JP2002094292A - Method and apparatus for feeding electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for feeding electronic component in which an electronic component on the head side of a row from a stick can be carried regardless of the number of following electronic components when electronic components fed from the stick are carried to a forward pickup position. SOLUTION: In the method for feeding electronic components contained in a tubular stick sequentially to a pickup position by oscillating the electronic components, oscillation pattern for carrying the electronic components to the pickup position is switched depending on the state of electronic components in the way of carriage.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component supply apparatus for sending out electronic components contained in a cylindrical stick and sequentially supplying the electronic components to pickup positions of the electronic components.

[0002]

2. Description of the Related Art There are various types of electronic component supply devices for supplying electronic components to an electronic component mounting apparatus and the like. One of them is a large number of electronic components arranged in a line inside a cylindrical stick. Some electronic components are sequentially taken out by vibrating this cylindrical stick and supplied to an electronic component mounting apparatus. This type of electronic component supply device is disclosed in, for example, Japanese Patent Application Laid-Open No. 11-11 / 1999.
No. 634, widely used as an apparatus for continuously supplying a small number of electronic components. Hereinafter, a conventional electronic component supply device using the stick will be briefly described.

A conventional electronic component supply device 80 shown in FIG.
Are mainly composed of a body 81, a vibration table 83 swingably attached to the body 81 via a spring member 82, a vibration drive source 84 for applying vibration to the vibration table 83, and fixed on the vibration table 83. A transport guide member 85 formed with a transport guide for transporting the electronic components 3 at the bottom of the groove, and a stick 86 holding a large number of electronic components 3 in a plurality of rows and holding the tip of the stick 86 at the transport guide member 85 The stick holding mechanism 87 for sending the electronic component 3 to the bottom of the groove of the transport guide member 85 by contacting the electronic component 3 and the front row of the transported electronic component 3 provided on the transport rear side of the transport guide member 85 come into contact with each other. A stopper 88 for stopping the movement and a controller 89 for controlling the vibration operation of the vibration drive source 84 are provided.
The controller 89 includes a voltage adjustment unit 89a and a frequency adjustment unit 89b for adjusting the amplitude of vibration applied to the vibration table 83 at the initial stage of using the electronic component supply device 80. Here, the voltage adjustment unit 89a adjusts the voltage applied to the vibration drive source 84, and the frequency adjustment unit 89b adjusts the vibration frequency of the vibration drive source 84.

In the electronic component supply device 80, a vibration driving force having a certain amplitude, which is suitable for the electronic component 3 supplied by the stick 86, is vibrated by adjusting the voltage adjusting unit 89 a and the frequency adjusting unit 89 b. The vibration driving force generated by the source 84 is transmitted to the electronic component 3 in the stick 86 via the vibration table 83 and the conveyance guide member 85. As a result, the electronic component 3 is transported from the stick 86 to a position where it comes into contact with the stopper 88 along the groove bottom surface of the transport guide member 85, that is, the pickup position P, and stops. At this time, the electronic component 3 is moved to the pickup position P
Is detected by the component detection sensor 90. Then, the electronic component 3 that has reached the pickup position P
Is supplied to a suction nozzle 91 of an electronic component mounting apparatus, and is mounted at a predetermined position on a circuit board (not shown).

Here, a method of changing the amplitude of the vibration operation by adjusting the voltage adjusting unit 89a and the frequency adjusting unit 89b will be described with reference to FIGS. FIG. 5 is a graph in which a change in the amplitude A with respect to the frequency f is plotted according to each applied voltage V. FIG. 6 is a graph showing a change in the amplitude A with respect to each frequency f when the applied voltage V is fixed. When the amplitude is adjusted using only the voltage adjusting unit 89a, assuming that the frequency of vibration is fa as shown in FIG. 5, the amplitudes for the applied voltages V1 to V5 are A1
~ A5. When the amplitude is adjusted using only the frequency adjustment unit 89b, as shown in FIG.
The amplitudes for 1 to f5 change from A1 to A5, respectively. Thus, the amplitude can be set arbitrarily by adjusting the applied voltage and the vibration frequency.

[0006]

In the configuration of the above-mentioned conventional electronic component supply device 80, a stick 86 accommodating a plurality of electronic components 3 is disposed at an angle, and
Since the electronic components are continuously arranged in a straight line in the direction from the stick 86 to the tip of the transport guide member 85, the electronic components 3 arranged in the stick 86 and arranged on the transport guide member 85
In addition to the vibration from the vibration drive source 84, the electronic component 3 receives a forward force in the transport direction due to the weight of the electronic component located behind each of the electronic components 3. Therefore, the electronic component is conveyed to the pickup position P in combination with the force due to the vibration and the pushing force from the rear electronic component.

However, in this electronic component supply device 80, the electronic component is set so as to have a certain amplitude at the beginning of use, although the pushing force increases as the number of electronic components located behind the array increases. The parts 3 were conveyed by applying vibrations under certain conditions. For this reason, the electronic components 3 arranged in the stick 86 or on the transport guide member 85 may change the transport state between the front end side and the rear end side in the row, resulting in defective transport.

In order to stably convey each electronic component 3, it is conceivable to adjust the amplitude of the vibration required for conveyance by the voltage adjusting unit 89 a and the frequency adjusting unit 89 b. If the amplitude is set to be suitable for the electronic components on the leading end side of the array, the pushing force from the electronic components on the rear end side of the electronic components on the rear end side is weak, and the forward force in the transport direction decreases. Therefore, in addition to the fact that the electronic component 3 does not easily reach the pickup position P, the amplitude of the vibrations is not aligned with the electronic component on the rear end side, and the electronic component 3 on the rear end side becomes clogged. Occurs and proper conveyance cannot be performed. On the other hand, if the amplitude is set to be suitable for the electronic components on the rear end side, the pushing force from the electronic components on the rear side becomes stronger with respect to the electronic components on the front end side, and the forward force in the transport direction becomes excessive. This causes a problem that the leading electronic component jumps out of the pickup position P.

The present invention has been made in view of such a conventional problem, and when an electronic component supplied from a stick is transported to a pickup position in front, the electronic component is positioned at the head of the line from the stick. It is an object of the present invention to provide an electronic component supply method and an electronic component supply device that can transport an electronic component without being affected by the number of electronic components behind the electronic component.

[0010]

According to a first aspect of the present invention, there is provided an electronic component supply method according to the present invention, wherein an electronic component contained in a cylindrical stick is sent out, and the electronic component is vibrated. In the electronic component supply method for sequentially supplying the electronic component to the pickup position, the vibration drive for transporting the electronic component to the pickup position is performed in different types of vibration patterns according to the state of the electronic component during transportation. Switching is performed.

In this electronic component supply method, the vibration driving for transporting the electronic component to the pickup position is switched according to the state of the electronic component being transported, thereby comparing with the case of transporting the electronic component in the same vibration pattern. As a result, the electronic components can be transported more reliably and stably, and the electronic components located at the head of the line from the stick can be transported without being affected by the number of electronic components behind.

According to a second aspect of the present invention, there is provided the electronic component supply method, wherein a vibration pattern having a small amplitude is used when the number of the electronic components in the middle of transportation is large, and a vibration pattern having a large amplitude is used when the number is small. And

In this electronic component supply method, the amplitude is set to be small when the number of electronic components is large, and the amplitude is set to be large when the number is small. The vibration pattern is adjusted according to the increase or decrease of the pushing force due to the weight of the parts, so the excessive pushing force causes the electronic parts to pop out when the number of electronic parts is large, and the pushing force is small when the number of electronic parts is small. This can prevent the parts from being clogged.

According to a third aspect of the present invention, in the electronic component supply method, the position of the electronic component being transported is detected, and when the position of the last electronic component is close to the pickup position, the vibration pattern having a small amplitude is used. It is characterized by switching to a vibration pattern having a large amplitude.

In this electronic component supply method, when the position of the last electronic component is close to the pickup position, the vibration pattern is switched to a vibration pattern having a large amplitude, so that the pushing force from the electronic component behind the transport is reduced. Because the vibration pattern is adjusted, regardless of the position of the electronic component,
A good transport state is always obtained.

According to a fourth aspect of the present invention, in the electronic component supply method, the number of times of supply of the electronic component is counted, and when the number of times of supply of the electronic component becomes equal to or more than a predetermined number, a vibration pattern having a small amplitude is changed to a vibration having a large amplitude. It is characterized by switching to a pattern.

In this electronic component supply method, when the supply frequency of the electronic component becomes equal to or more than a predetermined number, the vibration pattern is switched to a vibration pattern having a large amplitude, so that the vibration is adjusted in accordance with a decrease in the pushing force from the electronic component behind the conveyance. Since the pattern is adjusted, a good transport state can always be obtained regardless of the number of electronic components supplied.

According to a fifth aspect of the present invention, in the electronic component supply method, when the length of the electronic component in the transport direction is large, a vibration pattern having a long drive time of the vibration is used. It is characterized by using a short vibration pattern.

In the electronic component supply method described above, the vibration driving time is set longer when the length of the electronic component in the transport direction is large, and the vibration drive time is set shorter when the electronic component length is small. The drive time can be set only to a required amount according to the length of the electronic component in the transport direction, and unnecessary vibration operation time can be reduced. Therefore, it is possible to prevent a decrease in the operation rate of the electronic component mounting apparatus.

According to a sixth aspect of the present invention, there is provided an electronic component supply apparatus for sending out an electronic component contained in a cylindrical stick, and sequentially driving the electronic component to a pickup position of the electronic component by vibrating the electronic component. A stick holding member that holds the stick, a conveyance guide member that receives an electronic component supplied from the tip of the stick, and conveys the pickup to the pickup position, and a vibration driving source that applies vibration to the stick and the conveyance guide member And a controller for controlling a vibration driving force of the vibration driving source, wherein the controller switches to a different type of vibration pattern according to a state of the stick and an electronic component held by the transport guide member. It is characterized by having.

In this electronic component supply device, the electronic component is supplied to the transport guide member from the tip of the stick held by the stick holding member, and the supplied electronic component is vibrated by the vibration drive source to the pickup position on the transport guide member. It is transported by the driving force. The vibration driving force during this transfer is
The vibration switching means of the controller switches to a different type of vibration pattern according to the state of the electronic component held by the stick and the conveyance guide member. As a result, the electronic components can be more reliably and stably conveyed as compared with the case where the electronic components are conveyed in the same vibration pattern. It can be transported without being affected by the quantity.

According to a seventh aspect of the present invention, in the electronic component supply device, the vibration switching unit switches to a vibration pattern having a different amplitude in accordance with the number of electronic components in the process of being conveyed.

In this electronic component supply device, by switching the amplitude of vibration in accordance with the number of electronic components, the electronic components located at the head of the array can be adjusted according to the increase or decrease of the pushing force due to the weight of the electronic components behind. The vibration pattern is adjusted, and when the number of electronic components is large, the excessive pushing force causes the electronic components to pop out, and when the number of electronic components is small, the pushing force is reduced and the components are clogged. Can be prevented.

According to another aspect of the present invention, there is provided an electronic component supply device comprising a component detection sensor for detecting a position of the electronic component, wherein the vibration switching means switches to a vibration pattern having a different amplitude according to the position of the last electronic component. It is characterized by the following.

In this electronic component supply device, the position of the last electronic component is detected by the component detection sensor, and this position is switched to a vibration pattern having a different amplitude in accordance with the pickup position, so that the position of the electronic component from the rear of the transport is reduced. Since the vibration pattern is adjusted in accordance with the decrease in the pushing force, a good transport state can always be obtained regardless of the position of the electronic component.

An electronic component supply device according to claim 9, further comprising a counter for counting the number of times the electronic component is supplied from the pickup position, wherein the vibration switching means has a vibration pattern having a different amplitude according to the number of times the electronic component is supplied. Is switched.

In this electronic component supply device, the number of electronic component supply times is counted by a counter, and when the number of supply times becomes equal to or greater than a predetermined number, the vibration pattern having a different amplitude is switched to the electronic component at the rear of the transport. The vibration pattern is adjusted according to the decrease of the pushing force of
Regardless of the number of electronic components supplied, a good transport state can always be obtained.

According to a tenth aspect of the present invention, in the electronic component supply device, the vibration switching unit switches to a vibration pattern having a different driving time according to the length of the electronic component in the transport direction.

In this electronic component supply device, the vibration driving time is adjusted according to the length of the electronic component in the transport direction, so that the vibration drive time can be set to only a necessary amount according to the length of the electronic component in the transport direction. In addition, unnecessary vibration operation time can be reduced. Therefore, it is possible to prevent a decrease in the operation rate of the electronic component mounting apparatus.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electronic component supply method and an electronic component supply device according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus to which an electronic component supply device according to the present invention is mounted, and FIG. 2 is a diagram illustrating the configuration of the electronic component supply device according to the present invention in (a) side view and (b) plan view. FIG.

First, the configuration of the electronic component mounting apparatus 100 will be briefly described. As shown in FIG. 1, an electronic component mounting apparatus 1
A guide rail 14 for a circuit board is provided at the center of the upper surface of the base 10. The circuit board is moved from the loader section 16 at one end to a mounting position 18 for electronic components by a transport belt of the guide rail 14. The sheet is conveyed from the position 18 to the unloader section 20 at the other end. Y tables 22 and 24 are provided on both sides of the upper surface of the base 10 above the circuit board, and an X table 26 is suspended between the two Y tables 22 and 24. Further, a transfer head 28 is attached to the X table 26, so that the transfer head 28 can be moved within an XY plane (horizontal plane).

The X table 26 and the Y tables 22, 2
The transfer head 28, which is mounted on an XY robot 4 and moves freely on the XY plane, receives a desired electronic component from a component supply unit 30 to which electronic components such as a resistor chip, a chip capacitor, an SOP and a QFP are supplied. Component mounting head 3
4, the electronic component is attached to a predetermined position on a circuit board after the electronic component is detected by a recognition device (not shown). The mounting operation of such electronic components is controlled by a control device (not shown) based on a preset mounting program.

An electronic component supply device 200 according to the present invention is mounted on the component supply section 30. In addition, a parts feeder 32 for supplying a small chip component from a tape-shaped component roll is appropriately mounted, and a parts tray 33 for supplying a large component such as a QFP is also provided on the opposite side across the guide rail 14.

The transfer head 28 includes a plurality of mounting heads 3.
4 are configured as a multiple head connected side by side. Each of the mounting heads 34 has the same structure, and a suction nozzle 36 is attached to a distal end portion thereof and supported so as to be able to move up and down.

In the electronic component mounting apparatus 100 having the above configuration,
When the circuit board loaded from the loader section 16 of the guide rail 14 is transported to a predetermined mounting position 18, the transfer head 28 is moved in the XY plane by the XY robot, and the mounting program is transferred from the electronic component supply device 200 or the like. The electronic component is mounted on a predetermined position of the circuit board after a desired electronic component is sucked based on the above, and the operation of correcting the mounting position is performed by recognizing the suction attitude of the electronic component.

Next, the electronic component supply device 20 according to the present invention
0 will be described in detail. As shown in FIG. 2, the electronic component supply device 200 includes an electronic component mounting device 10
A base member 42 for attachment to the base member 0 is provided. Above the base member 42, a vibration generator 46 including a vibration drive source 44 is fixed via vibration prevention plates 48, 48. The vibration generator 46 includes two vibration plates 50, 50 inclined at a predetermined angle, and upper ends of the vibration plates 50, 50 are fixed to a vibration table 52. A transport guide member 54 having a guide groove for electronic components formed thereon is attached to the upper surface of the vibration table 52.

A stick 5 containing a large number of electronic components
Reference numeral 5 designates the upper surface on the tip side of the stick 55
4 is pressed by a holding member 56 supported by the body 40 and the lower surface on the rear end side of the stick 55 is
It is pushed up so as to give an upward warp by a push-up member 60 which is supported at 0 and is provided around the pin 58 so as to be capable of turning around the pin 58. The tip of the stick 55 is located above the transport surface of the transport guide member 54.
The electronic component 3 inside can abut on the transport surface of the transport guide member 54 smoothly by contacting the end surface of the upper cover 62 provided at the height of.

A stopper plate 64 is fixed to the base member 42 at the leading end of the guide groove of the transfer guide member 54, and the electronic component 3 on the transfer surface contacts the end of the stopper plate 64. To stop. This stop position is the pickup position P of the electronic component 3.
Immediately below the pickup position P of the transport guide member 54, a component detection sensor 66 is provided to detect the presence or absence of the electronic component 3 at the pickup position P.

The vibration driving source 44 of the vibration generator 46 is electrically connected to a controller 70. The controller 70 includes a first amplitude adjusting unit for adjusting the amplitude of the vibration by the vibration driving source 44, which will be described in detail later. 71 and a second amplitude adjusting unit 72, and a vibration switching means for switching these amplitudes. The controller 70 controls the vibration generator 46 at a predetermined timing such as when the electronic component 3 is supplied from the electronic component supply device 200 to the electronic component mounting device 100.
Is driven to vibrate.

The first amplitude adjuster 71 adjusts a voltage applied to the vibration drive source 44, a first frequency adjuster 71b adjusts the frequency of the vibration, and adjusts the drive operation time of the vibration. The first vibration drive operation time adjustment unit 71
c, the second amplitude adjustment unit 72 includes a second voltage adjustment unit 72a that adjusts an applied voltage, a second frequency adjustment unit 72b that adjusts a frequency, and a second vibration drive operation time adjustment that adjusts a drive operation time. A portion 72c. Note that each of the above-mentioned adjustment units can be configured using a common variable resistor or the like.

Next, the electronic component supply device 200 having the above configuration
The operation of is described below. First, the electronic component supply device 20
0 is mounted on the component supply unit 30 of the electronic component mounting apparatus 100 via the base member 42. At the time of this mounting, the electronic component 3 by the transfer head 28 of the electronic component mounting apparatus 100 is
The positional relationship between the pickup position and the stopper plate 64 is checked, and then the stick 55 containing the electronic component 3 is mounted. The mounting of the stick 55 may be performed before the mounting to the electronic component mounting apparatus 100.

Then, the controller 70 switches between driving with the first amplitude A1 and driving with the second amplitude A2 (A1 <A2) by the vibration switching means, as shown in the vibration driving pattern in FIG. The vibration pattern of the vibration drive source 44 is controlled. The first amplitude A1 can be directly adjusted by the first amplitude adjustment unit 71, and the first voltage adjustment unit 71
a) The first frequency adjustment unit 71b can adjust the frequency by the method shown in FIGS. Similarly, the second amplitude A
2 can also be adjusted by the second voltage adjuster 72a and the second frequency adjuster 72b of the second amplitude adjuster 72.

First, a vibration driving force having the first amplitude A1 is generated from the vibration driving source 44. This first amplitude A1
Is an amplitude suitable for transporting the electronic component 3 on the distal end side of the stick 55 to the pickup position P on the transport guide member 54. The vibration driving force causes the electronic component 3 to move to the stopper as shown in FIG. The sheet is conveyed to a pickup position P in contact with the plate 64. That is, the first amplitude A1
Of the vibration driving source 44 from the vibration plate 50,
The stick 5 via the shaking table 52 and the conveyance guide member 54
The electronic component 3 in the stick 55 is conveyed from the stick 55 along the guide groove of the conveyance guide member 54 to a position where it comes into contact with the stopper plate 64 and stopped. The electronic component transported and stopped at the pickup position P is detected by the component detection sensor 66.

Electronic component 3 that has reached the pickup position P
When a detection signal is output from the component detection sensor 66,
Suction nozzle (or mechanical chuck mechanism) 3 mounted on transfer head 28 of electronic component mounting apparatus 100 shown in FIG.
6. Then, the transfer head 28 mounts the electronic component 3 at a predetermined position on the circuit board by the XY robot including the X table 26 and the Y tables 22 and 24.

By repeating this series of operations, the number of electronic components 3 that are linearly and continuously arranged from the stick 55 to the pickup position P on the transport guide member 54 is reduced, and the electronic components on the rear end side are arranged. In No. 3, the pushing force by the rear electronic component 3 is weakened, and the force in the transporting direction is reduced. In addition to this, the amplitude of the vibration by the vibration drive source 44 is also set to the amplitude A1 suitable for the electronic components on the front end side, so that if the transportation is good for the electronic components on the rear end side as it is. Eventually, a situation occurs in which the electronic component 3 does not reach the pickup position P. Then, after performing the vibration with the first amplitude A1 for the period T1, the controller 70 switches to the second amplitude A2 and vibrates the vibration driving source 44. That is, when the number of electronic components is large, the amplitude is set small, and when the number is small, the amplitude is set large.

As a result, the electronic component supply device 200
The pickup position P is also set for the electronic components 3 arranged on the rear end side.
It is possible to reliably and stably transfer the electronic components to the pickup position P by setting the amplitude of the vibration to be appropriate similarly to the electronic components arranged on the tip side. Become.

Further, this kind of electronic component supply device 200
Is generally configured to be able to supply electronic components of various shapes by exchanging the transport guide member 54. For this reason, for example, if the drive operation times T1 and T2 based on the first amplitude A1 and the second amplitude A2 are set so as to be suitable for electronic components having a long external dimension with respect to the transporting direction, for example, Unnecessary vibration operation time occurs for electronic components having short external dimensions, which leads to a reduction in the operating rate of the electronic component mounting apparatus 100. Therefore, the first amplitude A1 and the second amplitude A
The driving operation times T1 and T2 by the second vibration driving operation time adjusting unit 71c and the second vibration driving operation time adjusting unit 72
c is set to an arbitrary value, so that the driving operation time T based on the first amplitude A1 and the second amplitude A2 shown in FIG.
1, T2 is set to a vibration operation time according to the shape of the electronic component 3 and the positions of the electronic components 3 that are continuously arranged. That is, when the length of the electronic component in the transport direction is long, a vibration pattern with a long drive time for vibration is used, and when the length in the transport direction is small, a vibration pattern with a short drive time for vibration is used.

Here, when the setting is made in accordance with the shape of the electronic component, each adjusting section of the controller 70 is adjusted, and when the setting is made in accordance with the position of the electronic component 3, the inside of the stick 55 or on the transport guide member 54 is set. A component detection sensor capable of detecting the electronic component is appropriately disposed, the status of the last electronic component is monitored based on the detection signal from the component detection sensor, and a signal corresponding to the status is input to the controller 70. . Thereby, the controller 70 can automatically switch the amplitude. In this case, when the position of the last electronic component approaches the pickup position P, the vibration pattern is switched to a vibration pattern having a large amplitude.

Further, even if a counter is provided in the controller 70 and the number of supplied electronic components is counted to determine the number of remaining electronic components, the amplitude can be similarly switched. In this case, when the number of times of supply of the electronic component becomes equal to or more than a predetermined number, the vibration pattern having a small amplitude is switched to a vibration pattern having a large amplitude. Further, the switching of the amplitude may be performed when the remaining number of electronic components becomes equal to or less than a predetermined number. In this way, for example, the electronic component before the transport of the transport guide member 54 has the first amplitude A1, and the electronic component after the transport is the second amplitude A2.
, The vibration operation can be automatically switched, and the conveyance can be performed with an appropriate vibration amplitude according to the position of the electronic component 3.

In the above-described embodiment, an example has been shown in which electronic components are supplied by a driving operation using two types of amplitudes. However, electronic components can be supplied using more than two types of amplitudes. Providing electronic components with varying amplitudes is equally feasible. Although the amplitude is set by adjusting both the applied voltage and the frequency, the amplitude can be set by adjusting either the applied voltage or the frequency.

According to the electronic component supply device of the present embodiment,
By transporting electronic components to a predetermined pickup position P by vibrating driving forces having a plurality of different amplitudes, the electronic components located at the head of the line are transported stably and reliably regardless of the number of electronic components behind them. Therefore, the feeding failure of the electronic component can be eliminated, and the operating rate of the electronic component mounting apparatus 100 can be improved.

[0052]

According to the electronic component supply method and the electronic component mounting apparatus according to the present invention, the electronic component accommodated in the cylindrical stick is sent out, and the electronic component is driven to vibrate to the pickup position of the electronic component. When sequentially supplying, the vibration drive for transporting the electronic component to the pickup position is switched to a different type of vibration pattern according to the state of the electronic component being transported, thereby performing the same vibration pattern. In comparison, the electronic components can be transported more reliably and stably, and the electronic component located at the head of the line from the stick can be transported without being affected by the number of electronic components behind it. .

The amplitude is set small when the number of electronic components is large and large when the number is small, or when the position of the last electronic component is close to the pickup position. By switching to a vibration pattern having a large amplitude, or by switching to a vibration pattern having a large amplitude when the number of times of supply of the electronic component becomes equal to or more than a predetermined number, the electronic component located at the head side of the array is moved to the rear side. The vibration pattern is adjusted according to the increase or decrease of the pushing force due to the weight of the parts, so the excessive pushing force causes the electronic parts to pop out when the number of electronic parts is large, and the pushing force is small when the number of electronic parts is small. This can prevent the parts from being clogged.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus equipped with an electronic component supply device according to the present invention.

FIG. 2A shows the configuration of an electronic component supply device according to the present invention.
It is the figure shown by the side view and (b) top view.

FIG. 3 is a diagram showing a vibration drive pattern of a vibration drive source controlled by a controller.

FIG. 4 is a diagram showing a configuration of a conventional electronic component supply device.

FIG. 5 is a graph in which a change in amplitude with respect to a frequency is plotted according to each applied voltage.

FIG. 6 is a graph showing a change in amplitude with respect to each frequency when an applied voltage is fixed.

[Explanation of symbols]

 3 Electronic Components 44 Vibration Drive Source 46 Vibration Generator 52 Vibration Table 54 Transport Guide 55 Stick 70 Controller 71 First Amplitude Adjuster 71a First Voltage Adjuster 71b First Frequency Adjuster 71c First Vibration Drive Operating Time Adjuster 72 Second amplitude adjustment unit 72a Second voltage adjustment unit 72b Second frequency adjustment unit 72c Second vibration drive operation time adjustment unit 100 Electronic component mounting device 200 Electronic component supply device A1, A2 Amplitude P Pickup position T1, T2 Drive operation time

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shiro Oji 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 72) Inventor Koji Okawa 1006 Kadoma, Kazuma, Osaka Pref.F-term (reference) in Matsushita Electric Industrial Co., Ltd.

Claims (10)

[Claims] 1. An electronic component supply method for feeding an electronic component contained in a cylindrical stick and sequentially driving the electronic component to a pickup position of the electronic component by vibrating the electronic component, wherein the electronic component is moved to the pickup position. An electronic component supply method, wherein vibration driving for transport is switched to a different type of vibration pattern according to the state of an electronic component being transported. 2. The electronic component according to claim 1, wherein a vibration pattern having a small amplitude is used when the number of the electronic components in the middle of transport is large, and a vibration pattern having a large amplitude is used when the number is small. Supply method. 3. The method according to claim 1, wherein a position of the electronic component being transported is detected, and when the position of the last electronic component is close to the pickup position, the vibration pattern is switched from a vibration pattern having a small amplitude to a vibration pattern having a large amplitude. The electronic component supply method according to claim 1, wherein: 4. The method according to claim 1, wherein the number of times of supply of the electronic component is counted, and when the number of times of supply of the electronic component becomes equal to or more than a predetermined number, a vibration pattern having a small amplitude is switched to a vibration pattern having a large amplitude. Item 1. The electronic component supply method according to Item 1. 5. When the length of the electronic component in the transport direction is large, a vibration pattern with a long drive time of vibration is used, and when the length in the transport direction is small, a vibration pattern with a short drive time of vibration is used. The electronic component supply method according to claim 1, wherein 6. An electronic component supply device for feeding an electronic component contained in a cylindrical stick and sequentially supplying the electronic component to a pickup position of the electronic component by vibrating the electronic component, the stick holding member holding the stick. A transport guide member that receives an electronic component supplied from the tip of the stick and transports the electronic component to the pickup position; a vibration drive source that applies vibration to the stick and the transport guide member; and a vibration drive of the vibration drive source. A controller for controlling a force, wherein the controller has vibration switching means for switching to a different type of vibration pattern according to a state of the electronic component held by the stick and the transport guide member. Feeding device. 7. The electronic component supply device according to claim 6, wherein the vibration switching unit switches to a vibration pattern having a different amplitude according to the number of electronic components in the middle of the conveyance. 8. The apparatus according to claim 6, further comprising a component detection sensor for detecting a position of said electronic component, wherein said vibration switching means switches to a vibration pattern having a different amplitude according to the position of the last electronic component. Electronic parts supply equipment. 9. The apparatus according to claim 1, further comprising a counter for counting the number of times the electronic component is supplied from the pickup position, wherein the vibration switching unit switches to a vibration pattern having a different amplitude according to the number of times the electronic component is supplied. 7. The electronic component supply device according to 6. 10. The electronic component supply device according to claim 6, wherein the vibration switching unit switches to a vibration pattern having a different driving time according to the length of the electronic component in the transport direction.