JP2002100665A - Suction collet for semiconductor pellet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a suction collet which can easily correct the shift of rotation of a semiconductor pellet, and can always suck the semiconductor pellet in a right position for a suction face. SOLUTION: The suction collet 1 for retaining the semiconductor pellet 3 by suction has a pair of protrusions 16 and 16 placed parallel in the space as same as the width of the semiconductor pellet, or wider than that of the semiconductor pellet 3. A drawing hole 15 is provided between these protrusions 16 and 16. The semiconductor pellet 3 is guided and arbitrarily rotated by contacting both sides of the semiconductor pellet 3 to inside of these protrusions 16 and 16, and resulting the angle of the semiconductor pellet 3 to be adjusted to the right position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adsorption collet used for conveying semiconductor pellets.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor device such as an LED, for example, semiconductor pellets such as LED chips are sucked and held by a suction collet, and the semiconductor pellets are transported between various processing apparatuses. When the semiconductor pellet is sucked and held by the suction collet in this manner, the semiconductor pellet must be sucked in a correct posture in which the rotational displacement of the semiconductor pellet is eliminated with respect to the suction surface at the tip of the suction collet.

Therefore, conventionally, the rotation angle of the semiconductor pellet is recognized in advance before suction, and the rotation of the suction collet is adjusted according to the rotation angle of the semiconductor pellet to eliminate the rotational deviation, and then the semiconductor pellet is suction-held by the suction collet. are doing. After the semiconductor pellets are vacuum-adsorbed as described above, the adsorption collet is rotated again to return the adsorption collet to a predetermined position before the adsorption.

[0004]

For this reason, conventionally, it has been necessary to recognize the rotation angle of the semiconductor pellet and to rotate the suction collet every time the semiconductor device is transported, and the operation is complicated. Further, a measuring device for recognizing the rotation angle of the semiconductor pellet is required, so that the transfer device becomes large and the device cost is high. In addition, it takes a long time to measure the angle of the semiconductor pellet and adjust the rotation of the suction collet, so that it takes a long time to transport.

SUMMARY OF THE INVENTION An object of the present invention is to provide a suction collet which can easily correct a rotational deviation of a semiconductor pellet and can always hold a semiconductor pellet in a correct posture on a suction surface.

[0006]

In order to achieve this object, according to the present invention, there is provided an adsorption collet for adsorbing and holding a semiconductor pellet, wherein the collet has a width equal to the width of the semiconductor pellet. Alternatively, a pair of protrusions arranged at an interval wider than the width of the semiconductor pellet is formed on the suction surface at the tip of the suction collet, and a suction hole is provided between these protrusions. This claim 1
In the adsorption collet of (1), as described in claim 2,
Preferably, the pair of protrusions are arranged in parallel. Further, as described in claim 3, it is preferable that the inner surface of the projection is inclined so as to spread outward toward the tip. As described in claim 4, the angle between the inner surfaces of the projections is 45 ° or more and less than 90 °, and the area of the suction surface is 100% or more and less than 130% of the area of the upper surface of the semiconductor pellet. Is preferred.

In the suction collet of the first to fourth aspects, the semiconductor pellet is, for example, an LED chip having a mesa structure or the like, and may be other various semiconductor pellets. In the suction collet according to any one of the first to fourth aspects, the suction collet is moved from above, and the suction surface of the tip of the suction collet is brought close to the semiconductor pellet placed on, for example, a mounting table. breath,
The semiconductor pellet enters between a pair of protrusions formed on the suction surface of the suction collet. Then, the semiconductor pellet is guided and rotated as appropriate by the both sides of the semiconductor pellet abutting on the inner surfaces of the pair of protrusions, and the angle of the semiconductor pellet is adjusted to the correct posture. In this way, the semiconductor pellet is stored between the pair of protrusions in the correct posture. Then, by sucking the semiconductor pellets through the suction holes provided between the protrusions, the semiconductor pellets can be suctioned on the suction surface at the tip of the suction collet in a correct posture. In order to sufficiently store the semiconductor pellet between the pair of projections, the height of the pair of projections formed on the suction surface at the tip of the suction collet should be 100% or more and less than 130% of the thickness of the semiconductor pellet. It is desirable to set the range.

According to the suction collet of the first to fourth aspects, by rotating the semiconductor pellet, vacuum suction can be performed without rotating the suction collet, and the semiconductor pellet can always be suctioned in a correct posture without an angular deviation. It becomes possible. Further, since the both sides of the semiconductor pellet sucked on the suction surface at the tip of the suction collet are pressed from both sides by the inner surfaces of the pair of projections, there is no fear that the angle of the semiconductor pellet is shifted even during transportation. For this reason,
The semiconductor pellets adsorbed on the suction surface can be always conveyed in the correct posture, and the semiconductor pellets can always be supplied to other processing apparatuses in the correct posture.

[0009]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an explanatory view showing a state in which a suction collet 1 according to an embodiment of the present invention is mounted on a holder 2, and FIG. 2 is an enlarged longitudinal sectional view showing the suction collet 1 removed from the holder 2. It is. FIG. 3 is an enlarged vertical cross-sectional view of the nozzle portion 12 at the tip of the suction collet 1, and FIG. 4 is an enlarged front view of the tip surface of the suction collet 1 (the tip surface of the nozzle portion 12).

The suction collet 1 has a flange portion 10 formed on the peripheral surface of the suction collet 1 having a hollow cylindrical shape, and a base end side of the flange portion 10 (above the flange portion 10 in FIG. 2). Are attachment portions 11 for the holder 2. Tip of suction collet 1 (Fig. 2
In this embodiment, the lower end of the suction collet 1 is formed in a truncated quadrangular pyramid-shaped nozzle portion 12, and the tip surface of the suction collet 1 (the lower end surface of the nozzle portion 12 in FIG. At the suction surface 13 of FIG.

At the center of the suction collet 1, an air passage 1 is provided.
4 is formed, and a suction hole 15 serving as one end of the air passage 14 is provided so as to open to the suction surface 13 described above. As shown in FIGS. 3 and 4, a pair of projections 16 are formed on both sides of the suction surface 13.

In the illustrated example, the semiconductor pellet 3 is an LED chip having a mesa structure. The distance L between the inner surfaces of the pair of protrusions 16 formed on the suction surface 13 at the tip of the suction collet 1 (the lower end of the nozzle portion 12) is equal to the width M of the semiconductor pellet 3 or the semiconductor pellet 3 Are wider than the width M of the projections 16,
16 are arranged in parallel with each other with an interval L therebetween. The inner surfaces of the projections 16, 16 are all inclined so as to spread outward toward the tip (the lower end in FIG. 3). The angle θ between the inner surfaces of the projections 16, 16 is set to 45 ° or more and less than 90 ° in this embodiment. Height H of projections 16, 16
Are set in a range of 100% or more and less than 130% of the thickness T of the semiconductor pellet 3. The area of the suction surface 13 formed between the projections 16 is 16% or more of the area of the upper surface of the semiconductor pellet 3.
It is set to less than 0%. The above-mentioned suction hole 15 is
The suction surface 13 is open between the projections 16.

As shown in FIG. 1, a mounting portion 20 is formed at the lower end of the holder 2, and this mounting portion 20 is formed.
The suction collet 1 is mounted on the holder 2 by inserting the mounting portion 11 into the hole 21 formed on the lower surface of the holder 2. An exhaust hole 2 is provided on the peripheral surface of the mounting portion 20.
The suction hole 15 is opened in the suction surface 13 through the air passage 14 in the suction collet 1 attached to the holder 2 by suction from the exhaust hole 22.
It is possible to carry out suction from.

Now, the suction collet 1 according to the embodiment of the present invention configured as described above is mounted on the holder 2 as shown in FIG.
For example, the suction surface 13 at the tip of the suction collet 1 approaches the semiconductor pellet 3 placed on a mounting table or the like from above. Thus, the suction surface 1 at the tip of the suction collet 1
The semiconductor pellet 3 is caused to enter between the pair of projections 16 formed on the semiconductor pellet 3. In this case, the projections 16, 1
Since the inner surface of the semiconductor pellet 6 is inclined so as to spread outward toward the tip, the semiconductor pellet 3 is located between the projections 16.
The frontage when entering is widened, making it easier to enter.

Since the semiconductor pellet 3 enters between the protrusions 16, both sides of the semiconductor pellet 3 come into contact with the inner surfaces of the pair of protrusions 16, 16. Are protrusions 16, 16
The semiconductor pellet 3 is appropriately rotated by being guided by the inner surface of the semiconductor pellet, and the angle of the semiconductor pellet 3 is adjusted to a correct posture. Thus, the semiconductor pellet 3 is stored between the pair of protrusions 16 in the correct posture. In this case, a pair of projections 1
The height H of 6, 16 is 10 times the thickness T of the semiconductor pellet 3.
Since it is set in the range of 0% or more and less than 130%, it is possible to sufficiently store the semiconductor pellet 3 between the projections 16.

Then, by suction through an exhaust hole 22 formed on the peripheral surface of the mounting portion 20 of the holder 2, suction is performed from a suction hole 15 opened in the suction surface 13 through an air passage 14 in the suction collet 1. As a result, the semiconductor pellet 3 is adsorbed on the adsorption surface 13 at the tip of the adsorption collet 1 while maintaining the correct posture.

Therefore, according to the suction collet 1, by appropriately rotating the semiconductor pellet 3, the semiconductor pellet 3 can always be suctioned in a correct posture without an angular deviation. The suction surface 13 at the tip of the suction collet 3
The two sides of the semiconductor pellet 3 adsorbed on the pair are formed with a pair of protrusions 1.
Since the semiconductor pellets 13 are pressed from both sides by the inner surfaces of the semiconductor pellets 6, there is no fear that the angle of the semiconductor pellet 13 is shifted even during transportation. For this reason, the semiconductor pellets 3 adsorbed on the suction surface 13 can be always conveyed in the correct posture, and the semiconductor pellets 3 can be always supplied to other processing apparatuses in the correct posture.

[0018]

Next, embodiments of the present invention will be described. A transport test of a semiconductor pellet (AlGaAs LED) was performed using the adsorption collet of the embodiment described with reference to FIGS. The angle between the inner surfaces of the protrusions was 60 °, and the height of the protrusions was equal to the thickness of the semiconductor pellet having a mesa structure to be conveyed. The area of the suction surface was set to 110% of the area of the upper surface of the semiconductor pellet. Approximately 20,000 semiconductor pellets were transported, but the rate of occurrence of angular misalignment (± 3 ° to ± 5 °) between adjacent semiconductor pellets due to transport was 0.1% or less, and damage to the end faces of the semiconductor pellets Did not occur. When the angle between the inner surfaces of the protrusions was 90 °, the rate of occurrence of the angular deviation between the semiconductor pellets brought adjacent by the conveyance was 0.5%, and the end faces of the semiconductor pellets were damaged. Further, when the acquaintance of the suction surface was equal to or less than the area of the upper surface of the semiconductor pellet, the occurrence rate of the angular deviation between the semiconductor pellets adjacent by the conveyance was 5%.

Further, in the conventional collet, the rate of occurrence of an angular shift between the semiconductor pellets brought adjacent by the conveyance was 10%. Although it was necessary to manually correct the angle shift with the conventional collet, the use of the suction collet according to the embodiment of the present invention significantly reduced the occurrence rate of the angle shift between the semiconductor pellets. In addition, there was no manual correction. As a result, an increase in the processing amount of about 15% or more can be secured, and the cost can be significantly reduced.

[0020]

According to the first to fourth aspects, vacuum suction can be performed without rotating the suction collet, and the semiconductor pellet can always be suctioned in a correct posture without any angular deviation. Also, there is no need to worry about the angle of the semiconductor pellet being shifted during transportation, and the semiconductor pellet adsorbed on the suction surface can always be transported in the correct posture. Be able to supply.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a state in which a suction collet according to an embodiment of the present invention is mounted on a holder.

FIG. 2 is an enlarged longitudinal sectional view of a suction collet.

FIG. 3 is an enlarged vertical sectional view of a nozzle portion at the tip of a suction collet.

FIG. 4 is an enlarged front view of a distal end surface of a suction collet (a distal end surface of a nozzle portion).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Suction collet 2 Holder 3 Semiconductor pellet 10 Flange part 11 Attachment part 12 Nozzle part 13 Suction surface 14 Air passage 15 Suction hole 16 Projection 20 Mounting part 21 Hole 22 Exhaust hole

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Masayuki Kimura 1-8-2 Marunouchi, Chiyoda-ku, Tokyo Dowa Mining Co., Ltd. F-term (reference) 3C007 DS01 FS01 FT01 FU02 KS03 NS17 3F061 AA01 CA01 CB01 CC03 DB06 DD01 5F031 CA13 FA05 FA07 GA23 GA38

Claims (4)

[Claims] 1. An adsorption collet for adsorbing and holding a semiconductor pellet, wherein a pair of protrusions arranged at an interval equal to or wider than the width of the semiconductor pellet are provided. A suction collet for semiconductor pellets, wherein the suction collet is formed on a suction surface at a tip of the suction collet and a suction hole is provided between the projections. 2. The adsorption collet for a semiconductor pellet according to claim 1, wherein said pair of projections are arranged in parallel. 3. The adsorption collet of a semiconductor pellet according to claim 1, wherein an inner surface of said projection is inclined so as to spread outward toward a tip. 4. The semiconductor device according to claim 1, wherein the angle between the inner surfaces of the protrusions is not less than 45 ° and less than 90 °, and the area of the suction surface is not less than 100% and less than 130% of the area of the upper surface of the semiconductor pellet. An adsorption collet for a semiconductor pellet according to claim 3.