JP2002088496A - Sn OR Sn ALLOY PLATING MATERIAL FOR TERMINAL AND CONNECTOR - Google Patents
Sn OR Sn ALLOY PLATING MATERIAL FOR TERMINAL AND CONNECTORInfo
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- JP2002088496A JP2002088496A JP2000279212A JP2000279212A JP2002088496A JP 2002088496 A JP2002088496 A JP 2002088496A JP 2000279212 A JP2000279212 A JP 2000279212A JP 2000279212 A JP2000279212 A JP 2000279212A JP 2002088496 A JP2002088496 A JP 2002088496A
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- contact resistance
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、自動車用集合端子
に適する端子、コネクター用Ｓｎ又はＳｎ合金めっき
材、特に高温雰囲気下のエンジンルーム内に実装される
かん合型端子に適するＳｎ又はＳｎ合金めっき材に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal suitable for a collective terminal for automobiles, a Sn or Sn alloy plated material for a connector, and particularly a Sn or Sn alloy suitable for a mating type terminal mounted in an engine room under a high temperature atmosphere. It relates to a plating material.
【０００２】[0002]
【従来の技術】従来、自動車用端子材としては、電気的
信頼性（経時的に接触抵抗が上昇しないこと）及び耐食
性を向上させるために、銅基合金上にＳｎめっきした材
料が使用されている。Ｓｎめっき材の製造方法として、
光沢電気Ｓｎめっき、電気めっき後溶融処理するリフロ
ーＳｎめっき、溶融Ｓｎ中に浸漬する溶融めっきが工業
的に実施されている。このとき、黄銅等のＺｎを含む銅
基合金材では、Ｚｎの粒界拡散によるはんだ濡れ性低下
防止のために、Ｓｎめっきの下地めっきとして、Ｃｕめ
っきやＮｉめっきが施される。2. Description of the Related Art Conventionally, as a terminal material for automobiles, a material plated with Sn on a copper-based alloy has been used in order to improve electrical reliability (the contact resistance does not increase with time) and corrosion resistance. I have. As a method for producing a Sn plating material,
Bright electric Sn plating, reflow Sn plating which undergoes a melting treatment after electroplating, and hot dip plating immersed in molten Sn are industrially practiced. At this time, in a copper-based alloy material containing Zn, such as brass, Cu plating or Ni plating is applied as a base plating of Sn plating in order to prevent a decrease in solder wettability due to a grain boundary diffusion of Zn.
【０００３】昨今、自動車の電装化に伴い、電気配線の
接続部に用いられるコネクターの極数は増加し、コネク
ターかん合時の挿入力は増加する傾向にある。その結
果、自動車組立工程の作業性が低下し、生産効率の低下
が懸念されている。これに対しては、Ｓｎめっき厚さを
制御することによって（一般的にＳｎめっき層は薄いほ
ど摩擦係数が小さくなる）、挿入力を低減した材料開発
が行われている（例えば特開平１０−２６５９９２号公
報、特開２０００−１６４２７９号公報等参照）。一
方、自動車室内の省スペース化の要求から、コネクター
の設置個所は室内からエンジンルーム内への移行が進展
している。その際、エンジンルームでの雰囲気温度は最
大１５０℃程度に到達し、現行のＳｎめっき材で製作さ
れた端子の接触抵抗が増加する問題が顕在化してきた。
接触抵抗が増加すると、電子制御機器の誤作動が懸念さ
れる。[0003] Recently, with the electrification of automobiles, the number of poles of a connector used for a connection portion of an electric wiring is increasing, and the insertion force at the time of mating the connector tends to increase. As a result, the workability of the automobile assembly process is reduced, and there is a concern that the production efficiency may be reduced. In response to this, by controlling the thickness of the Sn plating (generally, the thinner the Sn plating layer, the smaller the friction coefficient becomes), a material having a reduced insertion force has been developed (for example, Japanese Patent Application Laid-Open No. 10-1998). No. 265992 and JP-A-2000-164279). On the other hand, due to the demand for space saving in the vehicle interior, the location of the connector is shifting from the room to the engine room. At that time, the ambient temperature in the engine room reaches a maximum of about 150 ° C., and the problem that the contact resistance of the terminal made of the current Sn plating material increases has become apparent.
When the contact resistance increases, there is a concern that the electronic control device malfunctions.
【０００４】[0004]
【発明が解決しようとする課題】そこで、高温雰囲気下
での電気的信頼性を向上する方法として、Ｓｎめっき下
層に位置する下地めっきの種類の変更（Ａｇ、Ｎｉめっ
き等）が検討されている。これは、Ｃｕ合金素材及びＣ
ｕ下地めっき層中のＣｕ原子がＳｎ又はＳｎ合金めっき
層中へ拡散してＣｕ−Ｓｎ金属間化合物を形成し、高温
雰囲気下においてこれがめっき表面層にまで短期間のう
ちに到達し、接触抵抗を増加させるからである。しか
し、コネクター設置個所の温度が１５０℃程度になる
と、下地めっきの種類にかかわらず、接触抵抗増加の要
因の一つであるＳｎめっきの酸化が顕著になる。従っ
て、従来検討されている下地めっき種類の変更では、接
触抵抗増加を抑制することは困難である。Therefore, as a method of improving the electrical reliability in a high-temperature atmosphere, a change in the type of the undercoat located under the Sn plating (Ag, Ni plating, etc.) is being studied. . This is because Cu alloy material and C
The Cu atoms in the u-underlying plating layer diffuse into the Sn or Sn alloy plating layer to form a Cu-Sn intermetallic compound, which reaches the plating surface layer in a short period of time in a high-temperature atmosphere, and has a contact resistance. Is increased. However, when the temperature of the connector installation location is about 150 ° C., oxidation of Sn plating, which is one of the causes of an increase in contact resistance, becomes remarkable regardless of the type of base plating. Therefore, it is difficult to suppress an increase in the contact resistance by changing the type of the base plating, which has been conventionally studied.
【０００５】本発明は上記の問題点に鑑みてなされたも
ので、高温雰囲気下においても電気的信頼性（低接触抵
抗）を維持することができ、かつ挿入力も低く抑えるこ
とができる端子、コネクター用Ｓｎ又はＳｎ合金めっき
材を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and a terminal and a connector which can maintain electrical reliability (low contact resistance) even in a high-temperature atmosphere and can keep insertion force low. It is an object to provide a plated Sn or Sn alloy material.
【０００６】[0006]
【課題を解決するための手段】本発明に係る端子、コネ
クター用Ｓｎ又はＳｎ合金めっき材は、銅又は銅合金素
材上に、０．１μｍ以上５μｍ以下のめっき厚さでかつ
０．５ｐｐｍ以上５０００ｐｐｍ以下の水素を含むＮｉ
又はＮｉ合金めっき被膜を形成し、その上にＳｎ又はＳ
ｎ合金めっき被膜を形成したことを特徴とする。なお、
水素含有量は質量ｐｐｍである。Means for Solving the Problems The Sn or Sn alloy plating material for terminals and connectors according to the present invention has a plating thickness of 0.1 μm or more and 5 μm or less and 0.5 ppm or more and 5000 ppm or less on a copper or copper alloy material. Ni containing the following hydrogen
Alternatively, a Ni alloy plating film is formed, and Sn or S
An n-alloy plating film is formed. In addition,
The hydrogen content is ppm by mass.
【０００７】[0007]
【発明の実施の形態】上記端子、コネクター用Ｓｎ又は
Ｓｎ合金めっき材において、下地めっきであるＮｉ又は
Ｎｉ合金めっきの厚さが０．１μｍより薄い場合、銅合
金素材中のＣｕ元素の表面への拡散を防止できないた
め、塩水噴霧試験（実施例参照）後の試料表面に腐食生
成物を形成し、外観不良となる。なお、塩水噴霧試験
は、自動車で海岸を走行する場合など塩水の付着を想定
したものであり、その状況での信頼性を確認するための
ものである。一方、Ｎｉ又はＮｉ合金めっき厚さが５μ
ｍより厚くなると、Ｎｉ又はＮｉ合金めっき皮膜自体が
硬質であるため、端子成形時に、めっき皮膜の加工クラ
ックに追随して素材自体にクラックが発生し、曲げ加工
性が著しく低下する。従って、下地めっきであるＮｉ又
はＮｉ合金めっきの厚さは、０．１μｍ以上５μｍ以下
とする。BEST MODE FOR CARRYING OUT THE INVENTION In the above-mentioned Sn or Sn alloy plating material for terminals and connectors, when the thickness of Ni or Ni alloy plating as a base plating is less than 0.1 μm, the surface of Cu element in the copper alloy material is transferred to the surface. Therefore, corrosion products are formed on the surface of the sample after the salt spray test (see Examples), resulting in poor appearance. Note that the salt spray test is based on the assumption of salt water adhesion, such as when traveling on a coast by car, and is for confirming the reliability in that situation. On the other hand, Ni or Ni alloy plating thickness is 5μ.
If the thickness is larger than m, the Ni or Ni alloy plating film itself is hard, so that cracks occur in the material itself following the processing cracks of the plating film during terminal forming, and the bending workability is significantly reduced. Therefore, the thickness of the Ni or Ni alloy plating, which is the base plating, is 0.1 μm or more and 5 μm or less.
【０００８】上記Ｎｉ又はＮｉ合金めっき皮膜が水素を
含有する場合、端子の高温放置試験後の接触抵抗値が低
く維持できる。これは、Ｎｉ又はＮｉ合金めっき皮膜中
の水素が上層のＳｎ又はＳｎ合金めっき表面に拡散し、
酸化したＳｎ又はＳｎ合金めっき皮膜を還元する作用が
あるためである。しかし、Ｎｉ又はＮｉ合金めっき皮膜
中の水素含有量が０．５ｐｐｍより低い場合、高温放置
試験（１５０℃×１００ｈｒ）後の接触抵抗の改善は認
められなかった。一方、水素含有量が５０００ｐｐｍよ
りも高い場合、Ｎｉ又はＮｉ合金めっき時のめっき電流
効率が著しく低下し、めっき時間が長くなり、かつＮｉ
又はＮｉ合金めっき皮膜が硬化し曲げ加工性が低下する
ため、実用的ではない。従って、Ｎｉ又はＮｉ合金めっ
き皮膜中の水素含有量は、０．５ｐｐｍ以上５０００ｐ
ｐｍ以下とする。接触抵抗の改善及び実用性の観点か
ら、より望ましくは５ｐｐｍ以上５００ｐｐｍ以下の範
囲内である。When the Ni or Ni alloy plating film contains hydrogen, the contact resistance value of the terminal after the high-temperature storage test can be kept low. This is because hydrogen in the Ni or Ni alloy plating film diffuses to the upper Sn or Sn alloy plating surface,
This is because there is an action of reducing the oxidized Sn or Sn alloy plating film. However, when the hydrogen content in the Ni or Ni alloy plating film was lower than 0.5 ppm, no improvement in the contact resistance after the high-temperature storage test (150 ° C. × 100 hr) was not observed. On the other hand, when the hydrogen content is higher than 5000 ppm, the plating current efficiency during Ni or Ni alloy plating is significantly reduced, the plating time is increased, and the Ni content is increased.
Alternatively, it is not practical because the Ni alloy plating film hardens and the bending workability decreases. Therefore, the hydrogen content in the Ni or Ni alloy plating film is 0.5 ppm or more and 5000 p
pm or less. From the viewpoints of improvement in contact resistance and practicality, it is more preferably in the range of 5 ppm or more and 500 ppm or less.
【０００９】なお、Ｎｉ又はＮｉ合金めっき皮膜に水素
を含有させる具体的手段としては、上記のように、めっ
きの際に水素を同時に共析させる方法、つまり、めっき
時にカソード表面で発生した水素を取り込ませる方法が
用いられる。この場合、水素が発生するめっき条件で電
解し、水素含有量の調整は浴組成（主としてｐＨ）、電
流密度等を変化させて行う。そのほか、めっき中に水素
をバブリングして含有させる方法、あるいはめっき後に
吸蔵させる方法もある。下地めっきとしてはＮｉめっき
のほか、Ｎｉ−Ｃｏ、Ｎｉ−Ｆｅ等、水素を含有するこ
とが可能な種々のＮｉ合金めっきを用いることができ
る。いずれにしても、水素を含有することで高温放置後
の電気的信頼性を向上することが可能である。As a specific means for containing hydrogen in the Ni or Ni alloy plating film, as described above, a method of co-depositing hydrogen at the time of plating, that is, hydrogen generated on the cathode surface during plating is used. The method of taking in is used. In this case, electrolysis is performed under plating conditions that generate hydrogen, and the adjustment of the hydrogen content is performed by changing the bath composition (mainly pH), the current density, and the like. In addition, there is a method in which hydrogen is contained by bubbling during plating, or a method in which hydrogen is absorbed after plating. As the base plating, in addition to Ni plating, various Ni alloy platings that can contain hydrogen, such as Ni—Co and Ni—Fe, can be used. In any case, by containing hydrogen, it is possible to improve the electrical reliability after being left at a high temperature.
【００１０】また、Ｓｎ又はＳｎ合金めっきの厚さは
０．０５μｍ以上５μｍ以下が望ましい。Ｓｎ又はＳｎ
合金めっき厚さが０．０５μｍより薄い場合、亜硫酸ガ
ス腐食試験（実施例参照）後のめっき表面にニッケルを
含有した硫化物を形成し、接触抵抗が著しく増加する。
なお亜硫酸ガス腐食試験は、排ガスとして亜硫酸ガスが
発生する工業地帯の環境を模し、その環境での信頼性を
確認するためのものである。一方、Ｓｎ又はＳｎ合金め
っき厚さが５μｍより厚い場合、高温放置後のめっき特
性に顕著な差異はなく、また量産性に優れない。従っ
て、Ｓｎ又はＳｎ合金めっき厚さは０．０５μｍ以上５
μｍ以下が好ましい。このなかで、Ｓｎ又はＳｎ合金め
っき厚さが０．０５μｍ以上０．３０μｍ以下の場合、
摩擦係数が低下する。よって、特に低挿入力特性を要求
される端子材は、このめっき厚さの範囲が望ましい。な
お、Ｓｎ又はＳｎ合金めっきとしては、電気光沢めっ
き、リフローめっき、溶融めっき等、いずれの方法で形
成したものでもよい。また、Ｓｎ合金としては、Ｚｎ、
Ｎｉ、Ｃｕ、Ｐｂ、Ａｇ、Ｉｎ、Ｂｉのうち１種又は２
種以上を合計で０．０５〜４０質量％含む合金が挙げら
れる。The thickness of the Sn or Sn alloy plating is desirably 0.05 μm or more and 5 μm or less. Sn or Sn
When the alloy plating thickness is less than 0.05 μm, nickel-containing sulfide is formed on the plating surface after the sulfurous acid gas corrosion test (see Examples), and the contact resistance is significantly increased.
The sulfurous acid gas corrosion test simulates the environment of an industrial area where sulfurous acid gas is generated as exhaust gas, and is for confirming the reliability in the environment. On the other hand, when the thickness of the Sn or Sn alloy plating is greater than 5 μm, there is no remarkable difference in the plating characteristics after being left at a high temperature, and the mass productivity is not excellent. Therefore, the Sn or Sn alloy plating thickness is 0.05 μm or more and 5
μm or less is preferred. Among them, when the Sn or Sn alloy plating thickness is 0.05 μm or more and 0.30 μm or less,
The coefficient of friction decreases. Therefore, particularly for a terminal material that requires low insertion force characteristics, this range of the plating thickness is desirable. The Sn or Sn alloy plating may be formed by any method such as electro-bright plating, reflow plating, and hot-dip plating. Further, as the Sn alloy, Zn,
One or two of Ni, Cu, Pb, Ag, In, and Bi
Alloys containing at least 0.05 to 40% by mass of the total of the seeds are included.
【００１１】[0011]
【実施例】＜供試材の作成条件＞銅合金素材としてＣ２
６００、厚さ０．３０ｍｍの板材を用い、Ｎｉ−Ｈ下地
めっきを種々の厚さ及びＨ含有量で施した後、Ｓｎめっ
きを種々の厚さで施し、これを供試材（Ｎｏ．１〜１
５）とした。Ｎｉ−Ｈ下地めっきのめっき浴及びめっき
条件を表１に、Ｓｎめっきのめっき浴及びめっき条件を
表２に示す。Ｈ含有量の調整はめっき浴成分のＨ２ＳＯ
４の濃度を管理しｐＨを制御することで行った（ｐＨを
低下させた場合、Ｈ含有量が増加する傾向にある）。そ
のほか、上記の銅合金素材にＣｕ下地めっき及びＳｎめ
っきを施したＳｎめっき材（Ｎｏ．１６〜１７；従来
例）を用意した。各供試材のＮｉ−Ｈめっき厚さ、その
Ｈ含有量及びＳｎめっき厚さを表５に示す。[Example] <Conditions for preparing test material> C2 was used as a copper alloy material.
Using a plate material having a thickness of 600 mm and a thickness of 0.30 mm, Ni—H undercoating is applied in various thicknesses and H contents, and then Sn plating is applied in various thicknesses. ~ 1
5). Table 1 shows plating baths and plating conditions for Ni-H undercoating, and Table 2 shows plating baths and plating conditions for Sn plating. The H content is adjusted by adjusting the H 2 SO
The pH was controlled by controlling the concentration of No. 4 (when the pH was lowered, the H content tended to increase). In addition, a Sn plating material (No. 16 to 17; a conventional example) in which the above copper alloy material was subjected to Cu base plating and Sn plating was prepared. Table 5 shows the Ni-H plating thickness, the H content, and the Sn plating thickness of each test material.
【００１２】[0012]
【表１】 [Table 1]
【００１３】[0013]
【表２】 [Table 2]
【００１４】このようにして得た供試材（Ｓｎめっき
材）のそれぞれについて、下記の要領でめっき厚さ及び
Ｎｉめっき皮膜中のＨ含有量を測定し、また高温放置後
の接触抵抗、摩擦係数及び亜硫酸ガス試験後の接触抵抗
の測定試験、並びに塩水噴霧後の外観検査及び曲げ加工
性試験を行った。その結果を表５にあわせて示す。 ［めっき厚さ測定］Ｓｎ及びＮｉめっき厚さは、蛍光Ｘ
線膜厚計（セイコー電子工業株式会社；型式ＳＦＴ１５
６Ａ）を用いて測定した。 ［Ｎｉめっき皮膜中の水素含有量測定］Ｎｉめっき皮膜
中の水素含有量（質量ｐｐｍ）は、真空加熱（真空融
解）定容測圧法（ＪＩＳＺ２６１４に準拠）に基づき測
定した。試料を真空加熱炉に挿入しポンプを用いて超高
真空にした後、室温から８００℃まで加熱した際の発生
した水素量を質量分析計にて求めた。For each of the test materials (Sn-plated materials) thus obtained, the plating thickness and the H content in the Ni plating film were measured in the following manner, and the contact resistance and friction after leaving at high temperature were measured. The test for measuring the coefficient and the contact resistance after the sulfur dioxide gas test, and the appearance inspection and the bending workability test after spraying with salt water were performed. The results are shown in Table 5. [Measurement of plating thickness] The thickness of Sn and Ni plating is
Wire thickness gauge (Seiko Electronics Corporation; Model SFT15
6A). [Measurement of hydrogen content in Ni plating film] The hydrogen content (mass ppm) in the Ni plating film was measured based on a vacuum heating (vacuum melting) constant volume pressure measurement method (based on JISZ2614). After inserting the sample into a vacuum heating furnace and applying ultra-high vacuum using a pump, the amount of hydrogen generated when heated from room temperature to 800 ° C. was determined by a mass spectrometer.
【００１５】［高温放置後の接触抵抗測定］供試材に対
し大気中にて１５０℃×１００ｈｒの熱処理を行った
後、接触抵抗を四端子法により、解放電圧２０ｍＶ、電
流１０ｍＡ、摺動荷重９．８Ｎの条件にて測定した。 ［亜硫酸ガス試験後の接触抵抗測定］供試材に対し表３
に示す条件で亜硫酸ガス試験を行った後、前記と同じ方
法で接触抵抗を測定した。[Measurement of contact resistance after standing at high temperature] After subjecting the test material to a heat treatment at 150 ° C. × 100 hr in the air, the contact resistance was measured by a four-terminal method using an open voltage of 20 mV, a current of 10 mA, and a sliding load. It was measured under the condition of 9.8 N. [Measurement of contact resistance after sulfur dioxide test] Table 3
After performing a sulfurous acid gas test under the following conditions, the contact resistance was measured by the same method as described above.
【表３】 ［塩水噴霧試験後の外観検査］供試材に対し表４に示す
条件で塩水噴霧試験を行った後、外観を検査し、試験後
の供試材表面に変色が発生していないものを○と評価
し、点状の変色が発生したものを×と評価した。[Table 3] [Appearance inspection after salt spray test] After performing a salt spray test on the test material under the conditions shown in Table 4, the appearance was inspected, and if no discoloration occurred on the test material surface after the test, it was evaluated as ○. Was evaluated, and those in which point-like discoloration occurred were evaluated as x.
【表４】 [Table 4]
【００１６】［摩擦係数測定］かん合型端子の接点部の
形状を模擬し、図１に示すように、供試材を内径１．５
ｍｍで半球加工した上下のメス試験片１、２の間にオス
試験片３（板状のままの供試材）を挟み込み、横型荷重
測定器（アイコーエンジニアリング株式会社製Ｍｏｄｅ
ｌ−２１５２）を用いて、オス試験片３を水平方向に引
っ張り、そのときの最大摩擦力Ｆを測定した。オス試験
片３とメス試験片１、２の接触荷重Ｐを２．９４Ｎと
し、摺動速度を８０ｍｍ／ｍｉｎとした。摩擦係数を下
記式（１）により求めた。なお、４はロードセル、矢印
は摺動方向である。 摩擦係数＝Ｆ／２Ｐ・・・・(1)[Measurement of friction coefficient] The shape of the contact portion of the mating type terminal was simulated, and as shown in FIG.
A male test piece 3 (a test piece in the form of a plate) is sandwiched between upper and lower female test pieces 1 and 2 which have been hemispherically processed in mm.
Using 1-2152), the male test piece 3 was pulled in the horizontal direction, and the maximum frictional force F at that time was measured. The contact load P between the male test piece 3 and the female test pieces 1 and 2 was 2.94 N, and the sliding speed was 80 mm / min. The coefficient of friction was determined by the following equation (1). In addition, 4 is a load cell, and an arrow is a sliding direction. Friction coefficient = F / 2P (1)
【００１７】［曲げ加工性］試験片を圧延方向が長手と
なるように切出し、ＪＩＳＨ３１１０に規定されるＷ曲
げ試験治具用い、圧延方向に対して直角方向となるよう
に９．８×１０３Ｎの荷重で曲げ加工を施した。その
後、ミクロトーム法にて、断面を切出し観察を行った。
曲げ加工性評価は、試験後の曲げ加工部に発生したクラ
ックが銅合金素材へ伝播しないレベルを○と評価し、銅
合金素材へ伝播し銅合金素材に亀裂が発生するレベルを
×と評価した。[Bending workability] A test piece was cut out so that the rolling direction became longitudinal, and a W bending test jig specified in JIS H3110 was used, and 9.8 × 10 3 was set so as to be perpendicular to the rolling direction. Bending was performed with a load of N. Thereafter, the cross section was cut out and observed by a microtome method.
In the bending workability evaluation, a level at which cracks generated in the bent portion after the test did not propagate to the copper alloy material was evaluated as ○, and a level at which the crack propagated to the copper alloy material and a crack occurred in the copper alloy material was evaluated as ×. .
【００１８】[0018]
【表５】 [Table 5]
【００１９】表５に示すように、下地Ｎｉ−Ｈめっきの
水素含有量及びめっき厚が本発明の範囲内にあり、Ｓｎ
めっき厚さも適正なＮｏ．１〜１０は高温放置後の接触
抵抗のほか、全ての特性が優れている。一方、下地Ｎｉ
−Ｈめっきの水素含有量が過多のＮｏ．１１と下地Ｎｉ
−Ｈめっきの厚さが過大なＮｏ．１４は曲げ加工性に劣
り、Ｓｎめっき厚さが０．０５μｍに満たないＮｏ．１
２は亜硫酸ガス試験後の接触抵抗が高く、下地Ｎｉ−Ｈ
めっきの厚さが不足するＮｏ．１３は高温放置後の接触
抵抗の改善が不十分で、亜硫酸ガス試験後の接触抵抗及
び塩水噴霧試験後の外観も劣り、下地Ｎｉ−Ｈめっきの
水素含有量が少ないＮｏ．１５は高温放置後の接触抵抗
が高い。なお、見かけの摩擦係数はいずれも小さく、特
にＳｎめっき厚さが０．３μｍ以下のＮｏ．１、２、１
２、１３はさらに小さくなっている。As shown in Table 5, the hydrogen content and the plating thickness of the base Ni—H plating were within the range of the present invention, and Sn
No. No. Nos. 1 to 10 are excellent in all characteristics, in addition to the contact resistance after being left at high temperature. On the other hand, the base Ni
No.-H plating with excessive hydrogen content. 11 and base Ni
No. -H plating with excessive thickness. No. 14 is inferior in bending workability and has a Sn plating thickness of less than 0.05 μm. 1
No. 2 has high contact resistance after the sulfurous acid gas test,
No. with insufficient plating thickness. No. 13 showed insufficient improvement in the contact resistance after standing at high temperature, the contact resistance after the sulfurous acid gas test and the appearance after the salt spray test were poor, and the hydrogen content of the base Ni-H plating was low. No. 15 has high contact resistance after being left at high temperature. The apparent coefficient of friction was small in each case. 1, 2, 1
2, 13 are even smaller.
【００２０】[0020]
【発明の効果】本発明に係る端子、コネクター用Ｓｎ又
はＳｎ合金めっき材は、高温雰囲気下においても電気的
信頼性（低接触抵抗）を維持することができ、かつ挿入
力も低く抑えることができる。また、亜硫酸ガス試験後
の接触抵抗、塩水噴霧試験後の外観及び曲げ加工性にす
ぐれるなど、特に高温雰囲気下のエンジンルーム内に実
装されるかん合型端子に適している。The Sn or Sn alloy plated material for terminals and connectors according to the present invention can maintain electrical reliability (low contact resistance) even under a high-temperature atmosphere, and can suppress insertion force. . In addition, it has excellent contact resistance after a sulfur dioxide test, excellent appearance after a salt spray test, and excellent bending workability, and is particularly suitable for a mating terminal mounted in an engine room under a high-temperature atmosphere.
【図１】 摩擦係数測定治具の概念図である。FIG. 1 is a conceptual diagram of a friction coefficient measuring jig.
１、２ メス試験片 ３ オス試験片 ４ ロードセル 1, 2 Female test piece 3 Male test piece 4 Load cell
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4K024 AA03 AA07 AA14 AA15 AA21 AB02 AB15 BA09 BB10 CA03 GA04 GA07 GA16 4K044 AA06 AB05 BA06 BA10 BB03 BC01 BC02 BC05 BC14 CA11 CA18 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4K024 AA03 AA07 AA14 AA15 AA21 AB02 AB15 BA09 BB10 CA03 GA04 GA07 GA16 4K044 AA06 AB05 BA06 BA10 BB03 BC01 BC02 BC05 BC14 CA11 CA18
Claims (1)
μｍ以下のめっき厚さでかつ０．５ｐｐｍ以上５０００
ｐｐｍ以下の水素を含むＮｉ又はＮｉ合金めっき被膜を
形成し、その上にＳｎ又はＳｎ合金めっき被膜を形成し
たことを特徴とする端子、コネクター用Ｓｎ又はＳｎ合
金めっき材。1. The method according to claim 1, wherein the copper or copper alloy material has a thickness of 0.1 μm or more.
Plating thickness of μm or less and 0.5 ppm or more and 5000
What is claimed is: 1. A Sn or Sn alloy plating material for terminals and connectors, wherein a Ni or Ni alloy plating film containing not more than ppm of hydrogen is formed, and a Sn or Sn alloy plating film is formed thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000279212A JP3659323B2 (en) | 2000-09-14 | 2000-09-14 | Sn or Sn alloy plating material for terminals and connectors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000279212A JP3659323B2 (en) | 2000-09-14 | 2000-09-14 | Sn or Sn alloy plating material for terminals and connectors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002088496A true JP2002088496A (en) | 2002-03-27 |
| JP3659323B2 JP3659323B2 (en) | 2005-06-15 |
Family
ID=18764253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000279212A Expired - Lifetime JP3659323B2 (en) | 2000-09-14 | 2000-09-14 | Sn or Sn alloy plating material for terminals and connectors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3659323B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006086113A (en) * | 2004-08-18 | 2006-03-30 | Yazaki Corp | Low insertion-force connector terminal, its manufacturing method, and board for low insertion-force connector terminal |
| US7104850B2 (en) | 2004-08-18 | 2006-09-12 | Yazaki Corporation | Low insertion-force connector terminal, method of producing the same and substrate for the same |
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| JP2014187056A (en) * | 2013-01-04 | 2014-10-02 | Jx Nippon Mining & Metals Corp | Metal foil for electromagnetic wave shield, and electromagnetic wave shield material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006086113A (en) * | 2004-08-18 | 2006-03-30 | Yazaki Corp | Low insertion-force connector terminal, its manufacturing method, and board for low insertion-force connector terminal |
| US7104850B2 (en) | 2004-08-18 | 2006-09-12 | Yazaki Corporation | Low insertion-force connector terminal, method of producing the same and substrate for the same |
| JP4592532B2 (en) * | 2004-08-18 | 2010-12-01 | 矢崎総業株式会社 | Low insertion force connector terminal, manufacturing method thereof, and low insertion force connector terminal board |
| JP2014187057A (en) * | 2013-01-04 | 2014-10-02 | Jx Nippon Mining & Metals Corp | Metal foil for electromagnetic wave shield, and electromagnetic wave shield material |
| JP2014187056A (en) * | 2013-01-04 | 2014-10-02 | Jx Nippon Mining & Metals Corp | Metal foil for electromagnetic wave shield, and electromagnetic wave shield material |
| WO2015002130A1 (en) * | 2013-07-04 | 2015-01-08 | Jx日鉱日石金属株式会社 | Metal foil for electromagnetic shielding, electromagnetic shielding member, and shielded cable |
| JP2015015328A (en) * | 2013-07-04 | 2015-01-22 | Jx日鉱日石金属株式会社 | Metal foil for electromagnetic wave shield, electromagnetic wave shield material, and shield cable |
| CN105309061A (en) * | 2013-07-04 | 2016-02-03 | Jx日矿日石金属株式会社 | Metal foil for electromagnetic shielding, electromagnetic shielding member, and shielded cable |
| TWI612884B (en) * | 2013-07-04 | 2018-01-21 | Jx Nippon Mining & Metals Corp | Metal foil for electromagnetic wave shielding, electromagnetic wave shielding material, and shielded cable |
| US10842058B2 (en) | 2013-07-04 | 2020-11-17 | Jx Nippon Mining & Metals Corporation | Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable |
| US10221487B2 (en) | 2014-05-30 | 2019-03-05 | Jx Nippon Mining & Metals Corporation | Metal foil for electromagnetic shielding, electromagnetic shielding material and shielded cable |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3659323B2 (en) | 2005-06-15 |
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