JP2002103067A - Method for laser beam cutting - Google Patents

Method for laser beam cutting

Info

Publication number
JP2002103067A
JP2002103067A JP2000302151A JP2000302151A JP2002103067A JP 2002103067 A JP2002103067 A JP 2002103067A JP 2000302151 A JP2000302151 A JP 2000302151A JP 2000302151 A JP2000302151 A JP 2000302151A JP 2002103067 A JP2002103067 A JP 2002103067A
Authority
JP
Japan
Prior art keywords
laser
cutting
work
laser beam
assist gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000302151A
Other languages
Japanese (ja)
Other versions
JP4186403B2 (en
Inventor
Takeshi Kasai
彪 葛西
Shinobu Numata
忍 沼田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP2000302151A priority Critical patent/JP4186403B2/en
Publication of JP2002103067A publication Critical patent/JP2002103067A/en
Application granted granted Critical
Publication of JP4186403B2 publication Critical patent/JP4186403B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

PROBLEM TO BE SOLVED: To realize an excellent laser beam cutting of a metallic structural body which is an assembly of thin plates or bars and has gaps between individual elements by optimizing parameters of machining condition and suppressing the generation of a self-burning phenomenon. SOLUTION: In a method for a laser beam cutting, a work 4, which is a metallic structural body which is an assembly of thin plates 4a or bars and has gaps 4b between individual elements, is cut by being irradiated with a laser beam 10 while an assist gas 9 is blown upon the work through a machining torch 3 in which a conversion lens 3a is built up, the cutting is performed by reciprocatively scanning several times the laser beam with respect to the work in the cutting direction. In this case, the focal point O of the conversion lens is set in the inner side of the work, and the parameters are so varied that the input power of the laser beam per a unit length of cutting and the supplying amount of the assist gas is gradually increased in accordance with the progress of the reciprocal scanning.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、例えば原子炉設備
の構造廃棄物などのように、薄板,ないし棒材の集合体
で個々の素体相互間に空隙があるような金属構造物を裁
断する場合に適用するレーザ切断加工方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of cutting a metal structure such as a structural waste of a nuclear reactor facility, which is an assembly of thin plates or rods and has a gap between individual elements. The present invention relates to a laser cutting method applied to the case.

【0002】[0002]

【従来の技術】レーザビームを使って鋼材などの金属構
造物(ワーク)を切断する加工方法として、レーザ発振
器から出力したレーザビームを集光レンズを通してワー
クの表面に照射し、かつレーザ照射面にアシストガス
(酸素)を吹き付けながらワークを切断方向に移動さ
せ、レーザビームのエネルギーとアシストガスとの酸化
反応熱を利用してワークの照射地点を溶融させ、その溶
融物,蒸発物をアシストガスにより飛散させて切断する
加工方法が周知である。
2. Description of the Related Art As a processing method of cutting a metal structure (work) such as a steel material using a laser beam, a laser beam output from a laser oscillator is irradiated on a surface of the work through a condenser lens, and is irradiated on a laser irradiation surface. The work is moved in the cutting direction while blowing assist gas (oxygen), and the irradiation point of the work is melted using the energy of the laser beam and the heat of oxidation reaction of the assist gas. A processing method of scattering and cutting is well known.

【0003】ここで、レーザ切断に用いるレーザ加工装
置の概要を図2に示す。図2において、1はレーザ発振
器、2はミラー、3は加工トーチ(レーザヘッド)、4
はワーク、5はワーク4を載置した移動テーブル、6は
アシストガスボンベ、7は流量制御弁、8は制御部であ
る。また、加工トーチ3は集光レンズ3aを内蔵し、先
端のノズル3bを通じてワーク4にレーザビーム9を照
射する。また、アシストガスボンベ6から供給したアシ
ストガス10は流量制御弁7を通じてガス入口3cより
加工トーチ3の内部に導入し、先端のノズル3bを通じ
てワークに吹き付けられる。そして、レーザ発振器1の
出力,移動テーブル5で設定するワーク4の切断速度,
および流量制御弁7で設定するアシストガスの供給量な
どは制御部8にて設定,制御する。なお、レーザ発振器
1がYAGレーザである場合には、ミラー2を使わずに
レーザ発振器1と加工トーチ3との間を柔軟性に富む光
ファイバを接続してレーザビームの伝送を行うことが可
能である。
FIG. 2 shows an outline of a laser processing apparatus used for laser cutting. In FIG. 2, 1 is a laser oscillator, 2 is a mirror, 3 is a processing torch (laser head), 4
Denotes a work table, 5 denotes a moving table on which the work 4 is placed, 6 denotes an assist gas cylinder, 7 denotes a flow control valve, and 8 denotes a control unit. Further, the processing torch 3 has a built-in condenser lens 3a and irradiates the work 4 with the laser beam 9 through the nozzle 3b at the tip. Further, the assist gas 10 supplied from the assist gas cylinder 6 is introduced into the inside of the processing torch 3 from the gas inlet 3c through the flow control valve 7, and is blown to the work through the nozzle 3b at the tip. Then, the output of the laser oscillator 1, the cutting speed of the work 4 set on the moving table 5,
The controller 8 sets and controls the supply amount of the assist gas set by the flow control valve 7 and the like. When the laser oscillator 1 is a YAG laser, it is possible to transmit a laser beam by connecting a flexible optical fiber between the laser oscillator 1 and the processing torch 3 without using the mirror 2. It is.

【0004】また、図3はレーザ切断加工の基本とし
て、板厚の厚い金属のバルク材をワークとして、図2の
レーザ加工装置を用いてレーザ切断する場合に、ワーク
と加工トーチとの関係のパラメータを表した模式図であ
り、図中でgは加工トーチ3のノズル3bとワーク4と
の間の距離、Oは集光レンズ3aの焦点位置、fは焦点
距離、fdはワーク表面を基準としたデフォーカス距離
を表している。
FIG. 3 shows the relationship between the work and the processing torch when the laser cutting is performed by using the laser processing apparatus shown in FIG. FIG. 4 is a schematic diagram showing parameters, where g is the distance between the nozzle 3b of the processing torch 3 and the work 4, O is the focal position of the condenser lens 3a, f is the focal length, and fd is based on the work surface. Defocus distance.

【0005】ここで、板厚50mmのステンレス鋼(バ
ルク材)を切断する場合に、その加工条件として、レー
ザ発振器(パルスYAGレーザ)の平均出力:2kW、
パルス幅:9.5ms、周波数:10Hz、デフォーカ
ス距離fd:±3mm以下、切断速度:100mm/m
in、アシストガスに酸素を使用して加工トーチ内のガ
ス圧が0.3MPaとなるように設定してレーザ切断を
行うことにより、ワーク4はセルフバーニング現象の発
生もなく,かつ切断面においても平行なドラグラインが
得られるように切断できる。また、切断部のカーフ幅は
ワーク4の表面に照射したレーザビームのスポット径に
対応してワーク表面から裏面までほぼ同じ幅で切断され
ている。これは、レーザビームが焦点位置Oで最小スポ
ット径に収束した後に、ワークの切断面で反射を繰り返
しながらジグザグに奥に進行するために、そのビーム径
はレーザが直進する場合のようには広がらず、この結果
として切断部におけるカーフ幅の末広がりが抑えられる
ものと考えられている。
[0005] Here, when cutting stainless steel (bulk material) having a thickness of 50 mm, the processing conditions include an average output of a laser oscillator (pulsed YAG laser): 2 kW,
Pulse width: 9.5 ms, frequency: 10 Hz, defocus distance fd: ± 3 mm or less, cutting speed: 100 mm / m
In, by using oxygen as an assist gas and performing laser cutting while setting the gas pressure in the processing torch to be 0.3 MPa, the work 4 does not have a self-burning phenomenon, and the workpiece 4 can be cut even at the cut surface. Can be cut to obtain parallel drag lines. In addition, the kerf width of the cut portion is cut at substantially the same width from the front surface to the back surface of the work 4 corresponding to the spot diameter of the laser beam applied to the front surface of the work 4. This is because, after the laser beam converges to the minimum spot diameter at the focal position O, it travels in a zigzag manner while repeatedly reflecting on the cut surface of the work, so that the beam diameter spreads as in the case where the laser goes straight. However, it is considered that as a result, the end of the kerf width at the cutting portion is suppressed.

【0006】[0006]

【発明が解決しようとする課題】ところで、頭記した原
子炉設備の構造廃棄物などのように、薄板,ないし棒材
の集合体で個々の素体相互間に空隙がある金属構造物を
レーザ切断する場合には次に記すような問題がある。す
なわち、図4で示すように板厚が5〜6mm程度である
ステンレス鋼の薄板4aを空隙4bを隔てて複数枚積層
した金属構造物(総厚さは図3のバルク材と同程度)を
ワーク4として、図3で述べたバルク材の切断と同じ加
工条件でレーザ切断を行ったところ、セルフバーニング
現象が発生し、ワーク4に大きな爆発穴が生じて切断面
が不整いになるほか、アシストガスの機能が十分に働か
ないで良好な切断が行えないことが判明した。また、丸
棒の集合体になる金属構造物をレーザ切断した場合に
も、前記と同じようにセルフバーニング現象が発生して
適正に切断できないことが確認されている。
By the way, a metal structure such as a structural waste of a nuclear reactor facility, which is a collection of thin plates or rods and having a gap between individual elements, is referred to as a laser. When cutting, there are the following problems. That is, as shown in FIG. 4, a metal structure in which a plurality of stainless steel thin plates 4a each having a thickness of about 5 to 6 mm are laminated with a gap 4b therebetween (total thickness is substantially the same as the bulk material in FIG. 3) When laser cutting was performed as the work 4 under the same processing conditions as the cutting of the bulk material described in FIG. 3, a self-burning phenomenon occurred, a large explosion hole was formed in the work 4, and the cut surface became irregular. It was found that good cutting could not be performed because the function of the assist gas did not work sufficiently. In addition, it has been confirmed that even when a metal structure that is to be an aggregate of round bars is laser-cut, a self-burning phenomenon occurs similarly to the above, and it cannot be cut properly.

【0007】前記したセルフバーニング現象の発生は次
のような点に原因がある考えられる。すなわち、ワーク
4を構成している個々の薄板4a,あるいは細い丸棒は
図3に示した板厚の厚いバルク材と比べて熱容量が遙に
小さく、かつその相互間には空隙4bが存在する。この
ために、あらかじめ設定した加工条件でワーク4の表面
側に高パワーなレーザビームを照射し、かつここにアシ
ストガスとして酸素が吹き付けられると、レーザビーム
とアシストガスの酸化反応熱のトータルエネルギーが過
剰となってワークの表面に並んでいる薄板,丸棒の切断
箇所に爆発的な燃焼が生じ、かつこの燃焼が周囲に波及
していくものと推定される。また、ワークの内部には空
隙が存在するために切断地点に吹き付けたアシストガス
が空隙に逸散してしまい、アシストガスとしての機能が
十分に果たせなくなる。
The occurrence of the self-burning phenomenon is considered to be caused by the following points. That is, the individual thin plates 4a or the thin round bars constituting the work 4 have a much smaller heat capacity than the thick bulk material shown in FIG. 3, and a gap 4b exists between them. . For this reason, when a high-power laser beam is irradiated to the surface side of the work 4 under the previously set processing conditions, and oxygen is blown as an assist gas, the total energy of the oxidation reaction heat of the laser beam and the assist gas is reduced. It is presumed that explosive combustion occurs at the cut portions of the thin plates and round bars arranged in excess on the surface of the work, and the combustion spreads to the surroundings. In addition, since the gap exists inside the work, the assist gas blown to the cutting point escapes to the gap, and the function as the assist gas cannot be sufficiently performed.

【0008】本発明は上記の点に鑑みなされたものであ
り、薄板,ないし棒材の集合体で個々の素体相互間に空
隙がある金属構造物をワークとしてレーザ切断を行う場
合に、その加工条件として各種パラメータを適正化し、
セルフバーニング現象の発生を押さえて良好に切断でき
るようにしたレーザ切断加工方法を提供することを目的
とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and is intended for use in a case where laser cutting is performed using a metal structure having a gap between individual elements in a set of thin plates or rods as a work. Optimize various parameters as processing conditions,
It is an object of the present invention to provide a laser cutting method capable of satisfactorily cutting by suppressing the occurrence of a self-burning phenomenon.

【0009】[0009]

【課題を解決するための手段】上記目的を達成するため
に、本発明によれば、薄板,ないし棒材の集合体で個々
の素体相互間に空隙がある金属構造物ワークとして、該
ワークに加工トーチを通じてアシストガスを吹き付けつ
つ、同時にレーザビームを照射してワークを切断するレ
ーザ切断加工方法において、ワークに対しレーザビーム
を切断方向に沿って複数回繰り返し往復走査させ、かつ
このレーザ走査行程の進行に合わせてレーザの単位切断
長当たりの投入パワーを当初に設定した低めの値から漸
次増加させていく(請求項1)ものとし、その実施態様
として、前記のレーザ走査行程の進行に合わせてワーク
の切断速度を漸次遅くする(請求項2)、もしくはレー
ザ出力を漸次高めるようにする(請求項3)。
According to the present invention, in order to achieve the above object, according to the present invention, a metal structure work having a gap between individual elements in an aggregate of thin plates or bars is provided. In a laser cutting method for cutting a work by irradiating a laser beam at the same time while blowing an assist gas through a processing torch, the work is repeatedly reciprocally scanned with a laser beam in a cutting direction a plurality of times, and the laser scanning process The input power per unit cutting length of the laser is gradually increased from the initially set lower value in accordance with the progress of the laser scanning (Claim 1). Thus, the cutting speed of the work is gradually reduced (claim 2) or the laser output is gradually increased (claim 3).

【0010】薄板,ないしは棒材の集合体からなる金属
構造物をワークとしてレーザ切断加工する際に、レーザ
加工条件のパラメータを前記のように設定することによ
り、切断開始から終了までにセルフバーニング現象が発
生せずに安定した切断が行える。すなわち、最初の走査
行程ではワークの表面に照射するレーザの投入パワーを
低めに抑えているので、熱容量の小さな薄板,あるいは
細い丸棒に加わるレーザビームのエネルギーが過剰にな
ることがなく、これによりセルフバーニング現象の発生
が抑制される。また、レーザビーム走査行程の進行に合
わせてレーザの投入パワーを漸次増加させることによ
り、ワーク内方の空隙に散乱するレーザビームの損失分
を補ってワークを構成している個々の薄板,ないしは棒
材を確実に切断することができる。
When a metal structure composed of an aggregate of thin plates or rods is laser-cut as a work, the parameters of the laser processing conditions are set as described above, so that the self-burning phenomenon occurs from the start to the end of cutting. Stable cutting can be performed without generation of cracks. That is, in the first scanning step, the input power of the laser for irradiating the surface of the work is suppressed to a low level, so that the energy of the laser beam applied to the thin plate having a small heat capacity or the thin round bar does not become excessive. The occurrence of the self-burning phenomenon is suppressed. Further, by gradually increasing the input power of the laser in accordance with the progress of the laser beam scanning process, the individual thin plates or rods constituting the work are compensated for by the loss of the laser beam scattered in the gap inside the work. The material can be cut reliably.

【0011】また、本発明によれば、前記の加工条件と
併せて、次記のような方法を併用することで、より安定
したレーザ切断加工が行える。 (1) レーザ走査の進行に合わせてアシストガスの供給量
を漸次増加させていき、ワーク内部で薄板,ないし細い
棒材の間の空隙にガスが逸散する分を補ってレーザ切断
に関与するアシストガスの機能を確保するようにする
(請求項4)。
According to the present invention, more stable laser cutting can be performed by using the following method in combination with the above processing conditions. (1) Increasing the supply amount of assist gas gradually with the progress of laser scanning, participating in laser cutting by compensating for the amount of gas escaping into the gap between thin plates or thin rods inside the work The function of the assist gas is ensured (claim 4).

【0012】(2) 加工トーチに組み込んだ集光レンズの
焦点位置をワークの内部にデフォーカスして設定し、ワ
ークの裏面に至るまでの照射範囲でレーザビームのスポ
ット径が広がるのをできるだけ小さく抑えて切断部のカ
ーフ幅が不要に拡大するのを防ぐようにする。(請求項
5)。
(2) The focal position of the condenser lens incorporated in the processing torch is set by defocusing inside the work, and the spot diameter of the laser beam is made as small as possible within the irradiation range up to the back surface of the work. The kerf width of the cutting portion is prevented from unnecessarily expanding. (Claim 5).

【0013】[0013]

【発明の実施の形態】以下、本発明の実施の形態を図
1,図2を基に説明する。なお、図1において図3に対
応する部材には同じ符号を付してその詳細な説明は省略
する。図1は板厚6.5mmのステンレス鋼薄板4aを
空隙4bを隔てて積層した総厚さ60mmの集合体をワ
ーク4としてレーザ切断加工する場合の状態を模式図と
して表したものであり、この実施例では加工条件として
各種パラメータを次のように設定する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In FIG. 1, members corresponding to those in FIG. 3 are denoted by the same reference numerals, and detailed description thereof will be omitted. FIG. 1 is a schematic diagram showing a state in which a laser cutting process is performed as a work 4 using an aggregate having a total thickness of 60 mm in which a stainless steel thin plate 4 a having a thickness of 6.5 mm is stacked with a gap 4 b therebetween. In the embodiment, various parameters are set as processing conditions as follows.

【0014】すなわち、レーザ発振器(パルスYAGレ
ーザ)1の平均出力を2kWとして、加工トーチ3の集
光レンズ3aを通じてワーク4に照射するレーザビーム
9の焦点位置Oをワーク4の表面から内方に11mmほ
ど入り込んだ位置にデフォーカスして設定する。また、
ワーク4へのレーザ照射は8回に分けて繰り返し往復走
査するものとし、その往復走査の進行に合わせて切断速
度を2,000mm/minから開始し、最終の走査行
程では500mm/minまで遅くするように制御して
単位切断長当たりの投入パワーを段階的に増加させるよ
うにする。さらに、アシストガス(酸素)についても、
当初は加工トーチ3の内圧を0.05MPaに設定して
往復走査の進行に合わせて段階的に増加させ、最終走査
行程では0.1MPaとなるように流量制御弁7(図2
参照)を制御する。
That is, assuming that the average output of the laser oscillator (pulse YAG laser) 1 is 2 kW, the focal position O of the laser beam 9 irradiating the work 4 through the condenser lens 3 a of the processing torch 3 is moved inward from the surface of the work 4. It is set by defocusing to a position where it enters about 11 mm. Also,
The laser irradiation on the workpiece 4 is repeated reciprocally scanning in eight times, and the cutting speed is started from 2,000 mm / min in accordance with the progress of the reciprocating scanning, and is reduced to 500 mm / min in the final scanning stroke. In this way, the input power per unit cutting length is increased stepwise. Furthermore, for assist gas (oxygen),
Initially, the internal pressure of the processing torch 3 is set to 0.05 MPa, and is gradually increased in accordance with the progress of the reciprocating scanning. The flow control valve 7 (FIG.
Control).

【0015】上記の切断方法により、図1に示した薄板
4aの積層集合体としてなるワーク4を、セルフバーニ
ングの発生がなく、かつ均一なカーフ幅で表面から裏面
まで良好に切断できることが確認されている。なお、上
記したパラメータの設定数値はあくまでも一例であり、
適用するワークの材質,板厚などの条件に合わせて最適
値に調整するものとする。
By the above-described cutting method, it was confirmed that the work 4 as the laminated aggregate of the thin plates 4a shown in FIG. 1 can be cut from the front surface to the back surface with no self-burning and with a uniform kerf width. ing. Note that the set values of the above parameters are only examples,
It should be adjusted to the optimum value according to the conditions such as the material and plate thickness of the work to be applied.

【0016】また、ワークの単位切断長当たりの投入パ
ワーを段階的に増加させる手段として、前記実施例では
切断速度を漸次遅くするようにしているが、切断速度を
一定にしてレーザ発振器1のランプ入力を漸次増してレ
ーザ出力を段階的に増加させるようにしてもよい。さら
に、前記実施例ではレーザとしてパルスYAGレーザを
使用したが、他にCWレーザ、あるいはCO2 レーザで
も同様に実施できることは勿論である。
As means for increasing the input power per unit cutting length of the work in a stepwise manner, the cutting speed is gradually reduced in the above-described embodiment. The input may be gradually increased to increase the laser output stepwise. Further, although the pulse YAG laser is used as the laser in the above-described embodiment, it goes without saying that the present invention can be similarly implemented by using a CW laser or a CO 2 laser.

【0017】[0017]

【発明の効果】以上述べたように、本発明のレーザ切断
加工方法を採用することにより、従来の方法ではセルフ
バーニングが発生して良好な切断が行えなかった薄板,
ないし棒材の集合体で個々の素体相互間に空隙がある金
属構造物を、セルフバーニングの発生なしに安定よく切
断することができる。
As described above, by adopting the laser cutting method of the present invention, a thin plate which cannot be cut well due to self-burning in the conventional method.
In addition, a metal structure having a gap between individual element bodies in an aggregate of bar materials can be cut stably without generating self-burning.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例による薄板積層体の金属構造物
をワークとしたレーザ切断加工の状態を表す模式図
FIG. 1 is a schematic view showing a state of laser cutting processing using a metal structure of a thin plate laminate according to an embodiment of the present invention as a work.

【図2】図1のレーザ切断加工に用いるレーザ加工装置
の概要図
FIG. 2 is a schematic diagram of a laser processing apparatus used for laser cutting in FIG. 1;

【図3】従来のレーザ切断加工方法による厚板の切断に
対応した切断条件のパラメータを表す模式図
FIG. 3 is a schematic diagram showing parameters of cutting conditions corresponding to cutting of a thick plate by a conventional laser cutting method.

【図4】従来のレーザ切断加工方法による薄板積層体の
金属構造物をワークとした切断状態を表す模式図
FIG. 4 is a schematic diagram showing a cutting state using a metal structure of a thin plate laminate as a work by a conventional laser cutting method.

【符号の説明】[Explanation of symbols]

1 レーザ発振器 3 加工トーチ 3a 集光レンズ 4 ワーク 4a 薄板 4b 空隙 9 レーザビーム 10 アシストガス DESCRIPTION OF SYMBOLS 1 Laser oscillator 3 Processing torch 3a Condensing lens 4 Work 4a Thin plate 4b Air gap 9 Laser beam 10 Assist gas

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) G21F 9/30 531 G21F 9/30 531D H01S 3/00 H01S 3/00 B // B23K 103:04 B23K 103:04 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) G21F 9/30 531 G21F 9/30 531D H01S 3/00 H01S 3/00 B // B23K 103: 04 B23K 103 : 04

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】薄板,ないし棒材の集合体で個々の素体相
互間に空隙がある金属構造物をワークとして、該ワーク
に加工トーチを通じてアシストガスを吹き付けつつ、レ
ーザビームを照射して切断するレーザ切断加工方法にお
いて、ワークに対してレーザビームを切断方向に沿って
複数回繰り返し往復走査させ、かつこの走査行程の進行
に合わせてレーザの単位切断長当たりの投入パワーを漸
次増加させていくことを特徴とするレーザ切断加工方
法。
1. A metal structure having a gap between individual element bodies, which is an aggregate of thin plates or rods, is used as a workpiece, and is cut by irradiating the workpiece with a laser beam while blowing an assist gas through a processing torch. In the laser cutting method, a workpiece is repeatedly reciprocatedly scanned with a laser beam in a cutting direction a plurality of times, and the input power per unit cutting length of the laser is gradually increased in accordance with the progress of the scanning process. A laser cutting method, comprising:
【請求項2】請求項1記載の切断加工において、レーザ
の投入パワーを増加させる手段として、ワークの切断速
度をレーザ走査行程の進行に合わせて漸次遅くするよう
にしたことを特徴とするレーザ切断加工方法。
2. The laser cutting machine according to claim 1, wherein the means for increasing the input power of the laser is such that the cutting speed of the workpiece is gradually reduced in accordance with the progress of the laser scanning process. Processing method.
【請求項3】請求項1記載の切断加工方法において、レ
ーザの投入パワーを増加させる手段として、レーザ出力
をレーザ走査行程の進行に合わせて漸次高めるようにし
たことを特徴とするレーザ切断加工方法。
3. The laser cutting method according to claim 1, wherein the laser output is gradually increased in accordance with the progress of the laser scanning process as means for increasing the input power of the laser. .
【請求項4】請求項1記載の切断加工方法において、レ
ーザ走査の進行に合わせてアシストガスの供給量を漸次
増加させていくことを特徴とするレーザ切断加工方法。
4. A laser cutting method according to claim 1, wherein the supply amount of the assist gas is gradually increased in accordance with the progress of the laser scanning.
【請求項5】請求項1記載の切断加工方法において、加
工トーチに組み込んだ集光レンズの焦点位置をワークの
内部にデフォーカスして設定したことを特徴とするレー
ザ切断加工方法。
5. A laser cutting method according to claim 1, wherein the focal position of the condenser lens incorporated in the processing torch is set by defocusing the inside of the work.
JP2000302151A 2000-10-02 2000-10-02 Laser cutting method Expired - Fee Related JP4186403B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000302151A JP4186403B2 (en) 2000-10-02 2000-10-02 Laser cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000302151A JP4186403B2 (en) 2000-10-02 2000-10-02 Laser cutting method

Publications (2)

Publication Number Publication Date
JP2002103067A true JP2002103067A (en) 2002-04-09
JP4186403B2 JP4186403B2 (en) 2008-11-26

Family

ID=18783557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000302151A Expired - Fee Related JP4186403B2 (en) 2000-10-02 2000-10-02 Laser cutting method

Country Status (1)

Country Link
JP (1) JP4186403B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014226706A (en) * 2013-05-24 2014-12-08 パナソニック株式会社 Laser cutting device and laser cutting method
WO2016063756A1 (en) * 2014-10-24 2016-04-28 株式会社アマダホールディングス Laser cutting processing method, control device in laser cutting processing machine, and programming device
JP2016068132A (en) * 2014-09-30 2016-05-09 三菱重工業株式会社 Laser cutting method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014226706A (en) * 2013-05-24 2014-12-08 パナソニック株式会社 Laser cutting device and laser cutting method
JP2016068132A (en) * 2014-09-30 2016-05-09 三菱重工業株式会社 Laser cutting method
WO2016063756A1 (en) * 2014-10-24 2016-04-28 株式会社アマダホールディングス Laser cutting processing method, control device in laser cutting processing machine, and programming device
JP2016083675A (en) * 2014-10-24 2016-05-19 株式会社アマダホールディングス Laser cut-off processing method and control unit and programming unit in laser cut-off processing machine
US11235425B2 (en) 2014-10-24 2022-02-01 Amada Holdings Co., Ltd. Laser cutting processing method

Also Published As

Publication number Publication date
JP4186403B2 (en) 2008-11-26

Similar Documents

Publication Publication Date Title
JP3978066B2 (en) Laser processing equipment
JP6064228B2 (en) Laser cutting apparatus and laser cutting method
WO2003024658A1 (en) Work welding method
WO2002066197A1 (en) Laser processing device and processing method
EP1483812A1 (en) Methods and systems for laser processing a workpiece and methods and apparatus for controlling beam quality therein
CN111151892B (en) Non-taper laser cutting method
WO2003004210B1 (en) Method of ablating an opening in a hard, non-metallic substrate
JP2008515643A (en) Hard material processing apparatus and processing method using laser having irradiance in the range of 106 to 109 Wcm-2 and repetition rate in the range of 10 to 50 kHz
JP2009012061A (en) Laser-beam working machine
JP2004154813A (en) Laser beam machining method and device
JP2002103067A (en) Method for laser beam cutting
Westphäling Pulsed Fiber Lasers from ns to ms range and their applications
JP4925616B2 (en) Piercing method and laser processing apparatus
JP2005118849A (en) Laser beam machining device
JP2003311459A (en) Laser beam surface machining device
JP2003285186A (en) Laser beam machining device
JP7290239B1 (en) LASER CUTTING METHOD AND LASER CUTTING APPARATUS
JP3436861B2 (en) Laser cutting method and apparatus for steel sheet
EP4234150A1 (en) Laser cutting method and machine
Rath Lasers for industrial production processing: Tailored tools with increasing flexibility
JP2004291026A (en) Method and apparatus for drilling hole in brittle material
Brown et al. High-brightness laser cutting & drilling of aerospace materials
JPS59206189A (en) Laser beam cutting device
JPH08118053A (en) Workpiece cutting process
JP3321015B2 (en) Laser cutting method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060215

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20060703

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20060704

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080812

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080819

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080901

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110919

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110919

Year of fee payment: 3

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110919

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110919

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120919

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120919

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130919

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees