JP2002082723A - Temperature controller - Google Patents
Temperature controllerInfo
- Publication number
- JP2002082723A JP2002082723A JP2000269903A JP2000269903A JP2002082723A JP 2002082723 A JP2002082723 A JP 2002082723A JP 2000269903 A JP2000269903 A JP 2000269903A JP 2000269903 A JP2000269903 A JP 2000269903A JP 2002082723 A JP2002082723 A JP 2002082723A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- duty ratio
- heater
- electrification
- hot air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Control Of Resistance Heating (AREA)
- Control Of Temperature (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ヒータの通電によ
る加熱と冷却用ファンの駆動による冷却を併用して、プ
ラスチック押出機のシリンダ、リフロー半田付け用加熱
炉における熱風等の制御対象の温度を制御する温度制御
装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of controlling the temperature of a controlled object such as hot air in a cylinder of a plastic extruder or a heating furnace for reflow soldering by using both heating by energizing a heater and cooling by driving a cooling fan. The present invention relates to a temperature control device to be controlled.
【０００２】[0002]
【従来の技術】従来、この種の温度制御装置としては、
例えば、図４に示すものが使用されている。これはプラ
スチック押出機１のシリンダ２（制御対象）の温度を制
御する装置であり、シリンダ２の温度を熱電対からなる
温度センサ３により検出し、これを３位置制御による温
度調節部４に入力し、シリンダ２の温度が予め定められ
た設定温度になるようヒータ５への供給電力を制御する
ようにしている。そしてヒータに５よりシリンダ２を加
熱し、プラスチック６を溶融軟化させ、これをスクリュ
ー７の回転で押出機ヘッド（図示せず）側へ移送されて
押し出すことができるようにしている。2. Description of the Related Art Conventionally, as a temperature control device of this kind,
For example, the one shown in FIG. 4 is used. This is a device for controlling the temperature of the cylinder 2 (control target) of the plastic extruder 1, detects the temperature of the cylinder 2 by a temperature sensor 3 composed of a thermocouple, and inputs this to a temperature control unit 4 by three-position control. The power supplied to the heater 5 is controlled so that the temperature of the cylinder 2 becomes a predetermined set temperature. Then, the cylinder 2 is heated by the heater 5 to melt and soften the plastic 6, and the plastic 6 is transferred to the extruder head (not shown) by the rotation of the screw 7 and can be extruded.
【０００３】この際、プラスチック６は移送の過程でス
クリュー７との回転摩擦により発熱し、シリンダ２の温
度がヒータ制御だけでは温度制御が不能になる恐れがあ
るので、冷却用ファン８（ファン以外の送風機を含む）
を前記温度調節部４からの指令で駆動して冷風をシリン
ダ２に吹き付け、シリンダ２が過熱することがないよう
にし、ヒータ５の通電による加熱と冷却用ファン８の駆
動による冷却を併用して、プラスチック押出機１のシリ
ンダ２の温度を制御する構成になっている。At this time, the plastic 6 generates heat due to rotational friction with the screw 7 during the transfer process, and the temperature of the cylinder 2 may not be controlled only by the heater control. Including the blower)
Is driven by a command from the temperature control unit 4 to blow cool air to the cylinder 2 so that the cylinder 2 is not overheated, and heating by energizing the heater 5 and cooling by driving the cooling fan 8 are used in combination. The configuration is such that the temperature of the cylinder 2 of the plastic extruder 1 is controlled.
【０００４】図５はリフロー半田付け用加熱炉９の概要
を示すものである。この炉９は、加熱室１０内にパネル
ヒータ１１、棒状のヒータ１２、不活性ガスを還流させ
る還流ファン１３等を設置して構成され、該炉内に不活
性ガスを満たし、加熱室１０内に電子部品を搭載した回
路基板１４を搬入して、パネルヒータ１１による輻射加
熱と、棒状のヒータ１２及び還流ファン１３により生じ
る熱風の対流加熱との併用により、回路基板１４を半田
付け温度に加熱するように構成されている。FIG. 5 shows an outline of a heating furnace 9 for reflow soldering. The furnace 9 is configured by installing a panel heater 11, a rod-shaped heater 12, a recirculation fan 13 for recirculating an inert gas, and the like in a heating chamber 10, and filling the furnace with an inert gas. The circuit board 14 on which the electronic components are mounted is carried in, and the circuit board 14 is heated to the soldering temperature by the combined use of the radiant heating by the panel heater 11 and the convection heating of the hot air generated by the rod-shaped heater 12 and the recirculation fan 13. It is configured to be.
【０００５】更に、この炉９において使用される前記熱
風（制御対象）の温度制御装置は、還流ファン１３から
吐出される熱風の温度を熱電対からなる温度センサ１５
により検出し、これを温度調節部１６に入力し、熱風の
温度が予め定められた設定温度になるように、前記ヒー
タ１２の通電率を変えて、熱風の温度を制御するように
している。この際、熱風温度は前記パネルヒータ１１か
らの温度の影響を受けるので、パネルヒータ１１との温
度制御のバランスが崩れると、熱風の温度が上昇して制
御不能になるケースがある。このため、熱風の温度を高
くなり過ぎた場合、冷却用ファン１７を駆動して冷風を
熱風の還流流路に吹き付け、熱風の温度が上がり過ぎな
いようにし、ヒータ１２の通電による加熱と冷却用ファ
ン１７の駆動による冷却を併用して、炉内を還流する熱
風の温度を制御する構成になっている。Further, the temperature control device for the hot air (control object) used in the furnace 9 uses a temperature sensor 15 comprising a thermocouple to measure the temperature of the hot air discharged from the recirculation fan 13.
The temperature of the hot air is controlled by changing the energization rate of the heater 12 so that the temperature of the hot air reaches a predetermined set temperature. At this time, since the temperature of the hot air is affected by the temperature from the panel heater 11, if the balance of the temperature control with the panel heater 11 is lost, the temperature of the hot air may rise and the control becomes impossible. For this reason, when the temperature of the hot air becomes too high, the cooling fan 17 is driven to blow the cool air to the hot air return flow path so that the temperature of the hot air does not become too high. The cooling by the driving of the fan 17 is also used to control the temperature of the hot air circulating in the furnace.
【０００６】[0006]
【発明が解決しようとする課題】図４に示す温度制御装
置では、３位置制御による温度調節部４を用いて制御対
象であるシリンダ２の温度が設定温度になるよう、冷却
用ファン８を常時駆動させなければならないので、装置
構造が複雑になる問題があった。In the temperature control device shown in FIG. 4, the cooling fan 8 is constantly operated so that the temperature of the cylinder 2 to be controlled becomes the set temperature by using the temperature control unit 4 by three-position control. Since the device has to be driven, there is a problem that the structure of the device becomes complicated.
【０００７】また、図５に示す温度制御装置は、温度調
節部１６でヒータ１２の通電率を変えると共に、制御対
象である熱風の温度が上がり過ぎたときに、冷却用ファ
ン１７を駆動するようにしているが、冷却用ファン１７
の駆動を開始するときの熱風の温度を予め設定する必要
があり、この設定に手間がかかるほか、温度設定に熟練
を要し、その温度設定を誤ると、制御不能になる恐れが
あり、温度制御の操作性及び信頼性が劣るという問題が
あった。これは、前記したプラスチック押出機１のシリ
ンダ２やリフロー半田付け用加熱炉９の熱風以外の制御
対象について、ヒータの通電による加熱と冷却用ファン
の駆動による冷却を併用して温度を制御する装置にも該
当する問題であった。The temperature controller shown in FIG. 5 changes the duty ratio of the heater 12 by the temperature controller 16 and drives the cooling fan 17 when the temperature of the hot air to be controlled rises too much. But the cooling fan 17
It is necessary to set the temperature of the hot air at the time of starting the drive of the motor in advance, and it takes time and effort to set the temperature. There was a problem that the operability and reliability of the control were poor. This is an apparatus for controlling the temperature of a control object other than the hot air of the cylinder 2 of the plastic extruder 1 and the heating furnace 9 for reflow soldering by using both heating by energizing a heater and cooling by driving a cooling fan. The problem was also applicable.
【０００８】本発明は前記の課題を解決し、操作性及び
信頼性に優れ、装置構造が簡単で安価に得られる温度制
御装置を提供することを目的とする。An object of the present invention is to solve the above-mentioned problems, and to provide a temperature control device which is excellent in operability and reliability, has a simple device structure, and can be obtained at low cost.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本発明の温度制御装置は、ヒータの通電による加熱
と冷却用ファンの駆動による冷却を併用して制御対象の
温度を予め定められた設定温度になるよう制御するもの
において、制御対象の温度を検出する温度センサと、そ
の検出温度と前記設定温度とを比較し、検出温度の設定
温度に対する温度差を検出する温度比較部と、その温度
差が正側に大きくなるに伴いヒータの通電率が低くなる
ようにその通電率を調節するヒータの通電率調節部と、
これにより調節された新通電率と設定温度における設定
通電率とを比較し、新通電率の設定通電率に対する通電
率差を検出する通電率比較部と、その通電率差が負側に
シフトして、新通電率が設定通電率より低くなったと
き、冷却用ファンを駆動して制御対象を冷却するファン
駆動制御手段とを備えた構成になっている。In order to achieve the above-mentioned object, a temperature control apparatus according to the present invention uses a combination of heating by energizing a heater and cooling by driving a cooling fan to determine a temperature of a control object in advance. A temperature sensor that detects a temperature of a control target, a temperature comparator that compares the detected temperature with the set temperature, and detects a temperature difference between the detected temperature and the set temperature, An energization rate adjustment unit for the heater that adjusts the energization rate so that the energization rate of the heater decreases as the temperature difference increases to the positive side;
A duty ratio comparing unit that compares the adjusted new duty ratio with the set duty ratio at the set temperature and detects a duty ratio difference with respect to the set duty ratio of the new duty ratio, and the duty ratio difference shifts to a negative side. And a fan drive control means for driving the cooling fan to cool the control target when the new duty ratio becomes lower than the set duty ratio.
【００１０】このような構成により、ヒータの通電率調
節部で調節された新通電率が設定通電率より低くなった
とき、冷却用ファンを駆動して制御対象を冷却するか
ら、冷却用ファンの駆動を開始するときの熱風の温度を
予め設定する必要がなくなり、手間が省けるほか、運転
者（オペレータ）が温度設定に習熟する必要もなく、温
度設定を誤るというミスを犯す恐れもなくなり、温度制
御の操作性及び信頼性を向上させることができる。ま
た、制御対象の温度が設定温度よりも大きく上昇してか
らではなく、設定温度より少し上昇し始めた比較的初期
の段階から、早めに温度制御を行うので、温度制御を迅
速、容易に、且つ、精度よく行うことが可能になる。ま
た、制御装置も特別な部品、回路を設計、製作して組み
立てる必要がなく、構造が簡単になり、安価に得ること
ができる。更に、冷却用ファンを常時駆動させて制御対
象の温度を制御する必要がなくなり、電力消費量を節減
することもできる。With this configuration, when the new duty ratio adjusted by the duty ratio adjustment unit of the heater becomes lower than the set duty ratio, the cooling fan is driven to cool the control target. There is no need to preset the temperature of the hot air at the start of driving, which saves time and effort, and also eliminates the need for the operator (operator) to become proficient in setting the temperature, and to avoid making mistakes in setting the temperature. Operability and reliability of control can be improved. Also, rather than after the temperature of the control target has risen significantly above the set temperature, rather than at a relatively early stage when it has started to rise slightly from the set temperature, temperature control is performed early, so temperature control can be performed quickly and easily, In addition, it can be performed with high accuracy. Also, the control device does not need to design, manufacture and assemble special parts and circuits, so that the structure is simplified and can be obtained at low cost. Further, it is not necessary to control the temperature of the control object by constantly driving the cooling fan, and the power consumption can be reduced.
【００１１】[0011]
【発明の実施の形態】次に、本発明の一実施形態を図面
により詳細に説明する。図１に示す温度制御装置は、例
えば、リフロー半田付け用加熱炉の熱風の温度制御に適
用したものであり、従来の技術で説明したものと同一構
成、機能を有するものには、同一符号を付してある。Next, an embodiment of the present invention will be described in detail with reference to the drawings. The temperature control device shown in FIG. 1 is applied, for example, to temperature control of hot air of a heating furnace for reflow soldering, and components having the same configuration and function as those described in the related art are denoted by the same reference numerals. It is attached.
【００１２】前記リフロー半田付け用加熱炉９は、加熱
室１０内にパネルヒータ１１、棒状のヒータ１２、不活
性ガスを還流させる還流ファン１３等を設置して構成さ
れ、該炉内に窒素ガス等の不活性ガスを満たし、加熱室
１０内に電子部品を搭載した回路基板１４を搬入して、
パネルヒータ１１による輻射加熱と、棒状のヒータ１２
及び還流ファン１３により生じる熱風の対流加熱との併
用により、回路基板１４を半田付け温度に加熱するよう
に構成されている。The heating furnace 9 for reflow soldering comprises a heating chamber 10 provided with a panel heater 11, a rod-shaped heater 12, a recirculation fan 13 for recirculating an inert gas, and the like. And the like, and the circuit board 14 on which the electronic components are mounted is loaded into the heating chamber 10.
Radiant heating by panel heater 11 and rod-shaped heater 12
The circuit board 14 is configured to be heated to the soldering temperature in combination with the convection heating of the hot air generated by the recirculation fan 13.
【００１３】この加熱炉９で使用される前記熱風（制御
対象）の温度制御装置は、前記棒状のヒータ１２の通電
による炉内雰囲気（不活性ガス）の加熱（熱風発生）
と、冷却用ファン１７（ファン以外の送風機を含む）の
駆動による熱風の冷却を併用して熱風（制御対象）の温
度を予め定められた設定温度になるよう制御するもので
ある。The hot air (control target) temperature control device used in the heating furnace 9 heats the atmosphere (inert gas) in the furnace (inert gas) by energizing the rod-shaped heater 12.
And cooling of the hot air by driving the cooling fan 17 (including a fan other than the fan) to control the temperature of the hot air (the control target) to a predetermined set temperature.
【００１４】更に詳細に説明すると、還流ファン１３の
熱風吐出側には、例えば熱電対からなる温度センサ１５
が設けられ、還流ファン１３から吐出される熱風の温度
を検出するようになっている。１８は温度センサ１５で
検出された前記熱風の検出温度と温度設定部１９で予め
設定された設定温度とを比較し、検出温度の設定温度に
対する温度差を検出する温度比較部である。More specifically, a temperature sensor 15 composed of, for example, a thermocouple is provided on the hot air discharge side of the recirculation fan 13.
For detecting the temperature of the hot air discharged from the recirculation fan 13. Reference numeral 18 denotes a temperature comparison unit that compares the detected temperature of the hot air detected by the temperature sensor 15 with a preset temperature preset by the temperature setting unit 19, and detects a temperature difference between the detected temperature and the preset temperature.
【００１５】２０はこの温度差に応じて前記ヒータ１２
の通電率を調節するヒータの通電率調節部であり、図２
に示すように、検出温度の設定温度に対する温度差が負
（−）のときは、ヒータの通電率が設定温度における設
定通電率より高くなり、該温度差が正（＋）のときは、
ヒータの通電率が設定温度における設定通電率より低く
なり、且つ、該温度差が正側に大きくなるに伴い、ヒー
タの通電率が半比例して低くなるように、温度差と通電
率に関するプログラムが内蔵されている。そして、前記
温度差が正側に大きくなるに伴いヒータ１２の通電率が
低くなるようにその通電率を調節するようになってい
る。なお、この通電率調節部２０により調節された新通
電率の信号は半導体スイッチ（ＳＳＣ）２１に入って該
スイッチ２１が動作（スイッチＯＮ）し、ヒータ通電制
御手段２２により該通電率に応じた電力がヒータ１２に
供給され、ヒータ１２が所定温度に加熱される。Reference numeral 20 denotes the heater 12 according to the temperature difference.
FIG. 2 is a diagram showing a heater duty ratio adjusting unit for adjusting the duty ratio of the heater.
As shown in (2), when the temperature difference between the detected temperature and the set temperature is negative (-), the duty ratio of the heater becomes higher than the set duty ratio at the set temperature, and when the temperature difference is positive (+),
A program relating to the temperature difference and the duty ratio so that the heater duty ratio becomes lower in half proportion as the heater duty ratio becomes lower than the set duty ratio at the set temperature and the temperature difference increases to the positive side. Is built-in. The duty ratio of the heater 12 is adjusted so that the duty ratio of the heater 12 decreases as the temperature difference increases toward the positive side. The signal of the new duty ratio adjusted by the duty ratio adjustment unit 20 enters the semiconductor switch (SSC) 21 and the switch 21 is operated (switch ON), and the heater current control unit 22 responds to the duty ratio. Electric power is supplied to the heater 12, and the heater 12 is heated to a predetermined temperature.
【００１６】２３は通電率調節部２０により調節された
新通電率と設定温度における設定通電率とを比較し、新
通電率の設定通電率に対する通電率差を検出する通電率
比較部、２４はその通電率差が負側にシフトして、新通
電率が設定通電率より低くなったとき、冷却用ファン１
７を駆動して前記熱風を冷却するファン駆動制御手段で
ある。本実施形態の温度制御装置は上記のような構成に
なっている。Reference numeral 23 denotes a duty ratio comparing unit which compares the new duty ratio adjusted by the duty ratio adjusting unit 20 with the set duty ratio at the set temperature, and detects a difference between the new duty ratio and the set duty ratio. When the difference in the duty ratio shifts to the negative side and the new duty ratio becomes lower than the set duty ratio, the cooling fan 1
7 is a fan drive control means for driving the hot air to cool the hot air. The temperature control device of the present embodiment is configured as described above.
【００１７】次に、本実施形態の温度制御装置の作動に
ついて図３の流れ図に従って説明する。先ず、最初に温
度設定部１９で前記加熱炉９内を還流する熱風の設定温
度（例えば２００℃）を予め設定する。また、ヒータ１
２の通電率を設定温度（例えば２００℃）における設定
通電率（例えば５０％）に予め設定しておく。Next, the operation of the temperature control device according to the present embodiment will be described with reference to the flowchart of FIG. First, the temperature setting unit 19 sets a preset temperature (for example, 200 ° C.) of the hot air circulating in the heating furnace 9 in advance. Also, heater 1
2 is set in advance to a set duty ratio (for example, 50%) at a set temperature (for example, 200 ° C.).
【００１８】このような各設定操作を行った後、半導体
スイッチ２１をＯＮし、ヒータ通電制御手段２２によ
り、ヒータ１２に設定通電率で電力を供給してヒータ１
２を通電すると共に、還流ファン１３を駆動して炉内に
充満させた不活性ガスを加熱して熱風を発生させ、加熱
室１０内に搬入された前記回路基板１４の対流加熱を開
始する。なお、詳細な説明は省略するが、回路基板１４
にはパネルヒータ１１による輻射加熱も併用され、別の
手段で温度制御されている。After performing each of these setting operations, the semiconductor switch 21 is turned on, and the heater power supply control means 22 supplies electric power to the heater 12 at the set power supply rate, so that the heater 1 is turned on.
2 and the recirculation fan 13 is driven to heat the inert gas filled in the furnace to generate hot air, and convection heating of the circuit board 14 carried into the heating chamber 10 is started. Although detailed description is omitted, the circuit board 14
, Radiation heating by the panel heater 11 is also used, and the temperature is controlled by another means.
【００１９】次に熱風による炉内の対流加熱が開始する
と同時に、その熱風の温度制御が行われる。即ち、この
熱風の温度は温度センサ１５で検出される。そして、そ
の検出温度は温度比較部１８で設定温度と比較され、検
出温度に対する設定温度の温度差が検出される。そし
て、その温度差に応じてヒータ１２の通電率が通電率調
節部２０で調節される。Next, at the same time when the convection heating in the furnace by the hot air starts, the temperature of the hot air is controlled. That is, the temperature of the hot air is detected by the temperature sensor 15. Then, the detected temperature is compared with the set temperature by the temperature comparing section 18, and a temperature difference between the detected temperature and the set temperature is detected. Then, the duty ratio of the heater 12 is adjusted by the duty ratio adjustment unit 20 according to the temperature difference.
【００２０】即ち、熱風の温度が設定温度よりも低くな
ると、その温度差が負になるため、通電率が設定通電率
よりも高くなり、また、熱風の温度が設定温度よりも高
くなると、その温度差が正になるため、通電率が設定通
電率よりも低くなるように通電率が調節される。そし
て、調節された新通電率に基づき、ヒータ通電制御手段
２２により、ヒータ１２に供給される電力の供給・停止
時間比率、強弱時間比率、最大許容供給電力に対する実
使用電力の割合等の通電容量が調節され、ヒータ１２の
加熱温度が変化して熱風の温度が制御される。That is, when the temperature of the hot air becomes lower than the set temperature, the temperature difference becomes negative, so that the duty ratio becomes higher than the set duty ratio, and if the temperature of the hot air becomes higher than the set temperature, the temperature becomes higher. Since the temperature difference becomes positive, the duty ratio is adjusted so that the duty ratio becomes lower than the set duty ratio. Then, based on the adjusted new power supply rate, the power supply capacity such as the supply / stop time ratio of power supplied to the heater 12, the strength time ratio, and the ratio of the actually used power to the maximum allowable supply power is controlled by the heater power supply control means 22. Is adjusted, and the heating temperature of the heater 12 is changed to control the temperature of the hot air.
【００２１】換言すると、熱風の温度が設定温度よりも
低くなると、通電率が設定通電率よりも高くなるので、
ヒータ１２の通電時間が増え、熱風の温度が上昇し設定
温度に近づく。熱風の温度が設定温度よりも高くなる
と、通電率が設定通電率よりも低くなるので、ヒータ１
２の通電時間が減少し、熱風温度が下降し設定温度に近
づく。In other words, when the temperature of the hot air becomes lower than the set temperature, the duty ratio becomes higher than the set duty ratio.
The energization time of the heater 12 increases, and the temperature of the hot air rises and approaches the set temperature. When the temperature of the hot air becomes higher than the set temperature, the duty ratio becomes lower than the set duty ratio.
2, the energization time is reduced, the hot air temperature falls, and approaches the set temperature.
【００２２】一方、このようなヒータ１２の通電率調節
と共に、通電率調節部２０で調節された新通電率は、通
電率比較部２３で設定通電率と比較され、新通電率の設
定通電率に対する通電率差が検出される。そして、その
通電率差が正の場合には、冷却用ファン１７は駆動され
ず停止している。また、ヒータ１２の通電率が高く調節
される。これより、熱風の温度を効率よく速やかに上昇
させて、設定温度に近づけることが可能になる。On the other hand, the new duty ratio adjusted by the duty ratio adjustment unit 20 is compared with the set duty ratio by the duty ratio comparison unit 23 together with the adjustment of the duty ratio of the heater 12, and the set duty ratio of the new duty ratio is set. Is detected. When the difference in the duty ratio is positive, the cooling fan 17 is stopped without being driven. In addition, the duty ratio of the heater 12 is adjusted to be high. This makes it possible to efficiently and quickly raise the temperature of the hot air to approach the set temperature.
【００２３】更に、その通電率差が負側にシフトして新
通電率が設定通電率より低くなったときには、ファン駆
動制御手段２４が作動して冷却用ファン１７が駆動を開
始すると共に、ヒータ１２の通電率が低く調節される。
このように熱風の温度が設定温度より少し上昇し始めた
比較的早い段階から、早めに冷却用ファン１７による熱
風の冷却が行われるので、熱風の温度制御を迅速、容易
に、且つ、精度よく行うことが可能になる。Further, when the difference in the duty ratio shifts to the negative side and the new duty ratio becomes lower than the set duty ratio, the fan drive control means 24 operates to start the driving of the cooling fan 17 and the heater. 12 is adjusted to be low.
As described above, the cooling of the hot air by the cooling fan 17 is performed early from a relatively early stage when the temperature of the hot air slightly starts to rise from the set temperature, so that the temperature of the hot air can be quickly, easily, and accurately controlled. It is possible to do.
【００２４】本実施形態の温度制御装置はリフロー半田
付け用加熱炉における熱風の温度制御に適用した場合に
ついて説明したが、ゴム、プラスチック押出機における
シリンダその他の制御対象について、ヒータの通電によ
る加熱と冷却用ファンの駆動による冷却を併用して行う
温度制御にも適用できるものである。The temperature control device of this embodiment has been described as applied to temperature control of hot air in a heating furnace for reflow soldering. However, for a cylinder or other controlled object in a rubber or plastic extruder, heating and energization of a heater are performed. The present invention can also be applied to temperature control performed in combination with cooling by driving a cooling fan.
【００２５】[0025]
【発明の効果】以上説明したように、本発明によれば、
ヒータの通電による加熱と冷却用ファンの駆動による冷
却を併用して制御対象の温度を予め定められた設定温度
になるよう制御するものにおいて、制御対象の温度を検
出する温度センサと、その検出温度と前記設定温度とを
比較し、検出温度の設定温度に対する温度差を検出する
温度比較部と、その温度差が正側に大きくなるに伴いヒ
ータの通電率が低くなるようにその通電率を調節するヒ
ータの通電率調節部と、これにより調節された新通電率
と設定温度における設定通電率とを比較し、新通電率の
設定通電率に対する通電率差を検出する通電率比較部
と、その通電率差が負側にシフトして、新通電率が設定
通電率より低くなったとき、冷却用ファンを駆動して制
御対象を冷却するファン駆動制御手段とを備えて構成さ
れるので、冷却用ファンの駆動を開始するときの熱風の
温度を予め設定する必要がなく、手間が省けるほか、温
度制御の操作性及び信頼性を向上させることができる。
また、制御対象の温度が設定温度より少し上昇し始めた
段階から、早めに温度制御を行うので、温度制御を迅
速、容易に、且つ、精度よく行うことが可能になる。ま
た、制御装置も特別な部品、回路を必要としないので、
構造が簡単になり、安価に得ることができる。更に、冷
却用ファンを常時駆動させて制御対象の温度を制御する
必要がなくなり、電力消費量を節減することもできる。As described above, according to the present invention,
A temperature sensor for detecting the temperature of a control target, wherein the temperature of the control target is controlled to be a predetermined set temperature by using both heating by energizing a heater and cooling by driving a cooling fan, and detecting the detected temperature. And a temperature comparison unit that compares the set temperature with the set temperature to detect a temperature difference between the detected temperature and the set temperature, and adjusts the duty ratio so that the duty ratio of the heater decreases as the temperature difference increases toward the positive side. A duty ratio adjustment unit for the heater to perform, a duty ratio comparison unit that compares the new duty ratio adjusted thereby and the set duty ratio at the set temperature, and detects a duty ratio difference with respect to the set duty ratio of the new duty ratio; When the difference in the duty ratio shifts to the negative side and the new duty ratio becomes lower than the set duty ratio, the cooling unit is configured to include a fan drive control unit that drives the cooling fan to cool the control target. For Previously it is not necessary to set the temperature of hot air when starting the driving of the down, labor can be saved in addition, it is possible to improve the operability and reliability of temperature control.
In addition, since the temperature control is performed early from the stage when the temperature of the control target slightly starts to rise from the set temperature, it is possible to perform the temperature control quickly, easily, and accurately. Also, the control unit does not need special parts and circuits,
The structure is simple and can be obtained at low cost. Further, it is not necessary to control the temperature of the control object by constantly driving the cooling fan, and the power consumption can be reduced.
【図１】本発明の一実施形態を示す温度制御装置で、リ
フロー半田付け用加熱炉の熱風の温度制御に適用した構
成図である。FIG. 1 is a configuration diagram of a temperature control device according to an embodiment of the present invention, which is applied to temperature control of hot air in a heating furnace for reflow soldering.
【図２】図１の温度制御装置において、熱風の検出温度
の設定温度に対する温度差とヒータの通電率との関係を
示すグラフである。FIG. 2 is a graph showing a relationship between a temperature difference of a detected temperature of hot air with respect to a set temperature and a duty ratio of a heater in the temperature control device of FIG.
【図３】図１の温度制御装置の作動に関する流れ図であ
る。FIG. 3 is a flowchart relating to the operation of the temperature control device of FIG. 1;
【図４】従来の温度制御装置として、プラスチック押出
機のシリンダの温度制御に適用した例を示す構成図であ
る。FIG. 4 is a configuration diagram showing an example in which a conventional temperature control device is applied to temperature control of a cylinder of a plastic extruder.
【図５】従来の温度制御装置として、リフロー半田付け
用加熱炉の熱風の温度制御に適用した例を示す構成図で
ある。FIG. 5 is a configuration diagram showing an example of a conventional temperature control apparatus applied to temperature control of hot air in a heating furnace for reflow soldering.
９ リフロー半田付け用加熱炉 １０ 加熱室 １１ パネルヒータ １２ 棒状のヒータ １３ 還流ファン １４ 回路基板 １５ 温度センサ １７ 冷却用ファン １８ 温度比較部 １９ 温度設定部 ２０ ヒータの通電率調節部 ２１ 半導体スイッチ ２２ ヒータ通電制御手段 ２３ 通電率比較部 ２４ ファン駆動制御用手段 Reference Signs List 9 heating furnace for reflow soldering 10 heating chamber 11 panel heater 12 rod-shaped heater 13 recirculation fan 14 circuit board 15 temperature sensor 17 cooling fan 18 temperature comparison unit 19 temperature setting unit 20 heater duty ratio adjustment unit 21 semiconductor switch 22 heater Power supply control means 23 Power supply rate comparison unit 24 Fan drive control means
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｂ 3/00 ３１０ Ｈ０５Ｂ 3/00 ３１０Ｅ Ｆターム(参考） 3K058 AA02 AA04 AA41 AA81 AA91 BA15 CA12 CA22 CB14 CB24 CC03 CE05 CE16 CE19 5H323 AA05 CA02 CB02 CB25 CB33 CB45 DA01 DB01 DB11 EE01 EE16 FF01 GG02 KK05 MM09──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (reference) H05B 3/00 310 H05B 3/00 310E F-term (reference) 3K058 AA02 AA04 AA41 AA81 AA91 BA15 CA12 CA22 CB14 CB24 CC03 CE05 CE16 CE19 5H323 AA05 CA02 CB02 CB25 CB33 CB45 DA01 DB01 DB11 EE01 EE16 FF01 GG02 KK05 MM09
Claims (1)
の駆動による冷却を併用して制御対象の温度を予め定め
られた設定温度になるよう制御する温度制御装置におい
て、制御対象の温度を検出する温度センサと、その検出
温度と前記設定温度とを比較し、検出温度の設定温度に
対する温度差を検出する温度比較部と、その温度差が正
側に大きくなるに伴いヒータの通電率が低くなるように
その通電率を調節するヒータの通電率調節部と、これに
より調節された新通電率と設定温度における設定通電率
とを比較し、新通電率の設定通電率に対する通電率差を
検出する通電率比較部と、その通電率差が負側にシフト
して、新通電率が設定通電率より低くなったとき、冷却
用ファンを駆動して制御対象を冷却するファン駆動制御
手段とを備えたことを特徴とする温度制御装置。1. A temperature control device for controlling a temperature of a control target to a predetermined set temperature by using both heating by energizing a heater and cooling by driving a cooling fan to detect the temperature of the control target. A temperature sensor, a temperature comparison unit that compares the detected temperature with the set temperature and detects a temperature difference between the detected temperature and the set temperature, and as the temperature difference increases to the positive side, the duty ratio of the heater decreases. The duty ratio of the heater that adjusts the duty ratio is compared with the new duty ratio adjusted by the heater and the set duty ratio at the set temperature to detect a difference between the duty ratio of the new duty ratio and the set duty ratio. A duty ratio comparison unit, and a fan drive control unit that drives a cooling fan to cool a control target when the duty ratio is shifted to the negative side and the new duty ratio is lower than the set duty ratio. Was it A temperature control device characterized by the above-mentioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000269903A JP4435394B2 (en) | 2000-09-06 | 2000-09-06 | Temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000269903A JP4435394B2 (en) | 2000-09-06 | 2000-09-06 | Temperature control device |
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| Publication Number | Publication Date |
|---|---|
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| JP4435394B2 JP4435394B2 (en) | 2010-03-17 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006202858A (en) * | 2005-01-18 | 2006-08-03 | Taiyo Denki Sangyo Kk | Reworking method and reworking device |
| CN100460119C (en) * | 2007-04-09 | 2009-02-11 | 盐城市康杰机械制造有限公司 | Temperature control method for heating soldering area of intermittent type gas protecting soldering furnace |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018176448A1 (en) * | 2017-04-01 | 2018-10-04 | 深圳市鑫华威机电设备有限公司 | Method and system for controlling welding of semi-automatic electric welding machine |
-
2000
- 2000-09-06 JP JP2000269903A patent/JP4435394B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006202858A (en) * | 2005-01-18 | 2006-08-03 | Taiyo Denki Sangyo Kk | Reworking method and reworking device |
| JP4663338B2 (en) * | 2005-01-18 | 2011-04-06 | 太洋電機産業株式会社 | Rework method |
| CN100460119C (en) * | 2007-04-09 | 2009-02-11 | 盐城市康杰机械制造有限公司 | Temperature control method for heating soldering area of intermittent type gas protecting soldering furnace |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4435394B2 (en) | 2010-03-17 |
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