JP2003118057A - Heat-resistant card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat-resistant card having self-fusion properties and heat resistance of 90 deg.C or higher, low in cost and having stable quality. SOLUTION: The heat-resistant card is constituted by using a multilayered sheet, which has at least one fusion layer comprising 5-100 pts.wt. of a copolyester obtained by substituting 10-70 mol% of the ethylene glycol component of a polyethylene terephthalate resin with cyclohexanedimethanol and 95-0 pts.wt. of a resin having a glass transition point higher than that of the copolyester and at least one heat-resistant layer comprising a resin alone with a glass transition point of 90 deg.C or higher or a resin mixture, on a core sheet comprising a resin composition, which is prepared by compounding 5-25 pts.wt. of an inorganic fillers, 5-20 pts.wt. of a rubbery elastomer and 5-20 pts.wt. of titanium oxide with 100 pts.wt. of a resin comprising 69-40 pts.wt. of the copolyester obtained by substituting 10-70 mol% of the ethylene glycol component of the polyethylene terephthalate resin with cyclohexanedimethanol and 31-60 pts.wt. of a polycarbonate resin, as an oversheet.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card such as an IC card or a magnetic stripe card, which is manufactured by stacking a core sheet and an oversheet and has an IC chip or the like mounted therein. Further, the present invention relates to a card having heat resistance characteristics that can be used in ETC or the like.

[0002]

2. Description of the Related Art Generally, a card material is composed of a white colored center layer called a core sheet and a transparent oversheet laminated on the surface of the core sheet and covered on the back surface of the card as a pair. It For the fusion bonding of the laminated surfaces of the core sheet and the oversheet, dry lamination via heat fusion or press fusion using a heat fusion adhesive is used.

Vinyl chloride sheets have been generally used for these card sheets, but in recent years, there has been a tendency to avoid polyvinyl chloride resins due to the problem of incineration. In addition, the standard endurance temperature of a card that can be used with ETC is 90 ° C, and there is a problem that the card may bend or dent. As a substitute for polyvinyl chloride resin, polyethylene terephthalate resin, which is an olefinic resin, and copolyester resin obtained by replacing the ethylene glycol component of polyethylene terephthalate resin with cyclohexanedimethanol are rapidly coming to the market. There is.

However, the polyethylene terephthalate resin has poor heat-sealing characteristics and cannot be produced by press-sealing using a heat-sealing adhesive. Therefore, the heat-sealing adhesive is applied to the oversheet, but it takes man-hours and costs. Further, the copolyester resin obtained by substituting the ethylene glycol component of the polyethylene terephthalate resin with cyclohexanedimethanol has insufficient heat resistance similarly to the vinyl chloride resin and has a high temperature (90
There was a problem that the card was bent or dented at (℃).

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a card which has self-fusing property and heat resistance of 90 ° C. or higher and which has stable quality at a low cost.

[0006]

Means for Solving the Problems As a result of intensive investigations to solve the above-mentioned problems, the inventors of the present invention applied a specific blending formulation with a multilayer sheet having at least one fusion layer and a heat-resistant layer. We have found that the problem can be solved by using the core sheet. That is, the present invention is that the ethylene glycol component of polyethylene terephthalate resin is 10 to 70 mol%.
5 to 25 parts by weight of an inorganic filler, 5 to 20 parts by weight of a rubber elastic body, 100 to 100 parts by weight of a resin composed of 69 to 40 parts by weight of a copolyester resin obtained by substituting cyclohexanedimethanol for 31 to 60 parts by weight of a polycarbonate resin. Part, 5 to 20 parts by weight of titanium oxide, and 10 to 70 mol% of the ethylene glycol component of the polyethylene terephthalate resin are replaced with cyclohexane dimethanol for the core sheet made of the resin composition.
To 100 parts by weight and a fusion layer composed of 95 to 0 parts by weight of a resin having a glass transition point higher than that of the copolyester resin, and a resin simple substance or a resin mixture having a glass transition point of 90 ° C. or more and having a thickness. A heat-resistant card comprising at least one heat-resistant layer having a thickness of 50 microns or more and using a multilayer sheet having a thickness composition ratio of the fusion layer and the heat-resistant layer of 5:95 to 50:50 as an oversheet. Is. More preferably, the resin having a glass transition point of 90 ° C. or higher is at least one selected from the group consisting of polycarbonate resin, polybutylene terephthalate resin, polyethylene naphthalate resin, and poly-1,4-cyclohexanedimethylene terephthalate resin. Alternatively, it is a card using a multilayer sheet of two or more kinds as an oversheet.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The copolyester resin used in the present invention is a polyethylene terephthalate resin in which 10 to 70 mol% of the ethylene glycol component is replaced with cyclohexanedimethanol. If the amount of substitution is less than 10 mol%, the heat fusion property is poor and the elastic modulus of the sheet after fusion is lowered. This is because, since the polyethylene terephthalate resin is a crystalline resin, the re-crystallization of the sheet progresses during cooling after fusion, the heat fusion property disappears, and the elastic modulus of the sheet decreases. On the contrary, when the substitution amount of the ethylene glycol component exceeds 70 mol%, the elastic modulus of the copolyester resin is lowered and the heat fusion property is lowered. This is because when the amount of replacement of the copolyester resin is large, recrystallization is accelerated and the heat fusion property is lost.

That is, 10 to 7 of the ethylene glycol component
By substituting 0 mol% of cyclohexanedimethanol, the copolyester resin becomes a non-crystalline resin, has thermal fusion bonding property, and the elastic modulus of the sheet does not decrease. Therefore, the substitution amount of the cyclohexanedimethanol of the ethylene glycol component is preferably 10 to 70 mol%, and more preferably 20 to 35 mol%.

The resin having a glass transition point (Tg) of 90 ° C. or higher used in the present invention includes polycarbonate resin, polybutylene terephthalate resin, polyethylene naphthalate resin, poly-1,4-cyclohexanedimethylene terephthalate resin and the like. preferable. The polycarbonate resin is a resin obtained by various polymerization methods such as a phosgene method (solvent method) and a transesterification method (melting method).

Polybutylene terephthalate resin is a polyester produced by substituting tetramethylene glycol for ethylene glycol in the production of polyethylene terephthalate resin. Polyethylene naphthalate resin is a polyester produced by replacing terephthalic acid or dimethyl terephthalate in the production of polyethylene terephthalate resin with naphthalene dicarboxylic acid or dimethyl naphthalene dicarboxylate. Poly-1,4-cyclohexane dimethylene terephthalate resin is a polyester produced by replacing cyclohexane dimethanol in place of ethylene glycol in the production of polyethylene terephthalate resin.

The fusing layer used in the present invention comprises 10 to 10 parts of the ethylene glycol component of the polyethylene terephthalate resin.
A resin having a glass transition point higher than that of the copolyester resin and 5 to 100 parts by weight of the copolyester resin obtained by substituting 70 mol% of cyclohexanedimethanol.
~ 0 parts by weight of the composition. 10-70 of ethylene glycol component of polyethylene terephthalate resin
If the amount of the copolymerized polyester resin obtained by substituting mol% by cyclohexanedimethanol is less than 5 parts by weight, the fusion-bonding property is deteriorated and it is not suitable for producing a card.

The heat-resistant layer used in the present invention comprises a resin simple substance or a resin mixture having a glass transition point of 90 ° C. or higher. When a resin alone or a resin mixture having a Tg of less than 90 ° C. is used, there is a problem that the card is bent at 90 ° C. The multilayer sheet of the present invention has a constitution having at least one fusion bonding layer and at least one heat-resistant layer. The thickness composition ratio of the fusion layer and the heat resistant layer is preferably in the range of 5:95 to 50:50. When the ratio of the fusion layer is less than 5, the fusion property is deteriorated, and when it exceeds 50, the heat resistance is deteriorated. The heat-resistant layer of the multilayer sheet preferably has a thickness of 50 μm or more. If it is less than 50 microns, the heat resistance will be insufficient and the card will be bent.

The core sheet used in the present invention comprises an ethylene glycol component of polyethylene terephthalate resin 10 to 10
5 to 25 parts by weight of an inorganic filler, 100 parts by weight of a resin composed of 69 to 40 parts by weight of a copolyester resin obtained by substituting 70 mol% of cyclohexanedimethanol and 31 to 60 parts by weight of a polycarbonate resin, and a rubber elastic body 5 ~ 20
It is a resin composition containing 5 parts by weight of titanium oxide and 5 to 20 parts by weight of titanium oxide. When the blending amount of the polycarbonate resin is less than 31 parts by weight, heat resistance of 90 ° C. or higher cannot be obtained, and defects such as bending and denting occur. On the other hand, if it exceeds 60 parts by weight, impact properties and the like are deteriorated and the card becomes brittle.

When the amount of the inorganic filler is less than 5 parts by weight, the warp of the card becomes large when the card is formed and then embossed. On the other hand, if it exceeds 25 parts by weight, the compatibility with the resin deteriorates, the impact strength decreases, and the card becomes brittle. If the rubber elastic body is less than 5 parts by weight, the impact property is deteriorated and the card becomes brittle. Further, if it exceeds 20 parts by weight, the heat resistance is lowered, which is not preferable.

When titanium oxide is less than 5 parts by weight, IC
There are problems that the hiding property of the chips and the like is lowered and the chips are transparent, and that the warp of the card after embossing becomes large. If it exceeds 20 parts by weight, the compatibility with the resin deteriorates, the impact strength decreases, and the card becomes brittle. Examples of the inorganic filler used in the present invention include talc, mica, calcium carbonate and the like. Above all,
Talc having an average particle diameter of 0.5 to 50 μm is preferable.

The rubber elastic material used in the present invention is an acrylic polymer or methacrylic polymer mainly containing alkyl acrylate or alkyl methacrylate,
Examples thereof include one or more copolymers of a diene polymer mainly containing a conjugated diene such as butadiene and isoprene, and a silicone polymer mainly containing polyorganosiloxane. Further, as the rubber elastic body, methyl methacrylate / butyl acrylate / styrene resin (hereinafter abbreviated as MAS resin), methyl methacrylate / butadiene / styrene resin (hereinafter abbreviated as MBS resin), butyl acrylate / isoprene / styrene resin. Known materials such as (hereinafter abbreviated as MAIS resin) can be used. MBS resin is particularly preferable.

Examples of rubber elastic bodies other than the above include butadiene rubber, styrene-butadiene rubber, acrylonitrile-butadiene-styrene, isobutylene-isoprene rubber, ethylene-propylene rubber, ethylene-propylene-diene rubber, acrylonitrile-butadiene rubber, styrene. -Butadiene-styrene rubber, hydride of styrene-butadiene rubber, styrene-isoprene-
Examples thereof include styrene rubber and hydrides of styrene-isoprene rubber. These rubber elastic bodies may be used alone or in combination of two or more.

The multilayer sheet and core sheet used in the present invention may optionally contain additives usually used, such as compatibilizers, stabilizers, lubricants, reinforcing agents, processing aids, pigments, antistatic agents, and antioxidants. Agents, neutralizing agents, ultraviolet absorbers, dispersants, thickeners, other inorganic fillers, etc., or other synthetic resins may be contained.

In order to process the multilayer sheet and the core sheet used in the present invention into a sheet shape, there are conventionally known calendering method, extrusion method, pressing method, casting method and the like, but not limited thereto.

[0020]

EXAMPLES The present invention will be described below with reference to examples, but these are merely examples and the present invention is not limited thereto. << Preparation of Oversheet >> A fusion-bonding layer and a heat-resistant layer having the compositions shown in Table 1 were extruded at the composition ratios shown in Table 2 to prepare a multilayer sheet having a thickness of 100 μm. << Preparation of Core Sheet >> A pellet having the composition shown in Table 3 was prepared and extruded into a sheet. The thickness of the sheet is 50
It was set to 0 μm.

<< Examples and Comparative Examples >> Using the prepared oversheet and core sheet, tests were conducted for fusion property and heat resistance. The results are shown in Tables 4 and 5. Various evaluations were performed based on the following. (1) Fusing property: A core sheet of a copolyester resin obtained by substituting 30 mol% of ethylene glycol component of polyethylene terephthalate resin with cyclohexane dimethanol and an oversheet prepared at a ratio of Table 4 at 150 ° C.
After pressing for 10 minutes, it was checked whether or not two sheets were peeled off by making a notch. ◯: The sheet is completely fused Δ: The sheet is partially peeled but can be used X: The sheet is completely peeled (2) Heat resistance test: 90 ° C oven The seat was leaned against the seat and it was confirmed whether the seat was bent. ◯: Not bent Δ: Slightly bent but usable level X: Completely bent emboss embossing test: An embosser DC9000 manufactured by Nippon Data Card was used for the embossing test. ◯: No crack was generated by emboss embossing ×: Crack was generated by emboss embossing (4) Warp after emboss embossing: An embosser DC9000 manufactured by Nippon Data Card was used for an embossing test. ◯: The warp after embossing was less than 3 mm ×: The warp after embossing was 3 mm or more

The symbols in the table are as follows. (1) PETG resin-1: A copolymerized polyester resin in which 30 mol% of the ethylene glycol component in the polyethylene terephthalate resin is replaced with cyclohexanedimethanol. (Tg = 81 ° C.) (2) PETG resin-2: Polyethylene terephthalate resin in which 5 mol% of the ethylene glycol component is replaced with cyclohexanedimethanol. (Tg = 85 ° C.) (3) PETG resin-3: Polyethylene terephthalate resin in which 80 mol% of the ethylene glycol component is replaced with cyclohexanedimethanol. (Tg = 88 ° C.) (4) PC resin-1: Polycarbonate resin (Tg = 1
35 ° C.) (5) PBT resin: polybutylene terephthalate resin (Tg = 210 ° C.) (6) PEN resin: polyethylene naphthalate resin (Tg = 120 ° C.) (7) Talc: average particle diameter 2.75 (MW HS-
T Hayashi Kasei Co., Ltd. (8) Rubber-like elastic body: MBS resin (B-56 manufactured by Kanebuchi Kagaku) (9) Titanium oxide: CR-60 (manufactured by Ishihara Sangyo)

[0023]

[Table 1]

[0024]

[Table 2]

[0025]

[Table 3]

[0026]

[Table 4]

[0027]

[Table 5]

[0028]

According to the polyester resin sheet of the present invention, a card of stable quality can be obtained at low cost without using an adhesive and an adhesive layer.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C08L 69/00 C08L 69/00 G06K 19/077 69:00 // (C08L 67/02 21:00 69: 00 G06K 19/00 K 21:00) F-term (reference) 2C005 HA10 JA02 JA26 KA01 KA07 MA11 PA01 PA15 4F100 AA21A AA21H AK01D AK01E AK41A AK41B AK41C AK41J AK42B AK42C AK45A AK45B AK45C AL05A AL05B AL05C AL05D AL05E AL09A BA05 BA06 BA15 CA23A GB71 JA05B JA05C JJ03 JJ03D JJ03E YY00A YY00B YY00C 4J002 AC033 AC063 AC073 BB153 BN123 BN143 BN163 BP013 CF05W CF06W CG00X DE136 DE237 DJ047 DJ057 FD017 GS00 5B035 AA07 BA03 BB02 BB09 CA01

Claims (2)

[Claims] 1. A copolyester resin 6 obtained by substituting 10 to 70 mol% of an ethylene glycol component of a polyethylene terephthalate resin with cyclohexane dimethanol.
5 to 25 parts by weight of inorganic filler, 5 to 20 parts by weight of rubber elastic body, 5 to 20 parts of titanium oxide in 100 parts by weight of resin consisting of 9 to 40 parts by weight and polycarbonate resin 31 to 60 parts by weight
For a core sheet made of a resin composition mixed by weight,
5 to 100 parts by weight of a copolyester resin obtained by substituting 10 to 70 mol% of the ethylene glycol component of the polyethylene terephthalate resin with cyclohexanedimethanol, and 95 to 0 parts by weight of a resin having a glass transition point higher than that of the copolyester. And a heat-resistant layer having a glass transition point of 90 ° C. or higher and a resin mixture or resin mixture having a glass transition point of 90 ° C. or more and having a thickness of 50 μm or more, and a thickness composition ratio between the fusion-bonding layer and the heat-resistant layer. Is 5: 9
A heat-resistant card characterized by using a multilayer sheet of 5 to 50:50 as an oversheet. 2. A resin having a glass transition point higher than that of the copolyester resin is selected from the group consisting of a polycarbonate resin, a polybutylene terephthalate resin, a polyethylene naphthalate resin and a poly-1,4-cyclohexanedimethylene terephthalate resin. The heat resistant card according to claim 1, which is at least one kind or two or more kinds.