JP2002094295A - Electronic component mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounter in which curvature of an X frame and an X linear guide due to temperature variation is suppressed. SOLUTION: One end of an X frame 16 is supported by a Y slide block 18 movably in the longitudinal direction of the X fame 16 through a linear guide R thus preventing curvature of the X frame.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine for mounting electronic components on a substrate by vacuum suction.

[0002]

2. Description of the Related Art In order to mount an electronic component supplied from an electronic component supply device such as a tape feeder at a predetermined position on a substrate, an electronic component mounting machine raises and lowers the electronic component in the Z direction by vacuum suction. An electronic component mounting head that rotates around an axis in the Z direction; an X linear guide that supports the electronic component mounting head and guides the electronic component in the X direction; an X frame that supports the X linear guide; A pair of Y linear guides that support both ends of the X frame via a slide block and guide in the Y direction.

The X linear guide is substantially bar-shaped and arranged in a pair in the upper and lower directions in the X direction. The X linear guide supports the electronic component mounting head movably in the X direction, and is generally made of iron. The X frame is a beam-shaped body having a U-shaped cross section, is arranged in the X direction with the U-shaped opening facing the Y direction, and supports each linear guide on the upper and lower side surfaces on the U-shaped opening side, Generally, a light metal such as aluminum is used as a material.

[0004] In recent years, there has been a tendency to mount electronic components with high accuracy in order to make electronic components more precise.
In order to satisfy this demand, high-precision processing and assembly of components of an electronic component mounting machine such as an X frame and an X linear guide are required.

[0005]

However, since the left and right ends of the X frame are fixed to the slide block, when the use environment temperature of the electronic component mounting machine rises, the X frame is curved so as to protrude in an arc shape. As a result, the position of the electronic component mounting head is shifted in the Y direction with respect to the Y linear guide, and there is a problem that the required high precision electronic components cannot be accurately mounted on the substrate. .
In addition, when the electronic component is sucked from the electronic component supply unit, there is a problem that the electronic component cannot be sucked from the electronic component supply unit.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide an electronic component mounting apparatus in which the bending of an X frame and an X linear guide due to a temperature change is suppressed. And

[0007]

According to the present invention, the one end of the X frame is slidably supported on the slide block, thereby preventing the X frame from bending in a curved manner and solving the above-mentioned problems.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. As shown in FIG.
An electronic component mounting machine 10 according to an example of this embodiment includes an electronic component mounting head for mounting an electronic component (not shown) supplied by an electronic component supply device (not shown) on a substrate (not shown). 12, an X linear guide 14, an X frame 16, slide blocks 18, 18, and a Y linear guide 20. The Y linear guide 20 is fixed on the base 22.

The electronic component mounting head 12 has a plurality of electronic component suction nozzles 12A for vacuum-sucking the electronic components, and these electronic component suction nozzles 12A can move up and down in the Z direction, and rotate around the axis in the Z direction. It is free.

The X linear guide 14 is a substantially rod-like body made of iron, and is arranged in a pair of upper and lower directions in the X direction. The X linear guide 14 supports the electronic component mounting head 12 movably in the X direction.
The X frame 16 is an aluminum beam having substantially the same length as the X linear guide 14 and has a U-shaped cross section. The U-shaped opening is arranged in the X direction toward the Y direction. On the upper and lower side surfaces on the side of the U-shaped opening, the X
The linear guide 14 is supported.

The slide block 18 has an inverted T section.
A pair of plates arranged in the vicinity of both ends of the X frame 16 and supporting the side surface of the X frame 16 on the opposite side of the U-shaped opening at the vertical portion 18A of the inverted T-shape. I have. The way of supporting the X frame 16 on the slide blocks 18 is that one slide block 18L fixedly supports the X frame 16 and the other slide block 18R supports the X frame via the linear guide R. ing.

As shown in FIG. 2, the linear guide R is fixed to a pair of upper and lower linear guide rails RA fixed to a slide block 18R, and is fixed to an X frame 16, and is movably supported in each linear guide rail RA. However, when the X frame 16 is bent by heat, the bearing block RB is fixed to the X frame 16.
Since the bearing block RB fixed to the frame 16 moves in the longitudinal direction along the linear guide rail RA, X
It acts to prevent the frame 16 from bending. Said Y
The linear block 20 is a substantially bar-shaped body, and is disposed in parallel in the Y direction at a pair of substantially the same height.
Are movably supported in the Y direction.

Next, the operation of the electronic component mounting machine 10 according to the embodiment of the present invention will be described. The operating environment temperature of the electronic component mounting machine 10 or the head 1
When the temperatures of the X linear guide 14 and the X frame 16 rise due to the sliding of 2, the X linear guide 14 and the X frame 16 tend to expand in the X direction according to their respective thermal expansion coefficients.

An X linear guide 14 and an X frame 16
Is fixed by the slide block 18,
Since the expansion cannot be performed in the X direction, the expanding force is converted into a bending force, and the X linear guide 14 and the X frame 16 attempt to bend. However, in this embodiment, one end of the X frame is movably fixed to the slide block 18 via the linear guide R.

For this reason, the bearing block RB is moved from the state shown in FIG. 3 to the linear guide rail R as shown in FIG.
It moves slightly along A, thereby preventing the X frame 16 from bending and deforming. Also, in the case of bending deformation due to contraction, as shown in FIG. 5, the bearing block RB moves along the linear guide rail RA in a direction opposite to that in FIG.

Next, a second embodiment of the present invention will be described. FIG. 6 shows an embodiment of the second aspect of the present invention. In addition to the configuration of the first embodiment, a driving unit for driving an X frame based on predetermined information is provided. The predetermined information is the temperature of the X frame corresponding to the amount of expansion and contraction of the X frame, or the information of the actual amount of distortion of the X frame, and is configured using a temperature sensor or a strain gauge to measure these. is there.

The embodiment shown in FIG. 2 uses a temperature sensor TC. Block 16A at one end of X frame 16
, A motor M having a screw portion 24S formed at the tip of the motor shaft 24 is fixed to the slide block 18, and the screw portion 24S is screwed into the block 16A. A temperature sensor TC is provided on the upper surface of the X frame 16, and is electrically connected to a microcomputer or the like having a control unit MC and a storage unit RM. The temperature sensor TC, the motor 24, the screw portion 24S, the control means MC, and the storage means RM constitute driving means for moving the X frame in the longitudinal direction based on predetermined information.

The storage means RM previously stores the optimal amount of expansion and contraction of the X frame 16 according to the temperature change, and calculates a signal corresponding to the amount of expansion and contraction corresponding to each temperature by the control means MC. Is output to the motor M. Thus, the motor M is driven to rotate, and the actual drive amount is detected and transmitted to the control means MC. The other configuration is the same as that of the first example of the embodiment, and will not be described.

Next, the operation will be described. As the temperature of the X frame 16 changes, the amount of expansion and contraction of the X frame 16 is controlled by the control unit based on the information from the temperature sensor TC and the information in the storage unit RM.
Calculated by MC. This drives the motor M to drive the end of the X frame 16. The temperature sensor T
A strain gauge may be used in place of S. In this case, optimal control of the motor M is performed via the control means MC so that the value of the strain gauge is minimized. Further, instead of the rotary linear drive by the screw portion 24S, a rack and pinion drive system in which a rack is provided on the X frame 16 and a pinion is provided on the motor shaft 24 of the motor M may be used.

[0020]

According to the present invention, since one end of the X frame is slidably supported in the longitudinal direction of the X frame, the X frame is prevented from being deformed into a curved shape due to a temperature change. Thus, the mounting accuracy of the electronic component on the substrate is improved, and the electronic component can be reliably sucked from the electronic component supply unit.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic overall structure of an electronic component mounting machine according to an embodiment of the present invention.

FIG. 2 is a perspective view of one embodiment of a linear guide.

FIG. 3 is a top view of a main part around an X frame.

FIG. 4 is a top view of a main part around the X frame, showing a state where the X frame is expanded.

FIG. 5 is a top view of a main part around the X frame showing a state where the X frame is contracted.

FIG. 6 is an essential part perspective view of an electronic component mounting machine according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting machine 12 ... Electronic component mounting head 14 ... X linear guide 16 ... X frame 18 ... Slide block 20 ... Y linear guide R ... Linear guide M ... Motor as drive means

Claims (2)

[Claims] 1. A pair of Y linear guides, a pair of slide blocks movably supported by the Y linear guides, and a beam-like member arranged in the X direction. Movable X
An X linear guide made of a material having a different coefficient of thermal expansion from the X frame and attached to one side surface of the X frame along the longitudinal direction to guide the electronic component mounting head in the X direction. An electronic component mounting machine according to claim 1, wherein one end of the X frame is supported by a slide block so as to be movable in the longitudinal direction of the X frame. 2. A pair of Y linear guides, a pair of slide blocks movably supported by the Y linear guides, and a beam-like member arranged in the X direction, supported by the slide blocks near both ends in the Y direction. Movable X
An X linear guide made of a material having a different coefficient of thermal expansion from the X frame and attached to one side surface of the X frame along the longitudinal direction to guide the electronic component mounting head in the X direction. In the electronic component mounting machine, one end of the X frame is supported on the slide block so as to be movable in the longitudinal direction of the X frame, and driving means for moving the X frame in the longitudinal direction based on predetermined information is provided. Electronic component mounting machine characterized by having.