JP2002076311A5 - - Google Patents
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- Publication number
- JP2002076311A5 JP2002076311A5 JP2000265384A JP2000265384A JP2002076311A5 JP 2002076311 A5 JP2002076311 A5 JP 2002076311A5 JP 2000265384 A JP2000265384 A JP 2000265384A JP 2000265384 A JP2000265384 A JP 2000265384A JP 2002076311 A5 JP2002076311 A5 JP 2002076311A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000265384A JP2002076311A (ja) | 2000-09-01 | 2000-09-01 | 半導体装置およびその製造方法 |
| US09/943,094 US20020068428A1 (en) | 2000-09-01 | 2001-08-29 | Semiconductor device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000265384A JP2002076311A (ja) | 2000-09-01 | 2000-09-01 | 半導体装置およびその製造方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008070859A Division JP2008199044A (ja) | 2008-03-19 | 2008-03-19 | 半導体装置およびその製造方法 |
| JP2008070860A Division JP2008199045A (ja) | 2008-03-19 | 2008-03-19 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002076311A JP2002076311A (ja) | 2002-03-15 |
| JP2002076311A5 true JP2002076311A5 (US20070244113A1-20071018-C00056.png) | 2006-10-19 |
Family
ID=18752657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000265384A Pending JP2002076311A (ja) | 2000-09-01 | 2000-09-01 | 半導体装置およびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20020068428A1 (US20070244113A1-20071018-C00056.png) |
| JP (1) | JP2002076311A (US20070244113A1-20071018-C00056.png) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6645796B2 (en) * | 2001-11-21 | 2003-11-11 | International Business Machines Corporation | Method and semiconductor structure for implementing reach through buried interconnect for silicon-on-insulator (SOI) devices |
| US7690254B2 (en) * | 2007-07-26 | 2010-04-06 | Honeywell International Inc. | Sensor with position-independent drive electrodes in multi-layer silicon on insulator substrate |
| FR2987699A1 (fr) * | 2012-03-01 | 2013-09-06 | St Microelectronics Sa | Composant electronique realise sur un substrat fdsoi |
| JP5955064B2 (ja) * | 2012-04-17 | 2016-07-20 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP7157027B2 (ja) | 2019-09-12 | 2022-10-19 | 株式会社東芝 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001527293A (ja) * | 1997-12-19 | 2001-12-25 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | バルクｃｍｏｓアーキテクチャと互換性のあるシリコン・オン・インシュレータ構成 |
| US6121659A (en) * | 1998-03-27 | 2000-09-19 | International Business Machines Corporation | Buried patterned conductor planes for semiconductor-on-insulator integrated circuit |
| US6600173B2 (en) * | 2000-08-30 | 2003-07-29 | Cornell Research Foundation, Inc. | Low temperature semiconductor layering and three-dimensional electronic circuits using the layering |
| US6759282B2 (en) * | 2001-06-12 | 2004-07-06 | International Business Machines Corporation | Method and structure for buried circuits and devices |
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2000
- 2000-09-01 JP JP2000265384A patent/JP2002076311A/ja active Pending
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2001
- 2001-08-29 US US09/943,094 patent/US20020068428A1/en not_active Abandoned
