JP2002086334A - Curved surface polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a curved surface grinding device capable of improving polishing accuracy by determining the form of an elastic body polishing tool deformed according to the fluctuation of a polishing load and correcting polishing conditions for uniformalizing polishing conditions even if the polishing load fluctuated due to the curved surface to be polished. SOLUTION: In the curved surface grinding device of such constitution that a member M to be polished is polished by a rotating elastic body polishing tool 2 while moving the member M to be polished by moving a base 3 and adding a polishing load by means of a static pressure guiding pneumatic cylinder mechanism 5, a control device 6 determines the deformation quantity of the elastic body polishing tool 2 deformed according to the fluctuation of the polishing load, and the polishing conditions are corrected according to the determined deformation quantity. As deformation quantity of the elastic body polishing tool 2, which varies according to the fluctuation of polishing loads, the radius of gyration of the elastic body polishing tool 2 while the polishing tool 2 is operated actually is calculated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curved surface polishing apparatus for polishing a curved surface of a plastic molding die such as an optical element having a curved surface.

[0002]

2. Description of the Related Art Conventionally, there have been provided a curved surface polishing apparatus for polishing a curved surface of a molding die and the like, and a polishing apparatus for polishing a surface layer of a semiconductor wafer. For example, JP-A-8-19
In the polishing apparatus disclosed in Japanese Patent No. 7404, as shown in FIG.
Then, a pressurizing shaft 32 that can be lowered vertically by its own weight is fitted therein, and a tool 34 is attached to the lower end thereof. Then, the posture of the workpiece (member to be polished) 35 is controlled such that the normal direction of the processing surface of the workpiece 35 is the vertical direction. Thus, the polishing load of the tool 34 is generated by utilizing the own weight of the shaft, and a dedicated pressurizing unit is not required. The direction of movement of the kinetic frictional force applied by the Z-axis slide 31 to the pressing shaft 32 is maintained by keeping the moving direction of the Z-axis slide 31 at one of continuing to be lowered or raised during processing. Is kept constant so that the magnitude of the polishing load does not change during the processing, so that precise processing is possible. Further, in a polishing apparatus for polishing a wafer disclosed in Japanese Patent Application Laid-Open No. 2000-6004, when a polishing head is swung on a wafer fixed upward to a holder to perform polishing, a polishing cloth associated with the polishing head swing is used. The processing accuracy is improved by increasing and decreasing the sequential load of the polishing head in proportion to the increase and decrease of the contact area with the wafer to keep the polishing load constant at all times. The contact area is determined from the shape and dimensions.

[0003]

However, in the prior art disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 8-197404, since the position of the member to be polished is controlled to keep the polishing load constant, the apparatus is complicated. And there is a problem that it becomes large. In the prior art disclosed in Japanese Patent Application Laid-Open No. 2000-6004, since the contact area is calculated from the shape and size, there is no problem if the polishing tool is a rigid body. There is a problem that changes in the contact area and the like due to elastic deformation are not reflected.
Accordingly, an object of the present invention is to solve such a problem of the prior art, and to obtain a shape of an elastic polishing tool which is deformed in accordance with the fluctuation even when the polishing load changes because the polishing surface is a curved surface. Another object of the present invention is to provide a curved-surface polishing apparatus capable of improving polishing accuracy by correcting polishing conditions to make polishing conditions uniform.

[0004]

According to the present invention, in order to achieve the above object, according to the first aspect of the present invention, there is provided an elastic polishing tool which rotates while applying a polishing load while moving a member to be polished. In a curved surface polishing apparatus for polishing a member to be polished, an amount of deformation of the elastic body polishing tool that changes due to a change in the polishing load is obtained, and polishing processing conditions are corrected according to the obtained amount of deformation. According to a second aspect of the present invention, in the first aspect of the present invention, a radius of rotation of the elastic polishing tool at the time of actual operation is calculated as a deformation amount of the elastic polishing tool that changes due to a change in the polishing load. Configuration. According to a third aspect of the present invention, in the second aspect of the present invention, an elastic modulus of the elastic body polishing tool, a shape of the elastic body polishing tool, an elastic modulus of the member to be polished, and a curved surface shape of the member to be polished Of these, at least one of them is taken into account to calculate the turning radius in actual operation. According to a fourth aspect of the present invention, in the second or third aspect of the present invention, the rotational speed of the elastic polishing tool is increased in accordance with the radius of rotation of the elastic polishing tool that has been shortened by deformation. In this manner, the polishing conditions are corrected. According to a fifth aspect of the present invention, in the second or third aspect of the present invention, the polishing target member is placed according to a radius of rotation of the elastic body polishing tool which is shortened by deformation. The polishing processing conditions are corrected so that the moving speed of the mounting member is reduced.

Further, according to the invention described in claim 6, according to claim 2,
Alternatively, in the invention according to claim 3, the polishing process is performed such that a feed pitch of a mounting member on which the polishing target member is mounted is reduced in accordance with a rotational radius of the elastic body polishing tool which has been deformed and shortened. It was designed to correct the conditions. According to a seventh aspect of the present invention, in the first aspect of the present invention, the contact area in actual operation of the elastic polishing tool is calculated as a deformation amount of the elastic polishing tool according to the polishing load. I made it. In the invention according to claim 8,
The invention according to claim 7, wherein at least one of an elastic coefficient of the elastic body polishing tool, a shape of the elastic body polishing tool, an elastic coefficient of the member to be polished, and a curved surface shape of the member to be polished is considered. The contact area at the time of the actual operation was calculated. According to the ninth aspect of the present invention, in the invention of the seventh or eighth aspect, the rotational speed of the elastic body polishing tool is increased by an amount corresponding to a reduction in polishing pressure due to deformation and an increase in the contact area. The polishing processing conditions are corrected so that Claim 10
According to the invention described in claim 7, in the invention according to claim 7 or 8, the feed of the mounting member on which the polishing target member is mounted is reduced by an amount corresponding to a reduction in the polishing pressure due to deformation and an increase in the contact area. The polishing processing conditions are corrected so that the speed is reduced. In the eleventh aspect of the present invention, in the invention of the seventh or eighth aspect, the polishing target member is mounted by an amount corresponding to a reduction in polishing pressure due to deformation and an increase in the contact area. The polishing processing conditions are corrected so as to reduce the feed pitch of the mounting member. In the invention according to claim 12,
In the invention according to any one of the first to eleventh aspects, the elastic body polishing tool has a cylindrical shape.

[0006]

According to the first aspect of the present invention, the amount of deformation of the elastic body polishing tool that changes due to a change in the polishing load is obtained, and the polishing processing conditions are determined according to the obtained amount of deformation. Will be corrected. According to a second aspect of the present invention, in the first aspect of the present invention, the radius of rotation of the elastic polishing tool during actual operation is calculated as the amount of deformation of the elastic polishing tool that changes due to a change in the polishing load. According to a third aspect of the present invention, in the second aspect, at least one of an elastic coefficient of the elastic body polishing tool, a shape of the elastic body polishing tool, an elastic coefficient of the member to be polished, and a curved surface shape of the member to be polished. Is calculated in consideration of the rotation radius in the actual operation. According to the invention described in claim 4, according to claim 2 or claim 3,
In the described invention, the polishing processing conditions are corrected so as to increase the rotation speed of the elastic polishing tool in accordance with the rotational radius of the elastic polishing tool that has been shortened by deformation. According to a fifth aspect of the present invention, in the second or third aspect of the present invention, the movement of the mounting member for mounting the polishing target member according to the rotational radius of the elastic polishing tool which has been deformed and shortened. The polishing processing conditions are corrected so as to reduce the speed. According to a sixth aspect of the present invention, in the second or third aspect of the present invention, the feeding of the mounting member on which the polishing target member is mounted according to the radius of rotation of the elastic polishing tool shortened by deformation. The polishing processing conditions are corrected so as to reduce the pitch. According to a seventh aspect of the present invention, in the first aspect of the present invention, a contact area in actual operation of the elastic body polishing tool is calculated as a deformation amount of the elastic body polishing tool according to a polishing load. According to an eighth aspect of the present invention, in the invention of the seventh aspect, at least one of an elastic coefficient of the elastic body polishing tool, a shape of the elastic body polishing tool, an elastic coefficient of the member to be polished, and a curved surface shape of the member to be polished. Is calculated in consideration of the actual contact area. According to a ninth aspect of the present invention, in the invention of the seventh or eighth aspect, the rotational speed of the elastic body polishing tool is increased by an amount corresponding to a reduction in polishing pressure due to deformation and an increase in the contact area. The polishing conditions are corrected. According to the tenth aspect of the present invention, the mounting member according to the seventh or eighth aspect, in which the polishing target member is mounted by an amount corresponding to a reduction in the polishing pressure due to deformation and an increase in the contact area. The polishing processing conditions are corrected so as to reduce the feed speed of the polishing. In the invention according to claim 11, in the invention according to claim 7 or claim 8,
The polishing conditions are corrected so that the feed pitch of the mounting member on which the member to be polished is mounted is reduced by an amount corresponding to the reduction in the polishing pressure due to the deformation and the increase in the contact area. According to the twelfth aspect of the present invention, the first to the first aspects are provided.
In the invention described in 1, the shape of the elastic body polishing tool is configured to be cylindrical.

[0007]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a configuration diagram showing a curved surface polishing apparatus according to each embodiment of the present invention. As shown in the figure, the curved surface polishing apparatus according to the present embodiment includes a polishing tool 1 having an elastic body polishing tool 2 that rotates at an end with a shaft 21 as a rotation axis, and a base (mounting member) on which a member M to be polished is mounted. ) 3 (3a,
3b), and the base 3 has a linear motion mechanism (not shown) for moving the polishing target member M in the horizontal direction (on the xy plane), that is, in the x-axis direction and the y-axis direction. And a static pressure guide / pneumatic cylinder mechanism 5 and a control device 6 for pressing the elastic body polishing tool 2 against the polishing target member M with an appropriate polishing load. In the illustrated example, the upper base 3a moves in the x-axis direction, and the lower base 3a moves.
b moves in the y-axis direction. FIG. 2 is a diagram showing a cross section of the static pressure guide / pneumatic cylinder mechanism 5. As shown,
The static pressure guide / pneumatic cylinder mechanism 5 includes a fixed part 11 and a movable part 12. The movable part 12 is supported by the fixed part 11 in a non-contact state by a static pressure bearing 13. Thereby, the influence of the friction between the fixed part 11 and the movable part 12 is eliminated, and low pressure control becomes possible. With such a configuration,
In the static pressure guide / pneumatic cylinder mechanism (hereinafter, abbreviated as cylinder mechanism) 5, a pressure difference of air is generated between the A chamber 14 and the B chamber 15, and the elastic body polishing tool 2 is moved according to the pressure difference. Press against the member M to be polished. The air pressure in the A chamber 14 and the B chamber 15 is controlled using an electronic air pressure valve (not shown). With such a configuration, this curved surface polishing apparatus polishes the upper surface of the member to be polished M mounted on the base 3 with the elastic polishing tool 2 rotating. As shown in the figure, the polishing tool 1 is fixed to a fixed static pressure guide / pneumatic cylinder mechanism 5 in a fixed posture. When changing the polishing position, the base 3a is set in the x-axis direction, and the base 3b is set in y. Move in the axial direction. At the time of polishing, the elastic body polishing tool 2 is pressed against the member M to be polished by the pneumatic pressure of the static pressure guide / pneumatic cylinder mechanism 5, and the shaft 21 is polished.
Is used to rotate the elastic body polishing tool 2.

In each embodiment of the present invention, the amount of deformation of the elastic polishing tool 2 that changes due to the changing polishing load is obtained, and the polishing processing conditions are corrected according to the obtained amount of deformation. Since the polished surface of the member M to be polished is a curved surface, the polishing load direction is not always perpendicular to the polished surface, so that the effective polishing load is reduced as compared with the case where the polished surface is perpendicular. Moreover, since the elastic body polishing tool 2 is an elastic body, it is deformed by a polishing load, and therefore, polishing conditions for determining a polishing amount are changed. The relationship between the polishing amount and the polishing conditions is shown below. Equation (1) is an F.F. for determining polishing conditions. W. PREST
It is an empirical rule of ON. H = K · P · V · t (1) where H: polishing amount, K: proportional coefficient, P: polishing pressure,
V: polishing speed (peripheral speed of rotating elastic polishing tool 2),
t: Polishing time. P = F / A (2) where, F: polishing load (polishing load perpendicular to the polishing surface),
A: The contact area (the area where the elastic body polishing tool 2 contacts the polishing target member M). V = r · ω (3) where, r: radius of rotation of the elastic polishing tool 2 during polishing (at the time of actual operation), ω: rotation speed It is. In each embodiment of the present invention, using such a relational expression, a polishing pressure P and a polishing speed V are obtained by obtaining a contact area A and a turning radius r as deformation amounts of the elastic polishing tool 2 which elastically deforms.
Even if the polishing pressure P or the polishing speed V changes, the polishing time t
By manipulating other parameters such as, for example, the polishing amount H in equation (1) is corrected to be constant.

Hereinafter, a first embodiment of the present invention will be described. In this embodiment, the amount of deformation of the elastic polishing tool 2 that changes due to the change in the polishing load F
From the rigidity value (elastic coefficient) of the elastic body polishing tool 2, the turning radius at the time of actual operation of the elastic body polishing tool 2 is calculated. Since the radius of rotation of the elastic polishing tool 2 is reduced by the elastic deformation, the radius of rotation is calculated. FIG. 3 is a diagram illustrating a state in which the turning radius r of the elastic polishing tool 2 decreases from ro to rp as the polishing load F increases. (A) shows a case where there is no polishing load F, and (b) and (c) show a case where there is a polishing load F. The turning radius r in the equation (3) is changed from ro to rp
Becomes smaller, the polishing rate V becomes smaller. Therefore, the parameter (P or t) is set so that the polishing amount H in the equation (1) becomes constant.
Correction to adjust is made. The amount of deformation of the radius of gyration, which is the amount of deformation of the elastic body, can be obtained by the elasticity of material mechanics, or by using the finite element method (FEM). The relationship between the polishing load F and the deformed radius of gyration r may be determined using data such as an approximate expression or a table. Formula (4) shows a calculation formula obtained by elasticity. λ = Kd ｛2 × F (1 / E1 + 1 / E2) ² (1 / d1 + 1 / d2)｝ ^1/3 (4) where λ is a change in radius, Kd is a proportional coefficient, and F is pressing. Force, E1 is the longitudinal modulus of the member to be polished, E2 is the longitudinal modulus of the elastic polishing tool, d1 is the diameter of the member to be polished (infinity for a flat surface, negative diameter for a concave shape), d2 This is the diameter of the elastic polishing tool. As described above, in this embodiment, the elastic coefficient of the elastic polishing tool 2, the shape of the elastic polishing tool 2,
The rotation radius in actual operation is calculated in consideration of the elastic modulus of the member M to be polished and the curved surface shape of the member M to be polished (or only a part thereof).

The control for adjusting the polishing load F and the polishing time r applied from the outside in order to keep the polishing amount H constant is performed by a controller 6.
Do. Since the polishing position that changes every moment from the polishing start time is known in advance, for example, an effective component (a component perpendicular to the polishing surface) of the polishing load at each polishing position is obtained, and a radius of rotation at each time is obtained from the value. Therefore, the control device 6 obtains the speed V from the equation (3) using the radius of gyration, and substitutes the speed V into the equation (1).
The polishing pressure P or the polishing time t at each time when the polishing amount H in equation (1) is constant is determined. Then, for example, when the polishing pressure P is obtained, the control device 6 obtains the polishing load F at each time by the equation (2), and adjusts the static pressure guide / pneumatic cylinder mechanism 5 to the time so that the polishing load F is obtained. Control. Alternatively, the moving speed of the base 3 is controlled by controlling the motor 4 so that the polishing time at the polishing position becomes the determined polishing time t. FIGS. 4A and 4B show:
The polishing locus of the elastic body polishing tool 2 on the polishing target member 2 is shown (FIG. 4 (a) is a perspective view, and FIG. 4 (b) is a plan view). Base movement in the y-axis direction shown as a trajectory (movement of base 3b)
Is controlled so that the polishing time t, which is the time required for the movement from the point a to the point b in FIGS. 4A and 4B, is obtained, for example. That is, in this embodiment, when the turning radius is reduced, the polishing load F applied from the outside is increased or the polishing time t is lengthened correspondingly. Thus, according to this embodiment, even if the polishing load fluctuates because the polishing surface is a curved surface, the turning radius of the elastic polishing tool 2 deformed with the fluctuation is obtained, and the polishing amount is kept constant. Since the polishing processing conditions are corrected in advance, the processing accuracy can be improved.

In the second embodiment of the present invention, the polishing conditions are corrected so that the rotational speed of the elastic polishing tool 2 is increased by an amount corresponding to the reduction of the turning radius r due to the elastic deformation of the elastic polishing tool 2. That is, after obtaining the rotation radius in the same manner as in the first embodiment, the control device 6 rotates the elastic body polishing tool 2 so that the speed V becomes constant by the equation (3). To increase the rotation speed ω by an amount corresponding to the decrease in the rotation radius r. Thus, according to the second embodiment, when the polishing load changes because the polishing surface is a curved surface, the turning radius of the elastic polishing tool 2 deformed in accordance with the fluctuation is obtained, and the polishing amount is fixed. Since the polishing processing conditions are corrected in advance, the processing accuracy can be improved.
In the third embodiment of the present invention, the feed pitch of the base 3a is reduced by an amount corresponding to the reduction of the turning radius r and the reduction of the polishing speed V due to the elastic deformation of the elastic polishing tool 2 (see FIG. 4).
By reducing the feed pitch of the base 3a, the trajectories of the elastic body polishing tool 2 overlap, whereby the polishing time t becomes longer, and the polishing amount H of the formula (1) can be kept constant. The feed pitch control is performed by the control device 6 controlling the rotation of the motor 4 according to the rotation radius r. Thus, according to the third embodiment as well, when the polishing load fluctuates because the polishing surface is a curved surface, the turning radius of the elastic polishing tool 2 deformed in accordance with the fluctuation is obtained, and the polishing amount is kept constant. Since the polishing processing conditions are corrected in advance, the processing accuracy can be improved.

In the fourth embodiment of the present invention, polishing conditions are corrected when the contact area A between the elastic polishing tool 2 and the member M to be polished is increased by the elastic deformation of the elastic polishing tool 2. As is clear from the equation (2), when the contact area A increases, the polishing pressure P decreases. Therefore, correction such as adjusting the parameter (V or t) so that the polishing amount H in the equation (1) becomes constant. It does. The amount of deformation of an elastic body can be obtained by the elasticity of material mechanics, and the finite element method (F
EM). The relationship between the polishing load and the deformed contact area may be determined using data such as an approximate expression or a table. Formula (5) shows a calculation formula obtained by elasticity. a = Kc {(F / 2) (1 / E1 + 1 / E2) / (1 / d1 + 1 / d2)} ^1/3 (5) where a is the radius of the contact area, Kc is the proportional coefficient, and F is Pressing force, E1 is the longitudinal modulus of the member to be polished, E2 is the longitudinal modulus of the elastic polishing tool, d1 is the diameter of the member to be polished (infinity for a flat surface, negative diameter for a concave shape), d2 Is the diameter of the elastic body polishing tool. Thus, in this embodiment,
Considering the elastic coefficient of the elastic body polishing tool 2, the shape of the elastic body polishing tool 2, the elastic coefficient of the member M to be polished, and the curved surface shape of the member M to be polished (or only a part thereof) during actual operation. Is calculated. For example, in this embodiment, after obtaining the contact area A which has become wider due to the elastic deformation of the elastic polishing tool 2, the rotation speed ω of the elastic polishing tool 2 is increased by the decrease in the polishing pressure P, and the polishing speed is increased. By increasing V, the polishing amount H in equation (1) is made constant. Alternatively, the contact area A that has been increased by the elastic deformation of the elastic polishing tool 2 is obtained, and the moving speed of the base 3 is reduced by the reduction in the polishing pressure P. By reducing the speed of the base 3, the polishing time t becomes longer, and the polishing amount H of the formula (1) can be kept constant. Thus, according to this embodiment, even if the polishing load fluctuates because the polishing surface is a curved surface, the contact area between the elastic body polishing tool 2 deformed with the fluctuation and the member M to be polished is obtained, and the polishing is performed. Since the polishing processing conditions are corrected so that the amount becomes constant, the processing accuracy can be improved.

In the fifth embodiment of the present invention, the contact area A which has been increased by the elastic deformation of the elastic polishing tool 2 is determined, and the feed pitch of the base 3 is reduced by the decrease in the polishing pressure P. By reducing the feed pitch of the base 3, the trajectories of the elastic body polishing tool 2 overlap with each other, so that the polishing time t
And the polishing amount H of the formula (1) can be kept constant. In the sixth embodiment of the present invention, in each of the above embodiments, the shape of the elastic body polishing tool 2 is cylindrical. That is,
As shown in FIG. 5 (a), by forming the columnar shape, the shape changes in the thickness direction (L shown in FIG. 5 (a), reference numeral 21 is a rotation axis in FIG. 5 (a)). (In the case of the spherical shape shown in FIG. 5B, the shape change due to the polishing load is large), and when obtaining the deformed shape, the mathematical formula and the FEM model can be simplified. The deformation amount such as the area of the contact region shown in FIG. Further, even if the elastic body polishing tool 2 is worn away due to wear, the shape other than the radius does not change, so that it is possible to cope by correcting the radius (the spherical shape shown in FIG. 5B). In the case of, the ball does not always become smaller, but becomes an elliptical shape like a rugby ball, and the calculation of the deformation amount becomes complicated.)

[0014]

As described above, according to the present invention,
According to the first aspect of the present invention, the amount of deformation of the elastic polishing tool that changes due to a change in the polishing load is obtained, and the polishing processing conditions are corrected according to the obtained amount of deformation, so that the polished surface is a curved surface. Even if the polishing load fluctuates, the polishing processing conditions are made uniform, so that the processing accuracy can be improved. According to a second aspect of the present invention, in the first aspect of the invention, a radius of rotation of the elastic polishing tool during actual operation is calculated as a deformation amount of the elastic polishing tool that changes due to a change in the polishing load. Therefore, it is possible to correct a change in the polishing condition due to a change in the turning radius.
Further, in the invention according to claim 3, in the invention according to claim 2, at least one of an elastic coefficient of the elastic body polishing tool, a shape of the elastic body polishing tool, an elastic coefficient of the member to be polished, and a curved surface shape of the member to be polished. Since the turning radius at the time of actual operation is calculated in consideration of any one, an appropriate turning radius can be calculated. According to the fourth aspect of the present invention,
Alternatively, in the invention according to claim 3, since the polishing processing conditions are corrected so as to increase the rotation speed of the elastic polishing tool in accordance with the radius of rotation of the elastic polishing tool that has been shortened by deformation, the polishing speed is reduced. Can be constant. According to a fifth aspect of the present invention, in the second or third aspect of the invention, there is provided a mounting member for mounting a member to be polished in accordance with a radius of rotation of an elastic body polishing tool shortened by deformation. Since the polishing processing conditions are corrected so as to reduce the moving speed of the polishing, the polishing time becomes longer, and therefore, the polishing amount can be kept constant. In the invention according to claim 6,
In the invention according to claim 2 or 3, polishing is performed so as to reduce the feed pitch of the mounting member on which the object to be polished is mounted according to the radius of rotation of the elastic body polishing tool that has been deformed and shortened. Since the conditions are corrected, the same portions are polished so as to overlap with each other, so that the polishing amount can be kept constant.

Further, according to the invention of claim 7, according to claim 1,
In the described invention, since the contact area during actual operation of the elastic polishing tool is calculated as the deformation amount of the elastic polishing tool according to the polishing load, the change in the polishing processing condition due to the change in the contact area is corrected. can do. Claim 8
In the invention described in claim 7, at least one of an elastic coefficient of the elastic body polishing tool, a shape of the elastic body polishing tool, an elastic coefficient of the member to be polished, and a curved surface shape of the member to be polished is taken into consideration. Thus, the contact area during actual operation is calculated, so that an appropriate contact area can be calculated. According to the ninth aspect of the present invention, in the seventh or eighth aspect,
In the described invention, the polishing conditions are corrected so that the rotational speed of the elastic polishing tool is increased by the amount corresponding to the decrease in the polishing pressure due to the deformation and the increase in the contact area. Can be Further, in the invention according to claim 10, in the invention according to claim 7 or claim 8, the member to be polished is mounted by an amount corresponding to a reduction in polishing pressure due to deformation and an increase in the contact area. Since the polishing processing conditions are corrected so that the feed speed of the placing member is reduced, the polishing time becomes longer, and therefore,
The polishing amount can be constant. According to the eleventh aspect of the invention, in the invention of the seventh or eighth aspect, the polishing target member is mounted by an amount corresponding to a reduction in polishing pressure due to deformation and an increase in the contact area. Since the polishing processing conditions are corrected so as to reduce the feed pitch of the placing member, the same portions are polished so as to be overlapped, so that the polishing amount can be made constant. Claim 1
According to the second aspect of the present invention, in the first to eleventh aspects of the present invention, since the shape of the elastic body polishing tool is formed in a cylindrical shape, a change in the shape with respect to the thickness direction (the height direction of the cylinder). When obtaining a reduced and deformed shape, it is possible to simplify mathematical formulas and FEM models, and it is possible to easily obtain the amount of deformation such as the area of the contact area. Also,
Even if the elastic body polishing tool is shaved by abrasion, the shape other than the radius does not change, so that it is possible to cope by correcting the radius.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a curved surface polishing apparatus according to each embodiment of the present invention.

FIG. 2 is a sectional view showing a main part of a curved surface polishing apparatus according to each embodiment of the present invention.

FIG. 3 is an explanatory view of a main part of a curved surface polishing apparatus showing a first embodiment of the present invention.

FIG. 4 is an explanatory diagram of a main part of a curved surface polishing apparatus showing first and third embodiments of the present invention.

FIG. 5 is an explanatory view of a main part of a curved surface polishing apparatus showing a sixth embodiment of the present invention.

FIG. 6 is a configuration diagram of a polishing apparatus showing an example of a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Polishing tool 2 Elastic body polishing tool 3 Base 4 Motor 5 Static pressure guide / pneumatic cylinder mechanism 6 Control device 11 Fixed part 12 Movable part 13 Static pressure bearing part 21 Shaft

Claims (12)

[Claims] 1. A curved surface polishing apparatus for polishing an object to be polished by an elastic body polishing tool which rotates while applying a polishing load while moving the object to be polished, wherein the elastic body polishing tool changes with a change in the polishing load. Characterized in that a polishing amount is corrected in accordance with the obtained deformation amount. 2. The curved surface polishing apparatus according to claim 1, wherein
A curved surface polishing apparatus, wherein a radius of rotation of the elastic body polishing tool at the time of actual operation is calculated as a deformation amount of the elastic body polishing tool that changes due to a change in the polishing load. 3. The curved surface polishing apparatus according to claim 2, wherein
The elastic radius of the elastic body polishing tool, the shape of the elastic body polishing tool, the elastic modulus of the member to be polished, the curved surface shape of the member to be polished, considering at least one of the turning radius in the actual operation. A curved surface polishing apparatus characterized in that a calculation is performed. 4. The curved surface polishing apparatus according to claim 2, wherein the polishing condition is corrected according to a radius of rotation of the elastic body polishing tool which has been deformed and shortened. A curved surface polishing apparatus, wherein the correction is performed so as to increase the rotation speed. 5. The curved surface polishing apparatus according to claim 2, wherein the polishing conditions are corrected by mounting the polishing target member in accordance with a radius of rotation of the elastic body polishing tool that has been shortened by deformation. A curved surface polishing apparatus, wherein the correction is performed so that the moving speed of the mounting member is reduced. 6. The curved surface polishing apparatus according to claim 2, wherein the polishing condition is corrected by mounting the object to be polished in accordance with a radius of rotation of the elastic body polishing tool that has been shortened by deformation. A curved surface polishing apparatus, wherein the correction is performed so as to reduce the feed pitch of the mounting member being mounted. 7. The curved surface polishing apparatus according to claim 1, wherein
A curved surface polishing apparatus, wherein a contact area of the elastic body polishing tool in actual operation is calculated as a deformation amount of the elastic body polishing tool according to the polishing load. 8. The curved surface polishing apparatus according to claim 7,
The contact area during actual operation in consideration of at least one of the elastic coefficient of the elastic body polishing tool, the shape of the elastic body polishing tool, the elastic coefficient of the member to be polished, and the curved surface shape of the member to be polished. A curved surface polishing apparatus characterized in that a calculation is performed. 9. The polishing tool according to claim 7, wherein the polishing condition is corrected by an amount corresponding to a reduction in polishing pressure due to deformation and an increase in contact area. A curved surface polishing apparatus, wherein the correction is performed such that the rotation speed of the surface is increased. 10. The curved surface polishing apparatus according to claim 7, wherein the polishing conditions are corrected by adjusting the polishing target member by an amount corresponding to a reduction in polishing pressure due to deformation and an increase in the contact area. A curved surface polishing apparatus characterized in that the correction is made so that the feed speed of the placed mounting member is reduced. 11. The curved surface polishing apparatus according to claim 7, wherein the polishing conditions are corrected by reducing the polishing pressure by an amount corresponding to a reduction in polishing pressure due to deformation and an increase in the contact area. A curved surface polishing apparatus, wherein the correction is performed so as to reduce a feed pitch of a mounting member being mounted. 12. The curved surface polishing apparatus according to claim 1, wherein said elastic body polishing tool has a cylindrical shape.