れば、接着剤及び接着層を使用することなく低コストで
品質の安定したカードを得ることができる。According to the polyester resin sheet of the present invention, it is possible to obtain a low-cost, stable card of high quality without using an adhesive or an adhesive layer.
Claims (3)
レングリコール成分10〜70モル%をシクロヘキサン
ジメタノールに置換してなる共重合ポリエステル70〜
100重量部とポリカーボネート樹脂30〜0重量部か
らなる樹脂100重量部に無機充填剤0〜25重量部、
ゴム性弾性体0〜15重量部を配合した樹脂組成物から
なるコアシートに対し、ポリエチレンテレフタレート樹
脂のエチレングリコール成分の10〜70モル%をシク
ロヘキサンジメタノールに置換してなる共重合ポリエス
テルである融着層と、ポリカーボネート樹脂である耐熱
層を積層してなる多層シートをオーバーシートとして使
用したことを特徴とするカード。1. A copolymer polyester obtained by substituting 10 to 70 mol% of an ethylene glycol component of a polyethylene terephthalate resin with cyclohexanedimethanol.
100 parts by weight of a resin consisting of 100 parts by weight and 30 to 0 parts by weight of a polycarbonate resin, 0 to 25 parts by weight of an inorganic filler,
A copolymer polyester obtained by substituting 10 to 70 mol% of an ethylene glycol component of a polyethylene terephthalate resin with cyclohexane dimethanol to a core sheet made of a resin composition containing 0 to 15 parts by weight of a rubber elastic body. A card using a multilayer sheet formed by laminating a heat-resistant layer, which is a polycarbonate resin, as an oversheet.
成比率が5:95〜50:50である請求項1記載のカ
ード。2. The card according to claim 1, wherein the thickness constituting ratio of the fusion layer and the heat-resistant layer of the multilayer sheet is from 5:95 to 50:50.
ン以上である請求項1または2記載のカード。3. The card according to claim 1, wherein the heat-resistant layer of the multilayer sheet has a thickness of 50 μm or more.
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