JP2002079442A - Grinding method and device for rotary saw - Google Patents

Grinding method and device for rotary saw

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Publication number
JP2002079442A
JP2002079442A JP2000271003A JP2000271003A JP2002079442A JP 2002079442 A JP2002079442 A JP 2002079442A JP 2000271003 A JP2000271003 A JP 2000271003A JP 2000271003 A JP2000271003 A JP 2000271003A JP 2002079442 A JP2002079442 A JP 2002079442A
Authority
JP
Japan
Prior art keywords
tooth
grinding
rotary saw
axis
pitch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000271003A
Other languages
Japanese (ja)
Other versions
JP4647760B2 (en
Inventor
Seiichi Hasegawa
清一 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tenryu Saw Manufacturing Co Ltd
Original Assignee
Tenryu Saw Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tenryu Saw Manufacturing Co Ltd filed Critical Tenryu Saw Manufacturing Co Ltd
Priority to JP2000271003A priority Critical patent/JP4647760B2/en
Publication of JP2002079442A publication Critical patent/JP2002079442A/en
Application granted granted Critical
Publication of JP4647760B2 publication Critical patent/JP4647760B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To quickly grind each tooth of a rotary saw with high accuracy. SOLUTION: This grinding device comprises a pitch measuring device 10 for measuring and storing a pitch of each tooth 5 of the rotary saw 3, a tooth sending device 6 for indexing and rotating the rotary saw 3 on the basis of a measured value, a grinding wheel 21 for grinding the tooth 5 sent to a predetermined position, and a grinding wheel attitude changing device 24 for changing the direction of the grinding wheel 21 to locate its grinding face oppositely to a predetermined face of the tooth 5, the rotary saw 3 is repeatedly rotated by the tooth sending device 6 on the basis of the data from the pitch measuring device 10 obtained in the initial rotation of the rotary saw 3, and the direction of the grinding wheel 21 is changed by the grinding wheel attitude changing device 24 every rotation of the rotary saw 3 to grind corresponding faces 5a, 5b of the tooth 5.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、回転鋸の歯の逃げ
面、すくい面等を研削する回転鋸の研削方法及びその研
削装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary saw grinding method and a grinding apparatus for grinding a flank, a rake face and the like of teeth of a rotary saw.

【0002】[0002]

【従来の技術】一般に回転鋸の歯は、切れ歯を形成する
ためにすくい面、逃げ面等、多種類の面を有する。従来
はこれらの面を研削(研磨)する際に、基準ピンを歯の
各種類の面の研削が全部終了するまで歯に向けて出没さ
せ、歯を1歯毎に上記基準ピンに当てて位置決めし、該
位置決めした歯のすくい面、逃げ面等を研削するように
していた。
2. Description of the Related Art In general, the teeth of a rotary saw have various kinds of surfaces such as a rake face and a flank face for forming cutting teeth. Conventionally, when grinding (polishing) these surfaces, the reference pins are protruded and retracted toward the teeth until all the types of surfaces of the teeth are completely ground, and the teeth are positioned on the reference pins for each tooth. Then, the rake face, flank face and the like of the positioned teeth are ground.

【0003】[0003]

【発明が解決しようとする課題】上記従来のものは、歯
の各種類の面の研削が全部終了するまで基準ピンで歯を
1歯毎に位置決めしするようにしていたので、研削時間
が延引するとともに、基準ピンが磨耗し易くなるもので
あった。本発明は回転鋸の初回の回転で歯の各ピッチを
記憶させ、この記憶したデーターに基づいて回転鋸を反
復回転させ、該回転鋸の歯の各面を研削することによ
り、上記不具合を解消するようにしたものである。ま
た、歯をレーザーセンサにより検知して回転鋸を歯送り
することにより、歯の横すくい角の大きさに左右される
ことなく、かつ歯送り装置を簡素にして高精度の研削精
度ができるようにした新規な回転鋸の研削方法及び研削
装置を得ることを目的とする。
In the above prior art, the teeth are positioned one by one with the reference pins until the grinding of each type of tooth is completed, so that the grinding time is extended. At the same time, the reference pin is easily worn. The present invention solves the above problem by storing each pitch of the teeth in the first rotation of the rotary saw, repeatedly rotating the rotary saw based on the stored data, and grinding each surface of the teeth of the rotary saw. It is intended to be. In addition, by detecting the teeth with a laser sensor and feeding the rotary saw to the teeth, the tooth feeder can be simplified and highly accurate grinding can be performed without being affected by the size of the lateral rake angle of the teeth. It is an object of the present invention to obtain a novel rotary saw grinding method and a new grinding apparatus.

【0004】[0004]

【課題を解決するための手段】本発明は、上記目的を達
成するために以下の如く構成したものである。即ち、請
求項1に係る発明は、回転される回転鋸の各歯のピッチ
をそれぞれ計測して記憶するピッチ計測装置と、前記計
測値に基づいて前記回転鋸を割出し回転させる歯送り装
置と、該歯送り装置によって所定位置に送られた歯を研
削する砥石と、該砥石の向きをその研削面が前記歯の所
定の面に対面する如く変更する砥石姿勢変更装置とを設
け、回転鋸の初回の回転で得たピッチ計測装置のデータ
ーに基づいて歯送り装置により前記回転鋸を反復回転さ
せ、該回転鋸が一回転される毎に前記砥石姿勢変更装置
により砥石の向きを変えてその研削面を前記歯の該当す
る面に対面させる構成にしたものである。また、請求項
2に係る発明は、ピッチ計測装置は、回転鋸を回転させ
る歯送り装置のサーボモータの駆動量と、砥石部に到来
する回転鋸の歯に向けてレーザービームを照射するレー
ザーセンサの信号とにより前記回転鋸の各歯のピッチを
計測し、これを記憶する構成にしたものである。また、
請求項3に係る発明は、フレームに回転鋸を割出し回転
させる歯送り装置を設け、前記フレームに回転鋸の所定
の歯部で該回転鋸の回転軸心と平行する研削中心を中心
として回動する回動台を設け、該回動台にこれの回動円
に対して半径方向に移動するX軸移動ベースを設け、該
X軸移動ベースにこれの移動軸線を中心として旋回する
旋回台を設け、該旋回台にこれの旋回中心と直交する軸
線を中心として回転する砥石ヘッドを設け、前記歯送り
装置は、前記研削中心部に到来する回転鋸の歯に向けて
レーザービームを照射するレーザーセンサを設け、該レ
ーザーセンサの信号を入力して前記回転鋸を割出し回転
させるサーボモータを設ける構成にしたものである。
Means for Solving the Problems The present invention is configured as follows to achieve the above object. That is, the invention according to claim 1 includes a pitch measuring device that measures and stores the pitch of each tooth of a rotating saw to be rotated, and a tooth feed device that indexes and rotates the rotating saw based on the measured value. A grinding wheel for grinding a tooth fed to a predetermined position by the tooth feeding device, and a grinding wheel attitude changing device for changing the direction of the grinding wheel so that the grinding surface faces the predetermined surface of the tooth; The rotary saw is repeatedly rotated by the tooth feeder based on the data of the pitch measuring device obtained in the first rotation of the first time, and the direction of the grinding wheel is changed by the grinding wheel attitude changing device every time the rotary saw is rotated once. In this configuration, a ground surface faces a corresponding surface of the tooth. According to a second aspect of the present invention, in the pitch measuring device, a driving amount of a servo motor of the gear feed device for rotating the rotary saw and a laser sensor for irradiating a laser beam toward the teeth of the rotary saw arriving at the grindstone portion. , The pitch of each tooth of the rotary saw is measured and stored. Also,
The invention according to claim 3 is provided with a gear feed device for indexing and rotating a rotary saw on a frame, and rotating the frame about a grinding center parallel to a rotation axis of the rotary saw at a predetermined tooth portion of the rotary saw. A rotating table that moves, an X-axis moving base that moves in a radial direction with respect to a rotating circle of the rotating table, and the X-axis moving base rotates around a moving axis of the rotating table. The turning table is provided with a grindstone head that rotates about an axis orthogonal to the center of rotation of the turning table, and the tooth feed device irradiates a laser beam toward the teeth of the rotary saw arriving at the grinding center. A laser sensor is provided, and a servomotor for inputting a signal from the laser sensor and indexing and rotating the rotary saw is provided.

【0005】[0005]

【発明の実施の形態】以下本発明の実施の形態を図面に
基いて説明する。図面において、図1は本発明の実施例
を示す回転鋸の研削装置の要部側面図、図2は本発明に
よる逃げ面の研削状態を示す正面図、図3は本発明によ
るすくい面の研削状態を示す正面図、図4は逃げ面の曲
面研削状態を示す正面図、図5は図2の要部拡大図、図
6は図3の要部拡大図である。図1〜図3において、1
は回転鋸の研削装置、2はそのフレームである。このフ
レーム2に回転鋸3を設け、該回転鋸3を歯送り装置6
によって例えば一歯毎に割出し回転させる。上記回転鋸
3は、図5に示すように円板状の基板5の外周部に超硬
チップ製の多数の歯5を所定ピッチで有する。
Embodiments of the present invention will be described below with reference to the drawings. In the drawings, FIG. 1 is a side view of a main part of a rotary saw grinding apparatus showing an embodiment of the present invention, FIG. 2 is a front view showing a flank grinding state according to the present invention, and FIG. 3 is a rake face grinding according to the present invention. FIG. 4 is a front view showing a state where the flank is ground, FIG. 5 is an enlarged view of a main part of FIG. 2, and FIG. 6 is an enlarged view of a main part of FIG. 1 to 3, 1
Is a rotary saw grinding device, and 2 is its frame. A rotary saw 3 is provided on the frame 2, and the rotary saw 3 is
For example, index rotation is performed for each tooth. As shown in FIG. 5, the rotary saw 3 has a number of teeth 5 made of carbide tips at a predetermined pitch on the outer periphery of a disk-shaped substrate 5.

【0006】上記歯送り装置6は、図1に示すように、
ピッチ計測装置10により回転制御される歯送りモータ
(サーボモータ)7によって上記回転鋸3を各歯5のピ
ッチに対応させて割出し回転させるようになっている。
即ち、上記ピッチ計測装置10は、同図に示すように、
レーザーセンサ11の発射器11aと受光器11bとを
研削基準点Oに到来する回転鋸3の歯5の両側に対向配
置し、上記歯送りモータ7により回転鋸3を回転させて
その各歯5を上記発射器11aと受光器11bとの間に
通過させ、上記レーザーセンサ10aの信号及び歯送り
モータ7の信号を入力して各歯5のピッチを演算(計
測)し、これを記憶するようになっている。そして、上
記回転鋸3の歯5を研削する際には、上記ピッチ計測装
置10の信号を入力して上記歯送りモータ7を回転制御
し、回転鋸3を各歯5のピッチに対応させて割出し回転
させる。
[0006] As shown in FIG.
The rotary saw 3 is indexed and rotated in accordance with the pitch of each tooth 5 by a tooth feed motor (servo motor) 7 whose rotation is controlled by a pitch measuring device 10.
That is, as shown in FIG.
The emitter 11a and the light receiver 11b of the laser sensor 11 are arranged on both sides of the teeth 5 of the rotary saw 3 arriving at the grinding reference point O, and the rotary saw 3 is rotated by the tooth feed motor 7 to rotate the respective teeth 5a. Is passed between the emitter 11a and the light receiver 11b, the signal of the laser sensor 10a and the signal of the tooth feed motor 7 are input, and the pitch of each tooth 5 is calculated (measured) and stored. It has become. When grinding the teeth 5 of the rotary saw 3, the signal of the pitch measuring device 10 is input to control the rotation of the tooth feed motor 7, and the rotary saw 3 is made to correspond to the pitch of each tooth 5. Rotate indexing.

【0007】上記フレーム2に砥石姿勢変更装置24を
介して砥石ヘッド20を設ける。この砥石姿勢変更装置
24は砥石ヘッド20に設けた砥石21の研削面の向き
が歯5の所定の面、例えば逃げ面5a、又はすくい面5
b等に対面する如く変更するもので、以下の如くなって
いる。即ち、回動台15を上記研削基準点O上で回転鋸
3の回転軸心と平行する支点軸15aを介してフレーム
2に回動可能に取付け、該回動台15を回動装置16に
よって回動させる。回動装置16は、サーボモータから
なる回動モータ18をフレーム2側に取り付け、この回
動モータ18の出力軸に取り付けたウォーム18aを上
記支点軸15aに取り付けたウォームホイール18bに
噛合させてなり、上記回動モータ18を正逆回転させる
ことにより、上記回動台15を研削基準点Oを中心とし
て図2に示す矢印M方向に正逆回動させる。17は上記
回動台15を案内するガイドレールであり、上記支点軸
15aを中心とする円弧状に延在させて回動台15の外
周部をフレーム2側に摺動可能に連結する。
A grinding wheel head 20 is provided on the frame 2 via a grinding wheel attitude changing device 24. The grindstone attitude changing device 24 is configured such that the direction of the grinding surface of the grindstone 21 provided on the grindstone head 20 is a predetermined surface of the tooth 5, for example, the flank 5a or the rake surface 5.
It is changed so as to face b and the like, and is as follows. That is, the turntable 15 is rotatably mounted on the frame 2 via the fulcrum shaft 15 a parallel to the rotation axis of the rotary saw 3 on the grinding reference point O, and the turntable 15 is turned by the turning device 16. Rotate. The rotation device 16 has a rotation motor 18 composed of a servomotor mounted on the frame 2 side, and a worm 18a mounted on an output shaft of the rotation motor 18 meshed with a worm wheel 18b mounted on the fulcrum shaft 15a. By rotating the rotating motor 18 in the forward and reverse directions, the rotating table 15 is rotated forward and backward in the direction of arrow M shown in FIG. Reference numeral 17 denotes a guide rail for guiding the turntable 15, which extends in an arc shape centered on the fulcrum shaft 15 a and slidably connects the outer peripheral portion of the turntable 15 to the frame 2 side.

【0008】上記砥石ヘッド20は図2に示すように、
その主軸20aが上記回動台15の回動円の接線方向を
なす矢印Y軸方向に向けて配置され、ヘッド移動装置2
5によって回動台15の回動円の半径方向をなすX軸方
向及びY軸方向に移動されるとともに、旋回装置33に
よって上記X軸と平行する軸線Lを中心として旋回され
る。上記ヘッド移動装置25は、砥石ヘッド20を回動
台15上でその回動円の半径方向(X軸方向)に移動さ
せるX軸ヘッド移動装置26と、該砥石ヘッド20を回
動台15上でその回動円の接線方向(Y軸方向)とに移
動させるY軸ヘッド移動装置30とを有する。
[0008] As shown in FIG.
The main shaft 20a is arranged in the direction of the arrow Y axis which is tangential to the rotation circle of the rotation table 15, and the head moving device 2
5, the rotary table 15 is moved in the X-axis direction and the Y-axis direction, which are the radial directions of the turning circle, and is turned by the turning device 33 about the axis L parallel to the X axis. The head moving device 25 includes an X-axis head moving device 26 that moves the grindstone head 20 on the turntable 15 in the radial direction (X-axis direction) of the turning circle, and moves the grindstone head 20 on the turntable 15. And a Y-axis head moving device 30 for moving in the tangential direction (Y-axis direction) of the rotating circle.

【0009】上記X軸ヘッド移動装置26は、回動台1
5にX軸移動ベース27を該回動台15の回動円の半径
方向に摺動可能に取付け、このX軸移動ベース27をサ
ーボモータからなるX軸モータ28によって移動制御し
てなり、また、上記Y軸ヘッド移動装置30は、上記X
軸移動ベース27にY軸移動ベース31をX軸移動ベー
ス27の移動方向と直交する方向(回動台15の回動円
の接線方向)に摺動可能に取付け、サーボモータからな
るY軸モータ32(図3)によって移動制御してなる。
図1中、29はX軸移動ベース27の移動を検知するセ
ンサーである。また、上記旋回装置33は、上記Y軸移
動ベース31にブラケット37を起立固定し、このブラ
ケット37の突出端部に旋回モータ(サーボモータ)3
6によってX軸を中心として回転制御される旋回軸34
を回転可能に取付け、この旋回軸34にコ字形に屈曲し
た旋回台35を固定する。
The X-axis head moving device 26 includes a rotary table 1
5, an X-axis moving base 27 is slidably mounted in the radial direction of the turning circle of the turntable 15, and the X-axis moving base 27 is controlled to move by an X-axis motor 28 comprising a servomotor. , The Y-axis head moving device 30
A Y-axis motor consisting of a servomotor is mounted on the axis-moving base 27 so that the Y-axis moving base 31 is slidable in a direction perpendicular to the moving direction of the X-axis moving base 27 (tangential direction of the turning circle of the turntable 15). 32 (FIG. 3).
In FIG. 1, reference numeral 29 denotes a sensor for detecting the movement of the X-axis movement base 27. The turning device 33 fixes a bracket 37 to the Y-axis moving base 31 in an upright position, and a turning motor (servo motor) 3
6 is controlled to rotate about the X axis
Is rotatably mounted, and a revolving base 35 bent in a U-shape is fixed to the revolving shaft 34.

【0010】上記旋回台35に第2Y軸移動ベース41
をY軸方向に摺動可能に取付け、該第2Y軸移動ベース
41に前述した砥石ヘッド20を、図1においてその下
端部が回動台15の研削基準点O上に位置する如く配置
して取り付ける。上記第2Y軸移動ベース41はサーボ
モータからなる第2Y軸モータ42(図2)によってY
軸方向に移動され、図4に示すように、砥石研削面22
a,23aの旋回軸線Lに対する偏心量Rを調節する。
上記旋回台35の後部側に砥石ヘッド20の主軸20a
を回転させる砥石モータ20bを取付け、この砥石モー
タ20bによりベルト、プーリーを介して主軸20aを
回転させる。
A second Y-axis moving base 41 is mounted on the swivel base 35.
Is mounted so as to be slidable in the Y-axis direction, and the above-mentioned grindstone head 20 is disposed on the second Y-axis moving base 41 such that the lower end thereof is located on the grinding reference point O of the turntable 15 in FIG. Attach. The second Y-axis moving base 41 is moved by a second Y-axis motor 42 (FIG. 2) composed of a servomotor.
It is moved in the axial direction, and as shown in FIG.
The eccentricity R of the a, 23a with respect to the turning axis L is adjusted.
The main shaft 20a of the grindstone head 20 is provided at the rear side of the turntable 35.
Is mounted, and the main shaft 20a is rotated via a belt and a pulley by the grinding wheel motor 20b.

【0011】上記主軸20aに取り付ける砥石21は、
図5、図6に示すように、軸方向外方に向かって拡開す
る大径かつ皿状の第1砥石22と、この第1砥石22の
軸方向外面側に重ねた小径かつ円筒状の第2砥石23と
を有する。上記第1砥石22は歯24のすくい面5bを
研削するもので、その外周を薄肉の円板状に形成すると
ともに、その軸方向外方端面に砥粒を固着して主軸20
aの回転軸心と直交する面をなす第1研削面22aを形
成する。また、上記第2砥石23は上記歯5の逃げ面5
aを研削するもので、その軸方向外方端部に砥粒を固着
して第2研削面23aを形成する。
The grinding stone 21 attached to the spindle 20a is
As shown in FIGS. 5 and 6, a large-diameter and dish-shaped first grindstone 22 expanding outward in the axial direction, and a small-diameter and cylindrical-shaped superimposed on the axially outer surface side of the first grindstone 22. A second grindstone 23. The first grindstone 22 is for grinding the rake face 5b of the teeth 24. The first grindstone 22 is formed in a thin disk shape on its outer periphery, and abrasive grains are fixed to its axially outer end face to form a main spindle 20b.
A first grinding surface 22a is formed, which is a surface orthogonal to the rotation axis of a. The second grinding stone 23 is provided on the flank 5 of the tooth 5.
The second grinding surface 23a is formed by fixing abrasive grains to the outer end in the axial direction.

【0012】前述した歯送り装置6、及び砥石姿勢変更
装置24、即ち回動装置16、砥石ヘッド20、ヘッド
移動装置25、及び旋回装置33等は、図9に示す制御
装置50によって駆動制御される。図9において、51
はマイクロコンピューターのメモリー部に記憶される研
削モード設定部であり、例えば、歯5の逃げ面5aを研
削する逃げ面研削モード、すくい面5bを研削するすく
い面研削モード、上記逃げ面5a又はすくい面5bを平
面に研削する平面研削モード、該逃げ面5a又はすくい
面5bを円弧面状に研削する曲面研削モード等が設定さ
れる。この設定は作業者がキーボード等を操作して行
う。
The above-described tooth feeder 6 and the grindstone attitude changing device 24, that is, the rotating device 16, the grindstone head 20, the head moving device 25, and the turning device 33 are driven and controlled by a control device 50 shown in FIG. You. In FIG. 9, 51
Is a grinding mode setting section stored in a memory section of the microcomputer, for example, a flank grinding mode for grinding the flank 5a of the tooth 5, a rake face grinding mode for grinding the rake face 5b, the flank 5a or the rake A surface grinding mode in which the surface 5b is ground into a plane, a curved surface grinding mode in which the flank 5a or the rake surface 5b is ground into an arc shape, and the like are set. This setting is performed by an operator operating a keyboard or the like.

【0013】52は研削指令部であり、上記研削モード
設定部51で設定された所定の研削モードに従って各駆
動部に所定順序の駆動指令を発する。53は歯ピッチ計
測部であり、研削指令部52からの指令によりピッチ計
測装置10を作動させ、歯送りモータ7で回転される回
転鋸3の各歯5のピッチを計測及び記憶する。54は歯
送り部であり、上記研削指令部52からの指令が歯ピッ
チの計測工程の場合には歯送りモータ7をピッチ計測に
適した速度で回転させ、また、研削指令部52からの指
令が研削工程の場合には、上記歯送りモータ7を各歯5
が上記歯ピッチ計測部53で計測(記憶)されたピッチ
となる回転角度で間欠回転させる。55は砥石姿勢変更
部であり、上記研削指令部52からの指令により回動モ
ータ18、X軸モータ28、Y軸モータ32、旋回モー
タ36、第2Y軸モータ42等を駆動制御して砥石21
の研削面を逃げ面5a、あるいはすくい面5bに対面さ
せる。
Reference numeral 52 denotes a grinding command section, which issues drive commands in a predetermined order to each drive section in accordance with a predetermined grinding mode set by the grinding mode setting section 51. Reference numeral 53 denotes a tooth pitch measuring unit which operates the pitch measuring device 10 according to a command from the grinding command unit 52 to measure and store the pitch of each tooth 5 of the rotary saw 3 rotated by the tooth feed motor 7. Reference numeral 54 denotes a tooth feed unit. When the command from the grinding command unit 52 is a tooth pitch measuring step, the tooth feed motor 7 is rotated at a speed suitable for pitch measurement. Is a grinding process, the tooth feed motor 7 is connected to each tooth 5.
Is intermittently rotated at a rotation angle that is the pitch measured (stored) by the tooth pitch measuring unit 53. Reference numeral 55 denotes a grindstone attitude changing unit which controls the driving of the rotation motor 18, the X-axis motor 28, the Y-axis motor 32, the turning motor 36, the second Y-axis motor 42, and the like according to a command from the grinding command unit 52.
Face the flank 5a or the rake face 5b.

【0014】図10は上記制御装置50の動作の一例を
示すフローチャートである。これを図1〜図9を参照し
て説明する。なお、図10においてP1〜P23はフロ
ーチャートの各ステップを示す。図10において、ステ
ップP1でスタートされると、P2で歯送りモータ7を
所定速度で回転させ、P3でピッチ計測装置10を作動
させる。即ち、レーザーセンサ11の発射器11aと受
光器11bとの間を通過する回転鋸3の各歯5を検出
し、これと歯送りモータ7の駆動量から各歯5のピッチ
を計測(演算)する。そしてP4で上記計測した各歯5
のピッチを記憶する。
FIG. 10 is a flowchart showing an example of the operation of the control device 50. This will be described with reference to FIGS. In FIG. 10, P1 to P23 indicate each step in the flowchart. In FIG. 10, when the process is started in step P1, the gear feed motor 7 is rotated at a predetermined speed in P2, and the pitch measuring device 10 is operated in P3. That is, each tooth 5 of the rotary saw 3 passing between the emitter 11a and the light receiver 11b of the laser sensor 11 is detected, and the pitch of each tooth 5 is measured (calculated) from this and the driving amount of the tooth feed motor 7. I do. And each tooth 5 measured above at P4
Is stored.

【0015】P5で上記各歯5のピッチの計測が終了す
ると、P6で平面研削か曲面研削(P22)かを判断
し、平面研削の場合はP7で逃げ面の研削かすくい面の
研削(P17)かを判断する。逃げ面研削の場合はP8
に進行して砥石姿勢変更装置24を作動させる。即ち、
回動モータ34を起動させて回動台15を図2、図5に
示す位置まで回転させるとともに、第2Y軸モータ42
を起動させて砥石ヘッド20をY軸方向に移動(砥石2
1の第2研削面23aを旋回軸34に対して所定量オフ
セット)させ、P9にて砥石21をその第2研削面23
aの角度が歯5の逃げ面5a(図7)に要する所定の先
端逃げ角Cと対応する位置に、また、P10にて上記第
2研削面23aの切込み量が所定の切込み量H1となる
位置に移動させる。
When the measurement of the pitch of each tooth 5 is completed in P5, it is determined in P6 whether surface grinding or curved surface grinding (P22). In the case of surface grinding, flank grinding or rake surface grinding (P17) is performed in P7. ) Judge. P8 for flank grinding
And the grindstone attitude changing device 24 is operated. That is,
The rotation motor 34 is activated to rotate the rotation table 15 to the position shown in FIGS. 2 and 5, and the second Y-axis motor 42
To move the grindstone head 20 in the Y-axis direction (grindstone 2
The second grinding surface 23a is offset by a predetermined amount with respect to the turning shaft 34), and the grinding wheel 21 is moved to the second grinding surface 23 at P9.
At a position where the angle of a corresponds to the predetermined tip clearance angle C required for the flank 5a (FIG. 7) of the teeth 5, and at P10, the cut amount of the second ground surface 23a becomes the predetermined cut amount H1. Move to position.

【0016】次いでP11で砥石モータ20bを介して
砥石21を回転させ、P12,P13で歯送りモータ7
を所定量起動させて研削すべき歯5が研削基準点O位置
に到来する如く割出し回転させた後、P14で上記歯送
りモータ7を停止させるとともに、制動装置(図示省
略)を作動させて回転鋸3をフレーム2側に固定する。
次いでP15でX軸モータ28を起動させて上記歯5を
研削する。次いでP16で回転鋸3の各歯5の逃げ面5
aの研削が完了したか否かを判断し、NO(否)の場合
はP12にジャンプし、YESの場合はP21に進行
し、ここで平面研削、つまり各歯5の逃げ面5a、及び
すくい面5bの研削が完了したか否かを判断する。
Next, at step P11, the grinding wheel 21 is rotated via the grinding wheel motor 20b, and at steps P12 and P13, the tooth feed motor 7 is rotated.
Is started by a predetermined amount and index rotation is performed so that the tooth 5 to be ground reaches the position of the grinding reference point O. Then, at step P14, the tooth feed motor 7 is stopped, and a braking device (not shown) is operated. The rotary saw 3 is fixed to the frame 2 side.
Next, at P15, the X-axis motor 28 is started to grind the teeth 5. Next, at P16, the flank 5 of each tooth 5 of the rotary saw 3
It is determined whether or not the grinding of a is completed. If NO (No), the process jumps to P12, and if YES, the process proceeds to P21. Here, the surface grinding, that is, the flank 5a of each tooth 5, and the rake It is determined whether the grinding of the surface 5b has been completed.

【0017】P21でNOの場合にはP7にジャンプ
し、ここからP17に進行し、YESの場合はP23に
進行して平面研削を終了する。上記P17に進行する
と、P18で砥石姿勢変更装置24を作動、即ち、回動
モータ34を起動させて回動台15を図3、図6に示す
位置まで回転させるとともに、第2Y軸モータ42を起
動させて砥石ヘッド20をY軸方向に移動(砥石21の
第1研削面22aを旋回軸34に対して所定量オフセッ
ト)させ、P19にて砥石21をその第1研削面22a
の角度が歯5のすくい面5b(図7)に要する所定のす
くい角Aと対応する位置に、また、P20にて上記第1
研削面22aの切込み量が所定の切込み量H2となる位
置に移動させる。次いでP11に進行し、P12〜P1
6にて前述と同様の動作を行って各歯5のすくい面5b
を研削する。
If NO in P21, the process jumps to P7 and proceeds to P17. If YES, the process proceeds to P23 to terminate the surface grinding. When proceeding to P17, the grindstone attitude changing device 24 is operated at P18, that is, the turning motor 34 is started to rotate the turning table 15 to the position shown in FIGS. 3 and 6, and the second Y-axis motor 42 is turned on. Upon activation, the grinding wheel head 20 is moved in the Y-axis direction (the first grinding surface 22a of the grinding wheel 21 is offset by a predetermined amount with respect to the turning shaft 34), and the grinding wheel 21 is moved to the first grinding surface 22a at P19.
At a position corresponding to a predetermined rake angle A required for the rake face 5b (FIG. 7) of the tooth 5, and at P20, the first
The grinding surface 22a is moved to a position where the cutting amount becomes a predetermined cutting amount H2. Next, the process proceeds to P11, and P12 to P1
6, the same operation as described above is performed, and the rake face 5b of each tooth 5 is formed.
Grinding.

【0018】なお、前述したP6からP22の曲面研削
モードに進行した場合には、前述したP15による逃げ
面5a、すくい面5bの研削は、X軸モータ28の正逆
回転に加えて旋回モータ36を所定角度で正逆回転さ
せ、図8に示すように、砥石21を旋回軸線L(旋回軸
34)を中心として所定角度で往復旋回させて上記逃げ
面5a、及びすくい面5bを円弧状に研削する。また、
P21は平面研削完から曲面研削完に換わることにな
る。その他は前述したP7〜P21と略同様の動作を行
う。
When the operation proceeds from P6 to the curved surface grinding mode of P22, the grinding of the flank 5a and the rake face 5b by P15 is performed in addition to the forward / reverse rotation of the X-axis motor 28 and the rotation motor 36. Is rotated forward and backward at a predetermined angle, and as shown in FIG. 8, the grindstone 21 is reciprocated at a predetermined angle about the rotation axis L (the rotation axis 34) to make the flank 5a and the rake face 5b into an arc shape. Grind. Also,
P21 is changed from completion of surface grinding to completion of curved surface grinding. Other operations are substantially the same as those of P7 to P21 described above.

【0019】[0019]

【発明の効果】以上の説明から明らかな如く、請求項1
に係る発明は、回転鋸の各歯のピッチを計測してこれを
記憶させ、この記憶したデーターに基づいて上記回転鋸
を反復回転させて各歯の逃げ面、すくい面等を研削する
ようにしたので、各歯を高精度にかつ迅速に研削するこ
とができる。また、請求項2に係る発明は、上記各歯の
ピッチを回転鋸を回転させるサーボモータの駆動量と砥
石部に到来する歯を検知するレーザーセンサの信号とに
より計測するようにしたので、従来のように歯を1歯毎
に位置決めする基準ピンが不要となり、構造が簡素にな
るとともに、すくい面の横すくい角の大きなものであっ
ても各歯のピッチを高精度にかつ迅速に計測することが
できる。また、請求項3に係る発明は、歯を1歯毎に位
置決めする基準ピンを省略して歯送り部の構造を簡素に
しながら、逃げ面、すくい面の平面研削、曲面研削を高
精度にかつ迅速に行うことができる。
As is apparent from the above description, claim 1
According to the invention, the pitch of each tooth of the rotary saw is measured and stored, and the rotary saw is repeatedly rotated based on the stored data to grind the flank, rake face, etc. of each tooth. Therefore, each tooth can be ground quickly and with high precision. In the invention according to claim 2, the pitch of each tooth is measured by a driving amount of a servo motor for rotating a rotary saw and a signal of a laser sensor for detecting a tooth arriving at a grindstone portion. The need for a reference pin for positioning the teeth for each tooth is eliminated, and the structure is simplified, and the pitch of each tooth can be measured with high precision and speed even if the rake face has a large lateral rake angle. be able to. The invention according to claim 3 simplifies the structure of the tooth feed portion by omitting a reference pin for positioning a tooth for each tooth, and performs flank, rake face surface grinding and curved surface grinding with high precision. Can be done quickly.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例を示す回転歯の研削装置の要部
側面図である。
FIG. 1 is a side view of a main part of a rotary tooth grinding device showing an embodiment of the present invention.

【図2】本発明による逃げ面の研削状態を示す正面図で
ある。
FIG. 2 is a front view showing a grinding state of a flank according to the present invention.

【図3】本発明によるすくい面の研削状態を示す正面図
である。
FIG. 3 is a front view showing a grinding state of a rake face according to the present invention.

【図4】本発明による逃げ面の曲面研削状態を示す正面
図である。
FIG. 4 is a front view showing a state in which a flank is ground by a curved surface according to the present invention;

【図5】図2の要部拡大図である。FIG. 5 is an enlarged view of a main part of FIG. 2;

【図6】図3の要部拡大図である。FIG. 6 is an enlarged view of a main part of FIG. 3;

【図7】逃げ面及びすくい面が研削された歯の側面図で
ある。
FIG. 7 is a side view of a tooth whose flank and rake face are ground.

【図8】逃げ面の曲面研削状態を示す要部説明図であ
る。
FIG. 8 is an explanatory view of a principal part showing a state where a flank is ground on a curved surface;

【図9】本発明による制御装置のブロック図である。FIG. 9 is a block diagram of a control device according to the present invention.

【図10】制御装置の研削動作の一例を示すフローチャ
ートである。
FIG. 10 is a flowchart illustrating an example of a grinding operation of the control device.

【符号の説明】[Explanation of symbols]

1 研削装置 2 フレーム 3 回転鋸 4 基板 5 歯 5a 逃げ面 5b すくい面 5c 先端切歯 6 歯送り装置 7 歯送りモータ(サーボモータ) 10 ピッチ計測装置 11 レーザーセンサ 11a 発射器 11b 受光器 15 回動台 15a 支点軸 O 研削基準点(回動中心) 16 回動装置 17 ガイドレール 18 回動モータ(サーボモータ) 18a ウォーム 18b ウォームホイール 20 砥石ヘッド 20a 主軸 20b 砥石モータ 21 砥石 22 第1砥石 22a 第1研削面 23 第2砥石 23a 第2研削面 24 砥石姿勢変更装置 25 ヘッド移動装置 26 X軸ヘッド移動装置 27 X軸移動ベース 28 X軸モータ(サーボモータ) 29 センサー 30 Y軸ヘッド移動装置 31 Y軸移動ベース 32 Y軸モータ(サーボモータ) 33 旋回装置 34 旋回軸 35 旋回台 36 旋回モータ(サーボモータ) 37 ブラケット 40 第2ヘッド移動装置 41 第2Y軸移動ベース 42 第2Y軸モータ(サーボモータ) 50 制御装置 51 研削モード設定部 52 研削指令部 53 歯ピッチ計測部 54 歯送り部 55 砥石姿勢変更部 DESCRIPTION OF SYMBOLS 1 Grinding device 2 Frame 3 Rotating saw 4 Substrate 5 Teeth 5a Relief surface 5b Rake surface 5c Tip cutting teeth 6 Tooth feed device 7 Tooth feed motor (servo motor) 10 Pitch measuring device 11 Laser sensor 11a Emitter 11b Light receiver 15 Rotation Table 15a Support shaft O Grinding reference point (center of rotation) 16 Rotating device 17 Guide rail 18 Rotating motor (servo motor) 18a Worm 18b Worm wheel 20 Wheel head 20a Main shaft 20b Wheel motor 21 Wheel 22 First wheel 22a First Grinding surface 23 Second grinding stone 23a Second grinding surface 24 Grinding stone attitude changing device 25 Head moving device 26 X-axis head moving device 27 X-axis moving base 28 X-axis motor (servo motor) 29 Sensor 30 Y-axis head moving device 31 Y-axis Moving base 32 Y-axis motor (servo motor) 33 rotation Rotating device 34 Revolving axis 35 Revolving table 36 Revolving motor (servo motor) 37 Bracket 40 Second head moving device 41 Second Y-axis moving base 42 Second Y-axis motor (servo motor) 50 Control device 51 Grinding mode setting unit 52 Grinding command unit 53 Tooth pitch measuring unit 54 Tooth feed unit 55 Grinding stone posture changing unit

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】回転される回転鋸(3)の各歯(5)のピ
ッチをそれぞれ計測して記憶するピッチ計測装置(1
0)と、前記計測値に基づいて前記回転鋸(3)を割出
し回転させる歯送り装置(6)と、該歯送り装置(6)
によって所定位置に送られた歯(5)を研削する砥石
(21)と、該砥石(21)の向きをその研削面が前記
歯(5)の所定の面に対面する如く変更する砥石姿勢変
更装置(24)とを設け、回転鋸(3)の初回の回転で
得たピッチ計測装置(10)のデーターに基づいて歯送
り装置(6)により前記回転鋸(3)を反復回転させ、
該回転鋸(3)が一回転される毎に前記砥石姿勢変更装
置(24)により砥石(21)の向きを変えてその研削
面(22a,23a)を前記歯(5)の該当する面(5
a,5b)に対面させることを特徴とする回転鋸の研削
方法。
A pitch measuring device (1) for measuring and storing a pitch of each tooth (5) of a rotating saw (3) to be rotated.
0), a tooth feeder (6) for indexing and rotating the rotary saw (3) based on the measured value, and the tooth feeder (6).
A grinding wheel (21) for grinding the tooth (5) sent to a predetermined position by the above, and a grinding wheel posture change for changing the direction of the grinding wheel (21) such that the grinding surface faces the predetermined surface of the tooth (5). Device (24), and the rotary saw (3) is repeatedly rotated by the tooth feeder (6) based on the data of the pitch measuring device (10) obtained by the first rotation of the rotary saw (3);
Each time the rotary saw (3) is rotated once, the direction of the grindstone (21) is changed by the grindstone attitude changing device (24), and the ground surface (22a, 23a) is changed to the corresponding surface (5) of the tooth (5). 5
a, 5b), a method for grinding a rotary saw.
【請求項2】ピッチ計測装置(10)は、回転鋸(3)
を回転させる歯送り装置(6)のサーボモータ(7)の
駆動量と、砥石(21)部に到来する回転鋸(3)の歯
(5)に向けてレーザービームを照射するレーザーセン
サ(11)の信号とにより前記回転鋸(3)の各歯
(5)のピッチを計測し、これを記憶してなることを特
徴とする請求項1記載の回転鋸の研削方法。
The pitch measuring device (10) includes a rotary saw (3).
And a laser sensor (11) for irradiating a laser beam toward the teeth (5) of the rotary saw (3) arriving at the grindstone (21), and the driving amount of the servomotor (7) of the tooth feeder (6) for rotating the teeth. 2. The method for grinding a rotary saw according to claim 1, wherein the pitch of each tooth of the rotary saw is measured based on the signal of (1) and stored.
【請求項3】フレーム(2)に回転鋸(3)を割出し回
転させる歯送り装置(6)を設け、前記フレーム(2)
に回転鋸(3)の所定の歯(5)部で該回転鋸(3)の
回転軸心と平行する研削中心(O)を中心として回動す
る回動台(15)を設け、該回動台(15)にこれの回
動円に対して半径方向に移動するX軸移動ベース(2
7)を設け、該X軸移動ベース(27)にこれの移動軸
線を中心として旋回する旋回台(35)を設け、該旋回
台(35)にこれの旋回中心(L)と直交する軸線を中
心として回転する砥石ヘッド(20)を設け、前記歯送
り装置(6)は、前記研削中心部に到来する回転鋸
(3)の歯(5)に向けてレーザービームを照射するレ
ーザーセンサ(11)を設け、該レーザーセンサ(1
1)の信号を入力して前記回転鋸(3)を割出し回転さ
せるサーボモータ(7)を設けてなることを特徴とする
回転鋸の研削装置。
3. A frame feeder (6) for indexing and rotating a rotary saw (3) is provided on a frame (2).
A rotary table (15) is provided at a predetermined tooth (5) portion of the rotary saw (3) to rotate about a grinding center (O) parallel to the rotation axis of the rotary saw (3). An X-axis moving base (2) that moves in a radial direction with respect to its
7), the X-axis moving base (27) is provided with a revolving base (35) for revolving around the moving axis thereof, and the revolving base (35) is provided with an axis perpendicular to the revolving center (L). A grinding wheel head (20) that rotates as a center is provided, and the tooth feeder (6) is provided with a laser sensor (11) that irradiates a laser beam toward a tooth (5) of a rotary saw (3) arriving at the grinding center. ), And the laser sensor (1)
A grinding machine for a rotary saw, comprising a servomotor (7) for inputting the signal of 1) and indexing and rotating the rotary saw (3).
JP2000271003A 2000-09-07 2000-09-07 Rotary saw grinding method and grinding apparatus Expired - Lifetime JP4647760B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publication Number Publication Date
JP2002079442A true JP2002079442A (en) 2002-03-19
JP4647760B2 JP4647760B2 (en) 2011-03-09

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Country Link
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4485593B1 (en) * 2009-06-19 2010-06-23 西島株式会社 Circular saw grinding machine
JP2017104966A (en) * 2015-12-11 2017-06-15 株式会社トリガー Chip saw and method for manufacturing the same

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JPS6420957A (en) * 1987-07-16 1989-01-24 Osaka Diamond Ind Grinding device
JPH03131458A (en) * 1989-10-17 1991-06-05 Kyushu Toshiba Kikai Kk Cutter grinding device
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JPH0691427A (en) * 1992-09-09 1994-04-05 Nkk Corp Missing tooth detection device for intermittent tooth-shaped body
JPH09168949A (en) * 1995-10-17 1997-06-30 Soichi Akei Disc cutting edge grinding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4485593B1 (en) * 2009-06-19 2010-06-23 西島株式会社 Circular saw grinding machine
JP2011000683A (en) * 2009-06-19 2011-01-06 Nishijima Corp Circular saw grinding device
JP2017104966A (en) * 2015-12-11 2017-06-15 株式会社トリガー Chip saw and method for manufacturing the same

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