JP2002071746A - Semiconductor testing device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably perform a test by preventing the flying-out of an IC during a test. SOLUTION: When ICs 1 are collectively tested in a state housed in a feed pallet 2, a windshield plate 7 for preventing the flying-out of the IC is used in a test part 3 to prevent the flying-out of the IC 1 from the positioning part on the way of push-up operation or the positional shift thereof to stably test the extremely small and lightweight IC 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor test device and a semiconductor test method for testing an IC (electrical characteristic test), and more particularly to a semiconductor test device provided with a windshield for preventing the IC from popping out. It is about.

[0002]

2. Description of the Related Art In a conventional semiconductor test apparatus, the electrical characteristics of an IC are tested by bringing the leads of the IC into contact with electrodes in a socket. As a configuration of the test unit, there is a method of contacting an IC lead and an electrode in a socket by pushing up an IC stored in a pallet from below and making contact with a socket arranged above the pallet, and solder dust is contained in the socket. In order to avoid the problem that water is accumulated, the socket is arranged upward as described above. In some cases, cooling air or hot air is blown to the test section in order to maintain the environmental temperature during the test. In this case, the test section is located in a heat insulating tank and has a structure in which cooling air or hot air is circulated.

FIG. 10 is a side view showing a conventional semiconductor test apparatus having a test section. In FIG.
C and 22 are transport pallets, 23 is a test section, 24 is a push-up tool, 25 is a socket, 26 is cooling air, 27 is an inloader, 28 is an outloader, 29 is a cooling air generator, 30
Is a tester. FIG. 11 is a side view showing the structure of a test section in another conventional semiconductor test apparatus. In the figure, 21 is an IC, 22 is a transport pallet, 23 is a test section, 24 is a push-up tool, 25 is a socket, 26 is a cooling wind.

FIG. 12 is a side view showing a state in which the test section is being tested (IC 21 is positioned in socket 25) in the apparatus shown in FIG. FIG.
In the device shown in FIG. 11, a very small and lightweight IC (BGA, C
FIG. 10 is a measurement plan view showing the push-up operation during the push-up operation of the push-up tool 24 from the positioning portion of the push-up tool 24 by the cooling air 26 from the side.

[0005]

Since the conventional semiconductor device is configured as described above, a very small and light IC (BG
A, CSP, etc.) when testing IC
If the IC jumps out of position or dislocates, the contact between the IC lead and the socket electrode will not be stable, not only will it not be possible to perform a normal test, but will also damage the push-up tool and socket, reducing the operating rate of the entire device. There was a problem of lowering productivity and lowering productivity.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and by preventing the IC from popping out at the time of a test, an extremely small and lightweight IC (BGA, CS
P) and the like (electrical characteristic test) stably, and by eliminating breakage of push-up tools and sockets, it is possible to increase the operation rate of the semiconductor test apparatus and improve productivity.

[0007] To achieve this object, the I
The windbreak plate for preventing the C from popping out is arranged in a structure having a slide mechanism at a cooling air supply port in the test section.
During the push-up operation, the wind baffle blocks the cooling air from directly beside, thereby preventing the IC from jumping out.

[0008]

According to a first aspect of the present invention, there is provided a semiconductor test apparatus for performing a test by directly blowing a cooling air or a hot air on an object to be measured, and a semiconductor device which projects to a test section. A windshield for prevention is provided.

According to a second aspect of the present invention, there is provided a semiconductor test apparatus, comprising: a pallet for transporting an IC; a test section for testing the IC; a pusher for pushing the IC from the pallet into the socket; And a cooling wind sent to the unit, and is provided with a windshield for preventing the IC from jumping out.

According to a third aspect of the present invention, there is provided a semiconductor test apparatus, comprising: a pallet for accommodating an IC; a test unit for testing the IC; a unit for moving the IC between the pallet and the die set unit; It consists of a push-up tool for pushing up into the socket and cooling air sent to the test section, and is provided with a windshield for preventing the IC from jumping out.

A semiconductor test method according to a fourth aspect of the present invention performs a semiconductor test using the semiconductor test apparatus according to any one of the first to third aspects.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side view showing a semiconductor test apparatus according to a first embodiment of the present invention in which a windshield plate for preventing IC jumping out is attached. In the figure, reference numeral 1 denotes an IC (small and lightweight IC: CSP / BGA
Etc.) 2 is a pallet for transporting IC1, 3 is IC1
A test unit 4 for pushing up the IC 1 from the inside of the transport pallet 2 into the socket 5;
Is a socket having electrodes connected to the tester, 6 is cooling air sent from a cooling air generator, 7 is a windbreak plate for preventing IC 1 from jumping out, and a cooling air supply port in the test section 3. Are arranged in a structure having a slide mechanism.

Next, the operation will be described with reference to FIGS. First, in FIG. 1, in a state where the push-up device 4 is lowered, the windshield plate 7 is opened, and the cooling air 6 is sent to the test unit 3 so that the environmental temperature during the test is maintained. Next, in FIG. 2, with the push-up device 4 lowered, prior to the push-up operation of the IC 1 from inside the pallet 2, the wind baffle 7 is closed to block the cooling air 6. Next, in FIG. 3, with the breeze plate 7 closed, the push-up tool 4 is raised to push up the IC 1 from the pallet 2. Conventionally, in this state, the cooling air 6 from right besides causes the IC 1 to pop out of the positioning portion of the lifting tool 4.

Next, in FIG. 4, the IC 1 is inserted into the socket 5 by the push-up tool 4 with the windshield plate 7 closed, and the leads of the IC 1 are brought into contact with the electrodes in the socket 5. Next, in FIG. 5, with the push-up device 4 raised, at the same time as the start of the test, the windshield plate 7 is opened, and the cooling air 6 is sent to the test unit 3. Next, in FIG. 6, with the push-up device 4 raised, prior to the operation of returning the IC 1 after the test to the pallet 2, the windshield plate 7 is closed,
The cooling air 6 is blocked.

Next, in FIG. 7, with the breeze plate 7 closed, the push-up tool 4 is lowered to return the IC 1 to the pallet 2. Next, in FIG. 8, with the push-up device 4 lowered, the baffle plate 7 opens, and the cooling air 6 is supplied to the test unit 3.
At the same time, the pallet 2 for which the test has been completed is replaced with the pallet 2 for the next test. Thereafter, the operations shown in FIGS. 1 to 8 are repeated.

As described above, by incorporating the windshield plate 7 for preventing the IC from popping out into the operation sequence, the protrusion of the IC 1 due to the cooling air 6 during the IC pushing-up operation is eliminated, regardless of the size of the IC package. , And a stable test becomes possible.

Embodiment 2 FIG. FIG. 9 is a side view showing a semiconductor test apparatus for performing IC transfer of an IC housing section and a test section by a P & P (pick and press) method.
Denotes a P & P unit, 9 denotes a head, 10 denotes a suction pad provided at the tip of the head 9 and can be suctioned by vacuum, and 11 denotes an IC.
The storage pallet 12 is a die set unit.

Next, the operation will be described. The head 9 moves in the X, Y, and Z directions, and moves the IC 1 to the IC storage pallet 1.
1 and is attached to the lifting tool 4 and transferred. After the transfer is completed, the die set unit 12 is raised, and after the transfer is completed, the windshield plate 7 is opened and a test is performed. After the test is completed, the windshield 7 is closed, and the die set unit 12 is lowered. And the head 9
1 is transferred from the lifting tool 4 to the IC storage pallet 11 by suction. Thereafter, the above operation is repeated.

As described above, by using the windshield plate 7 for preventing the IC from jumping out as described in the first embodiment for the test section, the IC from the positioning section during the push-up operation is provided.
1. Prevents jumping out and misalignment of 1 and enables stable (minimum and lightweight) IC test (electrical characteristic test)
This leads to an improvement in operation rate and productivity.

Embodiment 3 In addition to the case described in the above embodiment, in any test apparatus (not shown) in which cooling air or hot air is blown directly to the object to be measured, the IC described in the above embodiment is applied to the test section. A windshield for preventing popping out can be used. As a result, it is possible to prevent the object to be measured from jumping out of the positioning portion or to be displaced during the push-up operation, and to stably perform an extremely small and lightweight test of the object to be measured (electrical characteristic test). This can lead to an improvement in operation rate and productivity.

[0021]

According to the semiconductor test apparatus according to the first aspect of the present invention, the test is performed by directly blowing the cooling air or the warm air on the object to be measured. A windshield plate is provided to prevent the object to be measured from jumping out of the positioning part during the push-up process and to prevent displacement, and to stably perform the test (electrical characteristic test) of an extremely small and lightweight IC. it can.

According to the semiconductor test apparatus of the present invention, a pallet for transporting an IC, a test section for testing the IC, and a push-up tool for pushing up the IC from the pallet into the socket. And the cooling air sent to the test section, and a windshield plate for preventing the IC from jumping out is provided, so that the IC is prevented from jumping out due to the cooling wind during the IC push-up operation.
Stable testing is possible regardless of the size of the C package.

According to the semiconductor test apparatus of the third aspect of the present invention, a pallet for accommodating an IC, a test section for testing the IC, means for moving the IC between the pallet and the die set section, It consists of a push-up tool for pushing up the IC into the socket and cooling air sent to the test section. A windshield plate is provided to prevent the IC from popping out, so that the IC test can be performed stably. It is possible to improve the operation rate and the productivity.

According to the semiconductor test method of a fourth aspect of the present invention, a semiconductor test is performed using the semiconductor test apparatus according to any one of the first to third aspects. It is possible to prevent the object to be measured from jumping out of the positioning portion or to be displaced.

[Brief description of the drawings]

FIG. 1 is a side view showing a semiconductor test device according to a first embodiment of the present invention.

FIG. 2 is a side view showing the semiconductor test device according to the first embodiment of the present invention.

FIG. 3 is a side view showing a semiconductor test device according to the first embodiment of the present invention.

FIG. 4 is a side view showing a semiconductor test device according to the first embodiment of the present invention.

FIG. 5 is a side view showing a semiconductor test device according to the first embodiment of the present invention.

FIG. 6 is a side view showing the semiconductor test device according to the first embodiment of the present invention.

FIG. 7 is a side view showing a semiconductor test device according to the first embodiment of the present invention.

FIG. 8 is a side view showing a semiconductor test device according to the first embodiment of the present invention.

FIG. 9 is a side view showing a semiconductor test device according to a second embodiment of the present invention.

FIG. 10 is a side view showing a conventional semiconductor test device.

FIG. 11 is a side view showing a conventional semiconductor test apparatus.

FIG. 12 is a side view showing a conventional semiconductor test device.

FIG. 13 is a side view showing a conventional semiconductor test apparatus.

[Explanation of symbols]

1 IC, 2,11 pallet, 3 test part, 4 push-up tool, 5 socket, 6 cooling wind, 7 windshield, 1
2 Die set part.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G003 AA07 AB01 AC03 AD04 AG11 AG12 AH04 2G014 AA14 AB59 AC08 2G032 AB12 AE01 AE02 AJ07 AK01 AL03

Claims (4)

[Claims] 1. A semiconductor test apparatus for performing a test by directly blowing a cooling air or a hot air onto an object to be measured, wherein a windshield plate for preventing a semiconductor from jumping out is provided in a test section. Test equipment. 2. A pallet for transporting an IC, a test unit for testing the IC, a pusher for pushing the IC from the pallet into the socket, and cooling air sent to the test unit. A semiconductor test apparatus comprising: a windshield plate for preventing the IC from jumping out. 3. A pallet for accommodating an IC, a test section for testing the IC, means for moving the IC between the pallet and a die set section, and a push-up for pushing the IC into a socket. A semiconductor test device comprising a tool and cooling air sent to the test section, wherein a windshield plate for preventing the IC from popping out is provided. 4. A semiconductor test method, wherein a semiconductor test is performed using the semiconductor test apparatus according to claim 1.